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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | Max Operating Temperature | Min Operating Temperature | RoHS Status | Published | Datasheet | Current Rating | Package / Case | Lead Free | Factory Lead Time | Number of Pins | Lead Pitch | Pbfree Code | Number of Positions | Number of Contacts | Contact Finish - Mating | Flammability Rating | ECCN Code | Additional Feature | Contact Plating | Housing Material | Lead Length | Insulation Resistance | JESD-609 Code | Feature | Terminal Pitch | Operating Temperature (Max) | Pitch | Body Length or Diameter | Body Breadth | Number of Rows | Current Rating (Amps) | PCB Contact Pattern | Body Depth | Contact Style | Mating Contact Pitch | PCB Contact Row Spacing | Dielectric Withstanding Voltage | Number of Positions or Pins (Grid) | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Material - Post | Pitch - Mating | Termination Post Length | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 84-PGM11009-10 | Aries Electronics |
Min: 1 Mult: 1 |
download | PGA | PGM | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | 105°C | -55°C | ROHS3 Compliant | 2009 | https://pdf.utmel.com/r/datasheets/arieselectronics-80pgm1505910-datasheets-3551.pdf | 3A | 6 Weeks | Gold | UL94 V-0 | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 4.191mm | 3A | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.165 4.19mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||
| 88-PGM13041-10 | Aries Electronics |
Min: 1 Mult: 1 |
download | PGA | PGM | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | 105°C | -55°C | ROHS3 Compliant | 2008 | https://pdf.utmel.com/r/datasheets/arieselectronics-80pgm1505910-datasheets-3551.pdf | 3A | Lead Free | 6 Weeks | 88 | Gold | UL94 V-0 | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 4.191mm | 3A | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.165 4.19mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||
| 25-7750-10 | Aries Electronics |
Min: 1 Mult: 1 |
download | SIP | 700 Elevator Strip-Line™ | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | 105°C | -55°C | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-20782510-datasheets-7957.pdf | 1.5A | SIP | 7 Weeks | 2.54mm | 25 | Tin | UL94 V-0 | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.81mm | Elevated | 2.54mm | 2 | 1.5A | 25 (1 x 25) | UL94 V-0 | 200.0μin 5.08μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.150 3.81mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||
| 18-3503-21 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.3 (7.62mm) Row Spacing | 503 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/arieselectronics-08250330-datasheets-7188.pdf | 3A | 5 Weeks | 18 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 9.144mm | Closed Frame | 18 (2 x 9) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Phosphor Bronze | 0.100 2.54mm | 0.360 9.14mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||
| 40-3574-11 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | /files/arieselectronics-24657410-datasheets-8308.pdf | 1A | 5 Weeks | yes | 40 | 40 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | e4 | Closed Frame | 40 (2 x 20) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||
| 40-C300-31 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.6 (15.24mm) Row Spacing | EJECT-A-DIP™ | Surface Mount | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2013 | /files/arieselectronics-14c28031-datasheets-8969.pdf | 3A | Lead Free | 5 Weeks | 40 | 2.54mm | yes | 40 | Gold | UL94 V-0 | EAR99 | LATCHED, UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 1.016mm | 1000000000Ohm | e4 | Closed Frame | 0.7 inch | 2 | RECTANGULAR | RND PIN-SKT | 0.1 inch | 0.6 mm | 1000VAC V | 40 (2 x 20) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.040 1.02mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||
| 44-6556-21 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.6 (15.24mm) Row Spacing | 6556 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | /files/arieselectronics-24655620-datasheets-9089.pdf | 3A | 4 Weeks | yes | 44 | 44 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 7.1882mm | e4 | Open Frame | 2.54mm | 150°C | 2.79 inch | 1.27 inch | RECTANGULAR | 0.29 inch | RND PIN-SKT | 0.1 inch | 0.6 mm | 44 (2 x 22) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.283 7.19mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||
| 24-6574-16 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf | 1A | 5 Weeks | yes | 24 | 24 | Tin | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | 1000000000Ohm | Closed Frame | 2.54mm | 200°C | 1.79 inch | 0.9 inch | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 0.6 mm | 1000VAC V | 24 (2 x 12) | UL94 V-0 | 200.0μin 5.08μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | 200.0μin 5.08μm | ||||||||||||||||||
