Aries Electronics(10778)

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Part Status Type Series Mount Mounting Type Operating Temperature Packaging Moisture Sensitivity Level (MSL) Termination Max Operating Temperature Min Operating Temperature RoHS Status Published Datasheet Current Rating Package / Case Lead Free Factory Lead Time Number of Pins Lead Pitch Pbfree Code Number of Positions Number of Contacts Contact Finish - Mating Flammability Rating ECCN Code Additional Feature Contact Plating Housing Material Lead Length Insulation Resistance JESD-609 Code Feature Terminal Pitch Operating Temperature (Max) Pitch Body Length or Diameter Body Breadth Number of Rows Current Rating (Amps) PCB Contact Pattern Body Depth Contact Style Mating Contact Pitch PCB Contact Row Spacing Dielectric Withstanding Voltage Number of Positions or Pins (Grid) Material Flammability Rating Contact Finish Thickness - Mating Contact Material - Mating Contact Material - Post Pitch - Mating Termination Post Length Pitch - Post Contact Finish - Post Contact Finish Thickness - Post
29-0511-11 29-0511-11 Aries Electronics
RFQ

Min: 1

Mult: 1

download SIP 511 Through Hole Through Hole -55°C~125°C Bulk 1 (Unlimited) Solder 125°C -55°C ROHS3 Compliant 2006 https://pdf.utmel.com/r/datasheets/arieselectronics-12051110-datasheets-7232.pdf 1A SIP 7 Weeks 2.54mm 29 Gold UL94 V-0 Gold Polyamide (PA46), Nylon 4/6, Glass Filled 3.81mm 2.54mm 1 1A 29 (1 x 29) UL94 V-0 10.0μin 0.25μm Phosphor Bronze Phosphor Bronze 0.100 2.54mm 0.150 3.81mm 0.100 2.54mm Gold 10.0μin 0.25μm
1108594 1108594 Aries Electronics
RFQ

Min: 1

Mult: 1

download 1 (Unlimited) ROHS3 Compliant 2013 https://pdf.utmel.com/r/datasheets/arieselectronics-06350830-datasheets-4085.pdf 508 5 Weeks
28-3574-10 28-3574-10 Aries Electronics
RFQ

Min: 1

Mult: 1

download DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 57 Through Hole Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2005 https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf 1A 5 Weeks yes 28 28 Gold UL94 V-0 EAR99 STANDARD: UL 94V-0 Gold, Tin Polyphenylene Sulfide (PPS), Glass Filled 2.794mm e3 Closed Frame 28 (2 x 14) UL94 V-0 10.0μin 0.25μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm 10.0μin 0.25μm
84-PGM10003-10 84-PGM10003-10 Aries Electronics $13.94
RFQ

Min: 1

Mult: 1

download PGA PGM Through Hole Through Hole -55°C~105°C Bulk 1 (Unlimited) Solder 105°C -55°C ROHS3 Compliant 2009 https://pdf.utmel.com/r/datasheets/arieselectronics-80pgm1505910-datasheets-3551.pdf 3A 6 Weeks Gold UL94 V-0 Gold Polyamide (PA46), Nylon 4/6, Glass Filled 4.191mm 3A UL94 V-0 10.0μin 0.25μm Beryllium Copper Brass 0.100 2.54mm 0.165 4.19mm 0.100 2.54mm Tin 200.0μin 5.08μm
19-0508-31 19-0508-31 Aries Electronics
RFQ

Min: 1

Mult: 1

download SIP 508 Through Hole Through Hole -55°C~125°C Bulk 1 (Unlimited) Wire Wrap ROHS3 Compliant 2006 https://pdf.utmel.com/r/datasheets/arieselectronics-01050830-datasheets-9229.pdf 3A 5 Weeks 19 2.54mm 19 Gold UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyamide (PA46), Nylon 4/6 12.7mm e4 1 RECTANGULAR RND PIN-SKT 19 (1 x 19) UL94 V-0 10.0μin 0.25μm Beryllium Copper Brass 0.100 2.54mm 0.500 12.70mm 10.0μin 0.25μm
28-6508-30 28-6508-30 Aries Electronics
RFQ

