Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | REACH SVHC | Number of Pins | Density | Pbfree Code | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | JESD-609 Code | Terminal Finish | Applications | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Memory Size | Number of I/O | Memory Type | RAM Size | Speed Grade | Propagation Delay | Number of Outputs | Number of Registers | Number of Inputs | Output Characteristics | Access Time | Programming Voltage | Clock Frequency | Organization | Memory Width | Memory Density | Parallel/Serial | Standby Current-Max | Endurance | Data Retention Time-Min | Access Time (Max) | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Ready/Busy | Common Flash Interface | Page Size | I/O Type | Memory IC Type | Number of Gates | Operating System | Number of Logic Elements/Cells | Programmable Logic Type | Number of Logic Cells | Number of CLBs | License - User Details | Media Delivery Type | License Length | Programmable Type | Total RAM Bits | Number of LABs/CLBs | Combinatorial Delay of a CLB-Max |
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EF-DI-MODULARVOIP-WW | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | Worldwide | Electronically Delivered | 1 Year | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
EF-CSP-SIOTK-NL | Xilinx |
Min: 1 Mult: 1 |
download | System Analyzer | ChipScope™ Pro | 1 (Unlimited) | RoHS Compliant | 2011 | /files/xilinxinc-efrdidisplayportaudiosite-datasheets-6621.pdf | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
EF-VIVADO-DESIGN-FL | Xilinx |
Min: 1 Mult: 1 |
download | Integrated Software Environment (ISE) | Vivado™ Design Suite | Not Applicable | Non-RoHS Compliant | 2 Weeks | Programming | Linux, Windows | Floating Node | Electronically Delivered | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
EF-DI-CCM-WW | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | Worldwide | 1 Year | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
EF-DI-ETRNIC-WW | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | Worldwide | Electronically Delivered | 1 Year | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
LMS-EMBD-ZUPSW | Xilinx |
Min: 1 Mult: 1 |
download | License | Electronically Delivered | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
EF-DI-TEMAC-PROJ | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | 2 Weeks | Project | Electronically Delivered | 1 Year | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC17S200APDG8C | Xilinx |
Min: 1 Mult: 1 |
download | Through Hole | 0°C~70°C | Tube | 1 (Unlimited) | CMOS | 4.5974mm | RoHS Compliant | 1999 | /files/xilinxinc-xc17s200apdg8i-datasheets-4355.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | 3.3V | 8 | 8 | yes | EAR99 | No | 1 | e3 | Matte Tin (Sn) | NO | 3V~3.6V | DUAL | 250 | 3.3V | 2.54mm | XC17S200A | 8 | 3.6V | 3V | 30 | 0.015mA | 2Mb | 3-STATE | 1 | SERIAL | 0.001A | COMMON | CONFIGURATION MEMORY | OTP | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC17S15AVOG8C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | CMOS | 1.2mm | RoHS Compliant | 1999 | /files/xilinxinc-xc17s200apdg8i-datasheets-4355.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | 3.3V | 8 | 8 | 512 kb | yes | EAR99 | No | 1 | e3 | Matte Tin (Sn) | YES | 3V~3.6V | DUAL | GULL WING | 260 | 3.3V | 1.27mm | XC17S15A | 8 | 3.6V | 3V | 30 | 0.015mA | 150kb | 3-STATE | 197696X1 | 1 | SERIAL | 0.001A | COMMON | CONFIGURATION MEMORY | OTP | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCF128XFTG64C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | CMOS | 50MHz | 1.2mm | ROHS3 Compliant | 2005 | /files/xilinxinc-xcf128xftg64c-datasheets-1244.pdf | 64-TBGA | 13mm | 10mm | 64 | 10 Weeks | Unknown | 64 | EAR99 | Copper, Silver, Tin | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | 1.7V~2V | BOTTOM | BALL | 260 | 1.8V | 1mm | XCF128X | 64 | 2V | 1.7V | 30 | 1.81.8/3.3V | 0.053mA | 128Mb | FLASH | 85 ns | 1.8V | 8MX16 | 16 | 134217728 bit | PARALLEL | 0.000075A | NO | NO | YES | 4127 | YES | YES | 4words | In System Programmable | ||||||||||||||||||||||||||||||||||||||||||||||||
XC18V01PC20C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 0°C~70°C | Tube | 3 (168 Hours) | CMOS | 4.572mm | Non-RoHS Compliant | 1998 | /files/xilinxinc-xc18v02pc44c0936-datasheets-4382.pdf | 20-LCC (J-Lead) | 8.9662mm | 8.9662mm | 3.3V | Contains Lead | 20 | 10 Weeks | 20 | 1 Mb | no | EAR99 | No | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | 3V~3.6V | QUAD | J BEND | 225 | 3.3V | 1.27mm | XC18V01 | 20 | 3.6V | 3V | 30 | Flash Memories | 0.025mA | 33MHz | 128KX8 | 8 | PARALLEL/SERIAL | 0.01A | 20 | 15 ns | CONFIGURATION MEMORY | In System Programmable | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC17256EPC20C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 0°C~70°C | Tube | 3 (168 Hours) | CMOS | SYNCHRONOUS | 4.572mm | Non-RoHS Compliant | 2000 | /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf | 20-LCC (J-Lead) | 8.9662mm | 8.9662mm | Contains Lead | 20 | 20 | EAR99 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | not_compliant | 8542.32.00.61 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | 4.75V~5.25V | QUAD | J BEND | 225 | 5V | 1.27mm | XC17256E | 20 | 5.25V | 4.75V | 30 | 5V | 0.01mA | Not Qualified | 256Kb | 3-STATE | 15MHz | 256KX1 | 1 | 262144 bit | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | |||||||||||||||||||||||||||||||||||||||||||||||||||||
XC17256EPC20I | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C | Tube | 3 (168 Hours) | CMOS | SYNCHRONOUS | 4.572mm | Non-RoHS Compliant | 2000 | /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf | 20-LCC (J-Lead) | 8.9662mm | 8.9662mm | Contains Lead | 20 | 20 | EAR99 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | not_compliant | 8542.32.00.61 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | 4.5V~5.5V | QUAD | J BEND | 225 | 5V | 1.27mm | XC17256E | 20 | 5.5V | 4.5V | 30 | 5V | 0.01mA | Not Qualified | 256Kb | 3-STATE | 15MHz | 256KX1 | 1 | 262144 bit | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | |||||||||||||||||||||||||||||||||||||||||||||||||||||
XC17S05XLVO8C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 0°C~70°C | Tube | 1 (Unlimited) | CMOS | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xc17s10xlpdg8c-datasheets-4365.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | Contains Lead | 8 | 8 | EAR99 | not_compliant | 1 | e0 | YES | 3V~3.6V | DUAL | GULL WING | 3.3V | 1.27mm | XC17S05XL | 8 | 3.6V | 3V | 3.3V | 0.005mA | Not Qualified | 50kb | 3-STATE | 10MHz | 54544X1 | 1 | 54544 bit | 0.00005A | COMMON | MEMORY CIRCUIT | OTP | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC17128EVO8C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 0°C~70°C | Tube | 1 (Unlimited) | CMOS | Non-RoHS Compliant | 2000 | /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9276mm | 3.937mm | 5V | Contains Lead | 8 | 8 | 128 kb | EAR99 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | No | 1 | e0 | YES | 4.75V~5.25V | DUAL | GULL WING | 225 | 5V | 1.27mm | XC17128E | 8 | 30 | 5V | 0.01mA | 3-STATE | 15MHz | 1 | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC17S15APD8C | Xilinx |
Min: 1 Mult: 1 |
download | Through Hole | 0°C~70°C | Tube | Not Applicable | CMOS | 4.5974mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xc17s200apdg8i-datasheets-4355.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | 3.3V | Contains Lead | 8 | 8 | 512 kb | no | EAR99 | No | 1 | e0 | NO | 3V~3.6V | DUAL | 225 | 3.3V | 2.54mm | XC17S15A | 8 | 3.6V | 3V | 30 | 0.005mA | 150kb | 3-STATE | 197696X1 | 1 | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC17S30APD8C | Xilinx |
Min: 1 Mult: 1 |
