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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Max Supply Current | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Programming Voltage | Clock Frequency | Address Bus Width | Organization | Memory Width | Memory Density | Standby Current-Max | Word Size | Endurance | Write Cycle Time-Max (tWC) | Access Time (Max) | Sync/Async | Data Polling | Toggle Bit | Page Size | I/O Type | Standby Voltage-Min |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 70V658S12BF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v658s12bf-datasheets-8811.pdf | 15mm | 15mm | 3.3V | Contains Lead | 208 | 7 Weeks | 3.45V | 3.15V | 208 | Parallel | 2.3 Mb | no | 1.4mm | 2 | No | 1 | 465mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 0.8mm | 208 | COMMERCIAL | 20 | SRAMs | 256kB | RAM, SDR, SRAM | 3-STATE | 12 ns | 16b | 64KX36 | 0.015A | 36b | Asynchronous | COMMON | |||||||||||||||||||||||||||||||
| 71V3559S80BQ | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 95MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3559s80bq-datasheets-8809.pdf | 15mm | 13mm | 3.3V | Contains Lead | 165 | 11 Weeks | 3.465V | 3.135V | 165 | Parallel | 4.5 Mb | no | 1.2mm | 1 | No | 250mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 165 | COMMERCIAL | 20 | SRAMs | 512kB | RAM, SDR, SRAM | 100MHz | 3-STATE | 8 ns | 18b | 0.04A | 18b | Synchronous | COMMON | |||||||||||||||||||||||||||||||||
| X28HC64J-90 | Intersil (Renesas Electronics America) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 90GHz | 3.55mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/intersil-x28hc64j90-datasheets-8791.pdf | LCC | 13.97mm | 11.43mm | 5V | Contains Lead | 32 | 32 | Parallel | 64 kb | no | EAR99 | SOFTWARE DATA PROTECTION; 64 BYTE PAGE WRITE; 100 YEARS DATA RETENTION | No | 1 | e0 | Tin/Lead (Sn/Pb) | YES | QUAD | J BEND | 225 | 5V | 1.27mm | 32 | COMMERCIAL | 5V | 0.04mA | 62.5kB | EEPROM | 90 ns | 5V | 8KX8 | 8 | 0.0002A | 1000000 Write/Erase Cycles | 5ms | YES | YES | 64words | ||||||||||||||||||||||||||||||
| 7015S12J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7015s12j-datasheets-8789.pdf | PLCC | 24mm | 24mm | 5V | Contains Lead | 68 | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 72 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | 1 | 325mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | COMMERCIAL | NOT SPECIFIED | SRAMs | 5V | Not Qualified | 9kB | RAM, SDR, SRAM | 3-STATE | 12 ns | 26b | 8KX9 | 0.015A | 9b | Asynchronous | COMMON | ||||||||||||||||||||||||||||
| IDT71V3556S166PFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 166MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3556s166pfi8-datasheets-8766.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.36mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 128KX36 | 36 | 4718592 bit | 0.045A | 3.5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||||||
| 7140SA100P | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 1 (Unlimited) | 70°C | 0°C | CMOS | 5.08mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7140sa100p-datasheets-8750.pdf | PDIP | 61.7mm | 15.24mm | 5V | Contains Lead | 48 | 5.5V | 4.5V | 48 | Parallel | 8 kb | no | 3.8mm | 2 | EAR99 | No | 1 | 155mA | e0 | Tin/Lead (Sn85Pb15) | DUAL | 245 | 5V | 48 | COMMERCIAL | SRAMs | 5V | 1kB | RAM, SDR, SRAM | 3-STATE | 100 ns | 20b | 1KX8 | 0.015A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||||||||||
| 71V124SA12YGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 3.683mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v124sa12ygi-datasheets-8732.pdf | 20.9mm | 10.2mm | 3.3V | Lead Free | 140mA | 32 | 7 Weeks | 3.6V | 3V | 32 | Parallel | 1 Mb | yes | 2.2mm | 1 | No | 1 | 140mA | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 3.3V | 32 | INDUSTRIAL | SRAMs | 128kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 12 ns | 17b | 8b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||||||||||
| 7006L20G | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 1 (Unlimited) | 70°C | 0°C | CMOS | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7006l20g-datasheets-8706.pdf | 29.46mm | 29.46mm | 5V | Contains Lead | 68 | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 128 kb | no | 3.68mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 240mA | e0 | Tin/Lead (Sn/Pb) | PERPENDICULAR | PIN/PEG | 240 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 16kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 28b | 16KX8 | 0.0015A | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||||||||
| 70V9199L7PFG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9199l7pfg8-datasheets-8698.pdf | LQFP | 14mm | 14mm | 3.3V | Lead Free | 100 | 7 Weeks | 100 | Parallel | 1.1 Mb | yes | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | e3 | Matte Tin (Sn) - annealed | YES | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 100 | COMMERCIAL | 3.6V | 3V | 30 | SRAMs | RAM, SRAM | 3-STATE | 83MHz | 34b | 18 ns | COMMON | 3V | ||||||||||||||||||||||||||||||||
| 70V658S12BC | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v658s12bc-datasheets-8696.pdf | 17mm | 17mm | 3.3V | Contains Lead | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 2.3 Mb | no | 1.4mm | 2 | No | 1 | 465mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 1mm | 256 | COMMERCIAL | SRAMs | 256kB | RAM, SDR, SRAM | 3-STATE | 12 ns | 32b | 64KX36 | 0.015A | 36b | Asynchronous | COMMON | |||||||||||||||||||||||||||||||
| 71321SA55J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71321sa55j-datasheets-8672.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 16 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN | No | 1 | 155mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 2kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 22b | 0.015A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||||||||||
| 7140SA55P | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 1 (Unlimited) | 70°C | 0°C | CMOS | 5.08mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7140sa55p-datasheets-8660.pdf | PDIP | 61.7mm | 15.24mm | 5V | Contains Lead | 48 | 5.5V | 4.5V | 48 | Parallel | 8 kb | no | 3.8mm | 2 | EAR99 | No | 1 | 155mA | e0 | Tin/Lead (Sn85Pb15) | DUAL | 245 | 5V | 48 | COMMERCIAL | SRAMs | 5V | 1kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 20b | 1KX8 | 0.015A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||||||||||
| 70T651S15BF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t651s15bf-datasheets-8653.pdf | 15mm | 15mm | 2.5V | Contains Lead | 208 | 7 Weeks | 2.6V | 2.4V | 208 | Parallel | 9 Mb | no | 1.4mm | 2 | No | 1 | 305mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 0.8mm | 208 | COMMERCIAL | SRAMs | 1.1MB | RAM, SDR, SRAM | 3-STATE | 15 ns | 18b | 0.01A | 36b | Asynchronous | COMMON | ||||||||||||||||||||||||||||||||
| 7143LA90GB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 125°C | -55°C | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7143la90gb-datasheets-8648.pdf | 29.46mm | 29.46mm | 5V | Contains Lead | 10 Weeks | 5.5V | 4.5V | 68 | Parallel | 32 kb | 3.68mm | 2 | No | 280mA | RAM, SRAM | 90 ns | 22b | 16b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT45DB011D-SH-T | Microchip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape and Reel | 66MHz | Non-RoHS Compliant | 1997 | https://pdf.utmel.com/r/datasheets/microchip-at45db011dsht-datasheets-8624.pdf | 264B | DataFLASH, FLASH | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 71342LA35J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71342la35j-datasheets-8588.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 32 kb | no | 3.63mm | 2 | EAR99 | No | 1 | 200mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 4kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 24b | 4KX8 | 0.0015A | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||||||||
| 71V65603S150BQ | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 150MHz | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v65603s150bq-datasheets-8577.pdf | 15mm | 13mm | 3.3V | Contains Lead | 165 | 12 Weeks | 3.465V | 3.135V | 165 | Parallel | 9 Mb | no | 1.2mm | 1 | BURST COUNTER | No | 1 | 325mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 165 | COMMERCIAL | 20 | SRAMs | 1.1MB | RAM, SDR, SRAM | 150MHz | 3-STATE | 6.7 ns | 18b | 256KX36 | 0.04A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||||||
| 7008S55PFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 85°C | -40°C | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7008s55pfi8-datasheets-8574.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 512 kb | 1.4mm | 2 | No | 310mA | 64kB | RAM, SDR, SRAM | 55 ns | 32b | 8b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71V3556S166BQGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 166MHz | SYNCHRONOUS | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3556s166bqgi8-datasheets-8567.pdf | 165 | 165 | Parallel | unknown | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 3.3V | 1mm | INDUSTRIAL | SRAMs | 3.3V | 0.36mA | Not Qualified | RAM, SRAM | 3-STATE | 128KX36 | 36 | 4718592 bit | 0.045A | 3.5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||||||||||||||||||
| IDT71V424L15PHI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.2mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v424l15phi8-datasheets-8563.pdf | TSOP | 18.41mm | 10.16mm | 44 | Parallel | 3A991.B.2.A | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | GULL WING | 225 | 3.3V | 0.8mm | 44 | INDUSTRIAL | 3.6V | 3V | 20 | SRAMs | 3.3V | 0.145mA | Not Qualified | R-PDSO-G44 | RAM, SRAM - Asynchronous | 3-STATE | 512KX8 | 8 | 4194304 bit | 0.01A | 15 ns | COMMON | 3V | ||||||||||||||||||||||||||||||||||
| 71V65703S85BQ | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 91MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v65703s85bq-datasheets-8555.pdf | 15mm | 13mm | 3.3V | Contains Lead | 165 | 7 Weeks | 3.465V | 3.135V | 165 | Parallel | 9 Mb | no | 1.2mm | 1 | FLOW-THROUGH ARCHITECTURE | No | 1 | 225mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 165 | COMMERCIAL | 20 | SRAMs | 1.1MB | RAM, SDR, SRAM | 3-STATE | 8.5 ns | 18b | 256KX36 | 0.04A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||||||||
| 7132LA35J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7132la35j-datasheets-8512.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 16 kb | no | 3.63mm | 2 | EAR99 | AUTOMATIC POWER-DOWN | No | 1 | 120mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 2kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 22b | 0.0015A | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||||||||
| TC58NYG1S3HBAI6 | Toshiba |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 85°C | -40°C | CMOS | 1mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/toshiba-tc58nyg1s3hbai6-datasheets-8511.pdf | 8mm | 6.5mm | 1.8V | 67 | 67 | Parallel | 2 Gb | No | 1 | YES | BOTTOM | BALL | 1.8V | 0.8mm | 67 | INDUSTRIAL | 1.95V | 1.7V | EEPROM, NAND | 256MX8 | 8 | 2kB | |||||||||||||||||||||||||||||||||||||||||||||||||
| 71T75802S200PFG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 200MHz | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71t75802s200pfg8-datasheets-8498.pdf | TQFP | 20mm | 14mm | 2.5V | Lead Free | 100 | 8 Weeks | 2.625V | 2.375V | 100 | Parallel | 18 Mb | yes | 1.4mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 275mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 100 | COMMERCIAL | 30 | SRAMs | RAM, SRAM | 3-STATE | 3.2 ns | 20b | 0.04A | 18b | Synchronous | COMMON | 2.38V | |||||||||||||||||||||||||||||
| 709279L12PFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-709279l12pfi8-datasheets-8493.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 512 kb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | INDUSTRIAL | 20 | SRAMs | 5V | 0.305mA | 64kB | RAM, SDR, SRAM | 3-STATE | 12 ns | 50MHz | 30b | 0.005A | COMMON | |||||||||||||||||||||||||||||
| IDT71V3556S166BQGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 166MHz | SYNCHRONOUS | 1.2mm | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3556s166bqgi-datasheets-8478.pdf | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | unknown | 8542.32.00.41 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 1mm | 165 | INDUSTRIAL | 3.465V | 3.135V | 30 | SRAMs | 3.3V | 0.36mA | Not Qualified | RAM, SRAM | 3-STATE | 128KX36 | 36 | 4718592 bit | 0.045A | 3.5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||||||||
| 70T3589S133DR | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | 4.1mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3589s133dr-datasheets-8460.pdf | PQFP | 28mm | 28mm | 2.5V | Contains Lead | 208 | 7 Weeks | 2.6V | 2.4V | 208 | Parallel | 2.3 Mb | no | 3.5mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 370mA | e0 | Tin/Lead (Sn/Pb) | QUAD | GULL WING | 225 | 2.5V | 0.5mm | 208 | COMMERCIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 15 ns | 32b | 64KX36 | 0.015A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||||||
| 7142SA55P | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 70°C | 0°C | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7142sa55p-datasheets-8456.pdf | PDIP | 61.7mm | 15.24mm | 5V | Contains Lead | 5.5V | 4.5V | 48 | Parallel | 16 kb | 3.8mm | 2 | No | 155mA | 2kB | RAM, SDR, SRAM | 55 ns | 22b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 70V05L20PFGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v05l20pfgi-datasheets-8439.pdf | TQFP | 14mm | 14mm | 3.3V | Lead Free | 64 | 7 Weeks | 3.6V | 3V | 64 | Parallel | 64 kb | yes | 1.4mm | 2 | EAR99 | No | 1 | e3 | Matte Tin (Sn) - annealed | YES | QUAD | GULL WING | 260 | 3.3V | 0.8mm | 64 | INDUSTRIAL | 30 | SRAMs | 0.195mA | 8kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 26b | 8KX8 | 0.005A | COMMON | 3V | ||||||||||||||||||||||||||||||
| 70T3339S133BCI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 40MHz | 1.5mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3339s133bci-datasheets-8431.pdf | 17mm | 17mm | 2.5V | Contains Lead | 256 | 7 Weeks | 2.6V | 2.4V | 256 | Parallel | 9 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 450mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 1mm | 256 | INDUSTRIAL | 20 | SRAMs | 1.1MB | RAM, SDR, SRAM | 133MHz | 3-STATE | 15 ns | 19b | 18b | Synchronous | COMMON |
