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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Number of Ports | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Max Frequency | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Voltage - Supply | Terminal Position | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Power Supplies | Supply Current-Max | Qualification Status | Ambient Temperature Range High | JESD-30 Code | Supplier Device Package | Memory Size | Memory Type | Data Bus Width | Output Characteristics | Access Time | Programming Voltage | Clock Frequency | Address Bus Width | Memory Format | Memory Interface | Organization | Memory Width | Write Cycle Time - Word, Page | Memory Density | Parallel/Serial | Alternate Memory Width | Standby Current-Max | Word Size | Serial Bus Type | Endurance | Data Retention Time-Min | Write Protection | Access Time (Max) | Sync/Async | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Ready/Busy | Boot Block | Common Flash Interface | Page Size | I/O Type | Refresh Cycles | Sequential Burst Length | Interleaved Burst Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| W9412G6IH-5 | Winbond Electronics |
Min: 1 Mult: 1 |
download | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | SDRAM - DDR | SYNCHRONOUS | 1.2mm | ROHS3 Compliant | 2009 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w9412g6ih5-datasheets-5910.pdf | 66-TSSOP (0.400, 10.16mm Width) | 22.22mm | 10.16mm | 66 | 1 | EAR99 | AUTO/SELF REFRESH | 8542.32.00.02 | 1 | YES | 2.3V~2.7V | DUAL | NOT SPECIFIED | 2.5V | 0.65mm | 66 | 2.7V | 2.3V | NOT SPECIFIED | 2.5V | 0.32mA | Not Qualified | R-PDSO-G66 | 128Mb 8M x 16 | Volatile | 3-STATE | 50ns | 200MHz | DRAM | Parallel | 8MX16 | 16 | 15ns | 134217728 bit | 0.02A | COMMON | 4096 | 248 | 248 | |||||||||||||||||||||||||||||||||||||||||||||||||
| W9864G6IH-6 | Winbond Electronics | $1.61 |
Min: 1 Mult: 1 |
download | Surface Mount | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | SDRAM | 1.2mm | ROHS3 Compliant | 2008 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w9864g6ih6-datasheets-6001.pdf | 54-TSOP (0.400, 10.16mm Width) | 22.22mm | 3.3V | 54 | 54 | 64 Mb | 1 | EAR99 | AUTO/SELF REFRESH | No | 1 | 165mA | 3V~3.6V | DUAL | 3.3V | 0.8mm | 54 | 3.6V | 3V | 64Mb 4M x 16 | Volatile | 16b | 3-STATE | 5ns | 166MHz | 14b | DRAM | Parallel | 4MX16 | 16 | 0.002A | COMMON | 4096 | 1248FP | 1248 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| W9425G6EH-5 | Winbond Electronics |
Min: 1 Mult: 1 |
download | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | SDRAM - DDR | SYNCHRONOUS | 1.2mm | ROHS3 Compliant | 2008 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w9425g6eh5-datasheets-6327.pdf | 66-TSSOP (0.400, 10.16mm Width) | 22.22mm | 10.16mm | 66 | 1 | EAR99 | AUTO/SELF REFRESH | unknown | 8542.32.00.24 | 1 | YES | 2.3V~2.7V | DUAL | NOT SPECIFIED | 2.5V | 0.65mm | 66 | 2.7V | 2.3V | NOT SPECIFIED | 2.5V | 0.3mA | Not Qualified | R-PDSO-G66 | 256Mb 16M x 16 | Volatile | 3-STATE | 55ns | 250MHz | DRAM | Parallel | 16MX16 | 16 | 15ns | 268435456 bit | 0.02A | COMMON | 8192 | 248 | 248 | ||||||||||||||||||||||||||||||||||||||||||||||||
