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ContactSpecialized Power Management ICs(5989)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Current - Supply | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Number of Terminations | Factory Lead Time | ECCN Code | HTS Code | Number of Functions | Applications | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Telecom IC Type | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Number of Channels | Analog IC - Other Type | Time@Peak Reflow Temperature-Max (s) | Adjustable Threshold | Subcategory | Power Supplies | Supply Current-Max (Isup) | Qualification Status | JESD-30 Code |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MC34VR500VAES | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | -40°C~105°C TA | Tray | 3 (168 Hours) | 15mA | ROHS3 Compliant | /files/nxpusainc-mc34vr500vaesr2-datasheets-8357.pdf | 56-VFQFN Exposed Pad | 2 Weeks | QorlQ LS1/T1 Communications Processors | 2.8V~4.5V | |||||||||||||||||||||||||||||||
| MC33PF8100EPESR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | 1mm | /files/nxpusainc-mc34pf8100epepr2-datasheets-8462.pdf | 56-VFQFN Exposed Pad | 8mm | 8mm | 56 | 2 Weeks | 1 | High Performance i.MX 8, S32x Processor Based | YES | 2.5V~5.5V | QUAD | NO LEAD | 5V | 0.5mm | 5.5V | 2.5V | 12 | POWER SUPPLY MANAGEMENT CIRCUIT | YES | S-PQCC-N56 | |||||||||||||||||
| MC33FS4503NAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 16 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||
| MC33PF8100EQESR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | 1mm | /files/nxpusainc-mc34pf8100epepr2-datasheets-8462.pdf | 56-VFQFN Exposed Pad | 8mm | 8mm | 56 | 2 Weeks | 1 | High Performance i.MX 8, S32x Processor Based | YES | 2.5V~5.5V | QUAD | NO LEAD | 5V | 0.5mm | 5.5V | 2.5V | 12 | POWER SUPPLY MANAGEMENT CIRCUIT | YES | S-PQCC-N56 | |||||||||||||||||
| MC33FS4500NAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 16 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||
| MC33PF8100CDESR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2 Weeks | ||||||||||||||||||||||||||||||||||||||
| MC33FS8530A1ESR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | 2 Weeks | |||||||||||||||||||||||||||||||||||||||
| MC33FS6522LAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||
| MC34PF8100F3EPR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc34pf8100epepr2-datasheets-8462.pdf | 56-VFQFN Exposed Pad | 2 Weeks | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | POWER SUPPLY MANAGEMENT CIRCUIT | |||||||||||||||||||||||||||||||
| MC35FS4500NAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~150°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc35fs6513cae-datasheets-3127.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||
| MC33FS4501CAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||
| MC33FS6511NAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||
| MC35FS6501CAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~150°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc35fs6513cae-datasheets-3127.pdf | 48-LQFP Exposed Pad | 15 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||
| MC34FS6408NAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | 13mA | ROHS3 Compliant | 2015 | /files/nxpusainc-mc34fs6408nae-datasheets-8518.pdf | 48-LQFP Exposed Pad | 15 Weeks | EAR99 | 8542.39.00.01 | System Basis Chip | 2.7V~36V | NOT SPECIFIED | ETHERNET TRANSCEIVER | NOT SPECIFIED | |||||||||||||||||||||||||
| MC33FS6513CAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||
| MC13892DJVL | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 1.6mm | ROHS3 Compliant | 2004 | 186-LFBGA | 12mm | 12mm | 186 | 12 Weeks | EAR99 | 8542.39.00.01 | 1 | Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply | YES | BOTTOM | BALL | 260 | 3.6V | 0.8mm | MC13892 | 3.6V | 1.8V | 1 | POWER SUPPLY MANAGEMENT CIRCUIT | NOT SPECIFIED | YES | Power Management Circuits | 3.6V | 1.5mA | Not Qualified | S-PBGA-B186 | ||||||||
| MC33FS8510A3ESR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | 2 Weeks | |||||||||||||||||||||||||||||||||||||||
| MC33FS6512LAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||
| MC34PF8100CCEPR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc34pf8100epepr2-datasheets-8462.pdf | 56-VFQFN Exposed Pad | 2 Weeks | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | POWER SUPPLY MANAGEMENT CIRCUIT | |||||||||||||||||||||||||||||||
| MC33FS8510A2ESR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2 Weeks | ||||||||||||||||||||||||||||||||||||||
| MC33PF8100A0ESR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc34pf8100epepr2-datasheets-8462.pdf | 56-VFQFN Exposed Pad | 2 Weeks | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | 260 | POWER SUPPLY MANAGEMENT CIRCUIT | 40 | |||||||||||||||||||||||||||||
| MC33FS6502NAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||
| MC33PF8100CHESR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc34pf8100epepr2-datasheets-8462.pdf | 56-VFQFN Exposed Pad | 2 Weeks | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | POWER SUPPLY MANAGEMENT CIRCUIT | |||||||||||||||||||||||||||||||
| MC35FS4502NAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~150°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc35fs6513cae-datasheets-3127.pdf | 48-LQFP Exposed Pad | 16 Weeks | System Basis Chip | 1V~5V | |||||||||||||||||||||||||||||||
| MC34FS6407NAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | 13mA | ROHS3 Compliant | 2015 | /files/nxpusainc-mc34fs6408nae-datasheets-8518.pdf | 48-LQFP Exposed Pad | 15 Weeks | EAR99 | 8542.39.00.01 | System Basis Chip | 2.7V~36V | NOT SPECIFIED | ETHERNET TRANSCEIVER | NOT SPECIFIED | |||||||||||||||||||||||||
| MC33FS6504LAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||
| MC34PF8100EQEPR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc34pf8100epepr2-datasheets-8462.pdf | 56-VFQFN Exposed Pad | 2 Weeks | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | ||||||||||||||||||||||||||||||||
| MC33VR5500V3ES | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tray | 3 (168 Hours) | 2 Weeks | |||||||||||||||||||||||||||||||||||||||
| MC33FS6510LAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||
| MC34PF8100CHEPR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | /files/nxpusainc-mc34pf8100epepr2-datasheets-8462.pdf | 56-VFQFN Exposed Pad | 2 Weeks | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | POWER SUPPLY MANAGEMENT CIRCUIT |
