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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | REACH SVHC | Number of Pins | Interface | Density | Pbfree Code | ECCN Code | Additional Feature | Radiation Hardening | Manufacturer Package Identifier | Reach Compliance Code | HTS Code | Number of Functions | Evaluation Kit | JESD-609 Code | Terminal Finish | Applications | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | Max Junction Temperature (Tj) | Ambient Temperature Range High | Memory Size | Memory Type | Logic Function | Output Characteristics | Clock Frequency | Organization | Memory Width | Memory Density | Parallel/Serial | Standby Current-Max | Endurance | Data Retention Time-Min | Access Time (Max) | I/O Type | Memory IC Type | Operating System | License - User Details | Edition | Media Delivery Type | License Length | Programmable Type |
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| XQ4VLX160-10FF1148I4154 | Xilinx |
Min: 1 Mult: 1 |
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| EF-DI-RIO-PHY-SITE | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | RoHS Compliant | 2009 | Site | Electronically Delivered | 1 Year | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC9536-7VQ44I4307 | Xilinx |
Min: 1 Mult: 1 |
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| EF-DI-SMPTE2022-56-SITE | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | RoHS Compliant | 2005 | /files/xilinxinc-efdismpte202256site-datasheets-6762.pdf | 1 Weeks | Site | Electronically Delivered | 1 Year | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EFR-DI-IMG-MA-NOISE-SITE | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | RoHS Compliant | 2014 | Site | Electronically Delivered | 1 Year Renewal | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EFR-DI-VPSS-SITE | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | /files/xilinxinc-efrdivpssww-datasheets-7058.pdf | Site | Electronically Delivered | 1 Year Renewal | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EF-DI-10GEMAC-WW | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | Worldwide | Electronically Delivered | 1 Year | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EFR-DI-10GEMAC-WW | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | Worldwide | Electronically Delivered | 1 Year Renewal | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EF-DI-MIPI-PACK-SITE | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | ROHS3 Compliant | Site | Electronically Delivered | 1 Year | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EFR-DI-SMPTE2022-12-WW | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | Worldwide | Electronically Delivered | 1 Year Renewal | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EF-ISE-DSP-FL | Xilinx |
Min: 1 Mult: 1 |
download | Integrated Development Environment (IDE) | ISE® Design Suite | 1 (Unlimited) | RoHS Compliant | 2011 | /files/xilinxinc-docspprousbiignl-datasheets-6563.pdf | Yes | Programming | Windows | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EF-VIVADO-SYSTEM-NL | Xilinx |
Min: 1 Mult: 1 |
download | Integrated Software Environment (ISE) | Vivado™ Design Suite | Not Applicable | ROHS3 Compliant | 2 Weeks | Programming | Linux, Windows | Fixed Node | System | Electronically Delivered | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EF-DI-JESD204-SITE | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | 2 Weeks | Site | Electronically Delivered | 1 Year | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EF-DI-RSD-SITE | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Cable | Not Applicable | Non-RoHS Compliant | 2010 | 2 Weeks | No | Decoder | Site | Electronically Delivered | 1 Year | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LMS-CONN-RFSOC | Xilinx |
Min: 1 Mult: 1 |
download | License | Electronically Delivered | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LMS-FPGA-US | Xilinx |
Min: 1 Mult: 1 |
download | License | Electronically Delivered | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC18V02PC44C0936 | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 0°C~70°C | Tube | 3 (168 Hours) | CMOS | 4.572mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xc18v02pc44c0936-datasheets-4382.pdf | 44-LCC (J-Lead) | 16.5862mm | 16.5862mm | 3.3V | 44 | 44 | 2 Mb | no | 3A991.B.1 | No | 8542.32.00.61 | 1 | e0 | TIN LEAD | YES | 3V~3.6V | QUAD | J BEND | 225 | 3.3V | 1.27mm | XC18V02 | 44 | 3.6V | 3V | 30 | 256KX8 | 8 | PARALLEL/SERIAL | 20 ns | CONFIGURATION MEMORY | In System Programmable | ||||||||||||||||||||||||||||||||||||||||||
| XC17S30XLPDG8C | Xilinx |
Min: 1 Mult: 1 |
download | Through Hole | 0°C~70°C | Tube | 1 (Unlimited) | Through Hole | CMOS | SYNCHRONOUS | 4.5974mm | RoHS Compliant | 1999 | /files/xilinxinc-xc17s10xlpdg8c-datasheets-4365.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | 8 | No SVHC | 8 | Serial | EAR99 | unknown | 1 | e3 | Matte Tin (Sn) | NO | 3V~3.6V | DUAL | 250 | 3.3V | 2.54mm | XC17S30XL | 8 | 3.6V | 3V | 30 | 3.3V | 0.005mA | Not Qualified | 300kb | PROM | 3-STATE | 10MHz | 1 | 0.00005A | COMMON | OTP | ||||||||||||||||||||||||||||||||||||||
| XCF02SVOG20C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | Surface Mount | -40°C~85°C | Tube | 3 (168 Hours) | CMOS | 50MHz | SYNCHRONOUS | ROHS3 Compliant | 1999 | /files/xilinxinc-xcf16pfsg48c-datasheets-1087.pdf | 20-TSSOP (0.173, 4.40mm Width) | 6.5mm | 1.19mm | 4.39mm | 3.3V | Lead Free | 20 | 10 Weeks | Unknown | 20 | Parallel | yes | EAR99 | XCF02SVOG20C | 8542.32.00.51 | 1 | e3 | Matte Tin (Sn) | 3V~3.6V | DUAL | GULL WING | 260 | 3.3V | 0.65mm | XCF*S | 20 | 3.6V | 3V | 30 | 0.01mA | Not Qualified | 125°C | 85°C | 2Mb | FLASH | 2MX1 | SERIAL | 0.001A | 20 | In System Programmable | ||||||||||||||||||||||||||||||||
| XC18V02VQ44C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | CMOS | 1.2mm | Non-RoHS Compliant | 1998 | /files/xilinxinc-xc18v02pc44c0936-datasheets-4382.pdf | 44-TQFP | 10mm | 10mm | 3.3V | Contains Lead | 44 | 10 Weeks | 44 | 2 Mb | no | EAR99 | No | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | 3V~3.6V | QUAD | GULL WING | 225 | 3.3V | 0.8mm | XC18V02 | 44 | 3.6V | 3V | 30 | Flash Memories | 0.025mA | 20MHz | 256KX8 | 8 | PARALLEL/SERIAL | 0.01A | 20000 Write/Erase Cycles | 20 | 20 ns | CONFIGURATION MEMORY | In System Programmable | |||||||||||||||||||||||||||||||||||
| XC17128ELPD8C | Xilinx |
Min: 1 Mult: 1 |
download | Through Hole | 0°C~70°C | Tube | Not Applicable | CMOS | SYNCHRONOUS | 4.5974mm | Non-RoHS Compliant | 2000 | /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | Contains Lead | 8 | 8 | EAR99 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | not_compliant | 1 | e0 | NO | 3V~3.6V | DUAL | 225 | 3.3V | 2.54mm | XC17128EL | 8 | 3.6V | 3V | 30 | 3.3V | 0.005mA | Not Qualified | 128kb | 3-STATE | 15MHz | 1 | 131072 bit | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | ||||||||||||||||||||||||||||||||||||||
| XC17256ELPC20C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 0°C~70°C | Tube | 3 (168 Hours) | CMOS | SYNCHRONOUS | 4.572mm | Non-RoHS Compliant | 2000 | /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf | 20-LCC (J-Lead) | 8.9662mm | 8.9662mm | Contains Lead | 20 | 20 | EAR99 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | not_compliant | 8542.32.00.61 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | 3V~3.6V | QUAD | J BEND | 225 | 3.3V | 1.27mm | XC17256EL | 20 | 3.6V | 3V | 30 | 3.3V | 0.005mA | Not Qualified | 256Kb | 3-STATE | 15MHz | 256KX1 | 1 | 262144 bit | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | ||||||||||||||||||||||||||||||||||
| XC17S10VO8C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 0°C~70°C | Tube | 1 (Unlimited) | CMOS | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xc17s10xlpdg8c-datasheets-4365.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | Contains Lead | 8 | 8 | EAR99 | not_compliant | 1 | e0 | YES | 4.75V~5.25V | DUAL | GULL WING | 5V | 1.27mm | XC17S10 | 8 | 5.25V | 4.75V | 5V | 0.01mA | Not Qualified | 100kb | 3-STATE | 10MHz | 1 | 0.00005A | COMMON | MEMORY CIRCUIT | OTP | ||||||||||||||||||||||||||||||||||||||||||
| XC17128EVO8C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 0°C~70°C | Tube | 1 (Unlimited) | CMOS | Non-RoHS Compliant | 2000 | /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9276mm | 3.937mm | 5V | Contains Lead | 8 | 8 | 128 kb | EAR99 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | No | 1 | e0 | YES | 4.75V~5.25V | DUAL | GULL WING | 225 | 5V | 1.27mm | XC17128E | 8 | 30 | 5V | 0.01mA | 3-STATE | 15MHz | 1 | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | ||||||||||||||||||||||||||||||||||||||||||
| XC17S15APD8C | Xilinx |
Min: 1 Mult: 1 |
download | Through Hole | 0°C~70°C | Tube | Not Applicable | CMOS | 4.5974mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xc17s200apdg8i-datasheets-4355.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | 3.3V | Contains Lead | 8 | 8 | 512 kb | no | EAR99 | No | 1 | e0 | NO | 3V~3.6V | DUAL | 225 | 3.3V | 2.54mm | XC17S15A | 8 | 3.6V | 3V | 30 | 0.005mA | 150kb | 3-STATE | 197696X1 | 1 | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | ||||||||||||||||||||||||||||||||||||||||
| XC17S30APD8C | Xilinx |
Min: 1 Mult: 1 |
download | Through Hole | 0°C~70°C | Tube | 1 (Unlimited) | CMOS | 4.5974mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xc17s200apdg8i-datasheets-4355.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | 3.3V | Contains Lead | 8 | 8 | 512 kb | no | EAR99 | No | 1 | e0 | NO | 3V~3.6V | DUAL | 225 | 3.3V | 2.54mm | XC17S30 | 8 | 3.6V | 3V | 30 | 0.005mA | 300kb | 3-STATE | 1 | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | |||||||||||||||||||||||||||||||||||||||||
| XC17S30VO8I | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C | Tube | 1 (Unlimited) | CMOS | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xc17s10xlpdg8c-datasheets-4365.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | Contains Lead | 8 | 8 | EAR99 | not_compliant | 1 | e0 | YES | 4.5V~5.5V | DUAL | GULL WING | 5V | 1.27mm | XC17S30 | 8 | 5.5V | 4.5V | 5V | 0.01mA | Not Qualified | 300kb | 3-STATE | 10MHz | 1 | 0.00005A | COMMON | MEMORY CIRCUIT | OTP | ||||||||||||||||||||||||||||||||||||||||||
| XC17V01PC20C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 0°C~70°C | Tube | 3 (168 Hours) | CMOS | SYNCHRONOUS | 4.572mm | Non-RoHS Compliant | 1998 | /files/xilinxinc-xc17v01vo8c-datasheets-2408.pdf | 20-LCC (J-Lead) | 8.9662mm | 8.9662mm | Contains Lead | 20 | 20 | no | EAR99 | not_compliant | 8542.32.00.61 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | 3V~3.6V | QUAD | J BEND | 225 | 3.3V | 1.27mm | XC17V01 | 20 | 3.6V | 3V | 30 | 3.3V | 0.015mA | Not Qualified | 1Mb | 3-STATE | 15MHz | 1MX1 | 1 | 1048576 bit | SERIAL | 0.001A | COMMON | CONFIGURATION MEMORY | OTP | ||||||||||||||||||||||||||||||||||
| XC17S50APD8I | Xilinx |
Min: 1 Mult: 1 |
download | Through Hole | -40°C~85°C | Tube | Not Applicable | CMOS | 4.5974mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xc17s200apdg8i-datasheets-4355.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | 3.3V | Contains Lead | 8 | 8 | 1 Mb | no | EAR99 | No | 1 | e0 | NO | 3V~3.6V | DUAL | 225 | 3.3V | 2.54mm | XC17S50A | 8 | 3.6V | 3V | 30 | 0.015mA | 500kb | 3-STATE | 559200X1 | 1 | SERIAL | 0.001A | COMMON | CONFIGURATION MEMORY | OTP | ||||||||||||||||||||||||||||||||||||||||
| XC18V01VQ44I | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | CMOS | 1.2mm | Non-RoHS Compliant | 1998 | /files/xilinxinc-xc18v04vq44i-datasheets-2494.pdf | 44-TQFP | 10mm | 10mm | 3.3V | Contains Lead | 44 | 44 | 1 Mb | 3A001.B.1.A | No | 8542.39.00.01 | 1 | e0 | TIN LEAD | YES | 3V~3.6V | QUAD | GULL WING | 225 | 3.3V | 0.8mm | XC18V01 | 44 | 3.6V | 3V | 30 | Flash Memories | 0.025mA | 33MHz | 128KX8 | 8 | PARALLEL/SERIAL | 0.01A | 10000 Write/Erase Cycles | 10 | 15 ns | CONFIGURATION MEMORY | In System Programmable |
