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ContactTelecom Interface ICs(3995)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Supply Current | Current - Supply | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Number of Terminations | Factory Lead Time | Weight | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Pbfree Code | Number of Ports | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Voltage | Surface Mount | Max Power Dissipation | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Temperature Grade | Telecom IC Type | Operating Temperature (Max) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Number of Circuits | Qualification Status | JESD-30 Code | Supplier Device Package | Data Rate | Logic Function | Function |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| LE88264TQC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | 2015 | 4-Wire Serial | 2 | 64-QFN | Battery Switch | |||||||||||||||||||||||||||||||||||||||||||||||||||
| LE9531DMQC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 40mA | ROHS3 Compliant | QFN | Parallel | 3.3V | 1 | Subscriber Line Interface Concept (SLIC) | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| RPCS3487C.B0-998840 | Inphi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | 1369-BGA | Interlaken, XAUI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LE9531CETCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | 40mA | ROHS3 Compliant | 2011 | Parallel | 3.3V | 1 | Subscriber Line Interface Concept (SLIC) | |||||||||||||||||||||||||||||||||||||||||||||||||||
| LE9531DETC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 40mA | ROHS3 Compliant | 2011 | QFN | Parallel | 3.3V | 1 | Subscriber Line Interface Concept (SLIC) | |||||||||||||||||||||||||||||||||||||||||||||||||||
| LE9520DDTCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | 40mA | ROHS3 Compliant | Parallel | 3.3V | 2 | 64-eTQFP | Subscriber Line Interface Concept (SLIC) | ||||||||||||||||||||||||||||||||||||||||||||||||||
| MT3271BE1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Through Hole | -40°C~85°C | Tube | 1 (Unlimited) | 85°C | -40°C | 4.19MHz | 3mA | 3mA | ROHS3 Compliant | 2007 | /files/microchiptechnology-mt3271be1-datasheets-2117.pdf | 8-DIP (0.300, 7.62mm) | 5V | 7 Weeks | 930.006106mg | 5.25V | 4.75V | 8 | Parallel | No | 3mA | 5V | 500mW | 4.75V~5.25V | 1 | 8-PDIP | Receiver | DTMF Receiver | ||||||||||||||||||||||||||||||
| LE9520DDTC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | 40mA | ROHS3 Compliant | Parallel | 3.3V | 2 | 64-eTQFP | Subscriber Line Interface Concept (SLIC) | ||||||||||||||||||||||||||||||||||||||||||||||||||
| LE88116BLC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/microchiptechnology-le88136blc-datasheets-2028.pdf | 44-LQFP | 44 | PCM | 3V 5V | 1 | Telecom Circuit | ||||||||||||||||||||||||||||||||||||||||||||||||
| ZL50070GAC | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 1 (Unlimited) | 500mA | Non-RoHS Compliant | /files/microsemicorporation-zl50070gac-datasheets-2085.pdf | 484-BGA | 23mm | 23mm | 484 | 256 | no | 96 | e0 | TIN LEAD | 1.71V~1.89V | BOTTOM | BALL | 225 | 1.8V | ZL50070 | 30 | 1 | Not Qualified | S-PBGA-B484 | Switch | ||||||||||||||||||||||||||||||||
| LE9531CMQCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | 40mA | ROHS3 Compliant | 2007 | QFN | Parallel | 3.3V | 1 | Subscriber Line Interface Concept (SLIC) | ||||||||||||||||||||||||||||||||||||||||||||||||||
| ZL50073GAG2 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 500mA | ROHS3 Compliant | 2006 | /files/microchiptechnology-zl50073gac-datasheets-1942.pdf | 484-BGA | 23mm | 23mm | 484 | 14 Weeks | 484 | 128 | No | e1 | TIN SILVER COPPER | 1.71V~1.89V | BOTTOM | BALL | 1.8V | ZL50073 | 1 | Switch | ||||||||||||||||||||||||||||||||||
| LE9520SDDTCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | 40mA | ROHS3 Compliant | Parallel | 3.3V | 1 | Subscriber Line Interface Concept (SLIC) | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| LE9500ABJCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 1 (Unlimited) | 4.7mA | 4.572mm | ROHS3 Compliant | PLCC | 3.3V | 28 | Parallel | yes | YES | QUAD | J BEND | 3.3V | COMMERCIAL | 70°C | 1 | Not Qualified | S-PQCC-J28 | 28-PLCC | Subscriber Line Interface Concept (SLIC) | ||||||||||||||||||||||||||||||||||||||
| ZL50110GAG | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 950mA | 2.53mm | Non-RoHS Compliant | 2009 | /files/microchiptechnology-zl50114gag-datasheets-2007.pdf | 552-BGA | 35mm | 35mm | 552 | TDM | no | e0 | TIN LEAD | YES | 1.65V~1.95V | BOTTOM | BALL | 225 | 1.8V | ZL50110 | 30 | Other Telecom ICs | 1 | Not Qualified | S-PBGA-B552 | Telecom Circuit | ||||||||||||||||||||||||||||||
| LE9500DBJC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tube | 1 (Unlimited) | 4.7mA | 4.572mm | ROHS3 Compliant | PLCC | 3.3V | 28 | Parallel | yes | YES | QUAD | J BEND | 3.3V | COMMERCIAL | 70°C | 1 | Not Qualified | S-PQCC-J28 | 28-PLCC | Subscriber Line Interface Concept (SLIC) | ||||||||||||||||||||||||||||||||||||||
| LE89136QVCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 1 | SLAC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LE9531DMQCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | 40mA | ROHS3 Compliant | QFN | Parallel | 3.3V | 1 | Subscriber Line Interface Concept (SLIC) | |||||||||||||||||||||||||||||||||||||||||||||||||||
| ZL50074GAG2 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 500mA | ROHS3 Compliant | /files/microchiptechnology-zl50074gac-datasheets-1983.pdf | 484-BGA | 23mm | 23mm | 484 | e1 | TIN SILVER COPPER | YES | 1.71V~1.89V | BOTTOM | BALL | 1.8V | ZL50074 | 1 | Not Qualified | S-PBGA-B484 | Switch | |||||||||||||||||||||||||||||||||||||
| LE9500CBJCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 1 (Unlimited) | 4.7mA | 4.572mm | ROHS3 Compliant | PLCC | 3.3V | 28 | Parallel | yes | YES | QUAD | J BEND | 3.3V | COMMERCIAL | 70°C | 1 | Not Qualified | S-PQCC-J28 | 28-PLCC | Subscriber Line Interface Concept (SLIC) | ||||||||||||||||||||||||||||||||||||||
| LE9500DBJCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 1 (Unlimited) | 4.7mA | 4.572mm | ROHS3 Compliant | 2011 | PLCC | 3.3V | 28 | Parallel | yes | YES | QUAD | J BEND | 3.3V | COMMERCIAL | 70°C | 1 | Not Qualified | S-PQCC-J28 | 28-PLCC | Subscriber Line Interface Concept (SLIC) | |||||||||||||||||||||||||||||||||||||
| XRT75VL00DIVTR | MaxLinear, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | 120mA | /files/maxlinearinc-xrt75vl00divtrf-datasheets-1850.pdf | 52-LQFP | LIU | 3.135V~3.465V | 1 | Line Interface Unit (LIU) | |||||||||||||||||||||||||||||||||||||||||||||||||
| LE88136BLC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/microchiptechnology-le88136blc-datasheets-2028.pdf | 44-LQFP | 44 | PCM | 1 | Telecom Circuit | |||||||||||||||||||||||||||||||||||||||||||||||||
| CS1777.E0-998170 | Inphi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | 1020-BGA | SPI-4.2 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LE88111BLCT | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | RoHS Compliant | 1993 | /files/microsemicorporation-le88111blct-datasheets-2030.pdf | 44-LQFP | 44 | PCM | 3V 5V | 1 | 44-eLQFP | Telecom Circuit | ||||||||||||||||||||||||||||||||||||||||||||||
| ZL50057GAG2 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 1 (Unlimited) | 85°C | -40°C | 240mA | 240mA | ROHS3 Compliant | /files/microchiptechnology-zl50057gac-datasheets-1917.pdf | 272-BBGA | 272 | 1.71V~1.89V | ZL50057 | 272-PBGA (27x27) | Switch | |||||||||||||||||||||||||||||||||||||||||||
| ZL50120GAG2 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 950mA | ROHS3 Compliant | /files/microchiptechnology-zl50119gag2-datasheets-1865.pdf | 324-BGA | 23mm | 23mm | 324 | 324 | TDM | No | e1 | TIN SILVER COPPER | 1.65V~1.95V | BOTTOM | BALL | 1.8V | ZL50120 | Other Telecom ICs | 1 | 64 kbps | Telecom Circuit | ||||||||||||||||||||||||||||||||||
| XRT79L71IB | MaxLinear, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 4 (72 Hours) | CMOS | 1.7mm | Non-RoHS Compliant | /files/maxlinearinc-xrt79l71ibf-datasheets-1805.pdf | 208-LBGA | 17mm | 17mm | 208 | LIU | compliant | 8542.39.00.01 | 1 | e0 | TIN LEAD | YES | 3.15V~3.45V | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 1mm | ATM/SONET/SDH NETWORK INTERFACE | NOT SPECIFIED | Not Qualified | S-PBGA-B208 | |||||||||||||||||||||||||||||||
| XRT75R03IV | MaxLinear, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 2A (4 Weeks) | 410mA | /files/maxlinearinc-xrt75r03ivtr-datasheets-1775.pdf | 128-LQFP | LIU | 3.135V~3.465V | 3 | 128-LQFP (14x20) | Line Interface Unit (LIU) | ||||||||||||||||||||||||||||||||||||||||||||||||
| ZL50112GAG | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 950mA | 2.53mm | Non-RoHS Compliant | /files/microchiptechnology-zl50114gag-datasheets-2007.pdf | 552-BGA | 35mm | 35mm | 1.8V | 552 | 552 | TDM | 1.65V~1.95V | BOTTOM | BALL | 1.8V | ZL50112 | Other Telecom ICs | 1 | Not Qualified | 1 Gbps | Telecom Circuit |
