Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Number of Terminations | Factory Lead Time | Number of Pins | Interface | Pbfree Code | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Temperature Grade | Operating Temperature (Max) | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Number of I/O | Peripherals | Core Architecture | RAM Size | Data Bus Width | Speed Grade | Propagation Delay | Architecture | Number of Outputs | Speed | uPs/uCs/Peripheral ICs Type | Number of Inputs | RAM (words) | Bus Compatibility | Boundary Scan | Clock Frequency | Organization | Number of Gates | UV Erasable | Core Processor | Connectivity | Number of Logic Elements/Cells | Number of Logic Blocks (LABs) | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Number of Equivalent Gates | Number of CLBs | License - User Details | Media Delivery Type | License Length | Combinatorial Delay of a CLB-Max |
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XCZU2CG-L1SFVC784I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 784-BFBGA, FCBGA | 784 | 11 Weeks | IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM) | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | S-PBGA-B784 | 252 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV100-6CSG144C | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | CMOS | 1.2mm | RoHS Compliant | 12mm | 12mm | 144 | yes | EAR99 | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | BOTTOM | BALL | 260 | 2.5V | 0.8mm | 144 | OTHER | 85°C | 2.625V | 2.375V | 30 | Not Qualified | S-PBGA-B144 | 333MHz | 108904 | FIELD PROGRAMMABLE GATE ARRAY | 600 | 0.6 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
XA7Z010-1CLG400Q | Xilinx |
Min: 1 Mult: 1 |
download | Automotive, AEC-Q100, Zynq®-7000 XA | Surface Mount | -40°C~125°C TJ | Tray | 4 (72 Hours) | CMOS | 667MHz | 1.6mm | ROHS3 Compliant | 2010 | /files/xilinxinc-xa7z0201clg484q-datasheets-0818.pdf | 400-LFBGA, CSPBGA | 17mm | 1V | 400 | 10 Weeks | 400 | CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | EAR99 | Copper, Silver, Tin | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 0.8mm | NOT SPECIFIED | Other uPs/uCs/Peripheral ICs | 11.8V | Not Qualified | 130 | DMA | ARM | 256KB | 32b | MCU, FPGA | MICROPROCESSOR CIRCUIT | N | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Artix™-7 FPGA, 28K Logic Cells | |||||||||||||||||||||||||||||||||||||||||||
XC9572XL7VQ64C0962 | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7Z014S-2CLG400E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | 0°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2016 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 400-LFBGA, CSPBGA | 17mm | 17mm | 400 | 10 Weeks | yes | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | 1.05V | 0.95V | NOT SPECIFIED | S-PBGA-B400 | 125 | DMA | 256KB | MCU, FPGA | 766MHz | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | 800MHz | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Artix™-7 FPGA, 65K Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||
XCV300E-6BGG432C | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | 85°C | 0°C | CMOS | 1.7mm | RoHS Compliant | BGA | 40mm | 40mm | 1.8V | 432 | yes | 3A991.D | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | BOTTOM | BALL | 260 | 1.8V | 1.27mm | 432 | OTHER | 1.89V | 30 | Field Programmable Gate Arrays | 16kB | 6 | 316 | 316 | 357MHz | FIELD PROGRAMMABLE GATE ARRAY | 82944 | 0.47 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||
XA7Z030-1FBV484Q | Xilinx |
Min: 1 Mult: 1 |
download | Automotive, AEC-Q100, Zynq®-7000 XA | -40°C~125°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2010 | /files/xilinxinc-xa7z0201clg484q-datasheets-0818.pdf | 484-BBGA, FCBGA | 484 | 10 Weeks | EAR99 | 8542.39.00.01 | YES | BOTTOM | BALL | S-PBGA-B484 | 130 | DMA | 256KB | MCU, FPGA | 667MHz | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 125K Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV50E-6FGG256C | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | 85°C | 0°C | CMOS | 2mm | RoHS Compliant | FBGA | 17mm | 17mm | 1.8V | 256 | yes | EAR99 | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | BOTTOM | BALL | 260 | 1.8V | 1mm | 256 | OTHER | 1.89V | 30 | Field Programmable Gate Arrays | 8kB | 6 | 176 | 176 | 357MHz | FIELD PROGRAMMABLE GATE ARRAY | 1728 | 384 | 0.47 ns | |||||||||||||||||||||||||||||||||||||||||||||||||
XCZU2CG-L2SFVC784E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | 0°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 784-BFBGA, FCBGA | 784 | 11 Weeks | IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM) | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | S-PBGA-B784 | 252 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC5VLX50T-3FF1136C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 85°C | 0°C | CMOS | RoHS Compliant | FCBGA | 1V | 1136 | e0 | BOTTOM | BALL | 225 | 1V | 1mm | OTHER | 1.05V | 30 | Field Programmable Gate Arrays | 12.5V | Not Qualified | 480 | 270kB | 3 | 480 | 1412MHz | 46080 | 3600 | FIELD PROGRAMMABLE GATE ARRAY | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU2EG-L2SFVA625E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2013 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 625-BFBGA, FCBGA | 625 | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B625 | 180 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC6VHX255T-1FFG1155I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 100°C | -40°C | CMOS | 3.5mm | RoHS Compliant | FCBGA | 35mm | 35mm | 1155 | yes | 3A991.D | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 245 | 1V | 1mm | 1155 | INDUSTRIAL | 1.05V | 0.95V | 30 | Field Programmable Gate Arrays | 11.2/2.5V | Not Qualified | S-PBGA-B1155 | 440 | 2.3MB | 440 | 440 | 1098MHz | 253440 | 19800 | FIELD PROGRAMMABLE GATE ARRAY | 5.08 ns | |||||||||||||||||||||||||||||||||||||||||||||||
XC7Z030-2FF676I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | 800MHz | Non-RoHS Compliant | 2009 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 676-BBGA, FCBGA | 676 | 11 Weeks | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 8542.39.00.01 | YES | BOTTOM | BALL | XC7Z030 | S-PBGA-B676 | 130 | DMA | ARM | 256KB | 32b | MCU, FPGA | 256000 | CAN, ETHERNET, I2C, PCI, SPI, UART, USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 125K Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC5VFX70T-3FFG665C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 85°C | 0°C | CMOS | 2.9mm | RoHS Compliant | FCBGA | 27mm | 27mm | 1V | 665 | 665 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 250 | 1V | 1mm | 665 | OTHER | 1.05V | 30 | Field Programmable Gate Arrays | 12.5V | Not Qualified | 360 | 666kB | 3 | 360 | 1412MHz | 71680 | 5600 | FIELD PROGRAMMABLE GATE ARRAY | |||||||||||||||||||||||||||||||||||||||||||||||||||
XAZU3EG-L1SFVC784I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 3.32mm | ROHS3 Compliant | /files/xilinxinc-xazu5ev1sfvc784q-datasheets-4797.pdf | 784-BFBGA, FCBGA | 23mm | 23mm | 784 | 11 Weeks | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.8mm | NOT SPECIFIED | S-PBGA-B784 | 128 | DMA, WDT | 1.8MB | MPU, FPGA | 500MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, I2C, SPI, UART/USART, USB | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV100E8BG352I | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | CMOS | 1.7mm | Non-RoHS Compliant | BGA | 35mm | 35mm | 352 | no | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 1.8V | 1.27mm | 352 | 1.89V | 1.71V | 30 | Field Programmable Gate Arrays | 1.2/3.61.8V | Not Qualified | 196 | 196 | 416MHz | 600 CLBS, 32400 GATES | FIELD PROGRAMMABLE GATE ARRAY | 2700 | 32400 | 600 | 0.4 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU4EG-1FBVB900I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5eg2fbvb900e-datasheets-4584.pdf | 900-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 204 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC5VLX50T-1FFV665I | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XAZU2EG-L1SFVC784I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 3.32mm | ROHS3 Compliant | /files/xilinxinc-xazu5ev1sfvc784q-datasheets-4797.pdf | 784-BFBGA, FCBGA | 23mm | 23mm | 784 | 11 Weeks | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.8mm | NOT SPECIFIED | S-PBGA-B784 | 128 | DMA, WDT | 1.2MB | MPU, FPGA | 500MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, I2C, SPI, UART/USART, USB | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC6VHX380T-1FFG1154I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 100°C | -40°C | CMOS | 3.5mm | RoHS Compliant | FCBGA | 35mm | 35mm | 1V | 1154 | yes | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 245 | 1V | INDUSTRIAL | 30 | Field Programmable Gate Arrays | Not Qualified | 320 | 3.4MB | 1 | 320 | 382464 | 29880 | FIELD PROGRAMMABLE GATE ARRAY | 5.08 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7Z035-L2FFG676I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | 3.37mm | ROHS3 Compliant | 2010 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 676-BBGA, FCBGA | 27mm | 27mm | 676 | 10 Weeks | 3A991.D | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | 1.05V | 0.95V | NOT SPECIFIED | S-PBGA-B676 | 130 | DMA | 256KB | MCU, FPGA | 800MHz | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | 800MHz | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 275K Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||
XC6VHX380T-2FF1155I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 100°C | -40°C | CMOS | 3.5mm | RoHS Compliant | FCBGA | 35mm | 35mm | 1V | 1156 | no | 3A991.D | No | e0 | TIN LEAD | BOTTOM | BALL | 1V | 1mm | 1156 | INDUSTRIAL | 1.05V | Field Programmable Gate Arrays | S-PBGA-B1156 | 440 | 3.4MB | 2 | 220 ps | 440 | 440 | 382464 | 29880 | FIELD PROGRAMMABLE GATE ARRAY | ||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU5CG-1SFVC784I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 784-BFBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 252 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 1.2GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV200E-8BG352I | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | CMOS | 1.7mm | Non-RoHS Compliant | BGA | 35mm | 35mm | 352 | no | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 1.8V | 1.27mm | 352 | 1.89V | 1.71V | 30 | Field Programmable Gate Arrays | 1.2/3.61.8V | Not Qualified | 260 | 260 | 416MHz | 1176 CLBS, 63504 GATES | FIELD PROGRAMMABLE GATE ARRAY | 5292 | 63504 | 1176 | 0.4 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU5EV-L2SFVC784E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EV | 0°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 784-BFBGA, FCBGA | 784 | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B784 | 252 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCVU080-1FFVD1517C | Xilinx |
Min: 1 Mult: 1 |
3.51mm | Non-RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/xilinx-xcvu0801ffvd1517c-datasheets-3322.pdf | 40mm | 40mm | 1517 | 16 Weeks | 3A001.A.7.B | 8542.39.00.01 | e1 | TIN SILVER COPPER | YES | BOTTOM | BALL | NOT SPECIFIED | 0.95V | 1mm | OTHER | 85°C | 0.979V | 0.922V | NOT SPECIFIED | S-PBGA-B1517 | 672 CLBS | FIELD PROGRAMMABLE GATE ARRAY | 672 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU5CG-2SFVC784E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 784-BFBGA, FCBGA | 11 Weeks | yes | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 252 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 1.3GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7K420T-L2FFG1156I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 100°C | -40°C | 3.35mm | RoHS Compliant | FCBGA | 35mm | 35mm | 1156 | 3A991.D | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 0.95V | 1mm | 0.97V | 0.93V | NOT SPECIFIED | S-PBGA-B1156 | 400 | 3.7MB | 416960 | 32575 | FIELD PROGRAMMABLE GATE ARRAY | 0.61 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
EF-DI-LAUI-SITE | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Non-RoHS Compliant | 10 Weeks | Site | Electronically Delivered | 1 Year | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC2S100E-6FG456C | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | 85°C | 0°C | CMOS | RoHS Compliant | FBGA | 23mm | 23mm | 1.8V | 456 | no | EAR99 | MAXIMUM USABLE GATES = 100000 | No | 8542.39.00.01 | e0 | YES | BOTTOM | BALL | 225 | 1.8V | 1mm | 456 | COMMERCIAL EXTENDED | 1.89V | 30 | Field Programmable Gate Arrays | 5kB | 6 | 202 | 202 | 357MHz | FIELD PROGRAMMABLE GATE ARRAY | 2700 | 37000 | 600 | 0.47 ns |
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