Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Number of Pins | Interface | Pbfree Code | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Operating Temperature (Max) | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Screening Level | Number of I/O | Memory Type | Peripherals | Core Architecture | RAM Size | Data Bus Width | Speed Grade | Architecture | Number of Outputs | Speed | uPs/uCs/Peripheral ICs Type | Number of Registers | Number of Inputs | RAM (words) | Bus Compatibility | Boundary Scan | Clock Frequency | Organization | Number of Gates | Core Processor | Connectivity | Number of Logic Elements/Cells | Number of Logic Blocks (LABs) | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Number of Equivalent Gates | Number of CLBs | Combinatorial Delay of a CLB-Max |
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XC95288XL10TQ144C0672 | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC3S100E4VQG100CS1 | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | 85°C | 0°C | CMOS | 1.2mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/xilinx-xc3s100e4vqg100cs1-datasheets-2191.pdf | 1.2V | 100 | 100 | yes | EAR99 | No | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 1.2V | 0.5mm | OTHER | 1.26V | 30 | Field Programmable Gate Arrays | 1.21.2/3.32.5V | 9kB | 4 | 59 | 1920 | 572MHz | FIELD PROGRAMMABLE GATE ARRAY | 2160 | 240 | 0.76 ns | ||||||||||||||||||||||||||||||||||||||||||||||
XC4085XLA-09BG432C | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | CMOS | 1.7mm | Non-RoHS Compliant | 40mm | 40mm | 432 | no | CAN ALSO USE 180000 GATES | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 3.3V | 1.27mm | 432 | OTHER | 85°C | 3.6V | 3V | 30 | Field Programmable Gate Arrays | 3.3V | Not Qualified | S-PBGA-B432 | 352 | 352 | 227MHz | 3136 CLBS, 55000 GATES | FIELD PROGRAMMABLE GATE ARRAY | 7448 | 55000 | 3136 | 1.1 ns | ||||||||||||||||||||||||||||||||||||||||||||
XC7VX980T-2FFG1928C | Xilinx |
Min: 1 Mult: 1 |
4 (72 Hours) | 85°C | 0°C | CMOS | 3.65mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/xilinx-xc7vx980t2ffg1928c-datasheets-2830.pdf | FCBGA | 45mm | 45mm | 1V | 1928 | 13 Weeks | yes | 3A001.A.7.B | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | 1928 | OTHER | 1.03V | NOT SPECIFIED | Field Programmable Gate Arrays | 11.8V | Not Qualified | S-PBGA-B1928 | 480 | 6.6MB | -2 | 480 | 1.224e+06 | 480 | 1818MHz | 979200 | 76500 | FIELD PROGRAMMABLE GATE ARRAY | 0.61 ns | ||||||||||||||||||||||||||||||||||||||
XC6VLX365T-2FF1156C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 85°C | 0°C | CMOS | 3.5mm | RoHS Compliant | FCBGA | 35mm | 35mm | 1V | 1156 | no | 3A991.D | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | 1156 | OTHER | 1.05V | NOT SPECIFIED | Field Programmable Gate Arrays | Not Qualified | S-PBGA-B1156 | 600 | 1.8MB | 2 | 600 | 600 | 364032 | 28440 | FIELD PROGRAMMABLE GATE ARRAY | ||||||||||||||||||||||||||||||||||||||||||||||
XCV1000-6FG680CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC3S50-5TQ144C | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | 85°C | 0°C | CMOS | 1.6mm | RoHS Compliant | TQFP | 20mm | 20mm | 1.2V | 144 | 144 | no | EAR99 | e0 | YES | QUAD | GULL WING | 225 | 1.2V | 144 | OTHER | 1.26V | 30 | Field Programmable Gate Arrays | Not Qualified | 9kB | 5 | 97 | FIELD PROGRAMMABLE GATE ARRAY | 1728 | 192 | ||||||||||||||||||||||||||||||||||||||||||||||||||
XA3S700A-4FGG484Q | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 3 (168 Hours) | 125°C | -40°C | CMOS | 2.6mm | RoHS Compliant | FBGA | 23mm | 23mm | 1.2V | 484 | 484 | 3A991.D | e1 | BOTTOM | BALL | 250 | 1.2V | 1mm | 484 | AUTOMOTIVE | 1.26V | 30 | Field Programmable Gate Arrays | 1.21.2/3.33.3V | Not Qualified | AEC-Q100 | 372 | 45kB | 4 | 288 | 667MHz | 700000 | 13248 | 1472 | FIELD PROGRAMMABLE GATE ARRAY | |||||||||||||||||||||||||||||||||||||||||||||
XCV100E-7CS144CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC6VLX550T-L1FF1759C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 85°C | 0°C | CMOS | 3.5mm | RoHS Compliant | FCBGA | 42.5mm | 42.5mm | 900mV | 1759 | no | 3A001.A.7.A | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | 1759 | OTHER | 0.93V | NOT SPECIFIED | Field Programmable Gate Arrays | 11.2/2.5V | Not Qualified | S-PBGA-B1759 | 840 | 2.8MB | 840 | 840 | 1098MHz | 549888 | 42960 | FIELD PROGRAMMABLE GATE ARRAY | 5.87 ns | |||||||||||||||||||||||||||||||||||||||||||
XC6VLX550T-L1FFG1759I | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 4 (72 Hours) | 100°C | -40°C | CMOS | 3.5mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/xilinx-xc6vlx550tl1ffg1759i-datasheets-4439.pdf | FCBGA | 42.5mm | 42.5mm | 900mV | 6 Weeks | 1759 | yes | 3A001.A.7.A | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 245 | 0.9V | 1mm | INDUSTRIAL | 0.93V | 30 | Field Programmable Gate Arrays | 11.2/2.5V | Not Qualified | 840 | 2.8MB | 840 | 1098MHz | 549888 | 42960 | FIELD PROGRAMMABLE GATE ARRAY | 5.87 ns | ||||||||||||||||||||||||||||||||||||||||||
XC7Z045-2FF676I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | 800MHz | Non-RoHS Compliant | 2010 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 676-BBGA, FCBGA | 676 | 10 Weeks | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | no | 8542.39.00.01 | YES | BOTTOM | BALL | S-PBGA-B676 | 130 | ROMless | DMA | ARM | 256KB | 32b | MCU, FPGA | 256000 | CAN, ETHERNET, I2C, PCI, SPI, UART, USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 350K Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||
