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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Number of Pins | Interface | Density | Pbfree Code | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Max Power Dissipation | Voltage - Supply | Terminal Position | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Screening Level | Memory Size | Memory Type | Core Architecture | RAM Size | Data Bus Width | Watchdog Timer | Number of Timers/Counters | Number of Programmable I/O | Output Characteristics | Access Time | Programming Voltage | Clock Frequency | Address Bus Width | Memory Format | Memory Interface | Organization | Memory Width | Write Cycle Time - Word, Page | Memory Density | Parallel/Serial | Alternate Memory Width | Standby Current-Max | Word Size | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | I2C Control Byte | Sync/Async | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Reverse Pinout |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 24LC256T-E/ST | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 1 (Unlimited) | CMOS | 1.2mm | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/microchiptechnology-24lc256tisn-datasheets-9944.pdf | 8-TSSOP (0.173, 4.40mm Width) | 4.4mm | 3mm | Lead Free | 8 | 6 Weeks | 8 | I2C, Serial | 256 kb | yes | EAR99 | Tin | No | 1 | 3mA | e3 | 2.5V~5.5V | DUAL | 260 | 0.65mm | 24LC256 | 8 | 5.5V | 2.5V | 40 | 3/5V | 256Kb 32K x 8 | Non-Volatile | 900ns | 400kHz | EEPROM | I2C | 8 | 5ms | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | NO | |||||||||||||||||||||||||||||||||||||
| 93LC76T-I/SN | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 1 (Unlimited) | CMOS | 1.75mm | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/microchiptechnology-93lc86p-datasheets-5863.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.91mm | Lead Free | 8 | 7 Weeks | 8 | Serial | 8 kb | yes | No | 1 | 3mA | e3 | Matte Tin (Sn) | YES | 2.5V~6.0V | DUAL | 260 | 3V | 1.27mm | 93LC76 | 8 | 6V | 2.5V | 40 | 3/5V | 8Kb 1K x 8 512 x 16 | Non-Volatile | 3 μs | 3MHz | EEPROM | SPI | 512X16 | 5ms | 8 | 0.00003A | MICROWIRE | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | ||||||||||||||||||||||||||||||||||||||
| 24AA256-E/SM | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~125°C TA | Tube | 1 (Unlimited) | CMOS | 2.03mm | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/microchiptechnology-24lc256tisn-datasheets-9944.pdf | 8-SOIC (0.209, 5.30mm Width) | 5.26mm | 5.25mm | 8 | 5 Weeks | 8 | I2C, Serial | 256 kb | yes | EAR99 | Tin | No | 1 | e3 | 1.7V~5.5V | DUAL | 260 | 1.27mm | 24AA256 | 8 | 5.5V | 1.7V | 40 | 0.003mA | 256Kb 32K x 8 | Non-Volatile | 900ns | 400kHz | EEPROM | I2C | 8 | 5ms | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | NO | |||||||||||||||||||||||||||||||||||||||
| SST25WF040BT-40I/SN | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SST25 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 1 (Unlimited) | CMOS | 1.75mm | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/microchiptechnology-sst25wf040bt40inp-datasheets-6158.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | 1.8V | 8 | 7 Weeks | 8 | SPI, Serial | 4 Mb | No | 1 | e3 | Matte Tin (Sn) - annealed | YES | 1.65V~1.95V | DUAL | 260 | 1.8V | 1.27mm | SST25WF040 | 1.95V | 1.65V | 40 | 4Mb 512K x 8 | Non-Volatile | 40MHz | FLASH | SPI | 4MX1 | 1 | 1ms | 256B | |||||||||||||||||||||||||||||||||||||||||||||||
| 24AA256-E/P | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Through Hole | -40°C~125°C TA | Tube | 1 (Unlimited) | CMOS | SYNCHRONOUS | 5.334mm | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/microchiptechnology-24lc256tisn-datasheets-9944.pdf | 8-DIP (0.300, 7.62mm) | 9.271mm | 7.62mm | 8 | 7 Weeks | I2C, Serial | yes | EAR99 | Tin | 8542.32.00.51 | 1 | e3 | 1.7V~5.5V | DUAL | NOT APPLICABLE | 2.54mm | 24AA256 | 8 | 5.5V | 1.7V | NOT APPLICABLE | 1.8/5V | 0.003mA | Not Qualified | R-PDIP-T8 | 256Kb 32K x 8 | Non-Volatile | 900ns | 400kHz | EEPROM | I2C | 32KX8 | 8 | 5ms | 262144 bit | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | NO | |||||||||||||||||||||||||||||||||||
| IS25WP016D-JMLE-TR | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 2.65mm | ROHS3 Compliant | 16-SOIC (0.295, 7.50mm Width) | 10.31mm | 7.49mm | 16 | 1 | YES | 1.65V~1.95V | DUAL | NOT SPECIFIED | 1.8V | 1.27mm | 1.95V | 1.65V | NOT SPECIFIED | R-PDSO-G16 | 16Mb 2M x 8 | Non-Volatile | 1.8V | 133MHz | FLASH | SPI - Quad I/O, QPI, DTR | 2MX8 | 8 | 800μs | 16777216 bit | SERIAL | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S25FL064LABBHV033 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | FL-L | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 1.2mm | ROHS3 Compliant | 24-TBGA | 8mm | 6mm | 24 | 13 Weeks | IT ALSO HAVE X1 MEMORY WIDTH | 8542.32.00.51 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | 2.7V~3.6V | BOTTOM | NOT SPECIFIED | 3V | 1mm | 3.6V | 2.7V | NOT SPECIFIED | R-PBGA-B24 | 64Mb 8M x 8 | Non-Volatile | 3V | 108MHz | FLASH | SPI - Quad I/O, QPI | 16MX4 | 4 | 67108864 bit | SERIAL | 2 | |||||||||||||||||||||||||||||||||||||||||||||||||
| 24AA256T-E/SM | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 1 (Unlimited) | CMOS | SYNCHRONOUS | 2.03mm | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/microchiptechnology-24lc256tisn-datasheets-9944.pdf | 8-SOIC (0.209, 5.30mm Width) | 5.26mm | 5.25mm | 8 | 7 Weeks | 8 | I2C, Serial | 256 kb | yes | EAR99 | 1 | e3 | Matte Tin (Sn) | YES | 1.7V~5.5V | DUAL | 260 | 1.27mm | 24AA256 | 8 | 5.5V | 1.7V | 40 | 0.003mA | Not Qualified | 256Kb 32K x 8 | Non-Volatile | 900ns | 400kHz | EEPROM | I2C | 8 | 5ms | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | NO | ||||||||||||||||||||||||||||||||||||||
| SST25VF020B-80-4C-QAE-T | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SST25 | Surface Mount | Surface Mount | 0°C~70°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/microchiptechnology-sst25vf020b804csaet-datasheets-1062.pdf | 8-WDFN Exposed Pad | 3.3V | 8 | 7 Weeks | 8 | SPI, Serial | 2 Mb | yes | 3A991.B.1.A | No | 20mA | e3 | Matte Tin (Sn) - annealed | 2.7V~3.6V | DUAL | 1.27mm | SST25VF020B | 2Mb 256K x 8 | Non-Volatile | 8b | 6 ns | 80MHz | 1b | FLASH | SPI | 8 | 10μs | 0.00002A | 8b | SPI | 100000 Write/Erase Cycles | 100 | HARDWARE/SOFTWARE | Synchronous | |||||||||||||||||||||||||||||||||||||||||||||
| 47L16T-E/ST | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 1 (Unlimited) | EEPROM, SRAM | SYNCHRONOUS | 1.2mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-47l16isn-datasheets-0097.pdf | 8-TSSOP (0.173, 4.40mm Width) | 4.4mm | 3mm | 8 | 6 Weeks | IT ALSO HAS EEPROM BACKUP OF 2K X 8 BITS | 1 | e3 | Matte Tin (Sn) - annealed | YES | 2.7V~3.6V | DUAL | 260 | 3V | 0.65mm | 47L16 | 3.6V | 2.7V | 40 | R-PDSO-G8 | TS 16949 | 16Kb 2K x 8 | Non-Volatile | 400ns | 1MHz | EERAM | I2C | 2KX8 | 8 | 1ms | 16384 bit | |||||||||||||||||||||||||||||||||||||||||||||||||
| 24AA256T-E/ST | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 1 (Unlimited) | CMOS | SYNCHRONOUS | 1.2mm | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/microchiptechnology-24lc256tisn-datasheets-9944.pdf | 8-TSSOP (0.173, 4.40mm Width) | 4.4mm | 3mm | 8 | 6 Weeks | 8 | I2C, Serial | 256 kb | yes | EAR99 | 1 | 3mA | e3 | Matte Tin (Sn) | 1.7V~5.5V | DUAL | 260 | 0.65mm | 24AA256 | 8 | 5.5V | 1.7V | 40 | Not Qualified | 256Kb 32K x 8 | Non-Volatile | 900ns | 400kHz | EEPROM | I2C | 8 | 5ms | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | NO | ||||||||||||||||||||||||||||||||||||||
| SST25VF020-20-4C-QAE | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SST25 | Surface Mount | Surface Mount | 0°C~70°C TA | Tube | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/microchiptechnology-sst25vf020204csaet-datasheets-2060.pdf | 8-WDFN Exposed Pad | 6mm | 3.3V | Lead Free | 8 | 6 Weeks | 8 | SPI, Serial | 2 Mb | yes | 3A991.B.1.A | No | 1 | 10mA | e3 | Matte Tin (Sn) - annealed | 2.7V~3.6V | DUAL | 3V | 1.27mm | SST25VF020 | 8 | 3.6V | 2.7V | 2Mb 256K x 8 | Non-Volatile | 8b | 20 ns | 2.7V | 20MHz | 18b | FLASH | SPI | 2MX1 | 1 | 20μs | 0.000015A | 8b | SPI | 100000 Write/Erase Cycles | 100 | HARDWARE/SOFTWARE | Synchronous | ||||||||||||||||||||||||||||||||||||
| 47L04T-I/ST | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 1 (Unlimited) | EEPROM, SRAM | SYNCHRONOUS | 1.2mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-47l16isn-datasheets-0097.pdf | 8-TSSOP (0.173, 4.40mm Width) | 4.4mm | 3mm | 8 | 6 Weeks | 1 | e3 | Matte Tin (Sn) - annealed | YES | 2.7V~3.6V | DUAL | 260 | 3V | 0.65mm | 47L04 | 3.6V | 2.7V | 40 | R-PDSO-G8 | 4Kb 512 x 8 | Non-Volatile | 400ns | 1MHz | EERAM | I2C | 512X8 | 8 | 1ms | 4096 bit | |||||||||||||||||||||||||||||||||||||||||||||||||||
| DS28E05GB+T | Maxim Integrated | $1.04 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 1 (Unlimited) | CMOS | ASYNCHRONOUS | 0.4mm | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/maximintegrated-ds28e05rt-datasheets-9587.pdf | 2-XDFN | 5mm | 3.5mm | 2 | 6 Weeks | 2 | Serial | yes | 1 | YES | 3V~3.6V | BOTTOM | NOT SPECIFIED | DS28E05 | 3.63V | 1.71V | NOT SPECIFIED | 896b 112 x 8 | Non-Volatile | 2μs | EEPROM | 1-Wire® | 8 | 896 bit | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 93AA76/P | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Through Hole | 0°C~70°C TA | Tube | 1 (Unlimited) | CMOS | 4.32mm | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/microchiptechnology-93aa76sn-datasheets-1636.pdf | 8-DIP (0.300, 7.62mm) | 9.46mm | 7.62mm | Lead Free | 8 | 7 Weeks | 8 | Serial | 8 kb | yes | EAR99 | Tin | No | 1 | 3mA | e3 | 1.8V~6V | DUAL | 3V | 2.54mm | 93AA76 | 8 | 6V | 2/5V | TS 16949 | 8Kb 1K x 8 512 x 16 | Non-Volatile | 3-STATE | 3MHz | EEPROM | SPI | 512X16 | 16 | 5ms | 8 | 0.00003A | MICROWIRE | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | ||||||||||||||||||||||||||||||||||||||
| 24LC128-E/MF | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~125°C TA | Tube | 1 (Unlimited) | CMOS | SYNCHRONOUS | 1mm | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/microchiptechnology-24aa128tisn-datasheets-9540.pdf | 8-VDFN Exposed Pad | 6mm | 5mm | 5V | 8 | 7 Weeks | 8 | I2C, Serial | 128 kb | yes | EAR99 | 1000000 ERASE/WRITE CYCLES, HARDWARE WRITE PROTECT, DATA RETENTION > 200 YEARS | Tin | 1 | 3mA | e3 | 2.5V~5.5V | DUAL | 260 | 4.5V | 1.27mm | 24LC128 | 8 | 40 | Not Qualified | 128Kb 16K x 8 | Non-Volatile | 900ns | 400kHz | EEPROM | I2C | 8 | 5ms | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | ||||||||||||||||||||||||||||||||||||||
| MX25L3255EXCI-10G | Macronix |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MXSMIO™ | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 1.2mm | ROHS3 Compliant | 2009 | https://pdf.utmel.com/r/datasheets/macronix-mx25l3255em2i10g-datasheets-0764.pdf | 24-TBGA, CSPBGA | 8mm | 6mm | Lead Free | 24 | 10 Weeks | SPI, Serial | CAN BE ORGNISED AS 32 MBIT X 1; 4 X 6 BALL ARRAY | 1 | YES | 2.7V~3.6V | BOTTOM | NOT SPECIFIED | 3V | 1mm | 24 | 3.6V | 2.7V | NOT SPECIFIED | R-PBGA-B24 | 32Mb 4M x 8 | Non-Volatile | 2.7V | 104MHz | FLASH | SPI | 8MX4 | 4 | 300μs, 5ms | 33554432 bit | 2 | |||||||||||||||||||||||||||||||||||||||||||||||
| GD25Q64CSIG | GigaDevice Semiconductor (HK) Limited | $0.19 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/gigadevicesemiconductorhklimited-gd25q64cwigr-datasheets-1259.pdf | 8-SOIC (0.209, 5.30mm Width) | 4 Weeks | 2.7V~3.6V | 64Mb 8M x 8 | Non-Volatile | 120MHz | FLASH | SPI - Quad I/O | 50μs, 2.4ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S25FL064LABBHI023 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | FL-L | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 1.2mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/cypresssemiconductor-s25fl064labbhi023-datasheets-3630.pdf | 24-TBGA | 8mm | 6mm | 24 | 13 Weeks | IT ALSO HAVE X1 MEMORY WIDTH | 8542.32.00.51 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | 2.7V~3.6V | BOTTOM | NOT SPECIFIED | 3V | 1mm | 3.6V | 2.7V | NOT SPECIFIED | R-PBGA-B24 | 64Mb 8M x 8 | Non-Volatile | 3V | 108MHz | FLASH | SPI - Quad I/O, QPI | 16MX4 | 4 | 67108864 bit | SERIAL | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||
