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ContactTelecom Interface ICs(3995)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Supply Current | Current - Supply | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Number of Terminations | Factory Lead Time | Weight | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Pbfree Code | Number of Ports | Radiation Hardening | Nominal Supply Current | JESD-609 Code | Terminal Finish | Voltage | Surface Mount | Max Power Dissipation | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Temperature Grade | Telecom IC Type | Operating Temperature (Max) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Number of Circuits | Qualification Status | JESD-30 Code | Supplier Device Package | Logic Function | Function | Number of Input Lines | Battery Feed | Hybrid |
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| ZL50051GAG2 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 85°C | -40°C | 240mA | 240mA | ROHS3 Compliant | /files/microsemicorporation-zl50051gac-datasheets-1911.pdf | 256-BGA | 8 Weeks | 1.71V~1.89V | ZL50051 | 1 | 256-BGA | Switch | |||||||||||||||||||||||||||||||||||||||||||
| LE9500BBJC | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tube | 1 (Unlimited) | 4.7mA | 4.572mm | RoHS Compliant | 2011 | PLCC | 3.3V | 28 | Parallel | yes | YES | QUAD | J BEND | 3.3V | COMMERCIAL | 70°C | 1 | Not Qualified | S-PQCC-J28 | 28-PLCC | Subscriber Line Interface Concept (SLIC) | ||||||||||||||||||||||||||||||||||||||
| LE9500CBJC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tube | 1 (Unlimited) | 4.7mA | 4.572mm | ROHS3 Compliant | PLCC | 3.3V | 28 | Parallel | yes | YES | QUAD | J BEND | 3.3V | COMMERCIAL | 70°C | 1 | Not Qualified | S-PQCC-J28 | 28-PLCC | Subscriber Line Interface Concept (SLIC) | |||||||||||||||||||||||||||||||||||||||
| ZL50018GAC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 1 (Unlimited) | 165mA | Non-RoHS Compliant | 2011 | /files/microchiptechnology-zl50018gac-datasheets-2161.pdf | 256-BGA | 256 | 256 | no | 32 | No | e0 | TIN LEAD | 1.71V~1.89V | BOTTOM | BALL | 225 | 1.8V | ZL50018 | 30 | Other Telecom ICs | 1 | Switch | ||||||||||||||||||||||||||||||||||
| MT93L16AQ1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tube | 1 (Unlimited) | 3μA | 2.64mm | ROHS3 Compliant | 2008 | /files/microchiptechnology-mt93l16aq1-datasheets-2193.pdf | 36-BSOP (0.295, 7.50mm Width) | 7.5mm | 3.3V | 36 | 36 | Serial | No | e3 | MATTE TIN | 2.7V~3.6V | DUAL | GULL WING | 3.3V | 0.8mm | ISDN ECHO CANCELLER | 1 | Echo Cancellation | ||||||||||||||||||||||||||||||||||
| ZL50021GAC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 1 (Unlimited) | 1.75mA | Non-RoHS Compliant | /files/microchiptechnology-zl50021gag2-datasheets-1932.pdf | 256-BGA | 256 | no | e0 | TIN LEAD | YES | 1.71V~1.89V | BOTTOM | BALL | 225 | 1.8V | ZL50021 | 30 | Other Telecom ICs | 1 | Not Qualified | S-PBGA-B256 | Switch | ||||||||||||||||||||||||||||||||||||
| ZL50052GAC | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 1 (Unlimited) | 240mA | Non-RoHS Compliant | 2006 | /files/microsemicorporation-zl50052gac-datasheets-2165.pdf | 196-BGA | 1.8V | 196 | 196 | no | 16 | e0 | TIN LEAD | 1.71V~1.89V | BOTTOM | BALL | 225 | 1.8V | ZL50052 | 30 | Other Telecom ICs | 1 | Not Qualified | Switch | |||||||||||||||||||||||||||||||||
| LE9502BTCT | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | BIPOLAR | 7.5mA | RoHS Compliant | 2002 | /files/microchiptechnology-le9502btc-datasheets-2042.pdf | 44-TQFP Exposed Pad | 3.3V | 44 | 2-Wire | e3 | MATTE TIN | QUAD | GULL WING | 3.3V | 0.8mm | Analog Transmission Interfaces | 1 | Not Qualified | S-PQFP-G44 | Subscriber Line Interface Concept (SLIC) | CONSTANT CURRENT | 2-4 CONVERSION | ||||||||||||||||||||||||||||||||||
| MT3371BNR1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 1 (Unlimited) | 4.19MHz | 3mA | 2mm | ROHS3 Compliant | /files/microchiptechnology-mt3271be1-datasheets-2117.pdf | 20-SSOP (0.209, 5.30mm Width) | 7.2mm | 5.3mm | 5V | 20 | 20 | Parallel | yes | No | e3 | MATTE TIN | 4.75V~5.25V | DUAL | GULL WING | 260 | 5V | 0.65mm | DTMF SIGNALING CIRCUIT | 30 | 1 | Receiver | DTMF Receiver | |||||||||||||||||||||||||||||
| LE89830JSC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tube | 1 (Unlimited) | ROHS3 Compliant | 2010 | PCM | 1 | 16-SOIC | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| SI32268-C-FM1 | Silicon Labs |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ProSLIC® | Surface Mount | Surface Mount | Tray | 3 (168 Hours) | RoHS Compliant | 2000 | QFN | 8 Weeks | GCI, PCM, SPI | 3.3V | DIGITAL SLIC | 1 | 50-QFN (6x8) | Subscriber Line Interface Concept (SLIC), CODEC | ||||||||||||||||||||||||||||||||||||||||||||||
| LE88246DLC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/microsemicorporation-le88226dlct-datasheets-2094.pdf | 80-LQFP | 80 | PCM | 2 | Telecom Circuit | ||||||||||||||||||||||||||||||||||||||||||||||||||
| LE88264TQC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | 2015 | 4-Wire Serial | 2 | 64-QFN | Battery Switch | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| LE9531DMQC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 40mA | ROHS3 Compliant | QFN | Parallel | 3.3V | 1 | Subscriber Line Interface Concept (SLIC) | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| RPCS3487C.B0-998840 | Inphi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | 1369-BGA | Interlaken, XAUI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LE9531CETCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | 40mA | ROHS3 Compliant | 2011 | Parallel | 3.3V | 1 | Subscriber Line Interface Concept (SLIC) | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| LE9531DETC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 40mA | ROHS3 Compliant | 2011 | QFN | Parallel | 3.3V | 1 | Subscriber Line Interface Concept (SLIC) | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| LE9520DDTCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | 40mA | ROHS3 Compliant | Parallel | 3.3V | 2 | 64-eTQFP | Subscriber Line Interface Concept (SLIC) | |||||||||||||||||||||||||||||||||||||||||||||||||||
| MT3271BE1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Through Hole | -40°C~85°C | Tube | 1 (Unlimited) | 85°C | -40°C | 4.19MHz | 3mA | 3mA | ROHS3 Compliant | 2007 | /files/microchiptechnology-mt3271be1-datasheets-2117.pdf | 8-DIP (0.300, 7.62mm) | 5V | 7 Weeks | 930.006106mg | 5.25V | 4.75V | 8 | Parallel | No | 3mA | 5V | 500mW | 4.75V~5.25V | 1 | 8-PDIP | Receiver | DTMF Receiver | |||||||||||||||||||||||||||||||
| LE9520DDTC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | 40mA | ROHS3 Compliant | Parallel | 3.3V | 2 | 64-eTQFP | Subscriber Line Interface Concept (SLIC) | |||||||||||||||||||||||||||||||||||||||||||||||||||
| LE88116BLC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/microchiptechnology-le88136blc-datasheets-2028.pdf | 44-LQFP | 44 | PCM | 3V 5V | 1 | Telecom Circuit | |||||||||||||||||||||||||||||||||||||||||||||||||
| ZL50070GAC | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 1 (Unlimited) | 500mA | Non-RoHS Compliant | /files/microsemicorporation-zl50070gac-datasheets-2085.pdf | 484-BGA | 23mm | 23mm | 484 | 256 | no | 96 | e0 | TIN LEAD | 1.71V~1.89V | BOTTOM | BALL | 225 | 1.8V | ZL50070 | 30 | 1 | Not Qualified | S-PBGA-B484 | Switch | |||||||||||||||||||||||||||||||||
| LE9531CMQCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | 40mA | ROHS3 Compliant | 2007 | QFN | Parallel | 3.3V | 1 | Subscriber Line Interface Concept (SLIC) | |||||||||||||||||||||||||||||||||||||||||||||||||||
| LE89830JSCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 1 (Unlimited) | ROHS3 Compliant | 2010 | PCM | 1 | 16-SOIC | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| LE88226DLC | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | Tray | 3 (168 Hours) | RoHS Compliant | /files/microsemicorporation-le88226dlct-datasheets-2094.pdf | 80-LQFP | 80 | PCM | 2 | Telecom Circuit | ||||||||||||||||||||||||||||||||||||||||||||||||||
| LE88111BLC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/microsemicorporation-le88111blct-datasheets-2030.pdf | 44-LQFP | 5V | 356.09836mg | 44 | PCM | 3V 5V | Telecom Circuit | 1 | |||||||||||||||||||||||||||||||||||||||||||||||
| MT3171BE1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Through Hole | -40°C~85°C | Tube | 1 (Unlimited) | 4.19MHz | 3mA | 5.33mm | ROHS3 Compliant | /files/microchiptechnology-mt3271be1-datasheets-2117.pdf | 8-DIP (0.300, 7.62mm) | 9.59mm | 7.62mm | 5V | 8 | 8 | Parallel | yes | No | 3mA | e3 | MATTE TIN | 4.75V~5.25V | DUAL | 260 | 5V | 2.54mm | DTMF SIGNALING CIRCUIT | 30 | Telecom Signaling Circuits | 5V | 1 | Receiver | DTMF Receiver | |||||||||||||||||||||||||||
| ZL50212/GBC | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 85°C | -40°C | 10mA | 10mA | Non-RoHS Compliant | /files/microsemicorporation-zl50212gbc-datasheets-2092.pdf | 535-BGA | 535 | 1.6V~2V | 1 | 535-PBGA (31x31) | Echo Cancellation | ||||||||||||||||||||||||||||||||||||||||||||
| LE9531DETCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | 40mA | ROHS3 Compliant | 2011 | Parallel | 3.3V | 1 | Subscriber Line Interface Concept (SLIC) | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| LE88226DLCT | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | RoHS Compliant | 1993 | /files/microsemicorporation-le88226dlct-datasheets-2094.pdf | 80-LQFP | 80 | PCM | 2 | 80-eLQFP | Telecom Circuit |
