Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Supply Current | Current - Supply | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Number of Terminations | Factory Lead Time | Weight | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Lifecycle Status | Pbfree Code | Number of Ports | Radiation Hardening | Nominal Supply Current | JESD-609 Code | Terminal Finish | Voltage | Max Power Dissipation | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Telecom IC Type | Number of Channels | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Number of Circuits | Qualification Status | JESD-30 Code | Supplier Device Package | Logic Function | Function | Number of Input Lines | Battery Feed | Hybrid |
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ZL50052GAC | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 1 (Unlimited) | 240mA | Non-RoHS Compliant | 2006 | /files/microsemicorporation-zl50052gac-datasheets-2165.pdf | 196-BGA | 1.8V | 196 | 196 | no | 16 | e0 | TIN LEAD | 1.71V~1.89V | BOTTOM | BALL | 225 | 1.8V | ZL50052 | 30 | Other Telecom ICs | 1 | Not Qualified | Switch | |||||||||||||||||||||||||||||||||
LE9502BTCT | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | BIPOLAR | 7.5mA | RoHS Compliant | 2002 | /files/microchiptechnology-le9502btc-datasheets-2042.pdf | 44-TQFP Exposed Pad | 3.3V | 44 | 2-Wire | e3 | MATTE TIN | QUAD | GULL WING | 3.3V | 0.8mm | Analog Transmission Interfaces | 1 | Not Qualified | S-PQFP-G44 | Subscriber Line Interface Concept (SLIC) | CONSTANT CURRENT | 2-4 CONVERSION | ||||||||||||||||||||||||||||||||||
MT3371BNR1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 1 (Unlimited) | 4.19MHz | 3mA | 2mm | ROHS3 Compliant | /files/microchiptechnology-mt3271be1-datasheets-2117.pdf | 20-SSOP (0.209, 5.30mm Width) | 7.2mm | 5.3mm | 5V | 20 | 20 | Parallel | yes | No | e3 | MATTE TIN | 4.75V~5.25V | DUAL | GULL WING | 260 | 5V | 0.65mm | DTMF SIGNALING CIRCUIT | 30 | 1 | Receiver | DTMF Receiver | |||||||||||||||||||||||||||||
LE89830JSC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tube | 1 (Unlimited) | ROHS3 Compliant | 2010 | PCM | 1 | 16-SOIC | |||||||||||||||||||||||||||||||||||||||||||||||||||||
SI32268-C-FM1 | Silicon Labs |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ProSLIC® | Surface Mount | Surface Mount | Tray | 3 (168 Hours) | RoHS Compliant | 2000 | QFN | 8 Weeks | GCI, PCM, SPI | 3.3V | DIGITAL SLIC | 1 | 50-QFN (6x8) | Subscriber Line Interface Concept (SLIC), CODEC | ||||||||||||||||||||||||||||||||||||||||||||||
MT9196APR1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 1 (Unlimited) | CMOS | 400μA | 4.57mm | ROHS3 Compliant | /files/microchiptechnology-mt9196apr1-datasheets-2173.pdf | 28-LCC (J-Lead) | 5V | 28 | 28 | yes | No | e3 | MATTE TIN | 4.75V~5.25V | QUAD | J BEND | 260 | 5V | 30 | 1 | Telecom Circuit | |||||||||||||||||||||||||||||||||||
MT9196AE1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Through Hole | -40°C~85°C | Tube | 1 (Unlimited) | CMOS | 400μA | 6.35mm | ROHS3 Compliant | 2006 | /files/microchiptechnology-mt9196apr1-datasheets-2173.pdf | 28-DIP (0.600, 15.24mm) | 37.4mm | 5V | 28 | 28 | No | e3 | MATTE TIN | 4.75V~5.25V | DUAL | 5V | 2.54mm | 1 | Telecom Circuit | ||||||||||||||||||||||||||||||||||||
LE89010QVC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | LQFP | 181.692094mg | 48 | OBSOLETE (Last Updated: 1 month ago) | No | 1 | 1 | 48-LQFP | |||||||||||||||||||||||||||||||||||||||||||||||||
ZL30301GAG | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 1 (Unlimited) | 950mA | Non-RoHS Compliant | /files/microchiptechnology-zl30301gag-datasheets-2177.pdf | 324-BGA | 3V~3.6V | ZL30301 | 1 | Telecom Circuit | |||||||||||||||||||||||||||||||||||||||||||||||||
MT3370BS1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tube | 1 (Unlimited) | 4.19MHz | 3mA | 2.65mm | ROHS3 Compliant | /files/microchiptechnology-mt3271be1-datasheets-2117.pdf | 18-SOIC (0.295, 7.50mm Width) | 7.5mm | 5V | 18 | 18 | Parallel | yes | No | e3 | MATTE TIN | 500mW | 4.75V~5.25V | DUAL | GULL WING | 260 | 5V | DTMF SIGNALING CIRCUIT | 30 | Telecom Signaling Circuits | 5V | 8mA | 1 | Receiver | DTMF Receiver | |||||||||||||||||||||||||||
MT93L00AV | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 1 (Unlimited) | 65mA | Non-RoHS Compliant | 2006 | /files/microsemicorporation-mt93l00av-datasheets-2179.pdf | 208-LBGA | 208 | 208 | no | No | e0 | TIN LEAD | 3V~3.6V | BOTTOM | BALL | 225 | 1.8V | ISDN ECHO CANCELLER | 30 | 1 | Echo Cancellation | ||||||||||||||||||||||||||||||||||||
LE9520DDTCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | 40mA | ROHS3 Compliant | Parallel | 3.3V | 2 | 64-eTQFP | Subscriber Line Interface Concept (SLIC) | |||||||||||||||||||||||||||||||||||||||||||||||||||
