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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | Max Operating Temperature | Min Operating Temperature | RoHS Status | Published | Datasheet | Current Rating | Package / Case | Factory Lead Time | Number of Pins | Lead Pitch | Pbfree Code | Number of Positions | Number of Contacts | Contact Finish - Mating | Flammability Rating | ECCN Code | Additional Feature | Contact Plating | Housing Material | Lead Length | Insulation Resistance | JESD-609 Code | Feature | Terminal Pitch | Operating Temperature (Max) | Pitch | Body Length or Diameter | Body Breadth | Number of Rows | Current Rating (Amps) | PCB Contact Pattern | Body Depth | Contact Style | Mating Contact Pitch | PCB Contact Row Spacing | Dielectric Withstanding Voltage | Number of Positions or Pins (Grid) | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Material - Post | Pitch - Mating | Termination Post Length | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 20-0508-31 | Aries Electronics |
Min: 1 Mult: 1 |
download | SIP | 508 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-01050830-datasheets-9229.pdf | 3A | 5 Weeks | 20 | 2.54mm | 20 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6 | 12.7mm | e4 | 2 inch | 1 | RECTANGULAR | RND PIN-SKT | 20 (1 x 20) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.500 12.70mm | 10.0μin 0.25μm | ||||||||||||||||||||||||
| 24-6556-41 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.6 (15.24mm) Row Spacing | 6556 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder Cup | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-24655620-datasheets-9089.pdf | 3A | 6 Weeks | yes | 24 | 24 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 4.572mm | e4 | Open Frame | 24 (2 x 12) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.180 4.57mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||
| 24-3551-16 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 55 | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf | 6 Weeks | yes | 24 | Nickel Boron | EAR99 | STANDARD: UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | Closed Frame | 1A | 24 (2 x 12) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | |||||||||||||||||||||||||||||||
| 225-PGM15001-11 | Aries Electronics |
Min: 1 Mult: 1 |
download | PGA | PGM | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -55°C | ROHS3 Compliant | 2009 | /files/arieselectronics-80pgm1505910-datasheets-3551.pdf | 3A | 6 Weeks | Gold | UL94 V-0 | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 4.191mm | 3A | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.165 4.19mm | 0.100 2.54mm | Gold | 10.0μin 0.25μm | |||||||||||||||||||||||||||||
| 22-3503-31 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.3 (7.62mm) Row Spacing | 503 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-08250330-datasheets-7188.pdf | 3A | 5 Weeks | 2.54mm | 22 | 22 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 12.7mm | Closed Frame | 2 | 22 (2 x 11) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Phosphor Bronze | 0.100 2.54mm | 0.500 12.70mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||
| 34-6501-21 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.6 (15.24mm) Row Spacing | 501 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2013 | /files/arieselectronics-08350130-datasheets-3825.pdf | 1.5A | 7 Weeks | 34 | 34 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.414mm | e4 | Closed Frame | 2.54mm | 1.75 inch | 0.69 inch | RECTANGULAR | 0.3 inch | SQ PIN-SKT | 0.1 inch | 0.6 mm | 34 (2 x 17) | UL94 V-0 | 10.0μin 0.25μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.410 10.41mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||
| 25-0508-31 | Aries Electronics |
Min: 1 Mult: 1 |
download | SIP | 508 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-01050830-datasheets-9229.pdf | 3A | 5 Weeks | 25 | 25 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6 | 12.7mm | e4 | 2.54mm | 2.5 inch | 1 | RECTANGULAR | RND PIN-SKT | 25 (1 x 25) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.500 12.70mm | 10.0μin 0.25μm | ||||||||||||||||||||||||
| 40-823-90C | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.3 (7.62mm) Row Spacing | Vertisockets™ 800 | Horizontal, Through Hole | Through Hole, Right Angle, Horizontal | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-1282390c-datasheets-6745.pdf | 3A | 6 Weeks | 40 | 40 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e4 | Closed Frame | 2.54mm | 2 inch | 0.4 inch | RECTANGULAR | 0.528 inch | RND PIN-SKT | 0.1 inch | 0.3 mm | 40 (2 x 20) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||
| 29-0501-31 | Aries Electronics |
Min: 1 Mult: 1 |
download | SIP | 501 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Wire Wrap | 125°C | -55°C | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/arieselectronics-02050130-datasheets-3742.pdf | 1A | SIP | 7 Weeks | 2.54mm | 29 | Gold | UL94 V-0 | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 17.526mm | 2.54mm | 1 | 1A | 29 (1 x 29) | UL94 V-0 | 10.0μin 0.25μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.690 17.52mm | 0.100 2.54mm | Gold | 10.0μin 0.25μm | |||||||||||||||||||||||
| 24-C300-30 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.6 (15.24mm) Row Spacing | EJECT-A-DIP™ | Surface Mount | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-14c28031-datasheets-8969.pdf | 3A | 5 Weeks | 24 | yes | 24 | Gold | UL94 V-0 | EAR99 | LATCHED, UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 1.016mm | 1000000000Ohm | e3 | Closed Frame | 1.49 inch | 0.7 inch | 2 | RECTANGULAR | RND PIN-SKT | 0.1 inch | 0.6 mm | 1000VAC V | 24 (2 x 12) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.040 1.02mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||
| 36-3573-10 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf | 1A | 5 Weeks | yes | 36 | 36 | Tin | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | e3 | Closed Frame | 36 (2 x 18) | UL94 V-0 | 200.0μin 5.08μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | 200.0μin 5.08μm | |||||||||||||||||||||||||||
| 20-3508-211 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.3 (7.62mm) Row Spacing | 508 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | /files/arieselectronics-143508301-datasheets-6498.pdf | 3A | 5 Weeks | 2.54mm | 20 | 20 | Gold | UL94 V-0 | EAR99 | STACKABLE | Polyamide (PA46), Nylon 4/6, Glass Filled | 12.7mm | Open Frame | 1 inch | 0.4 inch | 2 | RECTANGULAR | 0.19 inch | RND PIN-SKT | 0.1 inch | 0.3 mm | 20 (2 x 10) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.500 12.70mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||
| 21-0511-11 | Aries Electronics |
Min: 1 Mult: 1 |
download | SIP | 511 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -55°C | ROHS3 Compliant | 2006 | /files/arieselectronics-12051110-datasheets-7232.pdf | 1A | SIP | 7 Weeks | 2.54mm | 21 | Gold | UL94 V-0 | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.81mm | 2.54mm | 1 | 1A | 21 (1 x 21) | UL94 V-0 | 10.0μin 0.25μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.150 3.81mm | 0.100 2.54mm | Gold | 10.0μin 0.25μm | |||||||||||||||||||||||
| 36-3570-16 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf | 1A | 5 Weeks | yes | 36 | 36 | Nickel Boron | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Nickel | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | Closed Frame | 36 (2 x 18) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Nickel | Beryllium Nickel | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | ||||||||||||||||||||||||||
| 40-3574-16 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf | 1A | 5 Weeks | yes | 40 | 40 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | Closed Frame | 40 (2 x 20) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||
| 42-3570-16 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | /files/arieselectronics-40655411-datasheets-2991.pdf | 1A | 5 Weeks | yes | 42 | 42 | Nickel Boron | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Nickel | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | Closed Frame | 42 (2 x 21) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Nickel | Beryllium Nickel | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | ||||||||||||||||||||||||||
| 28-3551-16 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 55 | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2013 | /files/arieselectronics-40655411-datasheets-2991.pdf | 6 Weeks | yes | 28 | Nickel Boron | EAR99 | STANDARD: UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | Closed Frame | 1A | 28 (2 x 14) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | |||||||||||||||||||||||||||||||
| 132-PGM13038-50 | Aries Electronics |
Min: 1 Mult: 1 |
download | PGA | PGM | Through Hole | 1 (Unlimited) | Solder | ROHS3 Compliant | 6 Weeks | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 3A | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.156 3.96mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||||||||
| 48-6573-16 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf | 1A | 5 Weeks | yes | 48 | 48 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | 1000000000Ohm | Closed Frame | 2.54mm | 200°C | 2.99 inch | 0.9 inch | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 0.6 mm | 1000VAC V | 48 (2 x 24) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||
