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ContactTDK InvenSense(364)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Size / Dimension | Moisture Sensitivity Level (MSL) | Termination | Max Operating Temperature | Min Operating Temperature | Voltage - Rated | Technology | Operating Supply Current | Current - Supply | Voltage Range | Port Location | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Bandwidth | Shape | Max Supply Current | Number of Terminations | Factory Lead Time | Interface | Accessory Type | Lifecycle Status | Impedance | Max Frequency | Number of Functions | Evaluation Kit | Feature | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Supply Voltage | Terminal Pitch | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Analog IC - Other Type | JESD-30 Code | Sensitivity | Output Type | Function | Height (Max) | Frequency Range | Kit Type | Quantity | Direction | Sensing Range | Sensor Type | Utilized IC / Part | Specifications | Axis | Range °/s | Sensitivity (LSB/(°/s)) | Beam Angle | Primary Attributes | Supplied Contents | Embedded | S/N Ratio | Mfr |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ITG-3701 | TDK InvenSense |
Min: 1 Mult: 1 |
download | Digital | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | 3.3mA | ROHS3 Compliant | 16-WFQFN Exposed Pad | 500Hz ~ 16kHz | Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor | 1.71V~3.6V | I2C, SPI | X (Pitch), Y (Roll), Z (Yaw) | ±500, 1000, 2000, 4000 | 8.2 ~ 65.5 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EV_INV-ARM | TDK InvenSense |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | RoHS Compliant | 2010 | 16 Weeks | Interface Board | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EV_MPU-6515 | TDK InvenSense |
Min: 1 Mult: 1 |
download | Non-RoHS Compliant | 2016 | 18 Weeks | Accelerometer, Gyroscope, Magnetometer, 3 Axis | MPU-6515 | Board(s) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DK-10100 | TDK InvenSense |
Min: 1 Mult: 1 |
download | SmartMotion® | 1 (Unlimited) | ROHS3 Compliant | 2018 | 16 Weeks | I2C, USB | 5V USB | ±1,.5 hPA, ±0.4°C | 30 ~ 110 kPA, -40 ~ 85°C | Barometric Pressure, Temperature | ATSMG55, ICP-10100 | Board(s) | Yes, MCU, 32-Bit | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ICM-42605 | TDK InvenSense |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 1 (Unlimited) | ROHS3 Compliant | 14-VFLGA Module | 16 Weeks | I²C, I3C℠, SPI | Accelerometer, Gyroscope, 6 Axis | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EV_ICS-40730-FX | TDK InvenSense |
Min: 1 Mult: 1 |
download | Audio | 1 (Unlimited) | Non-RoHS Compliant | https://pdf.utmel.com/r/datasheets/invensense-evics40730fx-datasheets-9290.pdf | 16 Weeks | MEMS Omnidirectional Microphones | ICS-40730 | Analog Output | Board(s) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EV_ICS-40310-FX | TDK InvenSense |
Min: 1 Mult: 1 |
download | Audio | 1 (Unlimited) | ROHS3 Compliant | 16 Weeks | MEMS Omnidirectional Microphones | ICS-40310 | Analog Output | Board(s) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EV_ICS-52000-ARRAY | TDK InvenSense |
Min: 1 Mult: 1 |
download | Audio | 1 (Unlimited) | Non-RoHS Compliant | 2016 | https://pdf.utmel.com/r/datasheets/tdkinvensense-evics52000array-datasheets-6504.pdf | 16 Weeks | MEMS Omnidirectional Microphones | ICS-52000 | Digital Output | Board(s) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| INMP504ACEZ-R0 | TDK InvenSense |