MT3271BE1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Through Hole | -40°C~85°C | Tube | 1 (Unlimited) | 85°C | -40°C | 4.19MHz | 3mA | 3mA | ROHS3 Compliant | 2007 | /files/microchiptechnology-mt3271be1-datasheets-2117.pdf | 8-DIP (0.300, 7.62mm) | 5V | 7 Weeks | 930.006106mg | 5.25V | 4.75V | 8 | Parallel | No | 3mA | 5V | 500mW | 4.75V~5.25V | 1 | 8-PDIP | Receiver | DTMF Receiver | |||||||||||||||||||||||||||||||
LE9520DDTC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | 40mA | ROHS3 Compliant | Parallel | 3.3V | 2 | 64-eTQFP | Subscriber Line Interface Concept (SLIC) | |||||||||||||||||||||||||||||||||||||||||||||||||||
LE88116BLC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/microchiptechnology-le88136blc-datasheets-2028.pdf | 44-LQFP | 44 | PCM | 3V 5V | 1 | Telecom Circuit | |||||||||||||||||||||||||||||||||||||||||||||||||
ZL50070GAC | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 1 (Unlimited) | 500mA | Non-RoHS Compliant | /files/microsemicorporation-zl50070gac-datasheets-2085.pdf | 484-BGA | 23mm | 23mm | 484 | 256 | no | 96 | e0 | TIN LEAD | 1.71V~1.89V | BOTTOM | BALL | 225 | 1.8V | ZL50070 | 30 | 1 | Not Qualified | S-PBGA-B484 | Switch | |||||||||||||||||||||||||||||||||
LE9531CMQCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | 40mA | ROHS3 Compliant | 2007 | QFN | Parallel | 3.3V | 1 | Subscriber Line Interface Concept (SLIC) | |||||||||||||||||||||||||||||||||||||||||||||||||||
LE89830JSCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 1 (Unlimited) | ROHS3 Compliant | 2010 | PCM | 1 | 16-SOIC | |||||||||||||||||||||||||||||||||||||||||||||||||||||
LE88226DLC | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | Tray | 3 (168 Hours) | RoHS Compliant | /files/microsemicorporation-le88226dlct-datasheets-2094.pdf | 80-LQFP | 80 | PCM | 2 | Telecom Circuit | ||||||||||||||||||||||||||||||||||||||||||||||||||
LE88111BLC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/microsemicorporation-le88111blct-datasheets-2030.pdf | 44-LQFP | 5V | 356.09836mg | 44 | PCM | 3V 5V | Telecom Circuit | 1 | |||||||||||||||||||||||||||||||||||||||||||||||
MT3171BE1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Through Hole | -40°C~85°C | Tube | 1 (Unlimited) | 4.19MHz | 3mA | 5.33mm | ROHS3 Compliant | /files/microchiptechnology-mt3271be1-datasheets-2117.pdf | 8-DIP (0.300, 7.62mm) | 9.59mm | 7.62mm | 5V | 8 | 8 | Parallel | yes | No | 3mA | e3 | MATTE TIN | 4.75V~5.25V | DUAL | 260 | 5V | 2.54mm | DTMF SIGNALING CIRCUIT | 30 | Telecom Signaling Circuits | 5V | 1 | Receiver | DTMF Receiver | |||||||||||||||||||||||||||
ZL50212/GBC | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 85°C | -40°C | 10mA | 10mA | Non-RoHS Compliant | /files/microsemicorporation-zl50212gbc-datasheets-2092.pdf | 535-BGA | 535 | 1.6V~2V | 1 | 535-PBGA (31x31) | Echo Cancellation | ||||||||||||||||||||||||||||||||||||||||||||
LE9531DETCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | 40mA | ROHS3 Compliant | 2011 | Parallel | 3.3V | 1 | Subscriber Line Interface Concept (SLIC) | ||||||||||||||||||||||||||||||||||||||||||||||||||||
LE88226DLCT | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | RoHS Compliant | 1993 | /files/microsemicorporation-le88226dlct-datasheets-2094.pdf | 80-LQFP | 80 | PCM | 2 | 80-eLQFP | Telecom Circuit | ||||||||||||||||||||||||||||||||||||||||||||||||
LE9520CDTCT | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | 40mA | RoHS Compliant | 2011 | Parallel | 3.3V | 2 | 64-eTQFP | Subscriber Line Interface Concept (SLIC) | ||||||||||||||||||||||||||||||||||||||||||||||||||
LE88116BLCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 1993 | /files/microchiptechnology-le88136blc-datasheets-2028.pdf | 44-LQFP | 44 | PCM | 3V 5V | 1 | 44-eLQFP | Telecom Circuit | |||||||||||||||||||||||||||||||||||||||||||||||
LE9531CETC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 40mA | ROHS3 Compliant | Parallel | 3.3V | 1 | Subscriber Line Interface Concept (SLIC) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
ZL50050GAC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 1 (Unlimited) | 85°C | -40°C | 240mA | 240mA | Non-RoHS Compliant | /files/microchiptechnology-zl50050gag2-datasheets-1930.pdf | 196-BGA | 196 | 32 | 1.71V~1.89V | ZL50050 | 1 | 196-PBGA (15x15) | Switch | ||||||||||||||||||||||||||||||||||||||||||
LE9531CMQC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 40mA | ROHS3 Compliant | QFN | Parallel | 3.3V | 1 | Subscriber Line Interface Concept (SLIC) | |||||||||||||||||||||||||||||||||||||||||||||||||||||
LE88216DLC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/microchiptechnology-le88216dlc-datasheets-2100.pdf | 80-LQFP | 80 | PCM | 2 | Telecom Circuit |
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