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ContactTDK InvenSense(364)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Size / Dimension | Moisture Sensitivity Level (MSL) | Termination | Voltage - Rated | Technology | Operating Supply Current | Current - Supply | Voltage Range | Port Location | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Bandwidth | Lead Free | Shape | Depth | Number of Terminations | Factory Lead Time | REACH SVHC | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Lifecycle Status | Impedance | Number of Functions | Evaluation Kit | JESD-609 Code | Feature | Terminal Finish | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Analog IC - Other Type | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Sensitivity | Output Type | Function | Height (Max) | Frequency Range | Direction | Sensing Range | Sensor Type | Utilized IC / Part | Secondary Attributes | Axis | Range °/s | Sensitivity (LSB/(°/s)) | Primary Attributes | Supplied Contents | Embedded | S/N Ratio | Mfr |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ICG-20330 | TDK InvenSense |
Min: 1 Mult: 1 |
download | Digital | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | 2.9mA | ROHS3 Compliant | 2014 | 1.6kHz | 16 Weeks | Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor | 1.71V~3.45V | I2C, SPI | X (Pitch), Y (Roll), Z (Yaw) | ±31.25, 62.5, 125, 250 | 131 ~ 1048 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EV_MPU-6500 | TDK InvenSense |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | Non-RoHS Compliant | I2C, SPI | 1.71V~3.6V | ±2g, 4g, 8g, 16g, ±250°/sec, ±500°/sec, ±1000°/sec, ±2000°/sec | Accelerometer, Gyroscope, 3 Axis | MPU-6500 | Board(s) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DK-20948 | TDK InvenSense |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | ROHS3 Compliant | 2016 | /files/invensense-dk20948-datasheets-6090.pdf | 16 Weeks | I2C, SPI | 5V USB | ±2g, 4g, 8g, 16g, ±250°/sec, ±500°/sec, ±1000°/sec, ±2000°/sec, ±4900μT | Accelerometer, Gyroscope, Magnetometer, 3 Axis | ICM-20948 | Board(s) | Yes, MCU, 32-Bit | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| STUDIO-30630-EVB | TDK InvenSense |
Min: 1 Mult: 1 |
download | FireFly | 1 (Unlimited) | RoHS Compliant | /files/tdkinvensense-studio30630evb-datasheets-7137.pdf | 16 Weeks | I2C, SPI | Yes | Accelerometer, Gyroscope, Magnetometer | ICM-30630 | Board(s) | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IAM-20680 | TDK InvenSense |
Min: 1 Mult: 1 |
download | Automotive, AEC-Q100 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | 0.8mm | ROHS3 Compliant | 2014 | 16-WFLGA Module | 3mm | 3mm | 16 | 16 Weeks | 1 | e4 | Gold (Au) - with Nickel (Ni) barrier | YES | BOTTOM | BUTT | NOT SPECIFIED | 1.8V | 0.5mm | 3.6V | 1.71V | ANALOG CIRCUIT | NOT SPECIFIED | S-XBCC-B16 | I2C, SPI | Accelerometer, Gyroscope, 6 Axis | |||||||||||||||||||||||||||||||||||||||||||||||
| EV_ICS-40180-FX | TDK InvenSense | $35.20 |
Min: 1 Mult: 1 |
download | Audio | 1 (Unlimited) | ROHS3 Compliant | 2014 | 16 Weeks | MEMS Omnidirectional Microphones | ICS-40180 | Analog Output | Board(s) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EV_INMP401 | TDK InvenSense |
Min: 1 Mult: 1 |
download | Audio | 1 (Unlimited) | ROHS3 Compliant | 2014 | 18 Weeks | Yes | MEMS Omnidirectional Microphones | INMP401 | -37dB Sensitivity, 62dB SNR | Analog Output, 200Ohm Impedance | Board(s) | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| INMP411ACEZ-R0 | TDK InvenSense |
Min: 1 Mult: 1 |
download | MEMS (Silicon) | INMP411 | Tape & Reel (TR) | 0.186Lx0.148W 4.72mmx3.76mm | 1 (Unlimited) | Solder Pads | 3.6V | 250μA | 250μA | 1.5V~3.63V | Bottom | ROHS3 Compliant | 2014 | /files/invensense-inmp411acezr0-datasheets-7739.pdf | 4.72mm | 1.1mm | 3.76mm | Rectangular | 19 Weeks | 200Ohm | -48dB ±2dB @ 94dB SPL | Analog | 0.039 1.00mm | 28Hz~20kHz | Omnidirectional | 62dB | ||||||||||||||||||||||||||||||||||||||||||||||||||
| ICS-40619 | TDK InvenSense |
Min: 1 Mult: 1 |
download | MEMS (Silicon) | Tape & Reel (TR) | 0.138Lx0.104W 3.50mmx2.65mm | 1 (Unlimited) | Solder Pads | 190μA | 190μA | 1.52V~3.63V | Top | ROHS3 Compliant | 2014 | Rectangular | 16 Weeks | PRODUCTION (Last Updated: 1 month ago) | -38db ±1dB | Analog | 0.043 1.10mm | 50Hz~20kHz | Omnidirectional | 67dB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ICS-41351 | TDK InvenSense |
Min: 1 Mult: 1 |
download | MEMS (Silicon) | Tape & Reel (TR) | 0.138Lx0.104W 3.50mmx2.65mm | 1 (Unlimited) | Solder Pads | 1.8V | 600μA | Top | ROHS3 Compliant | /files/tdkinvensense-ics41351-datasheets-3007.pdf | Rectangular | 16 Weeks | -26dB ±1dB @ 94dB SPL | Digital, PDM | 0.043 1.08mm | 50Hz~20kHz | Omnidirectional | 65dB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DK-42652 | TDK InvenSense |
Min: 1 Mult: 1 |
SmartIndustrial? | I2C, I3C, Serial, SPI | 1.71V ~ 3.6V | 16384LSB/g, 8192LSB/g, 4096LSB/g, 2048LSB/g, 2097.2LSB/°/s, 1048.6LSB/°/s, 524.3LSB/°/s, 262LSB/°/s, 131LSB/°/s, 65.5LSB/°/s, 32.8LSB/°/s, 16.4LSB/°/s | ±2g, ±4g, ±8g, ±16g, ±15.625°/sec, ±2000°/sec | Accelerometer, Gyroscope | IIM-42652 | Board(s) | No | TDK InvenSense | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ICG-1020S | TDK InvenSense |
Min: 1 Mult: 1 |
download | Digital | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 12-WFLGA | 32kHz | 16 Weeks | Sleep Mode, Temperature Sensor | 1.71V~3.6V | SPI | X (Pitch), Y (Roll) | ±46.5, 374 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EV_ICM-20609 | TDK InvenSense |
Min: 1 Mult: 1 |
download | Non-RoHS Compliant | 2015 | I2C, SPI | 1.71V~3.45V | ±2g, 4g, 8g, 16g, ±250°/sec, ±500°/sec, ±1000°/sec, ±2000°/sec | Accelerometer, Gyroscope, 3 Axis | ICM-20609 | Board(s) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EV_ICM-20948 | TDK InvenSense |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | Non-RoHS Compliant | 2014 | 16 Weeks | ±2g, 4g, 8g, 16g, ±250°/sec, ±500°/sec, ±1000°/sec, ±2000°/sec, ±4900μT | Accelerometer, Gyroscope, Magnetometer, 3 Axis | ICM-20948 | Board(s) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| BRD_CARRIER | TDK InvenSense |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | Non-RoHS Compliant | 2016 | /files/invensense-brdcarrier-datasheets-6706.pdf | 16 Weeks | Accelerometer, Gyroscope, 3 Axis | ICM-20648, ICM-20948 | Board(s) | Yes, MCU, 32-Bit | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ICM-20789 | TDK InvenSense |
Min: 1 Mult: 1 |
download | MotionTracking™ | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 1.465mm | ROHS3 Compliant | 2017 | 24-LFLGA Module | 4mm | 4mm | 24 | 16 Weeks | PRODUCTION (Last Updated: 2 months ago) | 1 | YES | BOTTOM | BUTT | 1.8V | 0.5mm | 3.45V | 1.71V | ANALOG CIRCUIT | S-XBGA-B24 | I2C | ||||||||||||||||||||||||||||||||||||||||||||||||||
| EV_INMP510-FX | TDK InvenSense |
Min: 1 Mult: 1 |
download | Audio | 1 (Unlimited) | ROHS3 Compliant | 2014 | 16 Weeks | Yes | MEMS Omnidirectional Microphones | INMP510 | Analog Output | Board(s) | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EV_INMP405-FX | TDK InvenSense |
Min: 1 Mult: 1 |
download | Audio | 3 (168 Hours) | 2014 | https://pdf.utmel.com/r/datasheets/tdkinvensense-evinmp405fx-datasheets-8851.pdf | MEMS Omnidirectional Microphones | INMP405 | Analog Output, 200Ohm Impedance | Board(s) | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| INMP621ACEZ-R0 | TDK InvenSense |
Min: 1 Mult: 1 |
