Aries Electronics(10778)

Name	Manufacturer	Pricing(USD)	Quantity	Part Status	Type	Series	Mount	Mounting Type	Operating Temperature	Packaging	Moisture Sensitivity Level (MSL)	Termination	Max Operating Temperature	Min Operating Temperature	RoHS Status	Published	Datasheet	Current Rating	Package / Case	Lead Free	Factory Lead Time	Number of Pins	Lead Pitch	Pbfree Code	Number of Positions	Number of Contacts	Contact Finish - Mating	Flammability Rating	ECCN Code	Additional Feature	Contact Plating	Housing Material	Lead Length	Insulation Resistance	JESD-609 Code	Feature	Terminal Pitch	Operating Temperature (Max)	Pitch	Body Length or Diameter	Body Breadth	Number of Rows	Current Rating (Amps)	PCB Contact Pattern	Body Depth	Contact Style	Mating Contact Pitch	PCB Contact Row Spacing	Dielectric Withstanding Voltage	Number of Positions or Pins (Grid)	Material Flammability Rating	Contact Finish Thickness - Mating	Contact Material - Mating	Contact Material - Post	Pitch - Mating	Termination Post Length	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post
29-0511-11	Aries Electronics		RFQ Min: 1 Mult: 1	download	SIP	511	Through Hole	Through Hole	-55°C~125°C	Bulk	1 (Unlimited)	Solder	125°C	-55°C	ROHS3 Compliant	2006	https://pdf.utmel.com/r/datasheets/arieselectronics-12051110-datasheets-7232.pdf	1A	SIP		7 Weeks		2.54mm		29		Gold	UL94 V-0			Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	3.81mm						2.54mm			1	1A							29 (1 x 29)	UL94 V-0	10.0μin 0.25μm	Phosphor Bronze	Phosphor Bronze	0.100 2.54mm	0.150 3.81mm	0.100 2.54mm	Gold	10.0μin 0.25μm
1108594	Aries Electronics		RFQ Min: 1 Mult: 1	download							1 (Unlimited)				ROHS3 Compliant	2013	https://pdf.utmel.com/r/datasheets/arieselectronics-06350830-datasheets-4085.pdf		508		5 Weeks
28-3574-10	Aries Electronics		RFQ Min: 1 Mult: 1	download	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	57	Through Hole	Through Hole		Bulk	1 (Unlimited)	Solder			ROHS3 Compliant	2005	https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf	1A			5 Weeks			yes	28	28	Gold	UL94 V-0	EAR99	STANDARD: UL 94V-0	Gold, Tin	Polyphenylene Sulfide (PPS), Glass Filled	2.794mm		e3	Closed Frame														28 (2 x 14)	UL94 V-0	10.0μin 0.25μm	Beryllium Copper	Beryllium Copper	0.100 2.54mm	0.110 2.78mm	0.100 2.54mm		10.0μin 0.25μm
84-PGM10003-10	Aries Electronics	$13.94	RFQ Min: 1 Mult: 1	download	PGA	PGM	Through Hole	Through Hole	-55°C~105°C	Bulk	1 (Unlimited)	Solder	105°C	-55°C	ROHS3 Compliant	2009	https://pdf.utmel.com/r/datasheets/arieselectronics-80pgm1505910-datasheets-3551.pdf	3A			6 Weeks						Gold	UL94 V-0			Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	4.191mm										3A								UL94 V-0	10.0μin 0.25μm	Beryllium Copper	Brass	0.100 2.54mm	0.165 4.19mm	0.100 2.54mm	Tin	200.0μin 5.08μm
19-0508-31	Aries Electronics		RFQ Min: 1 Mult: 1	download	SIP	508	Through Hole	Through Hole	-55°C~125°C	Bulk	1 (Unlimited)	Wire Wrap			ROHS3 Compliant	2006	https://pdf.utmel.com/r/datasheets/arieselectronics-01050830-datasheets-9229.pdf	3A			5 Weeks	19	2.54mm			19	Gold	UL94 V-0	EAR99	STANDARD: UL 94V-0		Polyamide (PA46), Nylon 4/6	12.7mm		e4							1		RECTANGULAR		RND PIN-SKT				19 (1 x 19)	UL94 V-0	10.0μin 0.25μm	Beryllium Copper	Brass	0.100 2.54mm	0.500 12.70mm			10.0μin 0.25μm
28-6508-30	Aries Electronics		RFQ Min: 1 Mult: 1	download	DIP, 0.6 (15.24mm) Row Spacing	508	Through Hole	Through Hole	-55°C~105°C	Bulk	1 (Unlimited)	Wire Wrap			ROHS3 Compliant	2006	https://pdf.utmel.com/r/datasheets/arieselectronics-06350830-datasheets-4085.pdf	3A			4 Weeks		2.54mm		28	28	Gold	UL94 V-0	EAR99	STANDARD: UL 94V-0		Polyamide (PA46), Nylon 4/6, Glass Filled	9.144mm			Open Frame					0.7 inch	2		RECTANGULAR	0.193 inch	RND PIN-SKT	0.1 inch	0.6 mm		28 (2 x 14)	UL94 V-0	30.0μin 0.76μm	Beryllium Copper	Brass	0.100 2.54mm	0.360 9.14mm	0.100 2.54mm	Tin	200.0μin 5.08μm
3883-312-10-32	Aries Electronics		RFQ Min: 1 Mult: 1	download							1 (Unlimited)	Solder			ROHS3 Compliant		/files/arieselectronics-24655620-datasheets-9089.pdf				4 Weeks
48-3554-11	Aries Electronics		RFQ Min: 1 Mult: 1	download	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	55	Through Hole	Through Hole		Bulk	1 (Unlimited)	Solder			ROHS3 Compliant	2005	https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf	1A			4 Weeks			yes	48	48	Gold	UL94 V-0	EAR99	STANDARD: UL 94V-0		Polyphenylene Sulfide (PPS), Glass Filled	2.794mm		e4	Closed Frame														48 (2 x 24)	UL94 V-0		Beryllium Copper	Beryllium Copper	0.100 2.54mm	0.110 2.78mm	0.100 2.54mm
42-6556-31	Aries Electronics		RFQ Min: 1 Mult: 1	download	DIP, 0.6 (15.24mm) Row Spacing	6556	Through Hole	Through Hole		Bulk	1 (Unlimited)	Wire Wrap			ROHS3 Compliant	2007	/files/arieselectronics-24655620-datasheets-9089.pdf	3A			6 Weeks			yes	42	42	Gold	UL94 V-0	EAR99	STANDARD: UL 94V-0		Polyphenylene Sulfide (PPS), Glass Filled	10.7442mm		e4	Open Frame	2.54mm	150°C		2.66 inch	1.27 inch			RECTANGULAR	0.29 inch	RND PIN-SKT	0.1 inch	0.6 mm		42 (2 x 21)	UL94 V-0	30.0μin 0.76μm	Beryllium Copper	Brass	0.100 2.54mm	0.423 10.74mm	0.100 2.54mm		10.0μin 0.25μm
85-PGM11007-10H	Aries Electronics		RFQ Min: 1 Mult: 1	download	PGA	PGM	Through Hole	Through Hole	-55°C~105°C	Bulk	1 (Unlimited)	Solder	105°C	-55°C	ROHS3 Compliant	2009	https://pdf.utmel.com/r/datasheets/arieselectronics-80pgm1505910-datasheets-3551.pdf	3A			6 Weeks						Gold	UL94 V-0			Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	4.191mm										3A								UL94 V-0	10.0μin 0.25μm	Beryllium Copper	Brass	0.100 2.54mm	0.165 4.19mm	0.100 2.54mm	Tin	200.0μin 5.08μm
42-3570-11	Aries Electronics		RFQ Min: 1 Mult: 1	download	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	57	Through Hole	Through Hole		Bulk	1 (Unlimited)	Solder			ROHS3 Compliant	2005	https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf	1A			5 Weeks			yes	42	42	Gold	UL94 V-0	EAR99	STANDARD: UL 94V-0		Polyphenylene Sulfide (PPS), Glass Filled	2.794mm		e4	Closed Frame														42 (2 x 21)	UL94 V-0	10.0μin 0.25μm	Beryllium Copper	Beryllium Copper	0.100 2.54mm	0.110 2.78mm	0.100 2.54mm		10.0μin 0.25μm
30-6823-90C	Aries Electronics		RFQ Min: 1 Mult: 1	download	DIP, 0.6 (15.24mm) Row Spacing	Vertisockets™ 800	Horizontal, Through Hole	Through Hole, Right Angle, Horizontal	-55°C~105°C	Bulk	1 (Unlimited)	Solder			ROHS3 Compliant	2006	/files/arieselectronics-1282390c-datasheets-6745.pdf	3A			6 Weeks	30	2.54mm			30	Gold	UL94 V-0	EAR99	STANDARD: UL 94V-0		Polyamide (PA46), Nylon 4/6, Glass Filled	3.556mm		e4	Closed Frame				1.5 inch	0.7 inch			RECTANGULAR	0.528 inch	RND PIN-SKT	0.1 inch	0.3 mm		30 (2 x 15)	UL94 V-0	30.0μin 0.76μm	Beryllium Copper	Brass	0.100 2.54mm	0.140 3.56mm	0.100 2.54mm	Tin	200.0μin 5.08μm
50-9513-10H	Aries Electronics		RFQ Min: 1 Mult: 1	download	DIP, 0.9 (22.86mm) Row Spacing	Lo-PRO®file, 513	Through Hole	Through Hole	-55°C~105°C	Bulk	1 (Unlimited)	Solder			ROHS3 Compliant	2006	/files/arieselectronics-08251310-datasheets-2619.pdf	3A			5 Weeks		2.54mm	yes	50	50	Gold	UL94 V-0	EAR99	LOW PROFILE; UL 94V-0		Polyamide (PA46), Nylon 4/6, Glass Filled	3.175mm		e3	Closed Frame				5 inch	1 inch	2		RECTANGULAR	0.165 inch	RND PIN-SKT	0.1 inch	0.9 mm		50 (2 x 25)	UL94 V-0	10.0μin 0.25μm	Beryllium Copper	Brass	0.100 2.54mm	0.125 3.18mm	0.100 2.54mm	Tin	200.0μin 5.08μm
36-3551-10	Aries Electronics		RFQ Min: 1 Mult: 1	download	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	55		Through Hole		Bulk	1 (Unlimited)	Solder			ROHS3 Compliant	2013	/files/arieselectronics-40655411-datasheets-2991.pdf				4 Weeks			yes		36	Tin		EAR99	STANDARD: UL 94V-0		Polyphenylene Sulfide (PPS), Glass Filled			e3	Closed Frame							1A							36 (2 x 18)	UL94 V-0	200.0μin 5.08μm	Beryllium Copper	Beryllium Copper	0.100 2.54mm	0.110 2.78mm	0.100 2.54mm		200.0μin 5.08μm
26-6823-90	Aries Electronics		RFQ Min: 1 Mult: 1	download	DIP, 0.6 (15.24mm) Row Spacing	Vertisockets™ 800	Horizontal, Through Hole	Through Hole, Right Angle, Horizontal		Bulk	1 (Unlimited)	Solder			ROHS3 Compliant	2006	/files/arieselectronics-0882390-datasheets-3547.pdf	1.5A			7 Weeks				26	26	Gold	UL94 V-0	EAR99	STANDARD: UL 94V-0		Polyamide (PA46), Nylon 4/6	3.683mm		e4	Closed Frame														26 (2 x 13)	UL94 V-0	10.0μin 0.25μm	Phosphor Bronze	Phosphor Bronze	0.100 2.54mm	0.145 3.68mm	0.100 2.54mm		10.0μin 0.25μm
175-PGM16003-11H	Aries Electronics		RFQ Min: 1 Mult: 1	download	PGA	PGM	Through Hole	Through Hole	-55°C~125°C	Bulk	1 (Unlimited)	Solder	125°C	-55°C	ROHS3 Compliant	2009	https://pdf.utmel.com/r/datasheets/arieselectronics-80pgm1505910-datasheets-3551.pdf	3A			6 Weeks						Gold	UL94 V-0			Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	4.191mm										3A								UL94 V-0	10.0μin 0.25μm	Beryllium Copper	Brass	0.100 2.54mm	0.165 4.19mm	0.100 2.54mm	Gold	10.0μin 0.25μm
24-3554-16	Aries Electronics		RFQ Min: 1 Mult: 1	download	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	55	Through Hole	Through Hole		Bulk	1 (Unlimited)	Solder			ROHS3 Compliant	2012	https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf	1A		Lead Free	6 Weeks			yes	24	24	Nickel Boron	UL94 V-0	EAR99	STANDARD: UL 94V-0	Nickel	Polyphenylene Sulfide (PPS), Glass Filled	2.794mm			Closed Frame														24 (2 x 12)	UL94 V-0	50.0μin 1.27μm	Beryllium Copper	Beryllium Copper	0.100 2.54mm	0.110 2.78mm	0.100 2.54mm	Nickel Boron	50.0μin 1.27μm