| 48-6556-10 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.6 (15.24mm) Row Spacing | 6556 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-24655620-datasheets-9089.pdf | 3A | 4 Weeks | yes | 48 | 48 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Gold, Tin | Polyphenylene Sulfide (PPS), Glass Filled | 3.302mm | e3 | Open Frame | 2.54mm | 105°C | 2.99 inch | 1.27 inch | RECTANGULAR | 0.29 inch | RND PIN-SKT | 0.1 inch | 0.6 mm | 48 (2 x 24) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||
| 27-0501-30 | Aries Electronics |
Min: 1 Mult: 1 |
download | SIP | 501 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Wire Wrap | 105°C | -55°C | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-02050130-datasheets-3742.pdf | 1A | SIP | 7 Weeks | 2.54mm | 27 | Tin | UL94 V-0 | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 17.526mm | 2.54mm | 1 | 1A | 27 (1 x 27) | UL94 V-0 | 200.0μin 5.08μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.690 17.52mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||
| 28-6556-20 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.6 (15.24mm) Row Spacing | 6556 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-24655620-datasheets-9089.pdf | 3A | 5 Weeks | yes | 28 | 28 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Gold, Tin | Polyphenylene Sulfide (PPS), Glass Filled | 7.1882mm | e3 | Open Frame | 2.54mm | 105°C | 1.99 inch | 1.27 inch | RECTANGULAR | 0.29 inch | RND PIN-SKT | 0.1 inch | 0.6 mm | 28 (2 x 14) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.283 7.19mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||
| 160-PGM14029-40 | Aries Electronics |
Min: 1 Mult: 1 |
download | PGA | PGM | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | 105°C | -55°C | ROHS3 Compliant | 2009 | /files/arieselectronics-80pgm1505910-datasheets-3551.pdf | 3A | 6 Weeks | Gold | UL94 V-0 | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 4.191mm | 3A | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.165 4.19mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||
| 32-6571-16 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 57 | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf | 5 Weeks | yes | 32 | Nickel Boron | EAR99 | STANDARD: UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 1000000000Ohm | Closed Frame | 2.54mm | 200°C | 2.19 inch | 0.9 inch | 1A | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 0.6 mm | 1000VAC V | 32 (2 x 16) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Nickel | Beryllium Nickel | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | |||||||||||||||||||||
| 132-PGM14015-10H | Aries Electronics |
Min: 1 Mult: 1 |
download | PGA | PGM | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | 105°C | -55°C | ROHS3 Compliant | 2009 | /files/arieselectronics-80pgm1505910-datasheets-3551.pdf | 3A | 6 Weeks | Gold | UL94 V-0 | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 4.191mm | 3A | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.165 4.19mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||
| 28-8495-610C | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.6 (15.24mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 28 | 28 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 28 (2 x 14) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||
| 160-PGM15056-10 | Aries Electronics |
Min: 1 Mult: 1 |
download | PGA | PGM | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | 105°C | -55°C | ROHS3 Compliant | 2009 | /files/arieselectronics-80pgm1505910-datasheets-3551.pdf | 3A | 6 Weeks | Gold | UL94 V-0 | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 4.191mm | 3A | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.165 4.19mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||
| 28-0501-31 | Aries Electronics |
Min: 1 Mult: 1 |
download | SIP | 501 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Wire Wrap | 125°C | -55°C | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-02050130-datasheets-3742.pdf | 1A | SIP | 7 Weeks | 2.54mm | 28 | Gold | UL94 V-0 | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 17.526mm | 2.54mm | 1 | 1A | 28 (1 x 28) | UL94 V-0 | 10.0μin 0.25μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.690 17.52mm | 0.100 2.54mm | Gold | 10.0μin 0.25μm | ||||||||||||||||||||||||
| 30-8940-310C | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 30 | 30 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 30 (2 x 15) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||