| 36-3551-16 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 55 | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2013 | /files/arieselectronics-40655411-datasheets-2991.pdf | 6 Weeks | yes | 36 | Nickel Boron | EAR99 | STANDARD: UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | Closed Frame | 1A | 36 (2 x 18) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | |||||||||||||||||||||||||||||||
| 40-6553-16 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 55 | Through Hole | -55°C~250°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf | 6 Weeks | yes | 40 | Nickel Boron | EAR99 | STANDARD: UL 94V-0 | Polyetheretherketone (PEEK), Glass Filled | Closed Frame | 1A | 40 (2 x 20) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Nickel | Beryllium Nickel | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | ||||||||||||||||||||||||||||||
| 156-PLS16011-12 | Aries Electronics |
Min: 1 Mult: 1 |
download | PGA, ZIF (ZIP) | PLS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2006 | /files/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | 156 | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||
| 169-PRS17012-12 | Aries Electronics |
Min: 1 Mult: 1 |
download | PGA, ZIF (ZIP) | PRS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2016 | /files/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||
| 32-6551-18 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 55 | Through Hole | -55°C~250°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 6 Weeks | 32 | Nickel Boron | EAR99 | STANDARD: UL 94V-0 | Polyetheretherketone (PEEK), Glass Filled | 1000000000Ohm | Closed Frame | 2.54mm | 2.19 inch | 0.9 inch | 1A | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 1000VAC V | 32 (2 x 16) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Nickel | Beryllium Nickel | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | ||||||||||||||||||||||||
| 36-6554-18 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 55 | Through Hole | Through Hole | -55°C~250°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2007 | 1A | 6 Weeks | yes | 36 | 36 | Nickel Boron | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Nickel | Polyetheretherketone (PEEK), Glass Filled | 2.794mm | 1000000000Ohm | Closed Frame | 2.54mm | 2.39 inch | 0.9 inch | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 1000VAC V | 36 (2 x 18) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Nickel | Beryllium Nickel | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | |||||||||||||||||
| 32-6574-18 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf | 1A | 6 Weeks | yes | 32 | 32 | Tin | UL94 V-0 | EAR99 | UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | 1000000000Ohm | Closed Frame | 2.54mm | 250°C | 2.19 inch | 0.9 inch | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 0.6 mm | 1000VAC V | 32 (2 x 16) | UL94 V-0 | 200.0μin 5.08μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | 200.0μin 5.08μm | |||||||||||||||||
| 36-6551-18 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 55 | Through Hole | -55°C~250°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 6 Weeks | 36 | Nickel Boron | EAR99 | STANDARD: UL 94V-0 | Polyetheretherketone (PEEK), Glass Filled | 1000000000Ohm | Closed Frame | 2.54mm | 2.39 inch | 0.9 inch | 1A | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 1000VAC V | 36 (2 x 18) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Nickel | Beryllium Nickel | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | ||||||||||||||||||||||||
| 162-PRS20020-12 | Aries Electronics |
Min: 1 Mult: 1 |
download | PGA, ZIF (ZIP) | PRS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | 162 | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||
| 40-6551-18 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 55 | Through Hole | -55°C~250°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 6 Weeks | 40 | Nickel Boron | EAR99 | STANDARD: UL 94V-0 | Polyetheretherketone (PEEK), Glass Filled | 1000000000Ohm | Closed Frame | 2.54mm | 2.59 inch | 0.9 inch | 1A | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 1000VAC V | 40 (2 x 20) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Nickel | Beryllium Nickel | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | ||||||||||||||||||||||||
| 44-6551-18 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 55 | Through Hole | -55°C~250°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 6 Weeks | 44 | Nickel Boron | EAR99 | STANDARD: UL 94V-0 | Polyetheretherketone (PEEK), Glass Filled | 1000000000Ohm | Closed Frame | 2.54mm | 2.79 inch | 0.9 inch | 1A | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 1000VAC V | 44 (2 x 22) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Nickel | Beryllium Nickel | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm |
