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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | Max Operating Temperature | Min Operating Temperature | RoHS Status | Published | Datasheet | Current Rating | Package / Case | Lead Free | Factory Lead Time | Number of Pins | Lead Pitch | Pbfree Code | Number of Positions | Number of Contacts | Contact Finish - Mating | Flammability Rating | ECCN Code | Additional Feature | Contact Plating | Housing Material | Lead Length | Insulation Resistance | JESD-609 Code | Feature | Terminal Pitch | Operating Temperature (Max) | Pitch | Body Length or Diameter | Body Breadth | Number of Rows | Current Rating (Amps) | PCB Contact Pattern | Body Depth | Contact Style | Mating Contact Pitch | PCB Contact Row Spacing | Dielectric Withstanding Voltage | Number of Positions or Pins (Grid) | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Material - Post | Pitch - Mating | Termination Post Length | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 32-3554-11 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 55 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf | 1A | 4 Weeks | 32 | 2.54mm | yes | 32 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | e4 | Closed Frame | 2 | 32 (2 x 16) | UL94 V-0 | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | ||||||||||||||||||||||||||||
| 24-8190-610C | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.6 (15.24mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 24 | 24 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 24 (2 x 12) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||
| 24-81250-610C | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.6 (15.24mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 24 | 24 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 24 (2 x 12) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||
| 32-8800-610C | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.6 (15.24mm) Row Spacing | 8 | Through Hole | -55°C~105°C | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2014 | 6 Weeks | yes | 32 | 32 | Gold | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | e3 | Closed Frame, Elevated | 3A | 32 (2 x 16) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||
| 24-8300-310C | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 24 | 24 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 24 (2 x 12) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||
| 40-1508-30 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.2 (5.08mm) Row Spacing | 508 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | /files/arieselectronics-01050830-datasheets-9229.pdf | 3A | 5 Weeks | 40 | 2.54mm | 40 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6 | 12.7mm | e3 | Closed Frame | 2 | RECTANGULAR | 0.193 inch | RND PIN-SKT | 0.1 inch | 0.1 mm | 40 (2 x 20) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.500 12.70mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||
| 38-3503-30 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.3 (7.62mm) Row Spacing | 503 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | /files/arieselectronics-08250330-datasheets-7188.pdf | 3A | 5 Weeks | 2.54mm | 38 | 38 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 12.7mm | Closed Frame | 2 | 38 (2 x 19) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Phosphor Bronze | 0.100 2.54mm | 0.500 12.70mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||
| 21-0508-31 | Aries Electronics |
Min: 1 Mult: 1 |
download | SIP | 508 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-01050830-datasheets-9229.pdf | 3A | 5 Weeks | 21 | 21 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6 | 12.7mm | e4 | 2.54mm | 1 | RECTANGULAR | RND PIN-SKT | 21 (1 x 21) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.500 12.70mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||
| 40-8600-610C | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.6 (15.24mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 40 | 40 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 40 (2 x 20) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||
| 40-81000-310C | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 40 | 40 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 40 (2 x 20) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||
| 24-3508-311 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.3 (7.62mm) Row Spacing | 508 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-143508301-datasheets-6498.pdf | 3A | 5 Weeks | 2.54mm | 24 | 24 | Gold | UL94 V-0 | EAR99 | STACKABLE | Polyamide (PA46), Nylon 4/6, Glass Filled | 12.7mm | Open Frame | 0.7 inch | 2 | RECTANGULAR | 0.19 inch | RND PIN-SKT | 0.1 inch | 0.3 mm | 24 (2 x 12) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.500 12.70mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||
| 28-C300-21 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.6 (15.24mm) Row Spacing | EJECT-A-DIP™ | Surface Mount | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-14c28031-datasheets-8969.pdf | 3A | 5 Weeks | 28 | 2.54mm | yes | 28 | Gold | UL94 V-0 | EAR99 | LATCHED, UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 1.016mm | 1000000000Ohm | e4 | Closed Frame | 1.69 inch | 0.7 inch | 2 | RECTANGULAR | RND PIN-SKT | 0.1 inch | 0.6 mm | 1000VAC V | 28 (2 x 14) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.040 1.02mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||
| 44-6573-10 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf | 1A | 5 Weeks | yes | 44 | 44 | Tin | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | 1000000000Ohm | e3 | Closed Frame | 2.54mm | 105°C | 2.79 inch | 0.9 inch | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 0.6 mm | 1000VAC V | 44 (2 x 22) | UL94 V-0 | 200.0μin 5.08μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | 200.0μin 5.08μm | |||||||||||||||||
| 44-3572-10 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf | 1A | 5 Weeks | yes | 44 | 44 | Tin | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | e3 | Closed Frame | 44 (2 x 22) | UL94 V-0 | 200.0μin 5.08μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | 200.0μin 5.08μm | ||||||||||||||||||||||||||||
| 30-3503-21 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.3 (7.62mm) Row Spacing | 503 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-08250330-datasheets-7188.pdf | 3A | 5 Weeks | 2.54mm | 30 | 30 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 9.144mm | Closed Frame | 2 | 30 (2 x 15) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Phosphor Bronze | 0.100 2.54mm | 0.360 9.14mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||
| 44-6573-11 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf | 1A | 5 Weeks | 44 | Tin | UL94 V-0 | Gold, Tin | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | Closed Frame | 1A | 44 (2 x 22) | UL94 V-0 | 200.0μin 5.08μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||
| 28-6570-16 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | /files/arieselectronics-24657410-datasheets-8308.pdf | 1A | 5 Weeks | yes | 28 | 28 | Nickel Boron | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Nickel | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | 1000000000Ohm | Closed Frame | 2.54mm | 200°C | 1.99 inch | 0.9 inch | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 0.6 mm | 1000VAC V | 28 (2 x 14) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Nickel | Beryllium Nickel | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | ||||||||||||||||
| 48-6572-11 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf | 1A | Lead Free | 5 Weeks | yes | 48 | 48 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | 1000000000Ohm | e4 | Closed Frame | 2.54mm | 150°C | 2.99 inch | 0.9 inch | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 0.6 mm | 1000VAC V | 48 (2 x 24) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||
| 38-3503-21 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.3 (7.62mm) Row Spacing | 503 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Wire Wrap | 125°C | -55°C | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-08250330-datasheets-7188.pdf | 3A | 5 Weeks | 2.54mm | 38 | Gold | UL94 V-0 | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 9.144mm | Closed Frame | 2.54mm | 2 | 3A | 38 (2 x 19) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Phosphor Bronze | 0.100 2.54mm | 0.360 9.14mm | 0.100 2.54mm | Gold | 10.0μin 0.25μm | ||||||||||||||||||||||||
| 42-6552-11 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 55 | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf | 4 Weeks | yes | 42 | Gold | EAR99 | STANDARD: UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | e4 | Closed Frame | 1A | 42 (2 x 21) | UL94 V-0 | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | ||||||||||||||||||||||||||||||||||
| 32-6556-11 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.6 (15.24mm) Row Spacing | 6556 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-24655620-datasheets-9089.pdf | 3A | 4 Weeks | yes | 32 | 32 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 3.302mm | e4 | Open Frame | 2.54mm | 150°C | 2.19 inch | 1.27 inch | RECTANGULAR | 0.29 inch | RND PIN-SKT | 0.1 inch | 0.6 mm | 32 (2 x 16) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||
| 38-6823-90C | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.6 (15.24mm) Row Spacing | Vertisockets™ 800 | Horizontal, Through Hole | Through Hole, Right Angle, Horizontal | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1282390c-datasheets-6745.pdf | 3A | 6 Weeks | 38 | 38 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e4 | Closed Frame | 2.54mm | 1.9 inch | 0.7 inch | RECTANGULAR | 0.528 inch | RND PIN-SKT | 0.1 inch | 0.3 mm | 38 (2 x 19) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||
| 40-3552-10 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 55 | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf | 4 Weeks | yes | 40 | Tin | EAR99 | STANDARD: UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | e3 | Closed Frame | 1A | 40 (2 x 20) | UL94 V-0 | 200.0μin 5.08μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||
| 20-9503-21 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.9 (22.86mm) Row Spacing | 503 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | /files/arieselectronics-08250330-datasheets-7188.pdf | 3A | 5 Weeks | 2.54mm | 20 | 20 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 9.144mm | Closed Frame | 2 | 20 (2 x 10) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Phosphor Bronze | 0.100 2.54mm | 0.360 9.14mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||
| 24-3552-11 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 55 | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf | 4 Weeks | yes | 24 | Gold | EAR99 | STANDARD: UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | e4 | Closed Frame | 1A | 24 (2 x 12) | UL94 V-0 | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | ||||||||||||||||||||||||||||||||||
| 28-8240-610C | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.6 (15.24mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | 28 | 28 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 28 (2 x 14) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||
| 120-PGM13015-11 | Aries Electronics |
Min: 1 Mult: 1 |
download | PGA | PGM | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -55°C | ROHS3 Compliant | 2009 | /files/arieselectronics-80pgm1505910-datasheets-3551.pdf | 3A | 6 Weeks | Gold | UL94 V-0 | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 4.191mm | 3A | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.165 4.19mm | 0.100 2.54mm | Gold | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||
| 40-6556-31 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.6 (15.24mm) Row Spacing | 6556 | Through Hole | 150°C | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 4 Weeks | yes | 40 | 40 | Gold | EAR99 | STANDARD: UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | e4 | Open Frame | 2.54mm | 2.59 inch | 1.27 inch | 3A | RECTANGULAR | 0.29 inch | RND PIN-SKT | 0.1 inch | 0.6 mm | 40 (2 x 20) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.423 10.74mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||
| 24-4508-21 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.4 (10.16mm) Row Spacing | 508 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | /files/arieselectronics-06350830-datasheets-4085.pdf | 3A | 4 Weeks | 2.54mm | 24 | 24 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 9.144mm | e4 | Open Frame | 0.5 inch | 2 | RECTANGULAR | 0.193 inch | RND PIN-SKT | 0.1 inch | 0.4 mm | 24 (2 x 12) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.360 9.14mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||
| 100-PGM13061-11 | Aries Electronics |
Min: 1 Mult: 1 |
download | PGA | PGM | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -55°C | ROHS3 Compliant | 2009 | /files/arieselectronics-80pgm1505910-datasheets-3551.pdf | 3A | 100 | 6 Weeks | Gold | UL94 V-0 | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 4.191mm | 3A | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.165 4.19mm | 0.100 2.54mm | Gold | 10.0μin 0.25μm |
