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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Address Bus Width | Organization | Memory Width | Memory Density | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | I/O Type | Standby Voltage-Min | Output Enable |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 70V06S20J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v06s20j8-datasheets-8335.pdf | PLCC | 24mm | 24mm | 3.3V | Contains Lead | 68 | 7 Weeks | 3.6V | 3V | 68 | Parallel | 128 kb | no | 3.63mm | 2 | EAR99 | No | 1 | 200mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 68 | COMMERCIAL | SRAMs | 16kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 14b | 16KX8 | 0.005A | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||
| 70V3399S166BC | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3399s166bc-datasheets-8337.pdf | 17mm | 17mm | 3.3V | Contains Lead | 256 | 16 Weeks | 3.45V | 3.15V | 256 | Parallel | 2.3 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 500mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 1mm | 256 | COMMERCIAL | SRAMs | RAM, SRAM | 3-STATE | 12 ns | 34b | 0.03A | 18b | Synchronous | COMMON | ||||||||||||||||||||||||||
| 70V658S10DR | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 4.1mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v658s10dr-datasheets-8303.pdf | PQFP | 28mm | 28mm | 3.3V | Contains Lead | 208 | 7 Weeks | 3.45V | 3.15V | 208 | Parallel | 2.3 Mb | no | 3.5mm | 2 | No | 1 | 500mA | e0 | Tin/Lead (Sn/Pb) | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 208 | COMMERCIAL | 20 | SRAMs | 256kB | RAM, SDR, SRAM | 3-STATE | 10 ns | 32b | 64KX36 | 0.015A | 36b | Asynchronous | COMMON | |||||||||||||||||||||||
| 70T3319S166BF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3319s166bf-datasheets-8293.pdf | 15mm | 15mm | 2.5V | Contains Lead | 208 | 7 Weeks | 2.6V | 2.4V | 208 | Parallel | 4 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 450mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 0.8mm | 208 | COMMERCIAL | SRAMs | RAM, SRAM | 3-STATE | 12 ns | 36b | 0.015A | 18b | Synchronous | COMMON | ||||||||||||||||||||||||||
| 7005S35G | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 1 (Unlimited) | 70°C | 0°C | CMOS | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7005s35g-datasheets-8255.pdf | 29.46mm | 29.46mm | 5V | Contains Lead | 68 | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 64 kb | no | 3.68mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE | No | 1 | 250mA | e0 | Tin/Lead (Sn/Pb) | PERPENDICULAR | PIN/PEG | 240 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 8kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 26b | 8KX8 | 0.015A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||
| 71V25761S183BG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 183MHz | 2.36mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v25761s183bg8-datasheets-8254.pdf | BGA | 14mm | 22mm | 3.3V | Contains Lead | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | no | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 340mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 119 | COMMERCIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 3.3 ns | 17b | 0.03A | 36b | Synchronous | COMMON | |||||||||||||||||||||||
| IDT71V3556S166BQG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | SYNCHRONOUS | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3556s166bqg8-datasheets-8248.pdf | 165 | 165 | Parallel | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 3.3V | 1mm | COMMERCIAL | SRAMs | 3.3V | 0.35mA | Not Qualified | RAM, SRAM | 3-STATE | 128KX36 | 36 | 4718592 bit | 0.04A | 3.5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||||||||||||
| 7007S20J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7007s20j8-datasheets-8246.pdf | PLCC | 24mm | 24mm | 5V | Contains Lead | 68 | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 256 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 315mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 32kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 15b | 0.015A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||
| 71321LA20PFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71321la20pfg-datasheets-8223.pdf | TQFP | 14mm | 14mm | 5V | Lead Free | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 16 kb | 1.4mm | 2 | No | 200mA | 2kB | SDR | 20 ns | 22b | 8b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||
| 70V658S10BCG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v658s10bcg-datasheets-8205.pdf | 17mm | 17mm | 3.3V | Lead Free | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 2.3 Mb | yes | 1.4mm | 2 | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 1mm | 256 | COMMERCIAL | 30 | SRAMs | 0.5mA | 256kB | RAM, SDR, SRAM | 3-STATE | 10 ns | 16b | 64KX36 | 0.015A | COMMON | |||||||||||||||||||||||||
| 71V65603S150BQI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 150MHz | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v65603s150bqi8-datasheets-8200.pdf | 15mm | 13mm | 3.3V | Contains Lead | 165 | 12 Weeks | 3.465V | 3.135V | 165 | Parallel | 9 Mb | no | 1.2mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 345mA | e0 | TIN LEAD | BOTTOM | BALL | 225 | 3.3V | 165 | INDUSTRIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 3.8 ns | 18b | 256KX36 | 0.06A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||
| 71V3558SA133BQG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3558sa133bqg-datasheets-8198.pdf | 15mm | 13mm | 3.3V | Lead Free | 165 | 11 Weeks | 3.465V | 3.135V | 165 | Parallel | 4.5 Mb | yes | 1.2mm | 1 | No | 1 | 300mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 165 | COMMERCIAL | 30 | SRAMs | 512kB | RAM, SDR, SRAM | 133MHz | 3-STATE | 4.2 ns | 18b | 0.04A | 18b | Synchronous | COMMON | |||||||||||||||||||||||||
| 71256SA20PZG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71256sa20pzg-datasheets-8182.pdf | TSOP | 8mm | 11.8mm | 5V | Lead Free | 28 | 7 Weeks | 5.5V | 4.5V | 28 | Parallel | 256 kb | yes | 1mm | 1 | EAR99 | No | 1 | e3 | Matte Tin (Sn) - annealed | YES | DUAL | GULL WING | 260 | 5V | 0.55mm | 28 | COMMERCIAL | 30 | SRAMs | 5V | 32kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 20 ns | 15b | 32KX8 | COMMON | ||||||||||||||||||||||||||
| IDT70824L20G | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 70°C | 0°C | CMOS | ASYNCHRONOUS | 5.207mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt70824l20g-datasheets-8179.pdf | 27.94mm | 27.94mm | 84 | 84 | Parallel | EAR99 | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn/Pb) | NO | PERPENDICULAR | PIN/PEG | NOT SPECIFIED | 5V | 2.54mm | 84 | COMMERCIAL | 5.5V | 4.5V | NOT SPECIFIED | Other Memory ICs | 5V | 0.33mA | Not Qualified | RAM | 4KX16 | 16 | 65536 bit | 5A | 20 ns | ||||||||||||||||||||||||||||||||
| 71342LA35PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71342la35pf-datasheets-8170.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 32 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 200mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.8mm | 64 | COMMERCIAL | 20 | SRAMs | 5V | 4kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 24b | 4KX8 | 0.0015A | 8b | Asynchronous | COMMON | 2V | ||||||||||||||||||||
| 70V07L25PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v07l25pf-datasheets-8164.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 80 | 7 Weeks | 3.6V | 3V | 80 | Parallel | 256 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | 1 | 140mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 80 | COMMERCIAL | 20 | SRAMs | Not Qualified | 32kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 30b | 0.003A | 8b | Asynchronous | COMMON | 3V | |||||||||||||||||||||
| 70V3389S5BF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 100MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3389s5bf-datasheets-8154.pdf | 15mm | 15mm | 3.3V | Contains Lead | 208 | 7 Weeks | 3.45V | 3.15V | 208 | Parallel | 1.1 Mb | no | 1.4mm | 2 | PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE | No | 1 | 360mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 0.8mm | 208 | COMMERCIAL | 20 | SRAMs | 128kB | RAM, SDR, SRAM | 3-STATE | 5 ns | 32b | 64KX18 | 0.015A | 18b | Synchronous | COMMON | ||||||||||||||||||||||
| IDT7164L25YI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 3.556mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt7164l25yi-datasheets-8145.pdf | 17.9324mm | 7.5184mm | 28 | 28 | Parallel | EAR99 | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | J BEND | 225 | 5V | 1.27mm | 28 | INDUSTRIAL | 5.5V | 4.5V | 30 | SRAMs | 5V | 0.15mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 8KX8 | 8 | 65536 bit | 0.00006A | 25 ns | COMMON | 2V | |||||||||||||||||||||||||||||
| 7142SA55CB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 125°C | -55°C | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7142sa55cb-datasheets-8141.pdf | DIP | 61.72mm | 15.24mm | 5V | Contains Lead | 5.5V | 4.5V | 48 | Parallel | 16 kb | 3.3mm | 2 | No | 190mA | RAM, SRAM | 55 ns | 22b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||
| IDT71V632S8PFG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Tape and Reel | 70°C | 0°C | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v632s8pfg8-datasheets-8142.pdf | TQFP | 3.3V | 3.63V | 3.135V | 100 | Parallel | 2 Mb | 1 | RAM, SRAM | 8 ns | 16b | 32b | Synchronous | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71V25761YSA166BQ | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v25761ysa166bq-datasheets-8138.pdf | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 3.3V | 1mm | 165 | INDUSTRIAL | 3.465V | 3.135V | 20 | SRAMs | 2.53.3V | 0.33mA | Not Qualified | RAM, SRAM | 3-STATE | 128KX36 | 36 | 4718592 bit | 0.035A | 3.5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||
| 71V416L10PHGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v416l10phgi8-datasheets-8101.pdf | TSOP | 18.41mm | 10.16mm | 3.3V | Lead Free | 44 | 12 Weeks | 3.6V | 3V | 44 | Parallel | 4 Mb | yes | 1mm | 1 | No | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 3.3V | 0.8mm | 44 | INDUSTRIAL | 30 | SRAMs | 512kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 10 ns | 18b | 16b | Asynchronous | COMMON | 3V | ||||||||||||||||||||||||||
| 7025L25PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7025l25pf8-datasheets-8075.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 128 kb | 1.4mm | 2 | No | 220mA | 16kB | RAM, SDR, SRAM | 25 ns | 26b | 16b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||
| 7007L35PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7007l35pf-datasheets-8067.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 80 | 7 Weeks | 5.5V | 4.5V | 80 | Parallel | 256 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 255mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.65mm | 80 | COMMERCIAL | 20 | SRAMs | 5V | 32kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 30b | 0.005A | 8b | Asynchronous | COMMON | |||||||||||||||||||||
| 71V65603S150BQ8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 150MHz | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v65603s150bq8-datasheets-8051.pdf | 15mm | 13mm | 3.3V | Contains Lead | 165 | 12 Weeks | 3.465V | 3.135V | 165 | Parallel | 9 Mb | no | 1.2mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 325mA | e0 | TIN LEAD | BOTTOM | BALL | 225 | 3.3V | 165 | COMMERCIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 3.8 ns | 18b | 256KX36 | 0.04A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||
| 70V3389S5BC | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 100MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3389s5bc-datasheets-8045.pdf | 17mm | 17mm | 3.3V | Contains Lead | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 1.1 Mb | no | 1.4mm | 2 | PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE | No | 1 | 360mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 1mm | 256 | COMMERCIAL | SRAMs | 128kB | RAM, SDR, SRAM | 3-STATE | 5 ns | 32b | 64KX18 | 0.015A | 18b | Synchronous | COMMON | |||||||||||||||||||||||
| IDT71V3577S80PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Tape and Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 100MHz | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3577s80pf8-datasheets-8039.pdf | TQFP | 20mm | 3.3V | 100 | 3.465V | 3.135V | 100 | Parallel | 4.5 Mb | 1 | FLOW-THROUGH ARCHITECTURE | not_compliant | 1 | 200mA | e0 | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | COMMERCIAL | 20 | SRAMs | Not Qualified | RAM, SRAM | 3-STATE | 8 ns | 17b | 36 | 0.03A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||||
| IDT71V016SA15Y8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.683mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v016sa15y8-datasheets-8041.pdf | 28.575mm | 10.16mm | 44 | 44 | Parallel | 1 | 3A991.B.2.B | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | J BEND | 225 | 3.3V | 1.27mm | 44 | COMMERCIAL | 3.6V | 3V | 30 | SRAMs | 3.3V | 0.13mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 64KX16 | 16 | 1048576 bit | 0.01A | 15 ns | COMMON | 3.15V | YES | ||||||||||||||||||||||||||
| IDT71V65602S133PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v65602s133pf8-datasheets-8034.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | COMMERCIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.3mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 256KX36 | 36 | 9437184 bit | 0.04A | 4.2 ns | COMMON | 3V | ||||||||||||||||||||||||
| IDT71V25761YSA166BGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 166MHz | SYNCHRONOUS | 2.36mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v25761ysa166bgi8-datasheets-8036.pdf | BGA | 22mm | 14mm | 119 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 3.3V | 1.27mm | 119 | INDUSTRIAL | 3.465V | 3.135V | SRAMs | 2.53.3V | 0.33mA | Not Qualified | RAM, SRAM | 3-STATE | 128KX36 | 36 | 4718592 bit | 0.035A | 3.5 ns | COMMON | 3.14V |
