10M08DFV81C8GES

FPGAs MAX? 10 Series 81-UFBGA, WLCSP


  • Manufacturer: Intel
  • NO: 386-10M08DFV81C8GES
  • Package: 81-UFBGA, WLCSP
  • Datasheet: pdf
  • Stock: 3875
  • Description: FPGAs MAX? 10 Series 81-UFBGA, WLCSP (Kg)

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SPECIFICATIONS

Parameters
Mounting Type Surface Mount
Package / Case 81-UFBGA, WLCSP
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series MAX® 10
Part Status Discontinued
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Voltage - Supply 1.15V~1.25V
Number of I/O 56
Number of Logic Elements/Cells 8000
Total RAM Bits 387072
Number of LABs/CLBs 500
RoHS Status RoHS Compliant

10M08DFV81C8GES Overview


In the package 81-UFBGA, WLCSP, this product is provided. There are 56 I/Os for better data transfer. There are 8000 logic elements/cells to form a fundamental building block. FPGA modules can be attached to development boards using a Surface Mount-connector. Fpga chips operates wFpga chipsh a supply voltage of 1.15V~1.25V. It is a type of FPGA belonging to the MAX? 10 seies. While operating, the operating temperature should be kept within a range of 0°C~85°C TJ. It is for space saving reasons that this FPGA model is contained in Tray. The RAM bits that are offered by this fpga chips are 387072. 500 LABs/CLBs are configured on this FPGA.

10M08DFV81C8GES Features


56 I/Os
Up to 387072 RAM bits

10M08DFV81C8GES Applications


There are a lot of Intel 10M08DFV81C8GES FPGAs applications.

  • Solar Energy
  • Ecosystem
  • Image processing
  • Distributed Monetary Systems
  • ASIC prototyping
  • OpenCL
  • Scientific Instruments
  • Radar and Sensors
  • Software-defined radio
  • Data center search engines

In Stock

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