| 42-6556-30 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.6 (15.24mm) Row Spacing | 6556 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-24655620-datasheets-9089.pdf | 3A | 6 Weeks | yes | 42 | 42 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Gold, Tin | Polyphenylene Sulfide (PPS), Glass Filled | 10.7442mm | e3 | Open Frame | 2.54mm | 105°C | 2.66 inch | 1.27 inch | RECTANGULAR | 0.29 inch | RND PIN-SKT | 0.1 inch | 0.6 mm | 42 (2 x 21) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.423 10.74mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||
| 36-7XXXX-10 | Aries Electronics |
Min: 1 Mult: 1 |
download | SIP | 700 Elevator Strip-Line™ | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | 105°C | -55°C | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/arieselectronics-20782510-datasheets-7957.pdf | 1.5A | SIP | 7 Weeks | 36 | Tin | UL94 V-0 | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.81mm | Elevated | 1.5A | 36 (1 x 36) | UL94 V-0 | 200.0μin 5.08μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.150 3.81mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||
| 36-3575-10 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf | 1A | 5 Weeks | yes | 36 | 36 | Tin | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | e3 | Closed Frame | 36 (2 x 18) | UL94 V-0 | 200.0μin 5.08μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | 200.0μin 5.08μm | ||||||||||||||||||||||||||||
| 44-3553-10 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 55 | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf | 4 Weeks | yes | 44 | Tin | EAR99 | STANDARD: UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | e3 | Closed Frame | 1A | 44 (2 x 22) | UL94 V-0 | 200.0μin 5.08μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||
| 34-0501-31 | Aries Electronics |
Min: 1 Mult: 1 |
download | SIP | 501 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-02050130-datasheets-3742.pdf | 1A | 7 Weeks | 2.54mm | yes | 34 | 34 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 17.526mm | e4 | 3.45 inch | 1 | RECTANGULAR | 0.26 inch | SQ PIN-SKT | 34 (1 x 34) | UL94 V-0 | 10.0μin 0.25μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.690 17.52mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||
| 36-3573-16 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf | 1A | 5 Weeks | yes | 36 | 36 | Nickel Boron | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Nickel | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | Closed Frame | 36 (2 x 18) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Nickel | Beryllium Nickel | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | |||||||||||||||||||||||||||
| 40-3570-16 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf | 1A | 5 Weeks | yes | 40 | 40 | Nickel Boron | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Nickel | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | Closed Frame | 40 (2 x 20) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Nickel | Beryllium Nickel | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | |||||||||||||||||||||||||||
| 42-6573-16 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf | 1A | 5 Weeks | yes | 42 | 42 | Tin | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | 1000000000Ohm | Closed Frame | 2.54mm | 200°C | 2.69 inch | 0.9 inch | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 0.6 mm | 1000VAC V | 42 (2 x 21) | UL94 V-0 | 200.0μin 5.08μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | 200.0μin 5.08μm | ||||||||||||||||||
| 28-6554-16 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 55 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf | 6 Weeks | yes | 28 | 28 | Nickel Boron | EAR99 | STANDARD: UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 1000000000Ohm | Closed Frame | 2.54mm | 200°C | 1.99 inch | 0.9 inch | 1A | RECTANGULAR | 0.47 inch | BELLOWED TYPE | 0.1 inch | 0.6 mm | 1000VAC V | 28 (2 x 14) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | |||||||||||||||||||
| 32-6552-16 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 55 | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2013 | /files/arieselectronics-40655411-datasheets-2991.pdf | 6 Weeks | yes | 32 | Nickel Boron | EAR99 | STANDARD: UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | Closed Frame | 1A | 32 (2 x 16) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | ||||||||||||||||||||||||||||||||
| 48-6575-16 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf | 1A | 5 Weeks | yes | 48 | 48 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | 1000000000Ohm | Closed Frame | 2.54mm | 200°C | 2.99 inch | 0.9 inch | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 0.6 mm | 1000VAC V | 48 (2 x 24) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||
| 36-6551-16 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 55 | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf | 6 Weeks | yes | 36 | Nickel Boron | EAR99 | STANDARD: UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | Closed Frame | 1A | 36 (2 x 18) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm |
