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ContactSpecialized Power Management ICs(5989)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Current - Supply | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Number of Terminations | Factory Lead Time | ECCN Code | Additional Feature | HTS Code | Number of Functions | JESD-609 Code | Terminal Finish | Applications | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Telecom IC Type | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Number of Channels | Analog IC - Other Type | Time@Peak Reflow Temperature-Max (s) | Adjustable Threshold | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Interface IC Type | uPs/uCs/Peripheral ICs Type | Driver Number of Bits |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MCZ33800EK | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tube | 3 (168 Hours) | 10mA | 2.45mm | ROHS3 Compliant | /files/nxpusainc-mcz33800ekr2-datasheets-8340.pdf | 54-SSOP (0.295, 7.50mm Width) Exposed Pad | 17.9mm | 7.5mm | 54 | 14 Weeks | EAR99 | ALSO REQUIRES A SUPPLY OF 5V TO 36V | 8542.39.00.01 | 1 | e3 | Matte Tin (Sn) | Automotive | YES | 5V~36V | DUAL | GULL WING | 260 | 5V | 0.65mm | MCZ33800 | 40 | Peripheral Drivers | 3.3/59/18V | Not Qualified | R-PDSO-G54 | INTERFACE CIRCUIT | 8 | ||||||||||||
| MC33FS8530A0ES | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tray | 3 (168 Hours) | 2 Weeks | ||||||||||||||||||||||||||||||||||||||||||||
| MWCT1014SFVLH | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mwct1014sfvlh-datasheets-8764.pdf | 64-LQFP | 15 Weeks | General Purpose | 2.7V~5.5V | MICROCONTROLLER, RISC | ||||||||||||||||||||||||||||||||||||
| MC33PF8100EAES | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | -40°C~105°C TA | Tray | 3 (168 Hours) | /files/nxpusainc-mc33pf8100a0es-datasheets-9400.pdf | 56-VFQFN Exposed Pad | 8 Weeks | High Performance i.MX 8, S32x Processor Based | 2.7V~5.5V | POWER SUPPLY MANAGEMENT CIRCUIT | |||||||||||||||||||||||||||||||||||||
| MC35FS6502CAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~150°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc35fs6513cae-datasheets-3127.pdf | 48-LQFP Exposed Pad | 16 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | |||||||||||||||||||||||||||||||||
| MC34708VKR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | 1.25mm | ROHS3 Compliant | 2011 | /files/nxpusainc-mc34708vm-datasheets-3057.pdf | 206-LFBGA | 8mm | 8mm | 206 | 16 Weeks | EAR99 | 8542.39.00.01 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | General Purpose | YES | 1.8V~4.5V | BOTTOM | BALL | 260 | 3.6V | 0.5mm | MC34708 | 4.5V | 3V | 16 | POWER SUPPLY MANAGEMENT CIRCUIT | 40 | YES | S-PBGA-B206 | |||||||||||||
| MWCT1001A3VLH | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 64-LQFP | 2 Weeks | Automotive, Wireless Power Transmitter | 2.7V~3.6V | ||||||||||||||||||||||||||||||||||||||
| MC33FS8530A1ES | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tray | 3 (168 Hours) | 2 Weeks | ||||||||||||||||||||||||||||||||||||||||||||
| MWCT1213VLL | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tray | 3 (168 Hours) | ROHS3 Compliant | 2 Weeks | |||||||||||||||||||||||||||||||||||||||||||
| MC33PF8100ERES | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | -40°C~105°C TA | Tray | 3 (168 Hours) | /files/nxpusainc-mc33pf8100a0es-datasheets-9400.pdf | 56-VFQFN Exposed Pad | 8 Weeks | High Performance i.MX 8, S32x Processor Based | 2.7V~5.5V | POWER SUPPLY MANAGEMENT CIRCUIT | |||||||||||||||||||||||||||||||||||||
| MC35FS6501NAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~150°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc35fs6513cae-datasheets-3127.pdf | 48-LQFP Exposed Pad | 15 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | |||||||||||||||||||||||||||||||||
| MC33PF8100CDES | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | -40°C~105°C TA | Tray | 3 (168 Hours) | 56-VFQFN Exposed Pad | 8 Weeks | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | |||||||||||||||||||||||||||||||||||||||
| MC34PF8100EPEP | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | -40°C~105°C TA | Tray | 3 (168 Hours) | /files/nxpusainc-mc33pf8100a0es-datasheets-9400.pdf | 56-VFQFN Exposed Pad | 8 Weeks | High Performance i.MX 8, S32x Processor Based | 2.7V~5.5V | POWER SUPPLY MANAGEMENT CIRCUIT | |||||||||||||||||||||||||||||||||||||
| MC34PF8100A0EP | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | /files/nxpusainc-mc33pf8100a0es-datasheets-9400.pdf | 56-VFQFN Exposed Pad | 8 Weeks | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | POWER SUPPLY MANAGEMENT CIRCUIT | |||||||||||||||||||||||||||||||||||||
| MWCT1014SFVLLR | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mwct1014sfvllr-datasheets-8678.pdf | 100-LQFP | 16 Weeks | Automotive, Wireless Power Transmitter | 2.7V~5.5V | MICROCONTROLLER, RISC | ||||||||||||||||||||||||||||||||||||
| MC35FS4501NAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~150°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc35fs6513cae-datasheets-3127.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | |||||||||||||||||||||||||||||||||
| MC33PF8100CEES | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | -40°C~105°C TA | Tray | 3 (168 Hours) | 56-VFQFN Exposed Pad | 8 Weeks | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | |||||||||||||||||||||||||||||||||||||||
| MC35FS6501CAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~150°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc35fs6513cae-datasheets-3127.pdf | 48-LQFP Exposed Pad | 15 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | |||||||||||||||||||||||||||||||||
| MC33FS6512LAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | |||||||||||||||||||||||||||||||||
| MC33FS6504LAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | |||||||||||||||||||||||||||||||||
| MC35FS4503CAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~150°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc35fs6513cae-datasheets-3127.pdf | 48-LQFP Exposed Pad | 14 Weeks | System Basis Chip | 1V~5V | ||||||||||||||||||||||||||||||||||||
| MC34PF8100CHEP | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | /files/nxpusainc-mc33pf8100a0es-datasheets-9400.pdf | 56-VFQFN Exposed Pad | 8 Weeks | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | POWER SUPPLY MANAGEMENT CIRCUIT | |||||||||||||||||||||||||||||||||||||
| MC35FS4503NAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~150°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc35fs6513cae-datasheets-3127.pdf | 48-LQFP Exposed Pad | 16 Weeks | System Basis Chip | 1V~5V | ||||||||||||||||||||||||||||||||||||
| MC34PF8100CFEP | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | -40°C~105°C TA | Tray | 3 (168 Hours) | /files/nxpusainc-mc33pf8100a0es-datasheets-9400.pdf | 56-VFQFN Exposed Pad | 8 Weeks | High Performance i.MX 8, S32x Processor Based | 2.7V~5.5V | POWER SUPPLY MANAGEMENT CIRCUIT | |||||||||||||||||||||||||||||||||||||
| MC35FS6503CAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~150°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc35fs6513cae-datasheets-3127.pdf | 48-LQFP Exposed Pad | 16 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | |||||||||||||||||||||||||||||||||
| MC35FS6512NAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~150°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc35fs6513cae-datasheets-3127.pdf | 48-LQFP Exposed Pad | 16 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | |||||||||||||||||||||||||||||||||
| MC35FS6512CAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~150°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc35fs6513cae-datasheets-3127.pdf | 48-LQFP Exposed Pad | 16 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | |||||||||||||||||||||||||||||||||
| MC34708VMR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | 1.61mm | ROHS3 Compliant | 2011 | /files/nxpusainc-mc34708vm-datasheets-3057.pdf | 206-LFBGA | 13mm | 13mm | 206 | 16 Weeks | EAR99 | 8542.39.00.01 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | General Purpose | YES | 1.8V~4.5V | BOTTOM | BALL | 260 | 3.6V | 0.8mm | MC34708 | 4.5V | 3V | 16 | POWER SUPPLY MANAGEMENT CIRCUIT | 40 | YES | S-PBGA-B206 | |||||||||||||
| MC33PF8200DMESR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc33pf8200dnesr2-datasheets-8638.pdf | 2 Weeks | POWER SUPPLY MANAGEMENT CIRCUIT | |||||||||||||||||||||||||||||||||||||||||
| MC33PF8100EPES | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | -40°C~105°C TA | Tray | 3 (168 Hours) | 1mm | /files/nxpusainc-mc33pf8100a0es-datasheets-9400.pdf | 56-VFQFN Exposed Pad | 8mm | 8mm | 56 | 8 Weeks | 1 | High Performance i.MX 8, S32x Processor Based | YES | 2.7V~5.5V | QUAD | NO LEAD | 5V | 0.5mm | 5.5V | 2.7V | 12 | POWER SUPPLY MANAGEMENT CIRCUIT | YES | S-PQCC-N56 |