Min: 1

Mult: 1

download DIP, 0.6 (15.24mm) Row Spacing 508 Through Hole Through Hole -55°C~105°C Bulk 1 (Unlimited) Wire Wrap ROHS3 Compliant 2006 https://pdf.utmel.com/r/datasheets/arieselectronics-06350830-datasheets-4085.pdf 3A 4 Weeks 2.54mm 28 28 Gold UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 9.144mm Open Frame 0.7 inch 2 RECTANGULAR 0.193 inch RND PIN-SKT 0.1 inch 0.6 mm 28 (2 x 14) UL94 V-0 30.0μin 0.76μm Beryllium Copper Brass 0.100 2.54mm 0.360 9.14mm 0.100 2.54mm Tin 200.0μin 5.08μm
3883-312-10-32 3883-312-10-32 Aries Electronics
RFQ

Min: 1

Mult: 1

download 1 (Unlimited) Solder ROHS3 Compliant /files/arieselectronics-24655620-datasheets-9089.pdf 4 Weeks
48-3554-11 48-3554-11 Aries Electronics
RFQ

Min: 1

Mult: 1

download DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 55 Through Hole Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2005 https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf 1A 4 Weeks yes 48 48 Gold UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyphenylene Sulfide (PPS), Glass Filled 2.794mm e4 Closed Frame 48 (2 x 24) UL94 V-0 Beryllium Copper Beryllium Copper 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm
42-6556-31 42-6556-31 Aries Electronics
RFQ

Min: 1

Mult: 1

download DIP, 0.6 (15.24mm) Row Spacing 6556 Through Hole Through Hole Bulk 1 (Unlimited) Wire Wrap ROHS3 Compliant 2007 /files/arieselectronics-24655620-datasheets-9089.pdf 3A 6 Weeks yes 42 42 Gold UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyphenylene Sulfide (PPS), Glass Filled 10.7442mm e4 Open Frame 2.54mm 150°C 2.66 inch 1.27 inch RECTANGULAR 0.29 inch RND PIN-SKT 0.1 inch 0.6 mm 42 (2 x 21) UL94 V-0 30.0μin 0.76μm Beryllium Copper Brass 0.100 2.54mm 0.423 10.74mm 0.100 2.54mm 10.0μin 0.25μm
85-PGM11007-10H 85-PGM11007-10H Aries Electronics
RFQ

Min: 1

Mult: 1

download PGA PGM Through Hole Through Hole -55°C~105°C Bulk 1 (Unlimited) Solder 105°C -55°C ROHS3 Compliant 2009 https://pdf.utmel.com/r/datasheets/arieselectronics-80pgm1505910-datasheets-3551.pdf 3A 6 Weeks Gold UL94 V-0 Gold Polyamide (PA46), Nylon 4/6, Glass Filled 4.191mm 3A UL94 V-0 10.0μin 0.25μm Beryllium Copper Brass 0.100 2.54mm 0.165 4.19mm 0.100 2.54mm Tin 200.0μin 5.08μm
42-3570-11 42-3570-11 Aries Electronics
RFQ

Min: 1

Mult: 1

download DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 57 Through Hole Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2005 https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf 1A 5 Weeks yes 42 42 Gold UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyphenylene Sulfide (PPS), Glass Filled 2.794mm e4 Closed Frame 42 (2 x 21) UL94 V-0 10.0μin 0.25μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm 10.0μin 0.25μm
30-6823-90C 30-6823-90C Aries Electronics
RFQ

Min: 1

Mult: 1

download DIP, 0.6 (15.24mm) Row Spacing Vertisockets™ 800 Horizontal, Through Hole Through Hole, Right Angle, Horizontal -55°C~105°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 2006 /files/arieselectronics-1282390c-datasheets-6745.pdf 3A 6 Weeks 30 2.54mm 30 Gold UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 3.556mm e4 Closed Frame 1.5 inch 0.7 inch RECTANGULAR 0.528 inch RND PIN-SKT 0.1 inch 0.3 mm 30 (2 x 15) UL94 V-0 30.0μin 0.76μm Beryllium Copper Brass 0.100 2.54mm 0.140 3.56mm 0.100 2.54mm Tin 200.0μin 5.08μm
50-9513-10H 50-9513-10H Aries Electronics
RFQ

Min: 1

Mult: 1

download DIP, 0.9 (22.86mm) Row Spacing Lo-PRO®file, 513 Through Hole Through Hole -55°C~105°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 2006 /files/arieselectronics-08251310-datasheets-2619.pdf 3A 5 Weeks 2.54mm yes 50 50 Gold UL94 V-0 EAR99 LOW PROFILE; UL 94V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 3.175mm e3 Closed Frame 5 inch 1 inch 2 RECTANGULAR 0.165 inch RND PIN-SKT 0.1 inch 0.9 mm 50 (2 x 25) UL94 V-0 10.0μin 0.25μm Beryllium Copper Brass 0.100 2.54mm 0.125 3.18mm 0.100 2.54mm Tin 200.0μin 5.08μm
36-3551-10 36-3551-10 Aries Electronics
RFQ

Min: 1

Mult: 1

download DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 55 Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2013 /files/arieselectronics-40655411-datasheets-2991.pdf 4 Weeks yes 36 Tin EAR99 STANDARD: UL 94V-0 Polyphenylene Sulfide (PPS), Glass Filled e3 Closed Frame 1A 36 (2 x 18) UL94 V-0 200.0μin 5.08μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm 200.0μin 5.08μm
26-6823-90 26-6823-90 Aries Electronics
RFQ

Min: 1

Mult: 1

download DIP, 0.6 (15.24mm) Row Spacing Vertisockets™ 800 Horizontal, Through Hole Through Hole, Right Angle, Horizontal Bulk 1 (Unlimited) Solder ROHS3 Compliant 2006 /files/arieselectronics-0882390-datasheets-3547.pdf 1.5A 7 Weeks 26 26 Gold UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyamide (PA46), Nylon 4/6 3.683mm e4 Closed Frame 26 (2 x 13) UL94 V-0 10.0μin 0.25μm Phosphor Bronze Phosphor Bronze 0.100 2.54mm 0.145 3.68mm 0.100 2.54mm 10.0μin 0.25μm
175-PGM16003-11H 175-PGM16003-11H Aries Electronics
RFQ

Min: 1

Mult: 1

download PGA PGM Through Hole Through Hole -55°C~125°C Bulk 1 (Unlimited) Solder 125°C -55°C ROHS3 Compliant 2009 https://pdf.utmel.com/r/datasheets/arieselectronics-80pgm1505910-datasheets-3551.pdf 3A 6 Weeks Gold UL94 V-0 Gold Polyamide (PA46), Nylon 4/6, Glass Filled 4.191mm 3A UL94 V-0 10.0μin 0.25μm Beryllium Copper Brass 0.100 2.54mm 0.165 4.19mm 0.100 2.54mm Gold 10.0μin 0.25μm
24-3554-16 24-3554-16 Aries Electronics
RFQ

Min: 1

Mult: 1

download DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 55 Through Hole Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2012 https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf 1A Lead Free 6 Weeks yes 24 24 Nickel Boron UL94 V-0 EAR99 STANDARD: UL 94V-0 Nickel Polyphenylene Sulfide (PPS), Glass Filled 2.794mm Closed Frame 24 (2 x 12) UL94 V-0 50.0μin 1.27μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm Nickel Boron 50.0μin 1.27μm
32-6556-41 32-6556-41 Aries Electronics
RFQ

Min: 1

Mult: 1

download DIP, 0.6 (15.24mm) Row Spacing 6556 Through Hole Through Hole Bulk 1 (Unlimited) Solder Cup ROHS3 Compliant 2006 https://pdf.utmel.com/r/datasheets/arieselectronics-24655620-datasheets-9089.pdf 3A 6 Weeks yes 32 32 Gold UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyphenylene Sulfide (PPS), Glass Filled 4.572mm e4 Open Frame 32 (2 x 16) UL94 V-0 30.0μin 0.76μm Beryllium Copper Brass 0.100 2.54mm 0.180 4.57mm 0.100 2.54mm 10.0μin 0.25μm
144-PGM15025-10 144-PGM15025-10 Aries Electronics $20.12
RFQ

Min: 1

Mult: 1

download PGA PGM Through Hole Through Hole -55°C~105°C Bulk 1 (Unlimited) Solder 105°C -55°C ROHS3 Compliant 2009 https://pdf.utmel.com/r/datasheets/arieselectronics-80pgm1505910-datasheets-3551.pdf 3A 6 Weeks Gold UL94 V-0 Gold Polyamide (PA46), Nylon 4/6, Glass Filled 4.191mm 3A UL94 V-0 10.0μin 0.25μm Beryllium Copper Brass 0.100 2.54mm 0.165 4.19mm 0.100 2.54mm Tin 200.0μin 5.08μm
40-0501-30 40-0501-30 Aries Electronics
RFQ

Min: 1

Mult: 1

download SIP 501 Through Hole Through Hole -55°C~105°C Bulk 1 (Unlimited) Wire Wrap ROHS3 Compliant 2006 https://pdf.utmel.com/r/datasheets/arieselectronics-02050130-datasheets-3742.pdf 1A 7 Weeks 2.54mm yes 40 40 Tin UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 17.526mm e3 1 40 (1 x 40) UL94 V-0 200.0μin 5.08μm Phosphor Bronze Phosphor Bronze 0.100 2.54mm 0.690 17.52mm 0.100 2.54mm 200.0μin 5.08μm
42-3551-10 42-3551-10 Aries Electronics
RFQ

Min: 1

Mult: 1

download DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 55 Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2013 https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf 4 Weeks yes 42 Tin EAR99 STANDARD: UL 94V-0 Polyphenylene Sulfide (PPS), Glass Filled e3 Closed Frame 1A 42 (2 x 21) UL94 V-0 200.0μin 5.08μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm 200.0μin 5.08μm
1109906-40 1109906-40 Aries Electronics
RFQ

Min: 1

Mult: 1

download 1 (Unlimited) ROHS3 Compliant 4 Weeks
29-0501-21 29-0501-21 Aries Electronics
RFQ

Min: 1

Mult: 1

download SIP 501 Through Hole Through Hole -55°C~125°C Bulk 1 (Unlimited) Wire Wrap 125°C -55°C ROHS3 Compliant 2006 https://pdf.utmel.com/r/datasheets/arieselectronics-02050130-datasheets-3742.pdf 1A SIP 7 Weeks 2.54mm 29 Gold UL94 V-0 Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.668mm 2.54mm 1 1A 29 (1 x 29) UL94 V-0 10.0μin 0.25μm Phosphor Bronze Phosphor Bronze 0.100 2.54mm 0.420 10.67mm 0.100 2.54mm Gold 10.0μin 0.25μm
18-823-90T 18-823-90T Aries Electronics
RFQ

Min: 1

Mult: 1

download DIP, 0.3 (7.62mm) Row Spacing Vertisockets™ 800 Horizontal, Through Hole Through Hole, Right Angle, Horizontal -55°C~105°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 2006 /files/arieselectronics-0882390-datasheets-3547.pdf 1.5A 7 Weeks yes 18 18 Tin UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyamide (PA46), Nylon 4/6 3.683mm e3 Closed Frame 2.54mm 0.95 inch 0.4 inch RECTANGULAR 0.68 inch SQ PIN-SKT 0.1 inch 0.3 mm 18 (2 x 9) UL94 V-0 200.0μin 5.08μm Phosphor Bronze Phosphor Bronze 0.100 2.54mm 0.145 3.68mm 0.100 2.54mm 200.0μin 5.08μm
44-3552-10 44-3552-10 Aries Electronics
RFQ

Min: 1

Mult: 1

download DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 55 Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2013 https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf 4 Weeks yes 44 Tin EAR99 STANDARD: UL 94V-0 Polyphenylene Sulfide (PPS), Glass Filled e3 Closed Frame 1A 44 (2 x 22) UL94 V-0 200.0μin 5.08μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm 200.0μin 5.08μm
181-PGM18040-10 181-PGM18040-10 Aries Electronics
RFQ

Min: 1

Mult: 1

download PGA PGM Through Hole Through Hole -55°C~105°C Bulk 1 (Unlimited) Solder 105°C -55°C ROHS3 Compliant 2009 https://pdf.utmel.com/r/datasheets/arieselectronics-80pgm1505910-datasheets-3551.pdf 3A 6 Weeks Gold UL94 V-0 Gold Polyamide (PA46), Nylon 4/6, Glass Filled 4.191mm 3A UL94 V-0 10.0μin 0.25μm Beryllium Copper Brass 0.100 2.54mm 0.165 4.19mm 0.100 2.54mm Tin 200.0μin 5.08μm
28-6556-41 28-6556-41 Aries Electronics
RFQ

Min: 1

Mult: 1

download DIP, 0.6 (15.24mm) Row Spacing 6556 Through Hole Through Hole Bulk 1 (Unlimited) Solder Cup ROHS3 Compliant 2006 /files/arieselectronics-24655620-datasheets-9089.pdf 3A 6 Weeks yes 28 28 Gold UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyphenylene Sulfide (PPS), Glass Filled 4.572mm e4 Open Frame 28 (2 x 14) UL94 V-0 30.0μin 0.76μm Beryllium Copper Brass 0.100 2.54mm 0.180 4.57mm 0.100 2.54mm 10.0μin 0.25μm
48-6508-21 48-6508-21 Aries Electronics
RFQ

Min: 1

Mult: 1

download DIP, 0.6 (15.24mm) Row Spacing 508 Through Hole Through Hole -55°C~125°C Bulk 1 (Unlimited) Wire Wrap ROHS3 Compliant 2006 https://pdf.utmel.com/r/datasheets/arieselectronics-06350830-datasheets-4085.pdf 3A 4 Weeks 2.54mm 48 48 Gold UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 9.144mm e4 Open Frame 4.8 inch 0.7 inch 2 RECTANGULAR 0.193 inch RND PIN-SKT 0.1 inch 0.6 mm 48 (2 x 24) UL94 V-0 30.0μin 0.76μm Beryllium Copper Brass 0.100 2.54mm 0.360 9.14mm 0.100 2.54mm 10.0μin 0.25μm
40-6570-16 40-6570-16 Aries Electronics
RFQ

Min: 1

Mult: 1

download DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 57 Through Hole Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2005 https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf 1A 5 Weeks yes 40 40 Nickel Boron UL94 V-0 EAR99 STANDARD: UL 94V-0 Nickel Polyphenylene Sulfide (PPS), Glass Filled 2.794mm 1000000000Ohm Closed Frame 2.54mm 200°C 2.59 inch 0.9 inch RECTANGULAR 0.47 inch SQ PIN-SKT 0.1 inch 0.6 mm 1000VAC V 40 (2 x 20) UL94 V-0 50.0μin 1.27μm Beryllium Nickel Beryllium Nickel 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm Nickel Boron 50.0μin 1.27μm
42-3575-16 42-3575-16 Aries Electronics
RFQ

Min: 1

Mult: 1

download DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 57 Through Hole Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2005 https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf 1A 5 Weeks yes 42 42 Tin UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyphenylene Sulfide (PPS), Glass Filled 2.794mm Closed Frame 42 (2 x 21) UL94 V-0 200.0μin 5.08μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm 200.0μin 5.08μm

In Stock

Please send RFQ , we will respond immediately.