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ContactQualcomm (RF360 - A Qualcomm & TDK Joint Venture)(2530)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mounting Type | Operating Temperature | Packaging | Size / Dimension | Moisture Sensitivity Level (MSL) | Frequency | RoHS Status | Published | Datasheet | Package / Case | Capacitance | Height | Factory Lead Time | Impedance | Feature | Frequency Tolerance |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| B39801R2712U310 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Min: 1 Mult: 1 |
download | SAW | B39801 | Surface Mount | -45°C~125°C | Tape & Reel (TR) | 0.197Lx0.197W 5.00mmx5.00mm | 1 (Unlimited) | 804.5MHz | 2005 | https://pdf.utmel.com/r/datasheets/qualcommrf360aqualcommtdkjointventure-b39801r2712u310-datasheets-9702.pdf | 8-SMD | 0.053 1.35mm | 50Ohms | ||||||||||
| B39301R852H210 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Min: 1 Mult: 1 |
download | SAW | B39301 | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 0.197Lx0.138W 5.00mmx3.50mm | 1 (Unlimited) | 304.3MHz | 2005 | https://pdf.utmel.com/r/datasheets/qualcommrf360aqualcommtdkjointventure-b39301r852h210-datasheets-9691.pdf | 8-SMD | 0.053 1.35mm | 50Ohms | ||||||||||
| B39311R2710U310 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Min: 1 Mult: 1 |
download | SAW | B39311 | Surface Mount | -45°C~85°C | Tape & Reel (TR) | 0.197Lx0.197W 5.00mmx5.00mm | 1 (Unlimited) | 311.063MHz | 2005 | https://pdf.utmel.com/r/datasheets/qualcommrf360aqualcommtdkjointventure-b39311r2710u310-datasheets-9700.pdf | 8-SMD | 1.8pF | 0.053 1.35mm | 50Ohms | Built in Capacitor | ||||||||
| B39431R850H210 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Min: 1 Mult: 1 |
download | SAW | B39431 | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 0.197Lx0.138W 5.00mmx3.50mm | 1 (Unlimited) | 433.94MHz | 2005 | https://pdf.utmel.com/r/datasheets/qualcommrf360aqualcommtdkjointventure-b39431r850h210-datasheets-9708.pdf | 4-SMD | 2.7pF | 0.057 1.45mm | 50Ohms | Built in Capacitor | ||||||||
| B39321R0821H210 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Min: 1 Mult: 1 |
download | SAW | B39321 | Surface Mount | -40°C~125°C | Cut Tape (CT) | 0.197Lx0.138W 5.00mmx3.50mm | 1 (Unlimited) | 315MHz | ROHS3 Compliant | 4-SMD | 2.8pF | 0.057 1.45mm | 50Ohms | Without Capacitor | |||||||||
| B39421R2702U310 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Min: 1 Mult: 1 |
download | SAW | B39421 | Surface Mount | -45°C~85°C | Tape & Reel (TR) | 0.197Lx0.197W 5.00mmx5.00mm | 1 (Unlimited) | 418.05MHz | 2005 | https://pdf.utmel.com/r/datasheets/qualcommrf360aqualcommtdkjointventure-b39421r2702u310-datasheets-9710.pdf | 8-SMD | 0.053 1.35mm | 50Ohms | ||||||||||
| B39321R851H210 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Min: 1 Mult: 1 |
download | SAW | B39321 | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 0.197Lx0.138W 5.00mmx3.50mm | 1 (Unlimited) | 315.02MHz | 2005 | https://pdf.utmel.com/r/datasheets/qualcommrf360aqualcommtdkjointventure-b39321r851h210-datasheets-9722.pdf | 8-SMD | 0.057 1.45mm | 50Ohms | ||||||||||
| B39921R2906H110 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Min: 1 Mult: 1 |
download | SAW | B39921 | Surface Mount | -40°C~125°C | Cut Tape (CT) | 0.118Lx0.118W 3.00mmx3.00mm | 3 (168 Hours) | 915MHz | ROHS3 Compliant | 2014 | 6-SMD | 0.039 1.00mm | Without Capacitor | ||||||||||
| B39431R806H210 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Min: 1 Mult: 1 |
download | SAW | B39431 | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 0.197Lx0.138W 5.00mmx3.50mm | 1 (Unlimited) | 433.42MHz | 2005 | https://pdf.utmel.com/r/datasheets/qualcommrf360aqualcommtdkjointventure-b39431r806h210-datasheets-9714.pdf | 4-SMD | 2.4pF | 0.057 1.45mm | 50Ohms | Built in Capacitor | ||||||||
| B39301R2707U310 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Min: 1 Mult: 1 |
download | SAW | B39301 | Surface Mount | -45°C~85°C | Tape & Reel (TR) | 0.197Lx0.197W 5.00mmx5.00mm | 1 (Unlimited) | 303.825MHz | 2005 | https://pdf.utmel.com/r/datasheets/qualcommrf360aqualcommtdkjointventure-b39301r2707u310-datasheets-9684.pdf | 8-SMD | 0.053 1.35mm | 50Ohms | ||||||||||
| B39401R709U310 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Min: 1 Mult: 1 |
download | SAW | B39401 | Surface Mount | -45°C~85°C | Tape & Reel (TR) | 0.197Lx0.197W 5.00mmx5.00mm | 1 (Unlimited) | 403.55MHz | https://pdf.utmel.com/r/datasheets/qualcommrf360aqualcommtdkjointventure-b39401r709u310-datasheets-9898.pdf | 8-SMD | 3.7pF | 0.053 1.35mm | 50Ohms | Built in Capacitor | |||||||||
| B39871R804H210 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Min: 1 Mult: 1 |
download | SAW | B39871 | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 0.197Lx0.138W 5.00mmx3.50mm | 1 (Unlimited) | 868.35MHz | https://pdf.utmel.com/r/datasheets/qualcommrf360aqualcommtdkjointventure-b39871r804h210-datasheets-9757.pdf | 4-SMD | 0.057 1.45mm | 50Ohms | |||||||||||
| B39321R903U410 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Min: 1 Mult: 1 |
download | SAW | B39321 | Surface Mount | -40°C~125°C | Cut Tape (CT) | 0.118Lx0.118W 3.00mmx3.00mm | 1 (Unlimited) | 315.5MHz | ROHS3 Compliant | 6-SMD | 2.6pF | 0.043 1.09mm | 50Ohms | Without Capacitor | |||||||||
| B39431R0950U410 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Min: 1 Mult: 1 |
download | SAW | B39431 | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 0.118Lx0.118W 3.00mmx3.00mm | 1 (Unlimited) | 433.96MHz | https://pdf.utmel.com/r/datasheets/qualcommrf360aqualcommtdkjointventure-b39431r0950u410-datasheets-0061.pdf | 6-SMD | 0.043 1.09mm | 50Ohms | |||||||||||
| B39421R853H210 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Min: 1 Mult: 1 |
download | SAW | B39421 | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 0.197Lx0.138W 5.00mmx3.50mm | 1 (Unlimited) | 423.22MHz | 2002 | https://pdf.utmel.com/r/datasheets/qualcommrf360aqualcommtdkjointventure-b39421r853h210-datasheets-9668.pdf | 4-SMD | 0.057 1.45mm | 50Ohms | ||||||||||
| B39431R0962H110 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Min: 1 Mult: 1 |
download | SAW | B39431 | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 0.118Lx0.118W 3.00mmx3.00mm | 1 (Unlimited) | 433.95MHz | https://pdf.utmel.com/r/datasheets/qualcommrf360aqualcommtdkjointventure-b39431r0962h110-datasheets-0107.pdf | 6-SMD | 0.039 1.00mm | 50Ohms | |||||||||||
| B39301R734U310 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Min: 1 Mult: 1 |
download | SAW | B39301 | Surface Mount | -45°C~120°C | Tape & Reel (TR) | 0.197Lx0.197W 5.00mmx5.00mm | 1 (Unlimited) | 304.325MHz | https://pdf.utmel.com/r/datasheets/qualcommrf360aqualcommtdkjointventure-b39301r734u310-datasheets-0120.pdf | 8-SMD | 0.053 1.35mm | 50Ohms | |||||||||||
| B39871R0858H210 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Min: 1 Mult: 1 |
download | SAW | B39871 | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 0.197Lx0.138W 5.00mmx3.50mm | 1 (Unlimited) | 868.35MHz | https://pdf.utmel.com/r/datasheets/qualcommrf360aqualcommtdkjointventure-b39871r0858h210-datasheets-0164.pdf | 4-SMD | 0.057 1.45mm | ±75kHz | |||||||||||
| B39871R2709U310 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Min: 1 Mult: 1 |
download | SAW | B39871 | Surface Mount | -45°C~125°C | Tape & Reel (TR) | 0.197Lx0.197W 5.00mmx5.00mm | 1 (Unlimited) | 868.3MHz | 2011 | 8-SMD | 0.053 1.35mm | ||||||||||||
| B39431R715U310 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Min: 1 Mult: 1 |
