Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Pbfree Code | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Temperature Grade | Operating Temperature (Max) | Operating Temperature (Min) | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Supplier Device Package | Screening Level | Number of I/O | Memory Type | Peripherals | Core Architecture | RAM Size | Data Bus Width | Turn On Delay Time | Speed Grade | Propagation Delay | Architecture | Frequency (Max) | Number of Outputs | Speed | uPs/uCs/Peripheral ICs Type | Number of Registers | Number of Inputs | RAM (words) | Bus Compatibility | Boundary Scan | Clock Frequency | Organization | Number of Gates | Number of Macro Cells | UV Erasable | Output Function | Core Processor | Connectivity | Number of Logic Elements/Cells | Number of Logic Blocks (LABs) | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Number of Equivalent Gates | Number of CLBs | JTAG BST | Combinatorial Delay of a CLB-Max | In-System Programmable |
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XC7Z100-L2FFG1156I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | Surface Mount | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | 800MHz | 3.1mm | ROHS3 Compliant | 2010 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 1156-BBGA, FCBGA | 35mm | 35mm | 10 Weeks | 1.05V | 950mV | 1156 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 3A991.D | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | Copper, Silver, Tin | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | NOT SPECIFIED | 130 | DMA | ARM | 256KB | 120 ps | 120 ps | MCU, FPGA | 554800 | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 444K Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||
XCV300-4FG256C | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | CMOS | 2mm | Non-RoHS Compliant | 17mm | 17mm | 256 | no | 8542.39.00.01 | e0 | TIN LEAD | YES | BOTTOM | BALL | 225 | 2.5V | 1mm | 256 | OTHER | 85°C | 2.625V | 2.375V | 30 | Not Qualified | S-PBGA-B256 | 1536 CLBS, 322970 GATES | FIELD PROGRAMMABLE GATE ARRAY | 322970 | 1536 | 0.6 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU7EG-3FFVF1517E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 1517-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 464 | DMA, WDT | 256KB | MCU, FPGA | 600MHz, 667MHz, 1.5GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
EFR-DI-PCI-AL-SITE | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU11EG-L1FFVC1760I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1760-BBGA, FCBGA | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B1760 | 512 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC6VSX475T-L1FFG1759I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 100°C | -40°C | CMOS | 3.5mm | RoHS Compliant | FCBGA | 42.5mm | 42.5mm | 900mV | 1759 | yes | 3A001.A.7.A | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 245 | 0.9V | 1mm | INDUSTRIAL | 0.93V | 30 | Field Programmable Gate Arrays | 11.2/2.5V | Not Qualified | 840 | 4.7MB | 840 | 1098MHz | 476160 | 37200 | FIELD PROGRAMMABLE GATE ARRAY | 5.87 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU11EG-L1FFVB1517I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1517-BBGA, FCBGA | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B1517 | 488 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCR3384XL-10PQ208CES | Xilinx |
Min: 1 Mult: 1 |
70°C | 0°C | RoHS Compliant | 1996 | /files/xilinx-xcr3384xl10pq208ces-datasheets-7564.pdf | PQFP | 3.3V | 208 | No | EEPROM | 10 | 135MHz | 24 | 24 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU17EG-2FFVD1760E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1760-BBGA, FCBGA | 11 Weeks | yes | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 308 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC2V1500-6FF896C | Xilinx |
Min: 1 Mult: 1 |
