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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Pbfree Code | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Temperature Grade | Operating Temperature (Max) | Operating Temperature (Min) | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Supplier Device Package | Screening Level | Number of I/O | Memory Type | Peripherals | Core Architecture | RAM Size | Data Bus Width | Turn On Delay Time | Speed Grade | Propagation Delay | Architecture | Frequency (Max) | Number of Outputs | Speed | uPs/uCs/Peripheral ICs Type | Number of Registers | Number of Inputs | RAM (words) | Bus Compatibility | Boundary Scan | Clock Frequency | Organization | Number of Gates | Number of Macro Cells | UV Erasable | Output Function | Core Processor | Connectivity | Number of Logic Elements/Cells | Number of Logic Blocks (LABs) | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Number of Equivalent Gates | Number of CLBs | JTAG BST | Combinatorial Delay of a CLB-Max | In-System Programmable |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XCZU7EV-2FFVF1517I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EV | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 1517-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 464 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC2S200E-6FTG256C | Xilinx |
Min: 1 Mult: 1 |
download | Standard | 3 (168 Hours) | 85°C | 0°C | CMOS | 2mm | RoHS Compliant | 2001 | https://pdf.utmel.com/r/datasheets/xilinx-xc2s200e6ftg256c-datasheets-6510.pdf | 17mm | 17mm | 1.8V | 256 | 256 | yes | EAR99 | MAXIMUM USABLE GATES = 200000 | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | BOTTOM | BALL | 260 | 1.8V | 1mm | 256 | OTHER | 1.89V | 30 | Field Programmable Gate Arrays | 7kB | 6 | 289 | 357MHz | FIELD PROGRAMMABLE GATE ARRAY | 5292 | 71000 | 0.47 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU9EG-3FFVC900E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2013 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 900-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 204 | DMA, WDT | 256KB | MCU, FPGA | 600MHz, 1.5GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCV300E-7BG432CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU11EG-2FFVF1517I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1517-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 464 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC5VTX150T-1FF1759C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 85°C | 0°C | CMOS | 3.5mm | RoHS Compliant | FCBGA | 42.5mm | 42.5mm | 1V | 1759 | No | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 1V | OTHER | Field Programmable Gate Arrays | 680 | 1MB | 1 | 680 | 148480 | 11600 | FIELD PROGRAMMABLE GATE ARRAY | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU17EG-1FFVB1517I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1517-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 644 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC2VP4-7FGG256C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 3 (168 Hours) | 85°C | 0°C | CMOS | 2mm | RoHS Compliant | BGA | 1.5V | 256 | 256 | yes | EAR99 | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | BOTTOM | BALL | 260 | 1.5V | 1mm | 256 | OTHER | 30 | Field Programmable Gate Arrays | 1.51.5/3.32/2.52.5V | Not Qualified | 140 | 63kB | 7 | 140 | 6016 | 1350MHz | 6768 | 752 | FIELD PROGRAMMABLE GATE ARRAY | 752 | 0.28 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU11EG-3FFVC1760E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1760-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 512 | DMA, WDT | 256KB | MCU, FPGA | 600MHz, 667MHz, 1.5GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC6SLX45-L1FG484C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 3 (168 Hours) | 85°C | 0°C | CMOS | 2.6mm | RoHS Compliant | FBGA | 23mm | 23mm | 1V | 484 | 484 | no | 3A991.D | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1V | 1mm | 484 | OTHER | 1.05V | 30 | Field Programmable Gate Arrays | 12.5/3.3V | Not Qualified | 316 | 261kB | 316 | 54576 | 43661 | 3411 | FIELD PROGRAMMABLE GATE ARRAY | 0.46 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU17EG-L2FFVD1760E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1760-BBGA, FCBGA | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B1760 | 308 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC5VLX155T-2FFG1738I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 100°C | -40°C | CMOS | 3.5mm | RoHS Compliant | FCBGA | 1V | 1738 | 3A991.D | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | BOTTOM | BALL | 245 | 1V | 1mm | 1.05V | 30 | Field Programmable Gate Arrays | Not Qualified | 680 | 954kB | 2 | 680 | 155648 | 12160 | FIELD PROGRAMMABLE GATE ARRAY | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU11EG-L2FFVB1517E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1517-BBGA, FCBGA | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B1517 | 488 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCV50-4TQ144CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU7EG-2FBVB900I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 900-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 204 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC3S200A-5FT256C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 3 (168 Hours) | 85°C | 0°C | CMOS | RoHS Compliant | 17mm | 17mm | 1.2V | 256 | 256 | no | EAR99 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 240 | 1.2V | 1mm | 256 | OTHER | 1.26V | 30 | Field Programmable Gate Arrays | Not Qualified | 195 | 36kB | 5 | 160 | 770MHz | 200000 | 4032 | 448 | FIELD PROGRAMMABLE GATE ARRAY | 448 | 0.62 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z030-1SBG485C | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | 0°C~85°C TJ | Tray | 4 (72 Hours) | CMOS | 667MHz | 2.44mm | ROHS3 Compliant | 2009 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 484-FBGA, FCBGA | 19mm | 485 | 10 Weeks | 485 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | EAR99 | Copper, Silver, Tin | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | YES | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | 1.05V | 0.95V | NOT SPECIFIED | Other Microprocessor ICs | 11.8V | Not Qualified | 130 | DMA | ARM | 256KB | 32b | -1 | MCU, FPGA | MICROPROCESSOR CIRCUIT | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | N | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 125K Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||
| XC5VLX110-2FFG1760I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 100°C | -40°C | CMOS | 3.5mm | RoHS Compliant | FCBGA | 1V | 1760 | yes | 3A001.A.7.A | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | BOTTOM | BALL | 245 | 1V | 1mm | 1.05V | 30 | Field Programmable Gate Arrays | Not Qualified | 800 | 576kB | 2 | 800 | 110592 | 8640 | FIELD PROGRAMMABLE GATE ARRAY | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z045-1FFG900C | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | 0°C~85°C TJ | Tray | 4 (72 Hours) | CMOS | 667MHz | 3.35mm | ROHS3 Compliant | 2009 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 900-BBGA, FCBGA | 31mm | 900 | 10 Weeks | 3.3V | 1.2V | 900 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 3A991.D | Copper, Silver, Tin | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | YES | BOTTOM | BALL | 245 | 1V | 1mm | XC7Z045 | 30 | 130 | ROMless | DMA | ARM | 256KB | 32b | -1 | MCU, FPGA | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 190000 | Kintex™-7 FPGA, 350K Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||
| XC95144XV7CS144I | Xilinx |
Min: 1 Mult: 1 |
3 | 85°C | -40°C | CMOS | 1.2mm | RoHS Compliant | 12mm | 12mm | 2.5V | 144 | 144 | EAR99 | YES | No | e0 | YES | BOTTOM | BALL | 240 | 2.5V | 144 | INDUSTRIAL | 2.62V | 30 | Programmable Logic Devices | 117 | FLASH | 7.5 ns | 7 | 7.5 ns | 125MHz | 144 | MACROCELL | 8 | YES | YES | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z030-3SBG485E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | Surface Mount | 0°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | 1GHz | 2.44mm | ROHS3 Compliant | 2009 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 484-FBGA, FCBGA | 19mm | 485 | 10 Weeks | 485 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | EAR99 | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | Copper, Silver, Tin | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | 1.05V | 0.95V | NOT SPECIFIED | Other Microprocessor ICs | 11.8V | Not Qualified | 130 | DMA | ARM | 256KB | 32b | MCU, FPGA | MICROPROCESSOR CIRCUIT | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | N | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 125K Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||
| XC6SLX16-L1FT256C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 85°C | 0°C | RoHS Compliant | BGA | 1V | 256 | 186 | 72kB | 18224 | 14579 | 1139 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z012S-1CLG485I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2016 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 484-LFBGA, CSPBGA | 19mm | 19mm | 485 | 10 Weeks | yes | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | 1.05V | 0.95V | NOT SPECIFIED | S-PBGA-B485 | 150 | DMA | 256KB | MCU, FPGA | 667MHz | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | 667MHz | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Artix™-7 FPGA, 55K Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCV200-5BGG352I | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | CMOS | 1.7mm | RoHS Compliant | 35mm | 35mm | 352 | yes | EAR99 | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | BOTTOM | BALL | 260 | 2.5V | 1.27mm | 352 | 2.625V | 2.375V | 30 | Not Qualified | S-PBGA-B352 | 294MHz | 236666 | FIELD PROGRAMMABLE GATE ARRAY | 1176 | 0.7 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU9EG-2FFVB1156I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 1156-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 328 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC6SLX100T-2FG484C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 3 (168 Hours) | 85°C | 0°C | CMOS | RoHS Compliant | FBGA | 1.2V | 484 | 484 | no | 3A991.D | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1.2V | 1mm | 484 | OTHER | 30 | Field Programmable Gate Arrays | Not Qualified | 296 | 603kB | 2 | 296 | 126576 | 667MHz | 101261 | 7911 | FIELD PROGRAMMABLE GATE ARRAY | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z045-1FFG900CES | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | 0°C~85°C TJ | Tray | 4 (72 Hours) | 85°C | 0°C | 667MHz | RoHS Compliant | 2010 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 900-BBGA, FCBGA | 7 Weeks | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | XC7Z045 | 900-FCBGA (31x31) | 130 | DMA | ARM | 256KB | MCU, FPGA | 667MHz | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 350K Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVU095-2FFVA1760E | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/xilinx-xcvu0952ffva1760e-datasheets-0748.pdf | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z020-L1CLG484I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 667MHz | 1.6mm | ROHS3 Compliant | 2010 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 484-LFBGA, CSPBGA | 19mm | 19mm | 484 | 10 Weeks | 1.05V | 950mV | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 3A991.D | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | Copper, Silver, Tin | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | NOT SPECIFIED | S-PBGA-B484 | 130 | DMA | ARM | 256KB | 130 ps | MCU, FPGA | 106400 | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Artix™-7 FPGA, 85K Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||
| XQ4062XL-3BG432N | Xilinx |
Min: 1 Mult: 1 |
Bulk | 3 (168 Hours) | CMOS | 1.7mm | Non-RoHS Compliant | 40mm | 40mm | Contains Lead | 432 | 3A001.A.2.C | TYPICAL GATES = 40000 TO 130000 | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 3.3V | 1.27mm | 432 | MILITARY | 125°C | -55°C | 3.6V | 3V | 30 | Field Programmable Gate Arrays | 3.3V | Not Qualified | S-PBGA-B432 | MIL-PRF-38535 | 352 | 352 | 166MHz | 2304 CLBS, 40000 GATES | 62000 | FIELD PROGRAMMABLE GATE ARRAY | 5472 | 40000 | 2304 | 1.6 ns |
