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ContactAries Electronics(10778)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | Max Operating Temperature | Min Operating Temperature | RoHS Status | Published | Datasheet | Current Rating | Package / Case | Color | Lead Free | Material | Factory Lead Time | Approval Agency | REACH SVHC | Number of Pins | Lead Pitch | Accessory Type | Pbfree Code | Number of Positions | MIL Conformance | DIN Conformance | IEC Conformance | Number of Contacts | Contact Finish - Mating | Flammability Rating | ECCN Code | Additional Feature | Contact Plating | Housing Material | Lead Length | Insulation Resistance | JESD-609 Code | Feature | Terminal Pitch | Operating Temperature (Max) | Pitch | Connector Support Type | Assembly Item Name | Body Length or Diameter | Body Breadth | Number of Rows | Device Socket Type | Current Rating (Amps) | PCB Contact Pattern | Body Depth | Contact Style | Mating Contact Pitch | PCB Contact Row Spacing | Dielectric Withstanding Voltage | Number of Positions or Pins (Grid) | Material Flammability Rating | Convert From (Adapter End) | Convert To (Adapter End) | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Material - Post | Pitch - Mating | Termination Post Length | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Board Material |
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| 20-0518-10T | Aries Electronics | $2.21 |
Min: 1 Mult: 1 |
download | SIP | 518 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2014 | https://pdf.utmel.com/r/datasheets/arieselectronics-10051810-datasheets-2521.pdf | 3A | Lead Free | 5 Weeks | 20 | 2.54mm | yes | 20 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e3 | Open Frame | 1 | 20 (1 x 20) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||||||
| 42-6554-16 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 55 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf | 1A | 6 Weeks | yes | 42 | 42 | Nickel Boron | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Nickel | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | 1000000000Ohm | Closed Frame | 2.54mm | 200°C | 2.69 inch | 0.9 inch | RECTANGULAR | 0.47 inch | BELLOWED TYPE | 0.1 inch | 0.6 mm | 1000VAC V | 42 (2 x 21) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | ||||||||||||||||||||||||||||||
| 14-3518-101 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.3 (7.62mm) Row Spacing | 518 | Through Hole | Through Hole | Tube | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/aries-143518101-datasheets-6691.pdf | 3A | Lead Free | 5 Weeks | 2.54mm | yes | 14 | 14 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e3 | Open Frame | 0.7 inch | 0.4 inch | 2 | RECTANGULAR | RND PIN-SKT | 0.1 inch | 0.3 mm | 14 (2 x 7) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||
| 84-PLS10003-12 | Aries Electronics |
Min: 1 Mult: 1 |
download | PGA, ZIF (ZIP) | PLS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||||||||||||
| 01-0518-10H | Aries Electronics |
Min: 1 Mult: 1 |
download | SIP | 518 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-10051810-datasheets-2521.pdf | 3A | 5 Weeks | 1 | 2.54mm | yes | 1 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e3 | Open Frame | RECTANGULAR | RND PIN-SKT | 1 (1 x 1) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||||||
| 30-PLS16018-12 | Aries Electronics |
Min: 1 Mult: 1 |
download | PGA, ZIF (ZIP) | PLS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||||||||||||
| 01-0518-11H | Aries Electronics |
Min: 1 Mult: 1 |
download | SIP | 518 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-10051810-datasheets-2521.pdf | 3A | 5 Weeks | 1 | 2.54mm | yes | 1 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e4 | Open Frame | RECTANGULAR | RND PIN-SKT | 1 (1 x 1) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||||||||
| 48-6551-16 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 55 | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf | 6 Weeks | yes | 48 | Nickel Boron | EAR99 | STANDARD: UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | Closed Frame | 1A | 48 (2 x 24) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | ||||||||||||||||||||||||||||||||||||||||||||||
| 02-0513-11 | Aries Electronics |
Min: 1 Mult: 1 |
download | SIP | 0513 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-07051310-datasheets-2771.pdf | 3A | 5 Weeks | 2.54mm | yes | 2 | 2 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e4 | 1 | RECTANGULAR | RND PIN-SKT | 2 (1 x 2) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||||||||
| 128-PLS12023-12 | Aries Electronics |
Min: 1 Mult: 1 |
download | PGA, ZIF (ZIP) | PLS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | 128 | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||||||||||
| 04-1508-21 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.2 (5.08mm) Row Spacing | 508 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-01050830-datasheets-9229.pdf | 3A | 5 Weeks | 4 | 2.54mm | 4 | Gold | UL94 V-0 | EAR99 | Polyamide (PA46), Nylon 4/6 | 9.144mm | Closed Frame | 0.2 inch | 0.2 inch | 1 | RECTANGULAR | RND PIN-SKT | 4 (2 x 2) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.360 9.14mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||||||||
| 24-3554-18 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 55 | Through Hole | Through Hole | -55°C~250°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | 1A | 6 Weeks | 24 | 24 | Nickel Boron | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Nickel | Polyetheretherketone (PEEK), Glass Filled | 2.794mm | 1000000000Ohm | Closed Frame | 2.54mm | 1.79 inch | 0.9 inch | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 1000VAC V | 24 (2 x 12) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Nickel | Beryllium Nickel | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | |||||||||||||||||||||||||||||||||
| 22-4518-00 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.4 (10.16mm) Row Spacing | 518 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-08351800-datasheets-2355.pdf | 3A | 6 Weeks | 2.54mm | 22 | 22 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e3 | Open Frame | 1.1 inch | 2 | RECTANGULAR | 0.15 inch | RND PIN-SKT | 0.1 inch | 0.4 mm | 22 (2 x 11) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||
| 96-PRS14024-12 | Aries Electronics |
Min: 1 Mult: 1 |
download | PGA, ZIF (ZIP) | PRS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||||||||||||
| 17-0513-10H | Aries Electronics |
Min: 1 Mult: 1 |
download | SIP | 0513 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-07051310-datasheets-2771.pdf | 3A | 5 Weeks | 2.54mm | yes | 17 | 17 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e3 | 1 | RECTANGULAR | RND PIN-SKT | 17 (1 x 17) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||||||
| 10-655-10 | Aries Electronics |
Min: 1 Mult: 1 |
download | 655 | Bulk | ROHS3 Compliant | 2006 | /files/arieselectronics-0665810-datasheets-2816.pdf | Red | Lead Free | 5 Weeks | 10 | Cap (Cover) | 10 | Tin | 2.54mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 16-3518-10H | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.3 (7.62mm) Row Spacing | 518 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/arieselectronics-08351810t-datasheets-2464.pdf | 3A | 4 Weeks | 2.54mm | yes | 16 | 16 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e3 | Open Frame | 105°C | 1.6 inch | 0.4 inch | 2 | RECTANGULAR | RND PIN-SKT | 0.1 inch | 0.3 mm | 16 (2 x 8) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||
| 22-655-10 | Aries Electronics |
Min: 1 Mult: 1 |
download | 655 | Bulk | ROHS3 Compliant | 2006 | /files/arieselectronics-0665810-datasheets-2816.pdf | Red | Lead Free | 5 Weeks | 22 | 2.54mm | Cap (Cover) | 22 | Tin | 2.54mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 14-8260-10 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-14840010-datasheets-7181.pdf | 1A | 7 Weeks | yes | 14 | 14 | Tin | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 2.54mm | 0.75 inch | 0.395 inch | RECTANGULAR | 0.26 inch | SQ PIN-SKT | 0.1 inch | 0.3 mm | 14 (2 x 7) | UL94 V-0 | 200.0μin 5.08μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||
| 16-650-10 | Aries Electronics |
Min: 1 Mult: 1 |
download | 650 | Bulk | Not Applicable | ROHS3 Compliant | 2006 | /files/arieselectronics-1465010-datasheets-1163.pdf | Black | Lead Free | Glass | 4 Weeks | UL | Cap (Cover) | yes | 16 | NO | NO | NO | Nylon | CONNECTOR ACCESSORY | COVER ITEM | 2 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| 14-8870-10 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | /files/arieselectronics-14840010-datasheets-7181.pdf | 1A | Lead Free | 7 Weeks | yes | 14 | 14 | Tin | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 2.54mm | 0.75 inch | 0.395 inch | RECTANGULAR | 0.91 inch | SQ PIN-SKT | 0.1 inch | 0.3 mm | 14 (2 x 7) | UL94 V-0 | 200.0μin 5.08μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||