XC7V585T-3FFG1157E | Xilinx |
Min: 1 Mult: 1 |
4 (72 Hours) | 100°C | 0°C | CMOS | 3.35mm | RoHS Compliant | FCBGA | 35mm | 35mm | 1V | 1157 | yes | 3A991.D | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | YES | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | 1157 | MILITARY | 1.03V | NOT SPECIFIED | Field Programmable Gate Arrays | 11.8V | Not Qualified | S-PBGA-B1157 | 600 | 3.5MB | -3 | 600 | 728400 | 600 | 1818MHz | 582720 | 45525 | FIELD PROGRAMMABLE GATE ARRAY | 0.58 ns | |||||||||||||||||||||||||||||||||||||||||
XCZU6CG-1FFVC900I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 900-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 204 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 1.2GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV1600E-7FG1156CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU9EG-L1FFVC900I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2013 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 900-BBGA, FCBGA | 900 | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B900 | 204 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||
XCV2004FG456CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU7EV-1FFVC1156I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EV | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 1156-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 360 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC6VLX75T-L1FFG784I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 100°C | -40°C | CMOS | 3.1mm | RoHS Compliant | FCBGA | 29mm | 29mm | 900mV | 784 | 784 | yes | 3A991.D | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 245 | 0.9V | 1mm | 784 | INDUSTRIAL | 0.93V | 30 | Field Programmable Gate Arrays | 11.2/2.5V | Not Qualified | 360 | 702kB | 360 | 1098MHz | 74496 | 5820 | FIELD PROGRAMMABLE GATE ARRAY | 5.87 ns | ||||||||||||||||||||||||||||||||||||||||||||
XCZU7EG-2FFVF1517E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 1517-BBGA, FCBGA | 11 Weeks | yes | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 464 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC6VLX760-L1FF1760I | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 4 (72 Hours) | 100°C | -40°C | CMOS | 3.5mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/xilinx-xc6vlx760l1ff1760i-datasheets-5966.pdf | FCBGA | 42.5mm | 42.5mm | 1V | 1760 | 13 Weeks | no | 3A001.A.7.A | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 0.9V | 1mm | 1760 | INDUSTRIAL | 0.93V | 30 | Field Programmable Gate Arrays | 11.2/2.5V | Not Qualified | S-PBGA-B1760 | 1200 | 3.2MB | 1098MHz | 758784 | 59280 | FIELD PROGRAMMABLE GATE ARRAY | 5.87 ns | |||||||||||||||||||||||||||||||||||||||||
XCZU7EV-2FBVB900I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EV | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 900-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 204 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC3S50J-4PQ208CES | Xilinx |
Min: 1 Mult: 1 |
85°C | 0°C | RoHS Compliant | PQFP | 1.2V | 208 | No | 9kB | 4 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU11EG-1FFVB1517I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1517-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 488 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV300-6FGG456C | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | 85°C | 0°C | CMOS | RoHS Compliant | FBGA | 23mm | 23mm | 2.5V | 456 | yes | EAR99 | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | BOTTOM | BALL | 250 | 2.5V | 1mm | 456 | OTHER | 30 | 8kB | 6 | 333MHz | FIELD PROGRAMMABLE GATE ARRAY | 322970 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU7EV-3FBVB900E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EV | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 900-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 204 | DMA, WDT | 256KB | MCU, FPGA | 600MHz, 1.5GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC4008E-2PG191I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | Bulk | 100°C | -40°C | CMOS | 4.318mm | RoHS Compliant | LCC | 47.244mm | 47.244mm | Contains Lead | 191 | 8542.39.00.01 | PERPENDICULAR | PIN/PEG | 5V | 2.54mm | 191 | 5.5V | 4.5V | Field Programmable Gate Arrays | 5V | Not Qualified | S-CPGA-P191 | 61 | 1.3kB | 144 | 144 | 125MHz | 8000 | 770 | 324 | FIELD PROGRAMMABLE GATE ARRAY | 324 | 6000 | 324 | 1.6 ns | |||||||||||||||||||||||||||||||||||||||||||||
XCZU11EG-2FFVB1517I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1517-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 488 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV300E-7BGG432C | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | 85°C | 0°C | CMOS | RoHS Compliant | BGA | 40mm | 40mm | 1.8V | 432 | yes | 3A991.D | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | BOTTOM | BALL | 260 | 1.8V | 432 | OTHER | 1.89V | 30 | Field Programmable Gate Arrays | 16kB | 7 | 316 | 316 | 400MHz | 1536 CLBS, 82944 GATES | FIELD PROGRAMMABLE GATE ARRAY | 6912 | 82944 | 1536 | 0.42 ns | |||||||||||||||||||||||||||||||||||||||||||||
XCZU11EG-3FFVF1517E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1517-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 464 | DMA, WDT | 256KB | MCU, FPGA | 600MHz, 667MHz, 1.5GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells |
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