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ContactAries Electronics(10778)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | Max Operating Temperature | Min Operating Temperature | RoHS Status | Published | Datasheet | Current Rating | Package / Case | Length | Height | Color | Lead Free | Factory Lead Time | Number of Pins | Lead Pitch | Accessory Type | Pbfree Code | Number of Positions | Number of Contacts | Contact Finish - Mating | Flammability Rating | ECCN Code | Additional Feature | Contact Plating | Housing Material | Lead Length | JESD-609 Code | Feature | Terminal Pitch | Operating Temperature (Max) | Pitch | Connector Support Type | Body Length or Diameter | Body Breadth | Number of Rows | Row Spacing | Device Socket Type | Current Rating (Amps) | PCB Contact Pattern | Body Depth | Contact Style | Mating Contact Pitch | PCB Contact Row Spacing | Number of Positions or Pins (Grid) | Material Flammability Rating | Convert From (Adapter End) | Convert To (Adapter End) | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Material - Post | Pitch - Mating | Termination Post Length | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Board Material |
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| 229-PGM16015-10T | Aries Electronics |
Min: 1 Mult: 1 |
download | PGA | PGM | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | 105°C | -55°C | ROHS3 Compliant | 2009 | https://pdf.utmel.com/r/datasheets/arieselectronics-80pgm1505910-datasheets-3551.pdf | 3A | 6 Weeks | Tin | UL94 V-0 | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 4.191mm | 3A | UL94 V-0 | 200.0μin 5.08μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.165 4.19mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||||||
| 04-0508-31 | Aries Electronics |
Min: 1 Mult: 1 |
download | SIP | 508 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-01050830-datasheets-9229.pdf | 3A | 5 Weeks | 4 | 2.54mm | 4 | Gold | UL94 V-0 | EAR99 | Polyamide (PA46), Nylon 4/6 | 12.7mm | 1 | RECTANGULAR | RND PIN-SKT | 4 (1 x 4) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.500 12.70mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||||||
| 12-655-10 | Aries Electronics |
Min: 1 Mult: 1 |
download | 655 | Bulk | ROHS3 Compliant | 2006 | /files/arieselectronics-0665810-datasheets-2816.pdf | Red | Lead Free | 5 Weeks | 12 | 2.54mm | Cap (Cover) | 12 | Tin | 2.54mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 29-0518-10T | Aries Electronics |
Min: 1 Mult: 1 |
download | SIP | 518 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-10051810-datasheets-2521.pdf | 3A | 5 Weeks | 29 | 2.54mm | yes | 29 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e3 | Open Frame | 1 | 29 (1 x 29) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||
| 12-650-10 | Aries Electronics |
Min: 1 Mult: 1 |
download | 650 | 1 (Unlimited) | Solder | ROHS3 Compliant | 2007 | /files/arieselectronics-1465010-datasheets-1163.pdf | 4 Weeks | 2.54mm | Cap (Cover) | 12 | Tin | 2.54mm | CONNECTOR ACCESSORY | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 14-8260-10WR | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-14840010-datasheets-7181.pdf | 1A | 7 Weeks | yes | 14 | 14 | Tin | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 2.54mm | 0.75 inch | 0.395 inch | RECTANGULAR | 0.26 inch | SQ PIN-SKT | 0.1 inch | 0.3 mm | 14 (2 x 7) | UL94 V-0 | 200.0μin 5.08μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 200.0μin 5.08μm | |||||||||||||||||||||||||||
| 04-655-10 | Aries Electronics |
Min: 1 Mult: 1 |
download | 655 | Bulk | ROHS3 Compliant | 2007 | /files/arieselectronics-0665810-datasheets-2816.pdf | Red | Lead Free | 5 Weeks | 4 | 2.54mm | Cap (Cover) | 4 | Tin | 2.54mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 13-0513-11H | Aries Electronics |
Min: 1 Mult: 1 |
download | SIP | 0513 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-07051310-datasheets-2771.pdf | 3A | 5 Weeks | 2.54mm | yes | 13 | 13 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e4 | 1 | RECTANGULAR | RND PIN-SKT | 13 (1 x 13) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||
| 1107254-14 | Aries Electronics |
Min: 1 Mult: 1 |
download | Correct-A-Chip® 1107254 | Through Hole | Through Hole | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-110639628-datasheets-0009.pdf | 3A | 5 Weeks | 14 | 2.54mm | yes | 14 | Gold | UL94 V-0 | EAR99 | SOCKET ADAPTER | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.302mm | e3 | 0.7 inch | 2 | IC SOCKET | RECTANGULAR | 0.3 inch | RND PIN-SKT | 0.3 mm | UL94 V-0 | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.3 (7.62mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||