download | MEMS (Silicon) | INMP621 | Cut Tape (CT) | 0.157Lx0.118W 4.00mmx3.00mm | 1 (Unlimited) | Solder Pads | 1.6mA | 1.6mA | 1.62V~3.63V | Bottom | ROHS3 Compliant | 2014 | 4mm | 1mm | 3mm | Rectangular | 16 Weeks | -46dB ±2dB @ 94dB SPL | Digital, PDM | 0.043 1.10mm | 45Hz~20kHz | Omnidirectional | 65dB | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| INMP504ACEZ-R7 | TDK InvenSense |
Min: 1 Mult: 1 |
download | MEMS (Silicon) | INMP504 | Surface Mount | Cut Tape (CT) | 0.132Lx0.098W 3.35mmx2.50mm | 3 (168 Hours) | Solder Pads | 225μA | 1.6V~3.3V | Bottom | ROHS3 Compliant | 2011 | LGA | 980μm | Lead Free | Rectangular | 2.5mm | 16 Weeks | No SVHC | 3.3V | 1.6V | 3 | 200Ohm | -38dB ±3dB @ 94dB SPL | Analog | 100Hz~20kHz | Omnidirectional | 65dB | ||||||||||||||||||||||||||||||||||||||||||||||||
| ICS-40181 | TDK InvenSense |
Min: 1 Mult: 1 |
download | MEMS (Silicon) | Tape & Reel (TR) | 0.138Lx0.104W 3.50mmx2.65mm | 1 (Unlimited) | Solder Pads | 250μA | 1.5V~3.63V | Top | ROHS3 Compliant | 2014 | Rectangular | 16 Weeks | 3.63V | 1.5V | PRODUCTION (Last Updated: 1 month ago) | 350Ohm | -38db ±1dB | Analog | 0.043 1.10mm | 60Hz~20kHz | Omnidirectional | 65dB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DK-42670-P | TDK InvenSense |
Min: 1 Mult: 1 |
- | - | - | - | - | Accelerometer, Gyroscope | ICM-42670-P | Board(s) | - | TDK InvenSense | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ITG-3400 | TDK InvenSense |
Min: 1 Mult: 1 |
download | Digital | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | 3.2mA | RoHS Compliant | 2014 | 24-VFQFN Exposed Pad | 4kHz | Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor | 1.71V~3.45V | I2C, SPI | X (Pitch), Y (Roll), Z (Yaw) | ±250, 500, 1000, 2000 | 16.4 ~ 131 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EV_ICG-20660L | TDK InvenSense |
Min: 1 Mult: 1 |
download | Non-RoHS Compliant | 2017 | 16 Weeks | I2C, SPI | 1.71V~3.45V | ±2g, 4g, 8g, 16g, ±125°/sec, ±250°/sec, ±500°/sec | Accelerometer, Gyroscope, 3 Axis | ICG-20660 | Board(s) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EV_ICM-20602 | TDK InvenSense |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | ROHS3 Compliant | 2017 | 16 Weeks | I2C, SPI | Yes | 1.71V~3.45V | ±2g, 4g, 8g, 16g, ±250°/sec, ±500°/sec, ±1000°/sec, ±2000°/sec | Accelerometer, Gyroscope, 3 Axis | ICM-20602 | Board(s) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| STUDIO-30670-EVB | TDK InvenSense |
Min: 1 Mult: 1 |
download | Non-RoHS Compliant | I2C, SPI | 1.71V~3.6V | ±2g, 4g, 8g, 16g, ±250°/sec, ±500°/sec, ±1000°/sec, ±2000°/sec | Accelerometer, Gyroscope, 3 Axis | ICM-30670 | Board(s) | Yes, MCU, 32-Bit | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ICM-42688-P | TDK InvenSense |
Min: 1 Mult: 1 |
download | Tape & Reel (TR) | 1 (Unlimited) | ROHS3 Compliant | 16 Weeks | Accelerometer, Gyroscope, 6 Axis | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EV_INMP522-FX | TDK InvenSense |
Min: 1 Mult: 1 |
download | Audio | 1 (Unlimited) | ROHS3 Compliant | /files/invensense-evinmp522fx-datasheets-2066.pdf | Yes | MEMS Omnidirectional Microphones | INMP522 | Digital Output | Board(s) | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EV_INMP404-FX | TDK InvenSense |
Min: 1 Mult: 1 |
download | Audio | 1 (Unlimited) | ROHS3 Compliant | 2014 | Yes | MEMS Omnidirectional Microphones | INMP404 | Analog Output, 200Ohm Impedance | Board(s) | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ICS-41352 | TDK InvenSense |
Min: 1 Mult: 1 |
download | MEMS (Silicon) | ICS-41352 | Tape & Reel (TR) | 0.138Lx0.104W 3.50mmx2.65mm | 1 (Unlimited) | Solder Pads | 1.8V | 600μA | 1.65V~3.63V | Bottom | ROHS3 Compliant | 2016 | Rectangular | 16 Weeks | -26dB ±1dB @ 94dB SPL | Digital, PDM | 0.039 0.98mm | 85kHz | Omnidirectional | 64dB |