| S25FL064LABNFV043 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | FL-L | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 0.6mm | ROHS3 Compliant | 8-UDFN Exposed Pad | 4mm | 4mm | 8 | 13 Weeks | IT IS ALSO CONFIGURED AS 64M X 1 | 8542.32.00.51 | 1 | YES | 2.7V~3.6V | DUAL | NOT SPECIFIED | 3V | 0.8mm | 3.6V | 2.7V | NOT SPECIFIED | S-PDSO-N8 | 64Mb 8M x 8 | Non-Volatile | 3V | 108MHz | FLASH | SPI - Quad I/O, QPI | 16MX4 | 4 | 67108864 bit | SERIAL | 2 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| SST25LF020A-33-4I-QAE | Microchip Technology | $1.00 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SST25 | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2011 | https://pdf.utmel.com/r/datasheets/microchiptechnology-sst25lf020a334csae-datasheets-1097.pdf | 8-WDFN Exposed Pad | 6mm | 3.3V | 8 | 6 Weeks | 8 | SPI, Serial | 2 Mb | yes | 3A991.B.1.A | No | 1 | 10mA | e3 | Matte Tin (Sn) - annealed | 3V~3.6V | DUAL | 3.3V | 1.27mm | SST25LF020A | 8 | 3.6V | 3V | 2Mb 256K x 8 | Non-Volatile | 8b | 12 ns | 3V | 33MHz | 1b | FLASH | SPI | 2MX1 | 1 | 20μs | 0.000015A | 8b | SPI | 100000 Write/Erase Cycles | 100 | HARDWARE/SOFTWARE | Synchronous | ||||||||||||||||||||||||||||||||||||
| 25C160T-I/SN | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 1 (Unlimited) | CMOS | 1.75mm | ROHS3 Compliant | 2004 | https://pdf.utmel.com/r/datasheets/microchiptechnology-25lc160ip-datasheets-5425.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.91mm | 5V | Lead Free | 8 | 6 Weeks | 8 | SPI, Serial | 16 kb | yes | No | 1 | 5mA | e3 | Matte Tin (Sn) | YES | 4.5V~5.5V | DUAL | 260 | 5V | 1.27mm | 25C160 | 8 | 40 | 5V | 16Kb 2K x 8 | Non-Volatile | 150 ns | 3MHz | EEPROM | SPI | 8 | 5ms | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | ||||||||||||||||||||||||||||||||||||||||
| S25FL064LABNFV013 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | FL-L | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 0.6mm | ROHS3 Compliant | 8-WFDFN Exposed Pad | 4mm | 4mm | 8 | 13 Weeks | IT ALSO HAVE X1 MEMORY WIDTH | 8542.32.00.51 | 1 | e3 | Matte Tin (Sn) | YES | 2.7V~3.6V | DUAL | NOT SPECIFIED | 3V | 0.8mm | 3.6V | 2.7V | NOT SPECIFIED | S-PDSO-N8 | 64Mb 8M x 8 | Non-Volatile | 3V | 108MHz | FLASH | SPI - Quad I/O, QPI | 16MX4 | 4 | 67108864 bit | SERIAL | 2 | |||||||||||||||||||||||||||||||||||||||||||||||||
| LE25U81AFDW00TWG | ON Semiconductor |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2016 | 26 Weeks | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 25AA640A-E/MS | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C TA | Tube | 1 (Unlimited) | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/microchiptechnology-25lc640atesn-datasheets-0897.pdf | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 7 Weeks | 8 | SPI, Serial | 64 kb | No | e3 | Matte Tin (Sn) - annealed | 1.8V~5.5V | 260 | 25AA640A | 40 | 64Kb 8K x 8 | Non-Volatile | 100 ns | 10MHz | EEPROM | SPI | 5ms | SPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MX25L3255EXDI-10G | Macronix |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MXSMIO™ | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 1.2mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/macronix-mx25l3255em2i10g-datasheets-0764.pdf | 24-TBGA, CSPBGA | 8mm | 6mm | 24 | 10 Weeks | SPI, Serial | CAN BE ORGNISED AS 32 MBIT X 1; 5 X 5 BALL ARRAY | 1 | YES | 2.7V~3.6V | BOTTOM | 260 | 3V | 1mm | 24 | 3.6V | 2.7V | 40 | R-PBGA-B24 | 32Mb 4M x 8 | Non-Volatile | 2.7V | 104MHz | FLASH | SPI | 8MX4 | 4 | 300μs, 5ms | 33554432 bit | 2 | |||||||||||||||||||||||||||||||||||||||||||||||||
| 93C76T-E/SN | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 1 (Unlimited) | CMOS | ROHS3 Compliant | 2004 | https://pdf.utmel.com/r/datasheets/microchiptechnology-93c76esn-datasheets-5362.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 5V | Lead Free | 8 | 6 Weeks | 8 | Serial | 8 kb | yes | EAR99 | Tin | No | 1 | 3mA | e3 | 1W | 4.5V~5.5V | DUAL | 260 | 5V | 93C76 | 8 | 40 | 5V | 8Kb 1K x 8 512 x 16 | Non-Volatile | PIC | 96B | 8b | Yes | 1 | 13 | 2MHz | EEPROM | SPI | 16 | 10ms | 8 | MICROWIRE | 200 | HARDWARE/SOFTWARE | ||||||||||||||||||||||||||||||||||||||
| SST39VF010-70-4C-NHE-T | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SST39 MPF™ | Surface Mount | Surface Mount | 0°C~70°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 3.556mm | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/microchiptechnology-sst39vf010704iwhe-datasheets-0567.pdf | 32-LCC (J-Lead) | 13.97mm | 3.3V | Lead Free | 32 | 7 Weeks | 32 | 1 Mb | yes | 3A991.B.1.A | Tin | No | 1 | 20mA | e3 | 2.7V~3.6V | QUAD | 245 | 3V | 1.27mm | SST39VF010 | 3.6V | 2.7V | 40 | 1Mb 128K x 8 | Non-Volatile | 8b | 70ns | 17b | FLASH | Parallel | 128KX8 | 8 | 20μs | 0.000015A | 8b | Asynchronous | YES | YES | YES | 32 | 4K | ||||||||||||||||||||||||||||||||||||
| 93LC76-I/P | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | -40°C~85°C TA | Tube | 1 (Unlimited) | CMOS | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/microchiptechnology-93lc86p-datasheets-5863.pdf | 8-DIP (0.300, 7.62mm) | 9.46mm | Lead Free | 8 | 7 Weeks | 8 | I2C, SPI, Serial, USART | 8 kb | yes | No | 1 | 3mA | e3 | Matte Tin (Sn) | NO | 1W | 2.5V~6.0V | DUAL | 3V | 2.54mm | 93LC76 | 8 | 6V | 2.5V | 8Kb 1K x 8 512 x 16 | Non-Volatile | PIC | 368B | 8b | Yes | 3 | 22 | 3 μs | 3MHz | EEPROM | SPI | 512X16 | 16 | 5ms | 8 | MICROWIRE | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | ||||||||||||||||||||||||||||||||||||
| 25LC320-E/P | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Through Hole | -40°C~125°C TA | Tube | 1 (Unlimited) | CMOS | 5.33mm | ROHS3 Compliant | 2004 | https://pdf.utmel.com/r/datasheets/microchiptechnology-25c320ip-datasheets-0976.pdf | 8-DIP (0.300, 7.62mm) | 9.27mm | 7.62mm | Lead Free | 8 | 7 Weeks | 8 | SPI, Serial | 32 kb | yes | EAR99 | 1000K ERASE/WRITE CYCLES; DATA RETENTION > 200 YEARS | No | 1 | 5mA | e3 | Matte Tin (Sn) | 2.5V~5.5V | DUAL | 5V | 2.54mm | 25LC320 | 8 | 5.5V | 2.5V | 3/5V | 32Kb 4K x 8 | Non-Volatile | 230 ns | 2MHz | EEPROM | SPI | 8 | 5ms | 0.000001A | SPI | 100000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE |
