| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Pbfree Code | ECCN Code | Radiation Hardening | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Applications | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Number of Channels | Time@Peak Reflow Temperature-Max (s) | Qualification Status | JESD-30 Code | Supplier Device Package | Data Rate | Number of I/O | Max Dual Supply Voltage | Dual Supply Voltage | Propagation Delay | Supply Type | Min Dual Supply Voltage | uPs/uCs/Peripheral ICs Type | Boundary Scan | Low Power Mode | Clock Frequency | Organization | Output Function | Programmable Logic Type | Multiplexer/Demultiplexer Circuit | Voltage - Supply, Single (V+) |
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| LX64EV-5FN100I | Lattice Semiconductor |
Min: 1 Mult: 1 |
download | ispGDX2® | Surface Mount | Surface Mount | -40°C~105°C TJ | Tray | 3 (168 Hours) | CMOS | RoHS Compliant | 2000 | /files/latticesemiconductorcorporation-lx64ev3fn100c-datasheets-2609.pdf | 100-LBGA | 3.3V | 100 | 100 | EAR99 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | PCI Express® | BOTTOM | BALL | 260 | 3.3V | LX64 | 100 | 1 | 40 | Not Qualified | 11 Gbps | 3.6V | Triple | 3V | DSP PERIPHERAL, CROSSBAR SWITCH | YES | NO | 64:64 | 3V~3.6V | |||||||||||||||||||||||||||||
| ISPGDX160V-5Q208 | Lattice Semiconductor |
Min: 1 Mult: 1 |
download | ispGDX® | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | CMOS | Non-RoHS Compliant | 2000 | /files/latticesemiconductorcorporation-lptm1012473tg128i-datasheets-5774.pdf | 208-BFQFP | 28mm | 28mm | 3.3V | 208 | 3.6V | 3V | no | EAR99 | e0 | PCI Express® | YES | QUAD | GULL WING | 3.3V | 0.5mm | ISPGDX160 | 208 | 1 | Not Qualified | S-PQFP-G208 | 160 | 3.6V | 5 ns | Dual | 3V | MACROCELL | EE PLD | 160:160 | 3V~3.6V | ||||||||||||||||||||||||||
| LX64V-3FN100C | Lattice Semiconductor |
Min: 1 Mult: 1 |
download | ispGDX2® | Surface Mount | Surface Mount | 0°C~90°C TJ | Tray | 3 (168 Hours) | CMOS | RoHS Compliant | 2000 | /files/latticesemiconductorcorporation-lx64ev3fn100c-datasheets-2609.pdf | 100-LBGA | 3.3V | 100 | 100 | EAR99 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | PCI Express® | BOTTOM | BALL | 260 | 3.3V | LX64 | 100 | 1 | NOT SPECIFIED | Not Qualified | 11 Gbps | 3.6V | 3.3V | Triple | 3V | DSP PERIPHERAL, CROSSBAR SWITCH | YES | NO | 64:64 | 3V~3.6V | ||||||||||||||||||||||||||||
| LX128V-5FN208C | Lattice Semiconductor |
Min: 1 Mult: 1 |
download | ispGDX2® | Surface Mount | Surface Mount | 0°C~90°C TJ | Tray | 3 (168 Hours) | CMOS | RoHS Compliant | 2000 | /files/latticesemiconductorcorporation-lx64ev3fn100c-datasheets-2609.pdf | 208-BGA | 3.3V | Lead Free | 208 | 208 | yes | EAR99 | No | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | PCI Express® | BOTTOM | BALL | 3.3V | LX128 | 208 | 1 | 21 Gbps | 3.6V | 3.3V | Triple | 3V | DSP PERIPHERAL, CROSSBAR SWITCH | YES | NO | 128:128 | 3V~3.6V | ||||||||||||||||||||||||||||
| LX256V-5FN484C | Lattice Semiconductor |
Min: 1 Mult: 1 |
download | ispGDX2® | Surface Mount | Surface Mount | 0°C~90°C TJ | Tray | 3 (168 Hours) | CMOS | 2.6mm | RoHS Compliant | 2000 | /files/latticesemiconductorcorporation-lx64ev3fn100c-datasheets-2609.pdf | 484-BBGA | 23mm | 23mm | 3.3V | Lead Free | 484 | 484 | yes | EAR99 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | PCI Express® | BOTTOM | BALL | 250 | 3.3V | LX256 | 484 | 1 | NOT SPECIFIED | Not Qualified | 38 Gbps | 3.6V | Triple | 3V | DSP PERIPHERAL, CROSSBAR SWITCH | YES | NO | 256:256 | 3V~3.6V | ||||||||||||||||||||||||
| ISPGDX160V-5B208 | Lattice Semiconductor |
Min: 1 Mult: 1 |
download | ispGDX® | Surface Mount | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | CMOS | Non-RoHS Compliant | 2000 | /files/latticesemiconductorcorporation-ispgdx160v5b208-datasheets-2682.pdf | 208-BGA | 3.3V | 208 | 3.6V | 3V | 208 | no | EAR99 | not_compliant | e0 | Tin/Lead (Sn63Pb37) | PCI Express® | BOTTOM | BALL | 3.3V | ISPGDX160 | 208 | 1 | Not Qualified | 160 | 3.6V | 5 ns | Dual | 3V | MACROCELL | EE PLD | 160:160 | 3V~3.6V | |||||||||||||||||||||||||||
| LX64EV-5FN100C | Lattice Semiconductor |
Min: 1 Mult: 1 |
download | ispGDX2® | Surface Mount | Surface Mount | 0°C~90°C TJ | Tray | 3 (168 Hours) | CMOS | RoHS Compliant | 2000 | /files/latticesemiconductorcorporation-lx64ev3fn100c-datasheets-2609.pdf | 100-LBGA | 3.3V | 100 | 100 | EAR99 | No | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | PCI Express® | BOTTOM | BALL | 260 | 3.3V | LX64 | 100 | 1 | 40 | 11 Gbps | 3.6V | 3.3V | Triple | 3V | DSP PERIPHERAL, CROSSBAR SWITCH | YES | NO | 64:64 | 3V~3.6V | ||||||||||||||||||||||||||||
| ISPGDX160VA-5B272 | Lattice Semiconductor |
Min: 1 Mult: 1 |
download | ispGDX® | Surface Mount | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | CMOS | 2.8mm | Non-RoHS Compliant | 2000 | /files/latticesemiconductorcorporation-lptm1012473tg128i-datasheets-5774.pdf | 272-BBGA | 27mm | 27mm | 3.3V | 272 | 3.6V | 3V | 272 | EAR99 | No | PCI Express® | BOTTOM | BALL | 3.3V | ISPGDX160 | 272 | 1 | 160 | 3.6V | 5 ns | Dual | 3V | MACROCELL | EE PLD | 240:240 | 3V~3.6V | ||||||||||||||||||||||||||||
| LX256EV-5FN484I | Lattice Semiconductor |
Min: 1 Mult: 1 |
download | ispGDX2® | Surface Mount | Surface Mount | -40°C~105°C TJ | Tray | 3 (168 Hours) | RoHS Compliant | 2000 | /files/latticesemiconductorcorporation-lx64ev3fn100c-datasheets-2609.pdf | 484-BBGA | 3.3V | Lead Free | 484 | yes | EAR99 | PCI Express® | LX256 | 484 | 1 | 38 Gbps | 3.6V | Triple | 3V | 256:256 | 3V~3.6V | ||||||||||||||||||||||||||||||||||||||||
| ISPGDX120A-7T176 | Lattice Semiconductor |
Min: 1 Mult: 1 |
download | ispGDX® | Surface Mount | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | Non-RoHS Compliant | 2000 | /files/latticesemiconductorcorporation-lptm1012473tg128i-datasheets-5774.pdf | 176-LQFP | 24mm | 24mm | 5V | 176 | 5.25V | 4.75V | 176 | EAR99 | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn85Pb15) | PCI Express® | QUAD | GULL WING | 225 | 5V | 0.5mm | ISPGDX120 | 176 | 30 | Not Qualified | Single | DSP PERIPHERAL, CROSSBAR SWITCH | YES | NO | 80MHz | 4.75V~5.25V | |||||||||||||||||||||||||
| ISPGDX160V-7B208 | Lattice Semiconductor |
Min: 1 Mult: 1 |
download | ispGDX® | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | CMOS | Non-RoHS Compliant | 2000 | /files/latticesemiconductorcorporation-lptm1012473tg128i-datasheets-5774.pdf | 208-BGA | 3.3V | 208 | 3.6V | 3V | 208 | no | EAR99 | not_compliant | e0 | Tin/Lead (Sn63Pb37) | PCI Express® | YES | BOTTOM | BALL | 3.3V | ISPGDX160 | 208 | 1 | Not Qualified | 160 | 3.6V | 7 ns | Dual | 3V | 80MHz | MACROCELL | EE PLD | 160:160 | 3V~3.6V | ||||||||||||||||||||||||||
| ISPGDX160VA-9BN208I | Lattice Semiconductor |
Min: 1 Mult: 1 |
download | ispGDX® | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | RoHS Compliant | 2000 | /files/latticesemiconductorcorporation-lptm1012473tg128i-datasheets-5774.pdf | 208-BGA | 3.3V | 208 | 3.6V | 3V | yes | EAR99 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | PCI Express® | YES | BOTTOM | BALL | 250 | 3.3V | ISPGDX160 | 208 | 1 | 40 | Not Qualified | S-PBGA-B208 | 160 | 3.6V | 9 ns | Dual | 3V | 62.5MHz | MACROCELL | EE PLD | 240:240 | 3V~3.6V | |||||||||||||||||||||||||
| ISPGDX160V-7Q208I | Lattice Semiconductor |
Min: 1 Mult: 1 |
download | ispGDX® | Surface Mount | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | Non-RoHS Compliant | 2000 | /files/latticesemiconductorcorporation-lptm1012473tg128i-datasheets-5774.pdf | 208-BFQFP | 28mm | 28mm | 3.3V | 208 | 3.6V | 3V | 208 | no | EAR99 | e0 | PCI Express® | QUAD | GULL WING | 225 | 3.3V | 0.5mm | ISPGDX160 | 208 | 1 | 30 | Not Qualified | 160 | 3.6V | 7 ns | Dual | 3V | 80MHz | MACROCELL | EE PLD | 160:160 | 3V~3.6V | |||||||||||||||||||||||
| ISPGDX160VA-7BN208I | Lattice Semiconductor |
Min: 1 Mult: 1 |
download | ispGDX® | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | RoHS Compliant | 2000 | /files/latticesemiconductorcorporation-lptm1012473tg128i-datasheets-5774.pdf | 208-BGA | 3.3V | 208 | 3.6V | 3V | yes | EAR99 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | PCI Express® | YES | BOTTOM | BALL | 250 | 3.3V | ISPGDX160 | 208 | 1 | 40 | Not Qualified | S-PBGA-B208 | 160 | 3.6V | 7 ns | Dual | 3V | 80MHz | MACROCELL | EE PLD | 240:240 | 3V~3.6V | |||||||||||||||||||||||||
| ISPGDX160VA-5BN208 | Lattice Semiconductor |
Min: 1 Mult: 1 |
download | ispGDX® | Surface Mount | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | CMOS | RoHS Compliant | 2000 | /files/latticesemiconductorcorporation-lptm1012473tg128i-datasheets-5774.pdf | 208-BGA | 3.3V | 208 | 3.6V | 3V | 208 | yes | EAR99 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | PCI Express® | BOTTOM | BALL | 250 | 3.3V | ISPGDX160 | 208 | 1 | 40 | Not Qualified | 160 | 3.6V | 5 ns | Dual | 3V | MACROCELL | EE PLD | 240:240 | 3V~3.6V | ||||||||||||||||||||||||||
| LX256V-35FN484C | Lattice Semiconductor |
Min: 1 Mult: 1 |
download | ispGDX2® | Surface Mount | Surface Mount | 0°C~90°C TJ | Tray | 3 (168 Hours) | RoHS Compliant | 2000 | /files/latticesemiconductorcorporation-lx64ev3fn100c-datasheets-2609.pdf | 484-BBGA | 3.3V | Lead Free | 484 | yes | EAR99 | PCI Express® | LX256 | 484 | 1 | 38 Gbps | 3.6V | Triple | 3V | 256:256 | 3V~3.6V | ||||||||||||||||||||||||||||||||||||||||
| ISPGDX160VA-7B272I | Lattice Semiconductor |
Min: 1 Mult: 1 |
download | ispGDX® | Surface Mount | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 2.8mm | Non-RoHS Compliant | 2000 | /files/latticesemiconductorcorporation-lptm1012473tg128i-datasheets-5774.pdf | 272-BBGA | 27mm | 27mm | 3.3V | 272 | 3.6V | 3V | 272 | EAR99 | No | PCI Express® | BOTTOM | BALL | 3.3V | ISPGDX160 | 272 | 1 | 160 | 3.6V | 7 ns | Dual | 3V | 80MHz | MACROCELL | EE PLD | 240:240 | 3V~3.6V | |||||||||||||||||||||||||||
| ISPGDX160VA-5Q208I | Lattice Semiconductor |
Min: 1 Mult: 1 |
download | ispGDX® | Surface Mount | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | Non-RoHS Compliant | 2000 | /files/latticesemiconductorcorporation-lptm1012473tg128i-datasheets-5774.pdf | 208-BFQFP | 28mm | 28mm | 3.3V | 208 | 3.6V | 3V | 208 | no | EAR99 | e0 | PCI Express® | QUAD | GULL WING | 3.3V | 0.5mm | ISPGDX160 | 208 | 1 | Not Qualified | 160 | 3.6V | 5 ns | Dual | 3V | MACROCELL | EE PLD | 240:240 | 3V~3.6V | ||||||||||||||||||||||||||
| LX128V-32FN208C | Lattice Semiconductor |
Min: 1 Mult: 1 |
download | ispGDX2® | Surface Mount | Surface Mount | 0°C~90°C TJ | Tray | 3 (168 Hours) | CMOS | RoHS Compliant | 2000 | /files/latticesemiconductorcorporation-lx64ev3fn100c-datasheets-2609.pdf | 208-BGA | 3.3V | Lead Free | 208 | 208 | yes | EAR99 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | PCI Express® | BOTTOM | BALL | 250 | 3.3V | LX128 | 208 | 1 | NOT SPECIFIED | Not Qualified | 21 Gbps | 3.6V | 3.3V | Triple | 3V | DSP PERIPHERAL, CROSSBAR SWITCH | YES | NO | 128:128 | 3V~3.6V | ||||||||||||||||||||||||||
| LX128EV-5FN208I | Lattice Semiconductor |
Min: 1 Mult: 1 |
download | ispGDX2® | Surface Mount | Surface Mount | -40°C~105°C TJ | Tray | 3 (168 Hours) | CMOS | RoHS Compliant | 2000 | /files/latticesemiconductorcorporation-lx64ev3fn100c-datasheets-2609.pdf | 208-BGA | 3.3V | Lead Free | 208 | 208 | yes | EAR99 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | PCI Express® | BOTTOM | BALL | 250 | 3.3V | LX128 | 208 | 1 | 40 | Not Qualified | 21 Gbps | 3.6V | 3.3V | Triple | 3V | DSP PERIPHERAL, CROSSBAR SWITCH | YES | NO | 128:128 | 3V~3.6V | ||||||||||||||||||||||||||
| ISPGDX160VA-7Q208 | Lattice Semiconductor |
Min: 1 Mult: 1 |
download | ispGDX® | Surface Mount | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | CMOS | Non-RoHS Compliant | 2000 | /files/latticesemiconductorcorporation-lptm1012473tg128i-datasheets-5774.pdf | 208-BFQFP | 28mm | 28mm | 3.3V | 208 | 3.6V | 3V | 208 | no | EAR99 | No | e0 | PCI Express® | QUAD | GULL WING | 3.3V | 0.5mm | ISPGDX160 | 208 | 1 | 160 | 3.6V | 7 ns | Dual | 3V | 80MHz | MACROCELL | EE PLD | 240:240 | 3V~3.6V | |||||||||||||||||||||||||
| LX256EV-35FN484C | Lattice Semiconductor |
Min: 1 Mult: 1 |
download | ispGDX2® | Surface Mount | Surface Mount | 0°C~90°C TJ | Tray | 3 (168 Hours) | CMOS | 2.6mm | RoHS Compliant | 2000 | /files/latticesemiconductorcorporation-lx64ev3fn100c-datasheets-2609.pdf | 484-BBGA | 23mm | 23mm | 3.3V | Lead Free | 484 | 484 | yes | EAR99 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | PCI Express® | BOTTOM | BALL | 250 | 3.3V | LX256 | 484 | 1 | 40 | Not Qualified | 38 Gbps | 3.6V | Triple | 3V | DSP PERIPHERAL, CROSSBAR SWITCH | YES | NO | 256:256 | 3V~3.6V | ||||||||||||||||||||||||
| LX256EV-5FN484C | Lattice Semiconductor |
Min: 1 Mult: 1 |
download | ispGDX2® | Surface Mount | Surface Mount | 0°C~90°C TJ | Tray | 3 (168 Hours) | RoHS Compliant | 2000 | /files/latticesemiconductorcorporation-lx64ev3fn100c-datasheets-2609.pdf | 484-BBGA | 3.3V | Lead Free | 484 | yes | EAR99 | PCI Express® | LX256 | 484 | 1 | 38 Gbps | 3.6V | Triple | 3V | 256:256 | 3V~3.6V | ||||||||||||||||||||||||||||||||||||||||
| ISPGDX240VA-4BN388 | Lattice Semiconductor |
Min: 1 Mult: 1 |
download | ispGDX® | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | CMOS | 2.6mm | RoHS Compliant | 2000 | /files/latticesemiconductorcorporation-lptm1012473tg128i-datasheets-5774.pdf | 388-BBGA | 23mm | 23mm | 3.3V | 388 | 3.6V | 3V | yes | EAR99 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | PCI Express® | YES | BOTTOM | BALL | 250 | 3.3V | ISPGDX240 | 388 | 1 | 40 | Not Qualified | S-PBGA-B388 | 240 | 4.5 ns | Single | 0 DEDICATED INPUTS, 240 I/O | MACROCELL | EE PLD | 240:240 | 3V~3.6V | ||||||||||||||||||||||||
| ISPGDX240VA-7BN388 | Lattice Semiconductor |
Min: 1 Mult: 1 |
download | ispGDX® | Surface Mount | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | CMOS | 2.6mm | RoHS Compliant | 2000 | /files/latticesemiconductorcorporation-lptm1012473tg128i-datasheets-5774.pdf | 388-BBGA | 23mm | 23mm | 3.3V | 388 | 3.6V | 3V | 388 | yes | EAR99 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | PCI Express® | BOTTOM | BALL | 250 | 3.3V | ISPGDX240 | 388 | 1 | 40 | Not Qualified | 240 | 7 ns | Single | 80MHz | 0 DEDICATED INPUTS, 240 I/O | MACROCELL | EE PLD | 240:240 | 3V~3.6V | |||||||||||||||||||||||
| ISPGDX80VA-5TN100I | Lattice Semiconductor |
Min: 1 Mult: 1 |
download | ispGDX® | Surface Mount | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | CMOS | RoHS Compliant | 2000 | /files/latticesemiconductorcorporation-lptm1012473tg128i-datasheets-5774.pdf | 100-LQFP | 3.3V | 100 | 10 Weeks | 3.6V | 3V | 100 | yes | EAR99 | No | e3 | Matte Tin (Sn) | PCI Express® | QUAD | GULL WING | 260 | 3.3V | 0.5mm | ISPGDX80 | 100 | 1 | 80 | 1.95V | 5 ns | Single | 0 DEDICATED INPUTS, 80 I/O | MACROCELL | EE PLD | 80:80 | 3V~3.6V | |||||||||||||||||||||||||
| ISPGDX240VA-10BN388I | Lattice Semiconductor |
Min: 1 Mult: 1 |
download | ispGDX® | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | 85°C | -40°C | RoHS Compliant | 2000 | /files/latticesemiconductorcorporation-lptm1012473tg128i-datasheets-5774.pdf | 388-BBGA | 3.3V | 3.6V | 3V | PCI Express® | ISPGDX240 | 1 | 388-FPBGA (23x23) | Single | 240:240 | 3V~3.6V | ||||||||||||||||||||||||||||||||||||||||||||
| ISPGDX240VA-7BN388I | Lattice Semiconductor |
Min: 1 Mult: 1 |
download | ispGDX® | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 2.6mm | RoHS Compliant | 2000 | /files/latticesemiconductorcorporation-lptm1012473tg128i-datasheets-5774.pdf | 388-BBGA | 23mm | 23mm | 3.3V | 388 | 3.6V | 3V | yes | EAR99 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | PCI Express® | YES | BOTTOM | BALL | 250 | 3.3V | ISPGDX240 | 388 | 1 | NOT SPECIFIED | Not Qualified | S-PBGA-B388 | 240 | 7 ns | Single | 80MHz | 0 DEDICATED INPUTS, 240 I/O | MACROCELL | EE PLD | 240:240 | 3V~3.6V | |||||||||||||||||||||||
| ISPGDX160VA-5BN208I | Lattice Semiconductor |
Min: 1 Mult: 1 |
download | ispGDX® | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | RoHS Compliant | 2000 | /files/latticesemiconductorcorporation-lptm1012473tg128i-datasheets-5774.pdf | 208-BGA | 3.3V | 208 | 3.6V | 3V | yes | EAR99 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | PCI Express® | YES | BOTTOM | BALL | 250 | 3.3V | ISPGDX160 | 208 | 1 | 40 | Not Qualified | S-PBGA-B208 | 160 | 3.6V | 5 ns | Dual | 3V | MACROCELL | EE PLD | 240:240 | 3V~3.6V | ||||||||||||||||||||||||||
| ISPGDX160VA-9Q208I | Lattice Semiconductor |
Min: 1 Mult: 1 |
download | ispGDX® | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | Non-RoHS Compliant | 2000 | /files/latticesemiconductorcorporation-lptm1012473tg128i-datasheets-5774.pdf | 208-BFQFP | 28mm | 28mm | 3.3V | 208 | 3.6V | 3V | no | EAR99 | e0 | PCI Express® | YES | QUAD | GULL WING | 225 | 3.3V | 0.5mm | ISPGDX160 | 208 | 1 | 30 | Not Qualified | S-PQFP-G208 | 160 | 3.6V | 9 ns | Dual | 3V | 62.5MHz | MACROCELL | EE PLD | 240:240 | 3V~3.6V |
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