| W9812G6IH-6 | Winbond Electronics |
Min: 1 Mult: 1 |
download | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | SDRAM | 1.2mm | ROHS3 Compliant | 2008 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w9812g6ih6-datasheets-6355.pdf | 54-TSOP (0.400, 10.16mm Width) | 22.22mm | 3.3V | 54 | 128 Mb | 1 | EAR99 | AUTO/SELF REFRESH | No | 8542.32.00.02 | 1 | YES | 3V~3.6V | DUAL | 3.3V | 0.8mm | 54 | 3.6V | 3V | 0.12mA | R-PDSO-G54 | 128Mb 8M x 16 | Volatile | 16b | 3-STATE | 5ns | 166MHz | 14b | DRAM | Parallel | 8MX16 | 16 | 0.002A | COMMON | 4096 | 1248FP | 1248 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q80BVSSIG | Winbond Electronics | $0.48 |
Min: 1 Mult: 1 |
download | SpiFlash® | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q80bvsnig-datasheets-5321.pdf | 8-SOIC (0.209, 5.30mm Width) | 2.16mm | 3.3V | 8 | 8 | 8 Mb | EAR99 | Tin | No | 1 | 18mA | 2.7V~3.6V | DUAL | 3V | 1.27mm | 8 | 3.6V | 2.7V | 85°C | 8Mb 1M x 8 | Non-Volatile | 8.5 ns | 2.7V | 104MHz | 1b | FLASH | SPI | 1 | 3ms | SERIAL | 0.000005A | 8b | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | Asynchronous | 256B | |||||||||||||||||||||||||||||||||||||||||||||||||
| W25X20BVSNIG | Winbond Electronics |
Min: 1 Mult: 1 |
download | SpiFlash® | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | CMOS | 1.72mm | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25x20bvsnig-datasheets-6541.pdf | 8-SOIC (0.154, 3.90mm Width) | 3.3V | 8 | 8 | SPI, Serial | 2 Mb | EAR99 | No | 1 | 16.5mA | 2.7V~3.6V | DUAL | 3V | 1.27mm | 8 | 3.6V | 2.7V | 2Mb 256K x 8 | Non-Volatile | 7 ns | 2.7V | 104MHz | 24b | FLASH | SPI | 2MX1 | 1 | 3ms | 0.000005A | 1b | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | Synchronous | 256B | |||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q80BVZPIG | Winbond Electronics |
Min: 1 Mult: 1 |
download | SpiFlash® | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q80bvsnig-datasheets-5321.pdf | 8-WDFN Exposed Pad | 6mm | 3.3V | 8 | 8 | SPI, Serial | 8 Mb | EAR99 | No | 1 | 18mA | 2.7V~3.6V | DUAL | 3V | 1.27mm | 8 | 3.6V | 2.7V | 8Mb 1M x 8 | Non-Volatile | 8.5 ns | 2.7V | 104MHz | 1b | FLASH | SPI | 1 | 3ms | 0.000005A | 8b | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25X40BVZPIG | Winbond Electronics |
Min: 1 Mult: 1 |
download | SpiFlash® | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2009 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25x20bvsnig-datasheets-6541.pdf | 8-WDFN Exposed Pad | 6mm | 3.3V | 8 | 8 | SPI, Serial | 4 Mb | EAR99 | No | 1 | 16.5mA | 2.7V~3.6V | DUAL | 3V | 1.27mm | 8 | 3.6V | 2.7V | 4Mb 512K x 8 | Non-Volatile | 7 ns | 2.7V | 104MHz | 24b | FLASH | SPI | 4MX1 | 1 | 3ms | 0.000005A | 1b | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | Synchronous | 256B | |||||||||||||||||||||||||||||||||||||||||||||||||||
| W25X40BVDAIG | Winbond Electronics |
Min: 1 Mult: 1 |