4 (72 Hours) | 85°C | 0°C | CMOS | 3.4mm | RoHS Compliant | FCBGA | 31mm | 31mm | 1.5V | 896 | no | EAR99 | No | 8542.39.00.01 | e0 | YES | BOTTOM | BALL | 225 | 1.5V | 1mm | 896 | OTHER | 1.575V | 30 | Field Programmable Gate Arrays | 1.51.5/3.33.3V | 108kB | 6 | 528 | 15360 | 528 | 820MHz | 1920 CLBS, 1500000 GATES | FIELD PROGRAMMABLE GATE ARRAY | 17280 | 1500000 | 1920 | 0.35 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU19EG-L1FFVD1760I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1760-BBGA, FCBGA | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B1760 | 308 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC6SLX45-L1FG676C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 3 (168 Hours) | 85°C | 0°C | CMOS | 2.44mm | RoHS Compliant | BGA | 27mm | 27mm | 1V | 676 | 676 | no | 3A991.D | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1V | 1mm | 676 | OTHER | 1.05V | 30 | Field Programmable Gate Arrays | 12.5/3.3V | Not Qualified | 358 | 261kB | 358 | 54576 | 43661 | 3411 | FIELD PROGRAMMABLE GATE ARRAY | 0.46 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU19EG-3FFVE1924E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1924-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 668 | DMA, WDT | 256KB | MCU, FPGA | 600MHz, 667MHz, 1.5GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV50-5CS144CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU11EG-3FFVC1156E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1156-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 360 | DMA, WDT | 256KB | MCU, FPGA | 600MHz, 667MHz, 1.5GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC9536XL-4PC44C | Xilinx |
Min: 1 Mult: 1 |
3 | CMOS | 4.57mm | Non-RoHS Compliant | 16.5862mm | 16.5862mm | 44 | EAR99 | 36 MACROCELLS | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | J BEND | 225 | 3.3V | 1.27mm | 44 | COMMERCIAL | 70°C | 3.6V | 3V | 30 | Programmable Logic Devices | 2.5/3.33.3V | Not Qualified | S-PQCC-J44 | 34 | 4 ns | 200MHz | 0 DEDICATED INPUTS, 34 I/O | 36 | MACROCELL | FLASH PLD | YES | YES | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7Z020-3CLG400E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | 0°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 866MHz | 1.6mm | ROHS3 Compliant | 2009 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 400-LFBGA, CSPBGA | 17mm | 1V | 400 | 10 Weeks | 400 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | EAR99 | Copper, Silver, Tin | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1V | 0.8mm | XC7Z020 | 1.05V | 30 | 130 | DMA | ARM | 256KB | 32b | -3 | MCU, FPGA | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Artix™-7 FPGA, 85K Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||
XA3S200-4FTG256Q | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 3 (168 Hours) | 125°C | -40°C | 1.55mm | RoHS Compliant | 17mm | 17mm | 1.2V | 256 | 256 | yes | EAR99 | e1 | BOTTOM | BALL | 260 | 1.2V | 1mm | 256 | AUTOMOTIVE | 1.26V | 30 | Field Programmable Gate Arrays | 1.21.2/3.32.5V | Not Qualified | AEC-Q100 | 173 | 27kB | 4 | 173 | 125MHz | 200000 | 4320 | 480 | FIELD PROGRAMMABLE GATE ARRAY | 480 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7Z014S-1CLG484I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2016 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 484-LFBGA, CSPBGA | 19mm | 19mm | 484 | 10 Weeks | yes | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | 1.05V | 0.95V | NOT SPECIFIED | S-PBGA-B484 | 200 | DMA | 256KB | MCU, FPGA | 667MHz | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | 667MHz | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Artix™-7 FPGA, 65K Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC95216-20PQG160I | Xilinx |
Min: 1 Mult: 1 |
3 | 85°C | -40°C | CMOS | 3.7mm | Non-RoHS Compliant | PQFP | 5V | 160 | 160 | yes | EAR99 | YES | No | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 245 | 5V | 0.65mm | 160 | INDUSTRIAL | 30 | Programmable Logic Devices | 133 | FLASH | 20 ns | 20 | 20 ns | 50MHz | 0 DEDICATED INPUTS, 133 I/O | 216 | MACROCELL | 8 | YES | YES | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU9CG-1FFVC900E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 900-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 204 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 1.2GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC5VLX50-2FF324I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 100°C | -40°C | CMOS | RoHS Compliant | FCBGA | 19mm | 19mm | 1V | 324 | 324 | no | 3A991.D | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1V | 1mm | 324 | 1.05V | 30 | Field Programmable Gate Arrays | Not Qualified | 220 | 216kB | 2 | 220 | 46080 | 3600 | FIELD PROGRAMMABLE GATE ARRAY | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU2CG-2SBVA484I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 484-BFBGA, FCBGA | 484 | 11 Weeks | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.85V | 0.876V | NOT SPECIFIED | R-PBGA-B484 | 82 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC4VLX200-11FF1513CS2 | Xilinx |