32-6556-41	Aries Electronics		RFQ Min: 1 Mult: 1	download	DIP, 0.6 (15.24mm) Row Spacing	6556	Through Hole	Through Hole		Bulk	1 (Unlimited)	Solder Cup			ROHS3 Compliant	2006	https://pdf.utmel.com/r/datasheets/arieselectronics-24655620-datasheets-9089.pdf	3A			6 Weeks			yes	32	32	Gold	UL94 V-0	EAR99	STANDARD: UL 94V-0		Polyphenylene Sulfide (PPS), Glass Filled	4.572mm		e4	Open Frame														32 (2 x 16)	UL94 V-0	30.0μin 0.76μm	Beryllium Copper	Brass	0.100 2.54mm	0.180 4.57mm	0.100 2.54mm		10.0μin 0.25μm
144-PGM15025-10	Aries Electronics	$20.12	RFQ Min: 1 Mult: 1	download	PGA	PGM	Through Hole	Through Hole	-55°C~105°C	Bulk	1 (Unlimited)	Solder	105°C	-55°C	ROHS3 Compliant	2009	https://pdf.utmel.com/r/datasheets/arieselectronics-80pgm1505910-datasheets-3551.pdf	3A			6 Weeks						Gold	UL94 V-0			Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	4.191mm										3A								UL94 V-0	10.0μin 0.25μm	Beryllium Copper	Brass	0.100 2.54mm	0.165 4.19mm	0.100 2.54mm	Tin	200.0μin 5.08μm
40-0501-30	Aries Electronics		RFQ Min: 1 Mult: 1	download	SIP	501	Through Hole	Through Hole	-55°C~105°C	Bulk	1 (Unlimited)	Wire Wrap			ROHS3 Compliant	2006	https://pdf.utmel.com/r/datasheets/arieselectronics-02050130-datasheets-3742.pdf	1A			7 Weeks		2.54mm	yes	40	40	Tin	UL94 V-0	EAR99	STANDARD: UL 94V-0		Polyamide (PA46), Nylon 4/6, Glass Filled	17.526mm		e3							1								40 (1 x 40)	UL94 V-0	200.0μin 5.08μm	Phosphor Bronze	Phosphor Bronze	0.100 2.54mm	0.690 17.52mm	0.100 2.54mm		200.0μin 5.08μm
42-3551-10	Aries Electronics		RFQ Min: 1 Mult: 1	download	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	55		Through Hole		Bulk	1 (Unlimited)	Solder			ROHS3 Compliant	2013	https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf				4 Weeks			yes		42	Tin		EAR99	STANDARD: UL 94V-0		Polyphenylene Sulfide (PPS), Glass Filled			e3	Closed Frame							1A							42 (2 x 21)	UL94 V-0	200.0μin 5.08μm	Beryllium Copper	Beryllium Copper	0.100 2.54mm	0.110 2.78mm	0.100 2.54mm		200.0μin 5.08μm
1109906-40	Aries Electronics		RFQ Min: 1 Mult: 1	download							1 (Unlimited)				ROHS3 Compliant						4 Weeks
29-0501-21	Aries Electronics		RFQ Min: 1 Mult: 1	download	SIP	501	Through Hole	Through Hole	-55°C~125°C	Bulk	1 (Unlimited)	Wire Wrap	125°C	-55°C	ROHS3 Compliant	2006	https://pdf.utmel.com/r/datasheets/arieselectronics-02050130-datasheets-3742.pdf	1A	SIP		7 Weeks		2.54mm		29		Gold	UL94 V-0			Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	10.668mm						2.54mm			1	1A							29 (1 x 29)	UL94 V-0	10.0μin 0.25μm	Phosphor Bronze	Phosphor Bronze	0.100 2.54mm	0.420 10.67mm	0.100 2.54mm	Gold	10.0μin 0.25μm
18-823-90T	Aries Electronics		RFQ Min: 1 Mult: 1	download	DIP, 0.3 (7.62mm) Row Spacing	Vertisockets™ 800	Horizontal, Through Hole	Through Hole, Right Angle, Horizontal	-55°C~105°C	Bulk	1 (Unlimited)	Solder			ROHS3 Compliant	2006	/files/arieselectronics-0882390-datasheets-3547.pdf	1.5A			7 Weeks			yes	18	18	Tin	UL94 V-0	EAR99	STANDARD: UL 94V-0		Polyamide (PA46), Nylon 4/6	3.683mm		e3	Closed Frame	2.54mm			0.95 inch	0.4 inch			RECTANGULAR	0.68 inch	SQ PIN-SKT	0.1 inch	0.3 mm		18 (2 x 9)	UL94 V-0	200.0μin 5.08μm	Phosphor Bronze	Phosphor Bronze	0.100 2.54mm	0.145 3.68mm	0.100 2.54mm		200.0μin 5.08μm