Min: 1 Mult: 1 |
download | MEMS (Silicon) | INMP504 | Cut Tape (CT) | 0.132Lx0.098W 3.35mmx2.50mm | 1 (Unlimited) | Solder Pads | 225μA | 1.6V~3.3V | Bottom | ROHS3 Compliant | 2014 | Rectangular | 17 Weeks | 200Ohms | -38dB ±3dB @ 94dB SPL | Analog | 0.039 0.98mm | 100Hz~20kHz | Omnidirectional | 65dB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ICS-43432 | TDK InvenSense |
Min: 1 Mult: 1 |
download | MEMS (Silicon) | Surface Mount | Cut Tape (CT) | 0.157Lx0.118W 4.00mmx3.00mm | 1 (Unlimited) | Solder Pads | 85°C | -40°C | 1.5mA | 1.62V~3.63V | Bottom | ROHS3 Compliant | 2014 | 1.1mm | Rectangular | 24μA | 70 Weeks | PRODUCTION (Last Updated: 1 month ago) | 20kHz | -26dB ±1dB @ 94dB SPL | Digital, I2S | 50Hz~20kHz | Omnidirectional | 65dB | ||||||||||||||||||||||||||||||||||||||||||||||||||
| DK-42352 | TDK InvenSense |
Min: 1 Mult: 1 |
SmartIndustrial? | I2C, I3C, Serial, SPI | 1.71V ~ 3.6V | 16384LSB/g, 8192LSB/g, 4096LSB/g, 2048LSB/g | ±2g, ±4g, ±8g, ±16g | Accelerometer, 3 Axis | IIM-42352 | Board(s) | No | TDK InvenSense | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DK-46234 | TDK InvenSense |
Min: 1 Mult: 1 |
- | TDK InvenSense | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ISZ-2510 | TDK InvenSense |
Min: 1 Mult: 1 |
download | Digital | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | 2.8mA | ROHS3 Compliant | /files/invensense-isz2510-datasheets-2967.pdf | 16-VFQFN Exposed Pad | 5Hz ~ 8.8kHz | Adjustable Bandwidth, Selectable Scale, Temperature Sensor | 1.71V~3.6V | I2C, SPI | Z (Yaw) | ±250, 500, 1000, 2000 | 16.4 ~ 131 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MOD_CH101-03-01 | TDK InvenSense |
Min: 1 Mult: 1 |
download | Chirp Micro | -40°C~85°C | 1 (Unlimited) | 1.8V | ROHS3 Compliant | /files/tdkinvensense-modch1010301-datasheets-8453.pdf | 14 Weeks | 180° | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EV_ICM-20600 | TDK InvenSense |
Min: 1 Mult: 1 |
download | Non-RoHS Compliant | 16 Weeks | I2C, SPI | 1.71V~3.45V | ±2g, 4g, 8g, 16g, ±250°/sec, ±500°/sec, ±1000°/sec, ±2000°/sec | Accelerometer, Gyroscope, 3 Axis | ICM-20600 | Board(s) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DK-42605 | TDK InvenSense |
Min: 1 Mult: 1 |
download | Bulk | 1 (Unlimited) | ROHS3 Compliant | 16 Weeks | I2C, Serial, SPI | 1.71V~3.6V | 16384LSB/g, 8192LSB/g, 4096LSB/g, 2048LSB/g | ±2g, 4g, 8g, 16g | Accelerometer, Gyroscope, 3 Axis | ICM-42605 | Board(s) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ICM-20600 | TDK InvenSense |
Min: 1 Mult: 1 |
download | MotionTracking™ | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 14-VFLGA Module | 16 Weeks | I2C, SPI | Accelerometer, Gyroscope, 6 Axis | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EV_ICS-40618-FX | TDK InvenSense |
Min: 1 Mult: 1 |
download | Audio | 1 (Unlimited) | ROHS3 Compliant | 2016 | 16 Weeks | MEMS Omnidirectional Microphones | ICS-40618 | Analog Output | Board(s) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EV_INMP504-FX | TDK InvenSense |
Min: 1 Mult: 1 |
download | Audio | 1 (Unlimited) | ROHS3 Compliant | 2014 | 18 Weeks | Yes | MEMS Omnidirectional Microphones | INMP504 | Analog Output, 200Ohm Impedance | Board(s) | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MEMS-KIT | TDK InvenSense |
Min: 1 Mult: 1 |
download | Surface Mount | Book | 1 (Unlimited) | ROHS3 Compliant | Microphone | 30 Pieces (6 Values - 5 Each) | MEMS (Silicon) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| INMP522ACEZ-R0 | TDK InvenSense |
Min: 1 Mult: 1 |
download | MEMS (Silicon) | INMP522 | Tape & Reel (TR) | 0.157Lx0.118W 4.00mmx3.00mm | 1 (Unlimited) | Solder Pads | 3.63V | 1.4mA | 1.4mA | 1.62V~3.63V | Bottom | ROHS3 Compliant | 4mm | 1.1mm | 3mm | Rectangular | 19 Weeks | -26dB ±1dB @ 94dB SPL | Digital, PDM | 0.039 1.00mm | 75Hz~20kHz | Omnidirectional | 65dB | |||||||||||||||||||||||||||||||||||||||||||||||||||
| ICS-40212 | TDK InvenSense |
Min: 1 Mult: 1 |
download | MEMS (Silicon) | ICS-40212 | Tape & Reel (TR) | 0.138Lx0.104W 3.50mmx2.65mm | 1 (Unlimited) | Solder Pads | 190μA | 1.52V~3.63V | Bottom | ROHS3 Compliant | 2016 | /files/invensense-ics40212-datasheets-2784.pdf | Rectangular | 16 Weeks | -38dB ±1dB @ 94dB SPL | Analog | 0.039 0.98mm | 35Hz~20kHz | Omnidirectional | 66dB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EV_IIM-42351 | TDK InvenSense |
Min: 1 Mult: 1 |
SmartIndustrial? | I2C, I3C, Serial, SPI | 1.71V ~ 3.6V | 16384LSB/g, 8192LSB/g, 4096LSB/g, 2048LSB/g | ±2g, ±4g, ±8g, ±16g | Accelerometer, 3 Axis | IIM-42351 | Board(s) | No | TDK InvenSense | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EV_MPU-6000 | TDK InvenSense |
Min: 1 Mult: 1 |
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| IAM-20380 | TDK InvenSense |
Min: 1 Mult: 1 |
download | Digital | Automotive, AEC-Q100 | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 16-WFLGA Module | 27kHz | 16 Weeks | Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor | 1.71V~3.6V | I2C, SPI | X (Pitch), Y (Roll), Z (Yaw) | ±250, 500, 1000, 2000 | 16.4 ~ 131 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPU-9150EVB | TDK InvenSense |
Min: 1 Mult: 1 |
download | Box | 1 (Unlimited) | RoHS Compliant | 2012 | /files/tdkinvensense-mpu9150evb-datasheets-6599.pdf | I2C | Yes | 2.375V~3.465V | ±2g, 4g, 8g, 16g, ±250°/sec, ±500°/sec, ±1000°/sec, ±2000°/sec, ±1200μT | Accelerometer, Gyroscope, Magnetometer, 3 Axis | MPU-9150 | Board(s) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EV_ICG-20330 | TDK InvenSense |
Min: 1 Mult: 1 |
download | Non-RoHS Compliant | 16 Weeks | I2C, SPI | 1.71V~3.45V | 1048LSB/°/s | ±31.25°/sec, ±62.5°/sec, ±125°/sec, ±250°/sec | Gyroscope, 3 Axis | ICG-20330 | Board(s) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPU-6000EVB | TDK InvenSense |
Min: 1 Mult: 1 |
download | Box | 1 (Unlimited) | ROHS3 Compliant | 2011 | /files/invensense-mpu6000evb-datasheets-6443.pdf | I2C, SPI | Yes | 2.375V~3.46V | ±2g, 4g, 8g, 16g, ±250°/sec, ±500°/sec, ±1000°/sec, ±2000°/sec | Accelerometer, Gyroscope, 3 Axis | MPU-6000 | Board(s) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ICM-20689 | TDK InvenSense |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 0.95mm | ROHS3 Compliant | 2014 | 24-VFQFN Module Exposed Pad | 4mm | 4mm | 24 | 16 Weeks | 1 | YES | QUAD | NO LEAD | 1.8V | 0.5mm | 3.45V | 1.71V | ANALOG CIRCUIT | S-XQCC-N24 | I2C, SPI | Accelerometer, Gyroscope, Temperature, 6 Axis | |||||||||||||||||||||||||||||||||||||||||||||||||
| EV_ICS-40619-FX | TDK InvenSense |
Min: 1 Mult: 1 |
download | Audio | 1 (Unlimited) | ROHS3 Compliant | 2016 | 16 Weeks | MEMS Omnidirectional Microphones | ICS-40619 | Analog Output | Board(s) |