| 14-8435-10 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | /files/arieselectronics-14840010-datasheets-7181.pdf | 1A | 7 Weeks | yes | 14 | 14 | Tin | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 2.54mm | 0.75 inch | 0.395 inch | RECTANGULAR | SQ PIN-SKT | 0.1 inch | 0.3 mm | 14 (2 x 7) | UL94 V-0 | 200.0μin 5.08μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 200.0μin 5.08μm | ||||||||||||||||||||||||||||
| 14-35W000-10 | Aries Electronics |
Min: 1 Mult: 1 |
download | Correct-A-Chip® 35W000 | Through Hole | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2003 | /files/arieselectronics-2835w00010-datasheets-8362.pdf | SOIC | 17.8mm | 1.58mm | Lead Free | 5 Weeks | 14 | 14 | NOT SPECIFIED | EAR99 | IC SOCKET | SOIC-W | DIP, 0.3 (7.62mm) Row Spacing | Brass | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | Tin-Lead | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||||||||||||
| 18-3518-10H | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.3 (7.62mm) Row Spacing | 518 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-08351810t-datasheets-2464.pdf | 3A | 4 Weeks | 2.54mm | yes | 18 | 18 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e3 | Open Frame | 105°C | 1.8 inch | 0.4 inch | 2 | RECTANGULAR | 0.165 inch | RND PIN-SKT | 0.1 inch | 0.3 mm | 18 (2 x 9) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||
| 1106396-36 | Aries Electronics |
Min: 1 Mult: 1 |
download | Correct-A-Chip® 1106396 | Through Hole | Through Hole | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-110639628-datasheets-0009.pdf | 3A | 5 Weeks | 36 | 2.54mm | yes | 36 | Gold | UL94 V-0 | EAR99 | SOCKET ADAPTER | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.302mm | e3 | 2 | IC SOCKET | RECTANGULAR | RND PIN-SKT | 0.6 mm | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||
| 04-822-90C | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.3 (7.62mm) Row Spacing | Vertisockets™ 800 | Horizontal, Through Hole | Through Hole, Right Angle, Horizontal | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/arieselectronics-1282390c-datasheets-6745.pdf | 3A | 6 Weeks | 4 | 10 | Gold | UL94 V-0 | EAR99 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e4 | Closed Frame | 4 (2 x 2) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||||
| 14-665000-00 | Aries Electronics |
Min: 1 Mult: 1 |
download | Correct-A-Chip® 665000 | Surface Mount | Surface Mount | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2006 | /files/arieselectronics-1666500000-datasheets-0505.pdf | SOIC | 5 Weeks | 14 | 14 | 787.4μm | SOIC-W | SOIC | Brass | 0.050 1.27mm | 0.031 0.80mm | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||||||||||||
| 06-3518-10E | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.3 (7.62mm) Row Spacing | 518 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-08351810t-datasheets-2464.pdf | 3A | 4 Weeks | 2.54mm | yes | 6 | 6 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e3 | Open Frame | 105°C | 0.4 inch | 2 | RECTANGULAR | 0.173 inch | RND PIN-SKT | 0.1 inch | 0.3 mm | 6 (2 x 3) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||
| 16-307349-11-RC | Aries Electronics |
Min: 1 Mult: 1 |
download | Correct-A-Chip® 307349 | Through Hole | Through Hole | 1 (Unlimited) | Solder | ROHS3 Compliant | 2009 | /files/arieselectronics-1630734911rcp170up-datasheets-0307.pdf | 5 Weeks | 16 | Gold | EAR99 | 3.175mm | IC SOCKET | PLCC | DIP, 0.3 (7.62mm) Row Spacing | Brass | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | 10.0μin 0.25μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||||||||||||
| 08-3501-20 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.3 (7.62mm) Row Spacing | 501 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/arieselectronics-08350130-datasheets-3825.pdf | 1.5A | 7 Weeks | 8 | 8 | Tin | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.414mm | e3 | Closed Frame | 2.54mm | 0.45 inch | 0.39 inch | RECTANGULAR | 0.3 inch | SQ PIN-SKT | 0.1 inch | 0.3 mm | 8 (2 x 4) | UL94 V-0 | 200.0μin 5.08μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.410 10.41mm | 0.100 2.54mm | 200.0μin 5.08μm | ||||||||||||||||||||||||||||
| 16-354000-20 | Aries Electronics |
Min: 1 Mult: 1 |
download | Correct-A-Chip® 354000 | Surface Mount | 1 (Unlimited) | Solder | 105°C | -55°C | ROHS3 Compliant | 2006 | /files/arieselectronics-1435400010-datasheets-0450.pdf | 3A | 1.58mm | Lead Free | 5 Weeks | 16 | 16 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | e3 | 2 | 7.62 mm | IC SOCKET | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | SOIC | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.050 1.27mm | 10.0μin 0.25μm |