44-3552-10	Aries Electronics		RFQ Min: 1 Mult: 1	download	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	55		Through Hole		Bulk	1 (Unlimited)	Solder			ROHS3 Compliant	2013	https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf				4 Weeks			yes		44	Tin		EAR99	STANDARD: UL 94V-0		Polyphenylene Sulfide (PPS), Glass Filled			e3	Closed Frame							1A							44 (2 x 22)	UL94 V-0	200.0μin 5.08μm	Beryllium Copper	Beryllium Copper	0.100 2.54mm	0.110 2.78mm	0.100 2.54mm		200.0μin 5.08μm
181-PGM18040-10	Aries Electronics		RFQ Min: 1 Mult: 1	download	PGA	PGM	Through Hole	Through Hole	-55°C~105°C	Bulk	1 (Unlimited)	Solder	105°C	-55°C	ROHS3 Compliant	2009	https://pdf.utmel.com/r/datasheets/arieselectronics-80pgm1505910-datasheets-3551.pdf	3A			6 Weeks						Gold	UL94 V-0			Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	4.191mm										3A								UL94 V-0	10.0μin 0.25μm	Beryllium Copper	Brass	0.100 2.54mm	0.165 4.19mm	0.100 2.54mm	Tin	200.0μin 5.08μm
28-6556-41	Aries Electronics		RFQ Min: 1 Mult: 1	download	DIP, 0.6 (15.24mm) Row Spacing	6556	Through Hole	Through Hole		Bulk	1 (Unlimited)	Solder Cup			ROHS3 Compliant	2006	/files/arieselectronics-24655620-datasheets-9089.pdf	3A			6 Weeks			yes	28	28	Gold	UL94 V-0	EAR99	STANDARD: UL 94V-0		Polyphenylene Sulfide (PPS), Glass Filled	4.572mm		e4	Open Frame														28 (2 x 14)	UL94 V-0	30.0μin 0.76μm	Beryllium Copper	Brass	0.100 2.54mm	0.180 4.57mm	0.100 2.54mm		10.0μin 0.25μm
48-6508-21	Aries Electronics		RFQ Min: 1 Mult: 1	download	DIP, 0.6 (15.24mm) Row Spacing	508	Through Hole	Through Hole	-55°C~125°C	Bulk	1 (Unlimited)	Wire Wrap			ROHS3 Compliant	2006	https://pdf.utmel.com/r/datasheets/arieselectronics-06350830-datasheets-4085.pdf	3A			4 Weeks		2.54mm		48	48	Gold	UL94 V-0	EAR99	STANDARD: UL 94V-0		Polyamide (PA46), Nylon 4/6, Glass Filled	9.144mm		e4	Open Frame				4.8 inch	0.7 inch	2		RECTANGULAR	0.193 inch	RND PIN-SKT	0.1 inch	0.6 mm		48 (2 x 24)	UL94 V-0	30.0μin 0.76μm	Beryllium Copper	Brass	0.100 2.54mm	0.360 9.14mm	0.100 2.54mm		10.0μin 0.25μm
40-6570-16	Aries Electronics		RFQ Min: 1 Mult: 1	download	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	57	Through Hole	Through Hole		Bulk	1 (Unlimited)	Solder			ROHS3 Compliant	2005	https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf	1A			5 Weeks			yes	40	40	Nickel Boron	UL94 V-0	EAR99	STANDARD: UL 94V-0	Nickel	Polyphenylene Sulfide (PPS), Glass Filled	2.794mm	1000000000Ohm		Closed Frame	2.54mm	200°C		2.59 inch	0.9 inch			RECTANGULAR	0.47 inch	SQ PIN-SKT	0.1 inch	0.6 mm	1000VAC V	40 (2 x 20)	UL94 V-0	50.0μin 1.27μm	Beryllium Nickel	Beryllium Nickel	0.100 2.54mm	0.110 2.78mm	0.100 2.54mm	Nickel Boron	50.0μin 1.27μm
42-3575-16	Aries Electronics		RFQ Min: 1 Mult: 1	download	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	57	Through Hole	Through Hole		Bulk	1 (Unlimited)	Solder			ROHS3 Compliant	2005	https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf	1A			5 Weeks			yes	42	42	Tin	UL94 V-0	EAR99	STANDARD: UL 94V-0		Polyphenylene Sulfide (PPS), Glass Filled	2.794mm			Closed Frame														42 (2 x 21)	UL94 V-0	200.0μin 5.08μm	Beryllium Copper	Beryllium Copper	0.100 2.54mm	0.110 2.78mm	0.100 2.54mm		200.0μin 5.08μm

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