Min: 1 Mult: 1 |
4 (72 Hours) | 85°C | 0°C | CMOS | Non-RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/xilinx-xc4vlx20011ff1513cs2-datasheets-9983.pdf | FCBGA | 1.2V | 1513 | no | 3A001.A.7.A | No | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 1mm | Field Programmable Gate Arrays | 1.21.2/3.32.5V | S-PBGA-B1513 | 756kB | 11 | 960 | 960 | 1205MHz | FIELD PROGRAMMABLE GATE ARRAY | 200448 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XAZU5EV-1SFVC784I | Xilinx |
Min: 1 Mult: 1 |
download | 3 (168 Hours) | CMOS | 3.32mm | ROHS3 Compliant | /files/xilinxinc-xazu5ev1sfvc784q-datasheets-4796.pdf | 23mm | 23mm | 784 | 11 Weeks | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.85V | 0.8mm | INDUSTRIAL | 100°C | -40°C | NOT SPECIFIED | S-PBGA-B784 | MICROPROCESSOR CIRCUIT | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCS10XL-5VQG100C | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | 85°C | 0°C | CMOS | 1.2mm | RoHS Compliant | 14mm | 14mm | 3.3V | 100 | 100 | EAR99 | No | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 3.3V | 100 | OTHER | 3.6V | 30 | Field Programmable Gate Arrays | 5 | 77 | 616 | 196 CLBS, 3000 GATES | FIELD PROGRAMMABLE GATE ARRAY | 466 | 3000 | 196 | 1 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7Z045-2FFG900CES | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | 0°C~85°C TJ | Tray | 4 (72 Hours) | 85°C | 0°C | 800MHz | RoHS Compliant | 2010 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 900-BBGA, FCBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | XC7Z045 | 900-FCBGA (31x31) | 130 | DMA | ARM | 256KB | MCU, FPGA | 800MHz | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 350K Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV400E-8BG432I | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | CMOS | 1.7mm | Non-RoHS Compliant | BGA | 40mm | 40mm | 432 | no | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 1.8V | 1.27mm | 432 | 1.89V | 1.71V | 30 | Field Programmable Gate Arrays | 1.2/3.61.8V | Not Qualified | 316 | 316 | 416MHz | 2400 CLBS, 129600 GATES | FIELD PROGRAMMABLE GATE ARRAY | 10800 | 129600 | 2400 | 0.4 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XA7Z020-1CLG400I | Xilinx |
Min: 1 Mult: 1 |
download | Automotive, AEC-Q100, Zynq®-7000 XA | Surface Mount | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | 667MHz | 1.6mm | ROHS3 Compliant | 2010 | /files/xilinxinc-xa7z0201clg484q-datasheets-0818.pdf | 400-LFBGA, CSPBGA | 17mm | 1V | 400 | 10 Weeks | 400 | CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | EAR99 | Copper, Silver, Tin | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 0.8mm | NOT SPECIFIED | Other uPs/uCs/Peripheral ICs | 11.8V | Not Qualified | 130 | DMA | ARM | 256KB | 32b | MCU, FPGA | MICROPROCESSOR CIRCUIT | N | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Artix™-7 FPGA, 85K Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||
XQV300-4BG352N | Xilinx |
Min: 1 Mult: 1 |
download | Bulk | 3 (168 Hours) | CMOS | 1.7mm | Non-RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/xilinx-xqv3004bg352n-datasheets-0938.pdf | 35mm | 35mm | Contains Lead | 352 | no | 3A001.A.2.C | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 2.5V | 1.27mm | 352 | MILITARY | 125°C | -55°C | 2.625V | 2.375V | 30 | Field Programmable Gate Arrays | 1.2/3.62.5V | Not Qualified | S-PBGA-B352 | 38535Q/M;38534H;883B | 260 | 260 | 1536 CLBS, 322970 GATES | 300000 | FIELD PROGRAMMABLE GATE ARRAY | 6912 | 322970 | 1536 | 0.8 ns |
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