download | SpiFlash® | Through Hole | Through Hole | -40°C~85°C TA | Tube | 3 (168 Hours) | CMOS | 5.33mm | ROHS3 Compliant | 2009 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25x20bvsnig-datasheets-6541.pdf | 8-DIP (0.300, 7.62mm) | 9.27mm | 3.3V | 8 | 8 | SPI, Serial | 4 Mb | EAR99 | No | 1 | 16.5mA | 2.7V~3.6V | DUAL | 3V | 2.54mm | 8 | 3.6V | 2.7V | 4Mb 512K x 8 | Non-Volatile | 7 ns | 2.7V | 104MHz | 24b | FLASH | SPI | 4MX1 | 1 | 3ms | 0.000005A | 1b | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | Synchronous | 256B | ||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q16BVSFIG | Winbond Electronics |
Min: 1 Mult: 1 |
download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 2.64mm | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q16bvsfig-datasheets-6563.pdf | 16-SOIC (0.295, 7.50mm Width) | 10.31mm | 7.49mm | 16 | SPI, Serial | EAR99 | 8542.32.00.51 | 1 | YES | 2.7V~3.6V | DUAL | 3V | 1.27mm | 16 | 3.6V | 2.7V | 3/3.3V | 0.018mA | Not Qualified | R-PDSO-G16 | 16Mb 2M x 8 | Non-Volatile | 2.7V | 104MHz | FLASH | SPI - Quad I/O | 2MX8 | 8 | 50μs, 3ms | 16777216 bit | 0.000005A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q80BVDAIG | Winbond Electronics |
Min: 1 Mult: 1 |
download | SpiFlash® | Through Hole | Through Hole | -40°C~85°C TA | Tube | 1 (Unlimited) | 85°C | -40°C | FLASH - NOR | 104MHz | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q80bvsnig-datasheets-5321.pdf | 8-DIP (0.300, 7.62mm) | 3.3V | 3.6V | 2.7V | 8 | SPI, Serial | 8 Mb | No | 2.7V~3.6V | 8-PDIP | 8Mb 1M x 8 | Non-Volatile | 8.5 ns | 104MHz | 1b | FLASH | SPI | 3ms | 256B | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q64BVSFIG | Winbond Electronics |
Min: 1 Mult: 1 |
download | SpiFlash® | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | 2.64mm | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q64bvzeig-datasheets-6555.pdf | 16-SOIC (0.295, 7.50mm Width) | 10.31mm | 3.3V | 16 | 16 | SPI, Serial | 64 Mb | 3A991.B.1.A | No | 8542.32.00.51 | 1 | 18mA | 2.7V~3.6V | DUAL | 3V | 1.27mm | 16 | 3.6V | 2.7V | 64Mb 8M x 8 | Non-Volatile | 7 ns | 2.7V | 80MHz | 1b | FLASH | SPI | 8MX8 | 8 | 3ms | 0.000005A | 1b | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | Synchronous | 256B | |||||||||||||||||||||||||||||||||||||||||||||||||
| W25X40BVSNIG | Winbond Electronics | $0.18 |
Min: 1 Mult: 1 |
download | SpiFlash® | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | CMOS | 1.72mm | ROHS3 Compliant | 2009 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25x20bvsnig-datasheets-6541.pdf | 8-SOIC (0.154, 3.90mm Width) | 3.3V | 8 | 8 | SPI, Serial | 4 Mb | EAR99 | No | 1 | 16.5mA | 2.7V~3.6V | DUAL | 3V | 1.27mm | 8 | 3.6V | 2.7V | 4Mb 512K x 8 | Non-Volatile | 7 ns | 2.7V | 104MHz | 24b | FLASH | SPI | 4MX1 | 1 | 3ms | 0.000005A | 1b | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | Synchronous | 256B | ||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q32BVSFIG | Winbond Electronics | $0.37 |
Min: 1 Mult: 1 |
download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | 2.64mm | ROHS3 Compliant | 2011 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q32bvsfig-datasheets-6692.pdf | 16-SOIC (0.295, 7.50mm Width) | 10.31mm | 16 | 16 | SPI, Serial | 32 Mb | 3A991.B.1.A | No | 8542.32.00.51 | 1 | YES | 2.7V~3.6V | DUAL | 3V | 1.27mm | 16 | 3.6V | 2.7V | 3/3.3V | 0.025mA | 32Mb 4M x 8 | Non-Volatile | 2.7V | 104MHz | 1b | FLASH | SPI - Quad I/O | 32MX1 | 1 | 50μs, 3ms | 0.000005A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 256B | |||||||||||||||||||||||||||||||||||||||||||||||||||
| W25X20BVZPIG | Winbond Electronics |
Min: 1 Mult: 1 |
download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | CMOS | SYNCHRONOUS | 0.8mm | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25x20bvsnig-datasheets-6541.pdf | 8-WDFN Exposed Pad | 6mm | 5mm | 8 | SPI, Serial | EAR99 | 8542.32.00.51 | 1 | YES | 2.7V~3.6V | DUAL | 3V | 1.27mm | 8 | 3.6V | 2.7V | 3/3.3V | 0.025mA | Not Qualified | R-PDSO-N8 | 2Mb 256K x 8 | Non-Volatile | 2.7V | 104MHz | FLASH | SPI | 2MX1 | 1 | 3ms | 2097152 bit | 0.000005A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25X10BVSNIG | Winbond Electronics | $0.27 |
Min: 1 Mult: 1 |
download | SpiFlash® | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | CMOS | 1.72mm | ROHS3 Compliant | 2008 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25x20bvsnig-datasheets-6541.pdf | 8-SOIC (0.154, 3.90mm Width) | 3.3V | 8 | 8 | SPI, Serial | 1 Mb | EAR99 | No | 1 | 16.5mA | 2.7V~3.6V | DUAL | 3V | 1.27mm | 8 | 3.6V | 2.7V | 1Mb 128K x 8 | Non-Volatile | 7 ns | 2.7V | 104MHz | 24b | FLASH | SPI | 1MX1 | 1 | 3ms | 0.000005A | 1b | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | Synchronous | 256B | ||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q32BVZPIG | Winbond Electronics | $0.37 |
Min: 1 Mult: 1 |
download | SpiFlash® | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2011 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q32bvsfig-datasheets-6692.pdf | 8-WDFN Exposed Pad | 6mm | 8 | 8 | SPI, Serial | 32 Mb | 3A991.B.1.A | No | 1 | 2.7V~3.6V | DUAL | 3V | 1.27mm | 8 | 3.6V | 2.7V | 3/3.3V | 0.025mA | 32Mb 4M x 8 | Non-Volatile | 8.5 ns | 2.7V | 104MHz | 1b | FLASH | SPI - Quad I/O | 32MX1 | 1 | 50μs, 3ms | 0.000005A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 256B | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q32BVSSIG | Winbond Electronics | $0.73 |
Min: 1 Mult: 1 |
download | SpiFlash® | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | 2.16mm | ROHS3 Compliant | 2011 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q32bvsfig-datasheets-6692.pdf | 8-SOIC (0.209, 5.30mm Width) | 8 | 8 | SPI, Serial | 32 Mb | yes | 3A991.B.1.A | No | 1 | 18mA | e3 | MATTE TIN | 2.7V~3.6V | DUAL | 260 | 3V | 1.27mm | 8 | 3.6V | 2.7V | 3/3.3V | 32Mb 4M x 8 | Non-Volatile | 8.5 ns | 2.7V | 104MHz | 1b | FLASH | SPI - Quad I/O | 32MX1 | 1 | 50μs, 3ms | 0.000005A | 8b | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | Synchronous | 256B | ||||||||||||||||||||||||||||||||||||||||||||||
| W25X10BVZPIG | Winbond Electronics |
Min: 1 Mult: 1 |
download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | CMOS | SYNCHRONOUS | 0.8mm | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25x20bvsnig-datasheets-6541.pdf | 8-WDFN Exposed Pad | 6mm | 5mm | 8 | SPI, Serial | EAR99 | 8542.32.00.51 | 1 | YES | 2.7V~3.6V | DUAL | 3V | 1.27mm | 8 | 3.6V | 2.7V | 3/3.3V | 0.025mA | Not Qualified | R-PDSO-N8 | 1Mb 128K x 8 | Non-Volatile | 2.7V | 104MHz | FLASH | SPI | 1MX1 | 1 | 3ms | 1048576 bit | 0.000005A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q16BVSSIG | Winbond Electronics |
Min: 1 Mult: 1 |
download | SpiFlash® | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | 2.16mm | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q16bvsfig-datasheets-6563.pdf | 8-SOIC (0.209, 5.30mm Width) | 3.3V | Lead Free | 8 | 8 | SPI, Serial | 16 Mb | EAR99 | No | 1 | 18mA | 2.7V~3.6V | DUAL | 3V | 1.27mm | 8 | 3.6V | 2.7V | 16Mb 2M x 8 | Non-Volatile | 6 ns | 2.7V | 104MHz | 1b | FLASH | SPI - Quad I/O | 8 | 50μs, 3ms | 0.000005A | 8b | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | Synchronous | 256B | |||||||||||||||||||||||||||||||||||||||||||||||||||
| W25X40BVSSIG | Winbond Electronics | $0.13 |
Min: 1 Mult: 1 |
download | SpiFlash® | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | CMOS | 2.16mm | ROHS3 Compliant | 2009 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25x20bvsnig-datasheets-6541.pdf | 8-SOIC (0.209, 5.30mm Width) | 3.3V | 8 | 8 | SPI, Serial | 4 Mb | EAR99 | No | 1 | 16.5mA | 2.7V~3.6V | DUAL | 3V | 1.27mm | 8 | 3.6V | 2.7V | 4Mb 512K x 8 | Non-Volatile | 7 ns | 2.7V | 104MHz | 24b | FLASH | SPI | 4MX1 | 1 | 3ms | 0.000005A | 1b | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | Synchronous | 256B | ||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q16BVZPIG | Winbond Electronics |
Min: 1 Mult: 1 |
download | SpiFlash® | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q16bvsfig-datasheets-6563.pdf | 8-WDFN Exposed Pad | 6mm | 3.3V | Lead Free | 8 | 8 | SPI, Serial | 16 Mb | EAR99 | No | 1 | 18mA | 2.7V~3.6V | DUAL | 3V | 1.27mm | 8 | 3.6V | 2.7V | 16Mb 2M x 8 | Non-Volatile | 6 ns | 2.7V | 104MHz | 1b | FLASH | SPI - Quad I/O | 8 | 50μs, 3ms | 0.000005A | 8b | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | Synchronous | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q64CVSSIG | Winbond Electronics | $0.53 |
Min: 1 Mult: 1 |
download | SpiFlash® | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | 2.16mm | ROHS3 Compliant | 2011 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q64cvzeig-datasheets-5635.pdf | 8-SOIC (0.209, 5.30mm Width) | 3.3V | 8 | 8 | SPI, Serial | 64 Mb | 3A991.B.1.A | No | 1 | 18mA | 2.7V~3.6V | DUAL | 3V | 1.27mm | 8 | 3.6V | 2.7V | 64Mb 8M x 8 | Non-Volatile | 7 ns | 2.7V | 80MHz | 24b | FLASH | SPI - Quad I/O | 8 | 50μs, 3ms | 0.000005A | 8b | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | Synchronous | 256B | |||||||||||||||||||||||||||||||||||||||||||||||||||
| W971GG8JB-25 | Winbond Electronics |
Min: 1 Mult: 1 |
download | Surface Mount | 0°C~85°C TC | Tube | 3 (168 Hours) | SDRAM - DDR2 | SYNCHRONOUS | 1.2mm | ROHS3 Compliant | 2011 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w971gg8jb25-datasheets-0907.pdf | 60-TFBGA | 12.5mm | 1.8V | 60 | 60 | 1 Gb | 1 | EAR99 | AUTO/SELF REFRESH | 800MHz | 8542.32.00.02 | 1 | YES | 1.7V~1.9V | BOTTOM | NOT SPECIFIED | 1.8V | 0.8mm | 60 | 1.9V | 1.7V | NOT SPECIFIED | 0.18mA | Not Qualified | 1Gb 128M x 8 | Volatile | 8b | 3-STATE | 400ps | 200MHz | 17b | DRAM | Parallel | 16MX8 | 8 | 15ns | COMMON | 8192 | 48 | 48 | ||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q64BVSSIG | Winbond Electronics |
Min: 1 Mult: 1 |
download | SpiFlash® | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | 2.16mm | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q64bvzeig-datasheets-6555.pdf | 8-SOIC (0.209, 5.30mm Width) | 3.3V | 8 | 8 | SPI, Serial | 64 Mb | 3A991.B.1.A | No | 1 | 18mA | 2.7V~3.6V | DUAL | 3V | 1.27mm | 8 | 3.6V | 2.7V | 64Mb 8M x 8 | Non-Volatile | 7 ns | 2.7V | 80MHz | 1b | FLASH | SPI | 8 | 3ms | 0.000005A | 1b | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | Synchronous | 256B | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q64CVSFIG | Winbond Electronics | $0.34 |
Min: 1 Mult: 1 |
download | SpiFlash® | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | 2.64mm | ROHS3 Compliant | 2011 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q64cvzeig-datasheets-5635.pdf | 16-SOIC (0.295, 7.50mm Width) | 10.31mm | 3.3V | 16 | 16 | SPI, Serial | 64 Mb | 3A991.B.1.A | No | 8542.32.00.51 | 1 | 18mA | 2.7V~3.6V | DUAL | 3V | 1.27mm | 16 | 3.6V | 2.7V | 64Mb 8M x 8 | Non-Volatile | 7 ns | 2.7V | 80MHz | 24b | FLASH | SPI - Quad I/O | 8MX8 | 8 | 50μs, 3ms | 0.000005A | 8b | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | Synchronous | 256B | ||||||||||||||||||||||||||||||||||||||||||||||||
| W9464G6JH-4 | Winbond Electronics |
Min: 1 Mult: 1 |
download | Surface Mount | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | SDRAM - DDR | SYNCHRONOUS | 1.2mm | ROHS3 Compliant | 2011 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w9464g6jh4-datasheets-7939.pdf | 66-TSSOP (0.400, 10.16mm Width) | 22.22mm | 2.5V | 66 | 66 | 64 Mb | 1 | EAR99 | AUTO/SELF REFRESH | 8542.32.00.02 | 1 | 110mA | 2.4V~2.7V | DUAL | NOT SPECIFIED | 2.5V | 0.65mm | 66 | 2.7V | 2.4V | NOT SPECIFIED | Not Qualified | 64Mb 4M x 16 | Volatile | 3-STATE | 55ns | 250MHz | 14b | DRAM | Parallel | 4MX16 | 16 | 15ns | 0.005A | COMMON | 4096 | 248 | 248 | |||||||||||||||||||||||||||||||||||||||||||||||||
| W25X10CLZPIG TR | Winbond Electronics |
Min: 1 Mult: 1 |
download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25x10clsnig-datasheets-5946.pdf | 8-WDFN Exposed Pad | 2.3V~3.6V | 1Mb 128K x 8 | Non-Volatile | 104MHz | FLASH | SPI | 800μs | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W29GL064CB7B | Winbond Electronics |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | ASYNCHRONOUS | 1.4mm | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w29gl064cb7a-datasheets-5377.pdf | 64-LBGA | 13mm | 11mm | 64 | 14 Weeks | 64 | 3A991.B.1.A | BOTTOM BOOT BLOCK | 8542.32.00.51 | 1 | YES | 2.7V~3.6V | BOTTOM | 3V | 1mm | 64 | 3.6V | 2.7V | 3/3.3V | 0.055mA | Not Qualified | 64Mb 8M x 8 4M x 16 | Non-Volatile | 3V | FLASH | Parallel | 1 | 70ns | 8 | 0.000005A | 70 ns | YES | YES | YES | 8127 | YES | BOTTOM | YES | 8/16words | |||||||||||||||||||||||||||||||||||||||||||||||||
| W29GL128CH9T TR | Winbond Electronics |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w29gl128ch9t-datasheets-5439.pdf | 56-TFSOP (0.724, 18.40mm Width) | 14 Weeks | 2.7V~3.6V | 128Mb 16M x 8 8M x 16 | Non-Volatile | FLASH | Parallel | 90ns |