download | Through Hole | 0°C~70°C | Tube | 1 (Unlimited) | CMOS | 4.5974mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xc17s200apdg8i-datasheets-4355.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | 3.3V | Contains Lead | 8 | 8 | 512 kb | no | EAR99 | No | 1 | e0 | NO | 3V~3.6V | DUAL | 225 | 3.3V | 2.54mm | XC17S30 | 8 | 3.6V | 3V | 30 | 0.005mA | 300kb | 3-STATE | 1 | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC17S30VO8I | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C | Tube | 1 (Unlimited) | CMOS | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xc17s10xlpdg8c-datasheets-4365.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | Contains Lead | 8 | 8 | EAR99 | not_compliant | 1 | e0 | YES | 4.5V~5.5V | DUAL | GULL WING | 5V | 1.27mm | XC17S30 | 8 | 5.5V | 4.5V | 5V | 0.01mA | Not Qualified | 300kb | 3-STATE | 10MHz | 1 | 0.00005A | COMMON | MEMORY CIRCUIT | OTP | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC17V01PC20C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 0°C~70°C | Tube | 3 (168 Hours) | CMOS | SYNCHRONOUS | 4.572mm | Non-RoHS Compliant | 1998 | /files/xilinxinc-xc17v01vo8c-datasheets-2408.pdf | 20-LCC (J-Lead) | 8.9662mm | 8.9662mm | Contains Lead | 20 | 20 | no | EAR99 | not_compliant | 8542.32.00.61 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | 3V~3.6V | QUAD | J BEND | 225 | 3.3V | 1.27mm | XC17V01 | 20 | 3.6V | 3V | 30 | 3.3V | 0.015mA | Not Qualified | 1Mb | 3-STATE | 15MHz | 1MX1 | 1 | 1048576 bit | SERIAL | 0.001A | COMMON | CONFIGURATION MEMORY | OTP | |||||||||||||||||||||||||||||||||||||||||||||||||||||
XC17S50APD8I | Xilinx |
Min: 1 Mult: 1 |
download | Through Hole | -40°C~85°C | Tube | Not Applicable | CMOS | 4.5974mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xc17s200apdg8i-datasheets-4355.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | 3.3V | Contains Lead | 8 | 8 | 1 Mb | no | EAR99 | No | 1 | e0 | NO | 3V~3.6V | DUAL | 225 | 3.3V | 2.54mm | XC17S50A | 8 | 3.6V | 3V | 30 | 0.015mA | 500kb | 3-STATE | 559200X1 | 1 | SERIAL | 0.001A | COMMON | CONFIGURATION MEMORY | OTP | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC18V01VQ44I | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | CMOS | 1.2mm | Non-RoHS Compliant | 1998 | /files/xilinxinc-xc18v04vq44i-datasheets-2494.pdf | 44-TQFP | 10mm | 10mm | 3.3V | Contains Lead | 44 | 44 | 1 Mb | 3A001.B.1.A | No | 8542.39.00.01 | 1 | e0 | TIN LEAD | YES | 3V~3.6V | QUAD | GULL WING | 225 | 3.3V | 0.8mm | XC18V01 | 44 | 3.6V | 3V | 30 | Flash Memories | 0.025mA | 33MHz | 128KX8 | 8 | PARALLEL/SERIAL | 0.01A | 10000 Write/Erase Cycles | 10 | 15 ns | CONFIGURATION MEMORY | In System Programmable | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC1701LPD8C | Xilinx |
Min: 1 Mult: 1 |
download | Through Hole | 0°C~70°C | Tube | Not Applicable | CMOS | SYNCHRONOUS | 4.5974mm | Non-RoHS Compliant | 2000 | /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | Contains Lead | 8 | 8 | no | EAR99 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | not_compliant | 1 | e0 | NO | 3V~3.6V | DUAL | 225 | 3.3V | 2.54mm | XC1701L | 8 | 3.6V | 3V | 30 | 3.3V | 0.01mA | Not Qualified | 1Mb | 3-STATE | 15MHz | 1MX1 | 1 | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7K325T-1FFG900I | Xilinx |
Min: 1 Mult: 1 |
download | Kintex®-7 | Surface Mount | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | 3.35mm | ROHS3 Compliant | 2009 | /files/xilinxinc-xc7k325t1ffg900i-datasheets-5484.pdf | 900-BBGA, FCBGA | 31mm | 31mm | 900 | 11 Weeks | yes | 3A991.D | not_compliant | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | YES | 0.97V~1.03V | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | XC7K325T | 900 | NOT SPECIFIED | Field Programmable Gate Arrays | 11.83.3V | Not Qualified | S-PBGA-B900 | 1GB | 500 | DDR3 | 2MB | -1 | 500 | 407600 | 500 | 1098MHz | 326080 | FIELD PROGRAMMABLE GATE ARRAY | 16404480 | 25475 | 0.74 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7A200T-L1FBG676I | Xilinx |
Min: 1 Mult: 1 |
download | Artix-7 | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 4 (72 Hours) | 2.54mm | ROHS3 Compliant | 2009 | /files/xilinxinc-xc7a15t2fgg484c-datasheets-5466.pdf | 676-BBGA, FCBGA | 27mm | 27mm | 950mV | 676 | 10 Weeks | 3A991.D | Copper, Silver, Tin | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 0.95V~1.05V | BOTTOM | BALL | NOT SPECIFIED | 0.95V | 1mm | NOT SPECIFIED | S-PBGA-B676 | 1GB | 400 | DDR3 | 1.6MB | 130 ps | 269200 | 215360 | FIELD PROGRAMMABLE GATE ARRAY | 13455360 | 16825 | 1.27 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7K70T-1FBG676I | Xilinx |