| 18-35W000-10-P | Aries Electronics |
Min: 1 Mult: 1 |
download | Correct-A-Chip® 35W000 | Through Hole | Through Hole | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2006 | /files/arieselectronics-2835w00010-datasheets-8362.pdf | SOIC | 5 Weeks | 18 | 18 | 3.175mm | SOIC-W | DIP, 0.3 (7.62mm) Row Spacing | Brass | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | Tin-Lead | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24-1518-11 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.2 (5.08mm) Row Spacing | 518 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-10051810-datasheets-2521.pdf | 3A | 5 Weeks | 24 | 2.54mm | yes | 24 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e4 | Open Frame | 2 | RECTANGULAR | 0.165 inch | RND PIN-SKT | 0.1 inch | 0.1 mm | 24 (2 x 12) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||||
| LCQT-QFP0.65-52 | Aries Electronics |
Min: 1 Mult: 1 |
download | Correct-A-Chip® | Through Hole | Through Hole | -55°C~125°C | 1 (Unlimited) | Solder | 125°C | -55°C | Non-RoHS Compliant | /files/arieselectronics-lcqtqfp0564-datasheets-0071.pdf | QFP | Lead Free | 5 Weeks | No SVHC | 52 | UL94 V-0 | Polyester | 5.9944mm | UL94 V-0 | Multiple Packages | QFP | Brass | 0.026 0.65mm | 0.236 6.00mm | 0.100 2.54mm | Gold | Flash | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||||||||||||
| 02-0501-31 | Aries Electronics |
Min: 1 Mult: 1 |
download | SIP | 501 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Wire Wrap | 125°C | -55°C | ROHS3 Compliant | 2007 | /files/arieselectronics-02050130-datasheets-3742.pdf | 1A | SIP | 7 Weeks | 2.54mm | 2 | Gold | UL94 V-0 | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 17.526mm | 2.54mm | 1 | 1A | 2 (1 x 2) | UL94 V-0 | 10.0μin 0.25μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.690 17.52mm | 0.100 2.54mm | Gold | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||||||||
| 18-666000-00 | Aries Electronics |
Min: 1 Mult: 1 |
download | Correct-A-Chip® 666000 | Surface Mount | Surface Mount | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2006 | /files/arieselectronics-1666600000-datasheets-9487.pdf | 5 Weeks | 18 | 18 | EAR99 | UL 94V-0 | 2.032mm | e0 | IC SOCKET | SOIC | SOWIC | Brass | 0.050 1.27mm | 0.080 2.03mm | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||||||||||||||||||
| 37-0518-10 | Aries Electronics |
Min: 1 Mult: 1 |
download | SIP | 518 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2013 | /files/arieselectronics-10051810-datasheets-2521.pdf | 3A | 5 Weeks | 37 | 2.54mm | yes | 37 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e3 | Open Frame | 3.7 inch | 1 | RECTANGULAR | RND PIN-SKT | 37 (1 x 37) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||||
| 26-665000-00 | Aries Electronics |
Min: 1 Mult: 1 |
download | Correct-A-Chip® 665000 | Surface Mount | Surface Mount | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2006 | /files/arieselectronics-1666500000-datasheets-0505.pdf | SOIC | 5 Weeks | 26 | 26 | 787.4μm | SOIC-W | SOIC | Brass | 0.050 1.27mm | 0.031 0.80mm | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| 26-3513-10T | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.3 (7.62mm) Row Spacing | Lo-PRO®file, 513 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-08251310-datasheets-2619.pdf | 3A | 5 Weeks | 2.54mm | yes | 26 | 26 | Gold | UL94 V-0 | EAR99 | LOW PROFILE; UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e3 | Closed Frame | 0.4 inch | 2 | RECTANGULAR | 0.165 inch | RND PIN-SKT | 0.1 inch | 0.3 mm | 26 (2 x 13) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||
| 20-350000-10-HT | Aries Electronics |
Min: 1 Mult: 1 |
download | Correct-A-Chip® 350000 | Through Hole | Through Hole | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2005 | /files/arieselectronics-1435000010ht-datasheets-0250.pdf | 6 Weeks | 20 | 20 | Tin | EAR99 | SOCKET ADAPTER | POLYAMIDE | 3.175mm | High Temperature | IC SOCKET | SOIC | DIP, 0.3 (7.62mm) Row Spacing | Brass | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | Tin-Lead | 200.0μin 5.08μm | Polyimide (PI) |