download | SAW | B39431 | Surface Mount | -45°C~85°C | Tape & Reel (TR) | 0.197Lx0.197W 5.00mmx5.00mm | 1 (Unlimited) | 433.32MHz | 2011 | https://pdf.utmel.com/r/datasheets/qualcommrf360aqualcommtdkjointventure-b39431r715u310-datasheets-0082.pdf | 8-SMD | 0.053 1.35mm | 50Ohms | ||||||||||
| B39431R0960H110 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | $0.95 |
Min: 1 Mult: 1 |
download | SAW | B39431 | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 0.118Lx0.118W 3.00mmx3.00mm | 1 (Unlimited) | 433.92MHz | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/qualcommrf360aqualcommtdkjointventure-b39431r0960h110-datasheets-0235.pdf | 6-SMD | 0.039 1.00mm | 9 Weeks | 50Ohms | ||||||||
| B39431R0880H210 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Min: 1 Mult: 1 |
download | SAW | B39431 | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 0.197Lx0.138W 5.00mmx3.50mm | 1 (Unlimited) | 433.92MHz | ROHS3 Compliant | 4-SMD | 0.057 1.45mm | 9 Weeks | 50Ohms | ||||||||||
| B39401R724U310 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Min: 1 Mult: 1 |
download | SAW | B39401 | Surface Mount | -45°C~85°C | Tape & Reel (TR) | 0.197Lx0.197W 5.00mmx5.00mm | 1 (Unlimited) | 403.966MHz | 2011 | https://pdf.utmel.com/r/datasheets/qualcommrf360aqualcommtdkjointventure-b39401r724u310-datasheets-0351.pdf | 8-SMD | 0.053 1.35mm | 50Ohms | ||||||||||
| B39431R0820H210 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | $1.14 |
Min: 1 Mult: 1 |
download | SAW | B39431 | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 0.197Lx0.138W 5.00mmx3.50mm | 1 (Unlimited) | 433.92MHz | ROHS3 Compliant | 4-SMD | 0.057 1.45mm | 9 Weeks | 50Ohms | |||||||||
| B39421R714U310 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Min: 1 Mult: 1 |
download | SAW | B39421 | Surface Mount | -45°C~120°C | Tape & Reel (TR) | 0.197Lx0.197W 5.00mmx5.00mm | 1 (Unlimited) | 423.22MHz | 2011 | https://pdf.utmel.com/r/datasheets/qualcommrf360aqualcommtdkjointventure-b39421r714u310-datasheets-3791.pdf | 8-SMD | 0.053 1.35mm | 50Ohms | ||||||||||
| B39321R2704U310 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | $2.70 |
Min: 1 Mult: 1 |
download | SAW | B39321 | Surface Mount | -45°C~125°C | Tape & Reel (TR) | 0.197Lx0.197W 5.00mmx5.00mm | 1 (Unlimited) | 315MHz | 2005 | https://pdf.utmel.com/r/datasheets/qualcommrf360aqualcommtdkjointventure-b39321r2704u310-datasheets-3957.pdf | 8-SMD | 0.053 1.35mm | 50Ohms | |||||||||
| B39321R0822H210 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Min: 1 Mult: 1 |
download | SAW | B39321 | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 0.197Lx0.138W 5.00mmx3.50mm | 1 (Unlimited) | 319.508MHz | ROHS3 Compliant | 8-SMD | 0.057 1.45mm | 9 Weeks | 50Ohms | ||||||||||
| B39431R2701U310 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Min: 1 Mult: 1 |
download | SAW | B39431 | Surface Mount | -45°C~125°C | Tape & Reel (TR) | 0.197Lx0.197W 5.00mmx5.00mm | 1 (Unlimited) | 433.92MHz | 2005 | https://pdf.utmel.com/r/datasheets/qualcommrf360aqualcommtdkjointventure-b39431r2701u310-datasheets-4433.pdf | 8-SMD | 2.3pF | 0.053 1.35mm | 50Ohms | Built in Capacitor | ||||||||
| B39431R0900U410 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Min: 1 Mult: 1 |
download | SAW | B39431 | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 0.118Lx0.118W 3.00mmx3.00mm | 1 (Unlimited) | 433.92MHz | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/qualcommrf360aqualcommtdkjointventure-b39431r0900u410-datasheets-4679.pdf | 6-SMD | 0.043 1.09mm | 9 Weeks | 50Ohms | ±75kHz | ||||||||
| B39401R0983H110 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Min: 1 Mult: 1 |
download | B39401 | Surface Mount | Tape & Reel (TR) | 0.118Lx0.118W 3.00mmx3.00mm | 1 (Unlimited) | ROHS3 Compliant | 6-SMD | 0.039 1.00mm | 9 Weeks |