Min: 1 Mult: 1 |
download | Kintex®-7 | Surface Mount | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | 2.54mm | ROHS3 Compliant | 2010 | /files/xilinxinc-xc7k325t1ffg900i-datasheets-5484.pdf | 676-BBGA, FCBGA | 27mm | 27mm | 676 | 10 Weeks | 676 | yes | 3A991.D | Copper, Silver, Tin | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | YES | 0.97V~1.03V | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | XC7K70T | 676 | NOT SPECIFIED | Field Programmable Gate Arrays | 11.83.3V | Not Qualified | 300 | 607.5kB | -1 | 300 | 82000 | 1098MHz | 65600 | FIELD PROGRAMMABLE GATE ARRAY | 4976640 | 5125 | 0.74 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7A100T-2FGG676C | Xilinx |
Min: 1 Mult: 1 |
download | Artix-7 | Surface Mount | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | ROHS3 Compliant | 2009 | /files/xilinxinc-xc7a15t2fgg484c-datasheets-5466.pdf | 676-BGA | 27mm | 27mm | 676 | 12 Weeks | 676 | yes | 3A991.D | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | YES | 0.95V~1.05V | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | XC7A100T | 676 | NOT SPECIFIED | Field Programmable Gate Arrays | 1V | Not Qualified | 300 | 607.5kB | -2 | 300 | 126800 | 1286MHz | 101440 | FIELD PROGRAMMABLE GATE ARRAY | 4976640 | 7925 | 1.05 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC2S30-5CS144I | Xilinx |
Min: 1 Mult: 1 |
download | Spartan®-II | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 1.2mm | Non-RoHS Compliant | 2004 | /files/xilinxinc-xc2s155tq144c-datasheets-8899.pdf | 144-TFBGA, CSPBGA | 12mm | 12mm | 2.5V | Contains Lead | 144 | 10 Weeks | 144 | no | EAR99 | not_compliant | e0 | Tin/Lead (Sn63Pb37) | 2.375V~2.625V | BOTTOM | BALL | 240 | 2.5V | 0.8mm | XC2S30 | 144 | 30 | Field Programmable Gate Arrays | Not Qualified | 92 | 3kB | 5 | 92 | 263MHz | 30000 | 972 | FIELD PROGRAMMABLE GATE ARRAY | 972 | 216 | 24576 | 216 | 0.7 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC3S250E-4FTG256C | Xilinx |
Min: 1 Mult: 1 |
download | Spartan®-3E | Surface Mount | Surface Mount | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 572MHz | ROHS3 Compliant | 2008 | /files/xilinxinc-xc3s500e4pq208i-datasheets-5586.pdf | 256-LBGA | 17mm | 1mm | 17mm | 1.2V | Lead Free | 256 | 10 Weeks | Unknown | 256 | yes | EAR99 | e1 | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | XC3S250E | 256 | 30 | Field Programmable Gate Arrays | 1.21.2/3.32.5V | Not Qualified | 172 | 27kB | 4 | 132 | 4896 | 250000 | 5508 | FIELD PROGRAMMABLE GATE ARRAY | 612 | 221184 | 612 | 0.76 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC3S200-4PQG208C | Xilinx |
Min: 1 Mult: 1 |
download | Spartan®-3 | Surface Mount | Surface Mount | 0°C~85°C TJ | Tray | 3 (168 Hours) | SMD/SMT | CMOS | 630MHz | ROHS3 Compliant | 2006 | /files/xilinxinc-xc3s4004ftg256c-datasheets-5507.pdf | 208-BFQFP | 28mm | 3.4mm | 28mm | 1.2V | Lead Free | 208 | 10 Weeks | Unknown | 208 | yes | EAR99 | Tin | e3 | 1.14V~1.26V | QUAD | GULL WING | 245 | 1.2V | 0.5mm | XC3S200 | 208 | 30 | Field Programmable Gate Arrays | 1.21.2/3.32.5V | Not Qualified | 141 | 27kB | 4 | 141 | 200000 | 4320 | FIELD PROGRAMMABLE GATE ARRAY | 480 | 221184 | 480 | 0.61 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||
XC3S100E-4TQG144I | Xilinx |
Min: 1 Mult: 1 |
download | Spartan®-3E | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2008 | /files/xilinxinc-xc3s500e4pq208i-datasheets-5586.pdf | 144-LQFP | 20mm | 1.45mm | 20mm | 1.2V | 144 | 10 Weeks | 144 | yes | EAR99 | e3 | Matte Tin (Sn) | 1.14V~1.26V | QUAD | GULL WING | 260 | 1.2V | 0.5mm | XC3S100E | 144 | 30 | Field Programmable Gate Arrays | 1.21.2/3.32.5V | Not Qualified | 108 | 9kB | 4 | 80 | 1920 | 572MHz | 100000 | 2160 | FIELD PROGRAMMABLE GATE ARRAY | 240 | 73728 | 240 | 0.76 ns |
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