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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Max Supply Current | Number of Terminations | Factory Lead Time | Weight | REACH SVHC | Number of Pins | Interface | Density | Pbfree Code | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Voltage - Supply | Terminal Position | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Screening Level | Memory Size | Memory Type | Data Bus Width | Access Time | Programming Voltage | Clock Frequency | Address Bus Width | Memory Format | Memory Interface | Organization | Memory Width | Write Cycle Time - Word, Page | Memory Density | Parallel/Serial | Alternate Memory Width | Standby Current-Max | Word Size | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | I2C Control Byte | Access Time (Max) | Sync/Async | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Ready/Busy | Boot Block | Common Flash Interface | Page Size | Reverse Pinout |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 25AA080-I/SN | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tube | 1 (Unlimited) | CMOS | 1.75mm | ROHS3 Compliant | 2004 | https://pdf.utmel.com/r/datasheets/microchiptechnology-25lc080tisn-datasheets-1161.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.91mm | Lead Free | 8 | 6 Weeks | No SVHC | 8 | SPI, Serial | 8 kb | yes | EAR99 | Tin | No | 1 | 5mA | e3 | YES | 1.8V~5.5V | DUAL | 260 | 2.5V | 1.27mm | 25AA080 | 8 | 5.5V | 40 | 2/5V | 8Kb 1K x 8 | Non-Volatile | 475 ns | 1MHz | EEPROM | SPI | 8 | 5ms | 0.000001A | SPI | 10000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | ||||||||||||||||||||||||||||||||||||||
| 24LC256T-E/MNY | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 1 (Unlimited) | CMOS | SYNCHRONOUS | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/microchiptechnology-24lc256tisn-datasheets-9944.pdf | 8-WFDFN Exposed Pad | 3mm | 2mm | 8 | 6 Weeks | 8 | 1 | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | YES | 2.5V~5.5V | DUAL | 260 | 0.5mm | 24LC256 | 5.5V | 2.5V | 40 | 0.003mA | 256Kb 32K x 8 | Non-Volatile | 900ns | 400kHz | EEPROM | I2C | 8 | 5ms | 262144 bit | SERIAL | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | NO | |||||||||||||||||||||||||||||||||||||||||||
| W25Q64JWSSIQ TR | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | FLASH - NOR | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q64jwssiq-datasheets-2123.pdf | 8-SOIC (0.209, 5.30mm Width) | 12 Weeks | 1.7V~1.95V | 64Mb 8M x 8 | Non-Volatile | 133MHz | FLASH | SPI - Quad I/O | 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 47C16T-E/ST | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 1 (Unlimited) | EEPROM, SRAM | SYNCHRONOUS | 1.2mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-47l16isn-datasheets-0097.pdf | 8-TSSOP (0.173, 4.40mm Width) | 4.4mm | 3mm | 8 | 6 Weeks | IT ALSO HAS EEPROM BACKUP OF 2K X 8 BITS | 1 | e3 | Matte Tin (Sn) - annealed | YES | 4.5V~5.5V | DUAL | 260 | 5V | 0.65mm | 47C16 | 5.5V | 4.5V | 40 | R-PDSO-G8 | TS 16949 | 16Kb 2K x 8 | Non-Volatile | 400ns | 1MHz | EERAM | I2C | 2KX8 | 8 | 1ms | 16384 bit | |||||||||||||||||||||||||||||||||||||||||||||||||
| 93LC86T/SN | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 1 (Unlimited) | CMOS | 1.75mm | ROHS3 Compliant | 2004 | https://pdf.utmel.com/r/datasheets/microchiptechnology-93lc86p-datasheets-5863.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | Lead Free | 8 | 6 Weeks | 8 | Serial | 16 kb | yes | EAR99 | Tin | No | 1 | 3mA | e3 | 2.5V~6.0V | DUAL | 260 | 3V | 1.27mm | 93LC86 | 8 | 6V | 2.5V | 40 | 3/5V | 16Kb 2K x 8 1K x 16 | Non-Volatile | 3 μs | 3MHz | EEPROM | SPI | 1KX16 | 16 | 5ms | 8 | 0.00003A | MICROWIRE | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | ||||||||||||||||||||||||||||||||||||
| 25LC080/P | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | 0°C~70°C TA | Tube | 1 (Unlimited) | CMOS | ROHS3 Compliant | 2004 | https://pdf.utmel.com/r/datasheets/microchiptechnology-25lc080tisn-datasheets-1161.pdf | 8-DIP (0.300, 7.62mm) | 9.27mm | 3.3mm | 6.35mm | 2.5V | Lead Free | 8 | 7 Weeks | No SVHC | 8 | SPI, Serial | 8 kb | yes | EAR99 | DATA RETENTION > 200 YEARS; 4KV ESD PROTECTION; 1M ENDURANCE CYCLES | No | 1 | 5mA | e3 | Matte Tin (Sn) | NO | 2.5V~5.5V | DUAL | 3.3V | 2.54mm | 25LC080 | 8 | 5.5V | 3/5V | 8Kb 1K x 8 | Non-Volatile | 230 ns | 2MHz | EEPROM | SPI | 5ms | 0.000001A | SPI | 10000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | |||||||||||||||||||||||||||||||||||||||
| LE25S80FDTWG | ON Semiconductor |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~90°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | SYNCHRONOUS | 0.85mm | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 1.8V | 8 | 26 Weeks | SPI, Serial | 8 Mb | 1 | e3 | Tin (Sn) | YES | 1.65V~1.95V | DUAL | 1.8V | 1.27mm | 8 | 1.95V | 1.65V | R-PDSO-G8 | 8Mb 1M x 8 | Non-Volatile | 40MHz | 20b | FLASH | SPI | 1MX8 | 8 | 256B | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| 25C160T-E/SN | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 1 (Unlimited) | CMOS | 1.75mm | ROHS3 Compliant | 2004 | https://pdf.utmel.com/r/datasheets/microchiptechnology-25lc160ip-datasheets-5425.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.91mm | 5V | Lead Free | 8 | 6 Weeks | 8 | SPI, Serial | 16 kb | yes | No | 1 | 5mA | e3 | Matte Tin (Sn) | YES | 4.5V~5.5V | DUAL | 260 | 5V | 1.27mm | 25C160 | 8 | 40 | 5V | 16Kb 2K x 8 | Non-Volatile | 150 ns | 3MHz | EEPROM | SPI | 8 | 5ms | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | ||||||||||||||||||||||||||||||||||||||||
| AT25XV041B-SSHV-B | Adesto Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TC | Tube | 1 (Unlimited) | CMOS | SYNCHRONOUS | 1.75mm | ROHS3 Compliant | 2015 | https://pdf.utmel.com/r/datasheets/adestotechnologies-at25xv041bsshvt-datasheets-1601.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.925mm | 3.9mm | 8 | 18 Weeks | SPI, Serial | yes | 1 | YES | 1.65V~4.4V | DUAL | 1.8V | 1.27mm | 4.4V | 1.65V | R-PDSO-G8 | 4Mb 512K x 8 | Non-Volatile | 1.8V | 85MHz | FLASH | SPI | 4MX1 | 1 | 8μs, 2.75ms | 4194304 bit | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q64JWSSIM TR | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | FLASH - NOR | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q64jwssimtr-datasheets-2235.pdf | 8-SOIC (0.209, 5.30mm Width) | 12 Weeks | 1.7V~1.95V | 64Mb 8M x 8 | Non-Volatile | 133MHz | FLASH | SPI - Quad I/O | 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS28E07+T | Maxim Integrated | $1.12 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | -40°C~85°C TA | Tape & Reel (TR) | 1 (Unlimited) | CMOS | ASYNCHRONOUS | ROHS3 Compliant | 2017 | https://pdf.utmel.com/r/datasheets/maximintegrated-ds28e07-datasheets-9489.pdf | TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) | 3 | 10 Weeks | yes | 1 | NO | 3V~5.25V | BOTTOM | NOT SPECIFIED | DS28E07 | 5.25V | 3V | NOT SPECIFIED | O-XBCY-T3 | 1Kb 256 x 4 | Non-Volatile | 2μs | EEPROM | 1-Wire® | 1KX1 | 1 | 1024 bit | SERIAL | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SST25PF020B-80-4C-QAE | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SST25 | Surface Mount | Surface Mount | 0°C~70°C TA | Tube | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/microchiptechnology-sst25pf020b804csae-datasheets-1360.pdf | 8-WDFN Exposed Pad | 6mm | 750μm | 5mm | 12mA | 8 | 7 Weeks | 10.886217mg | No SVHC | 8 | SPI, Serial | 2 Mb | No | 1 | 20mA | e3 | Matte Tin (Sn) - annealed | 2.3V~3.6V | DUAL | 1.27mm | SST25PF020B | 3.6V | 2.3V | 2.5/3.3V | TS 16949 | 2Mb 256K x 8 | Non-Volatile | 8b | 12 ns | 2.7V | 80MHz | 1b | FLASH | SPI | 2MX1 | 10μs | 0.00002A | 8b | SPI | 100000 Write/Erase Cycles | 100 | HARDWARE/SOFTWARE | Synchronous | ||||||||||||||||||||||||||||||||||||
| 25LC640-E/P | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | -40°C~125°C TA | Tube | 1 (Unlimited) | CMOS | 4.32mm | ROHS3 Compliant | 2008 | https://pdf.utmel.com/r/datasheets/microchiptechnology-25lc640tisn-datasheets-9851.pdf | 8-DIP (0.300, 7.62mm) | 9.46mm | 7.62mm | 5V | Lead Free | 8 | 6 Weeks | 8 | SPI, Serial | 64 kb | yes | EAR99 | 1000K ERASE/WRITE CYCLES; DATA RETENTION > 200 YEARS | No | 1 | 5mA | e3 | Matte Tin (Sn) | NO | 2.5V~5.5V | DUAL | 5V | 2.54mm | 25LC640 | 8 | 5V | 64Kb 8K x 8 | Non-Volatile | 150 ns | 3MHz | EEPROM | SPI | 8 | 5ms | 0.000001A | SPI | 100000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | ||||||||||||||||||||||||||||||||||||||||
| MX25L3206EXCI-12G | Macronix |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MX25xxx05/06 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 1.2mm | ROHS3 Compliant | 2011 | https://pdf.utmel.com/r/datasheets/macronix-mx25l3206em2i12g-datasheets-0368.pdf | 24-TBGA, CSPBGA | 8mm | 6mm | 24 | 10 Weeks | SPI, Serial | 1 | YES | 2.7V~3.6V | BOTTOM | NOT SPECIFIED | 3V | 1mm | 3.6V | 2.7V | NOT SPECIFIED | 3/3.3V | 0.025mA | Not Qualified | R-PBGA-B24 | 32Mb 4M x 8 | Non-Volatile | 3.3V | 86MHz | FLASH | SPI | 16MX2 | 2 | 50μs, 3ms | 33554432 bit | 1 | 0.00002A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | ||||||||||||||||||||||||||||||||||||||||||
| MX25R3235FBDIL0 | Macronix | $0.41 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | FLASH - NOR | SYNCHRONOUS | Non-RoHS Compliant | 2017 | https://pdf.utmel.com/r/datasheets/macronix-mx25r3235fm2ih0-datasheets-0362.pdf | 12-UFBGA, WLCSP | Lead Free | 12 | 12 Weeks | IT IS ALSO CONFIGURED AS 32M X 1 | 1 | YES | 1.65V~3.6V | BOTTOM | NOT SPECIFIED | 1.8V | 3.6V | 1.65V | NOT SPECIFIED | R-PBGA-B12 | 32Mb 4M x 8 | Non-Volatile | 1.8V | 80MHz | FLASH | SPI | 8MX4 | 4 | 100μs, 10ms | 33554432 bit | SERIAL | 2 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| S-24CS04AFJ-TB-G | ABLIC U.S.A. Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 1 (Unlimited) | CMOS | SYNCHRONOUS | 1.75mm | RoHS Compliant | https://pdf.utmel.com/r/datasheets/ablicusainc-s24cs01afttbg-datasheets-9774.pdf | 8-SOIC (0.154, 3.90mm Width) | 5.02mm | 3.9mm | 8 | EAR99 | 8542.32.00.51 | 1 | e6/e2 | TIN BISMUTH/TIN SILVER | YES | 1.8V~5.5V | DUAL | 260 | 5V | 1.27mm | 8 | 5.5V | 2.7V | 10 | 2/5V | 0.004mA | Not Qualified | R-PDSO-G8 | 4Kb 512 x 8 | Non-Volatile | 900ns | 400kHz | EEPROM | I2C | 512X8 | 8 | 10ms | 4096 bit | SERIAL | 0.000002A | I2C | 1000000 Write/Erase Cycles | 10ms | 10 | HARDWARE | 1010DDMR | |||||||||||||||||||||||||||||||||||||||
| 25LC128T-I/SM | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 1 (Unlimited) | CMOS | 2.03mm | ROHS3 Compliant | 2011 | https://pdf.utmel.com/r/datasheets/microchiptechnology-25aa128tist-datasheets-1984.pdf | 8-SOIC (0.209, 5.30mm Width) | 5.26mm | 5.25mm | 8 | 5 Weeks | 8 | SPI, Serial | 128 kb | EAR99 | No | 1 | 5mA | e3 | Matte Tin (Sn) | 2.5V~5.5V | DUAL | 260 | 5V | 1.27mm | 25LC128 | 8 | 5.5V | 2.5V | 40 | 3/5V | 128Kb 16K x 8 | Non-Volatile | 50 ns | 10MHz | EEPROM | SPI | 8 | 5ms | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | ||||||||||||||||||||||||||||||||||||||||
| DS28E10R+T | Maxim Integrated | $1.24 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 1 (Unlimited) | EPROM - OTP | 1.12mm | ROHS3 Compliant | 2011 | https://pdf.utmel.com/r/datasheets/maximintegrated-ds28e10rt-datasheets-2182.pdf | TO-236-3, SC-59, SOT-23-3 | 2.92mm | 3 | 6 Weeks | 3 | yes | EAR99 | No | 1 | e3 | Matte Tin (Sn) | YES | 2.8V~3.6V | DUAL | 0.95mm | DS28E10 | 3 | 2.8V | 224b 28 x 8 | Non-Volatile | EPROM | 1-Wire® | 64X1 | 1 | 64 bit | SERIAL | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| 25C160-I/P | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | -40°C~85°C TA | Tube | 1 (Unlimited) | CMOS | 4.32mm | ROHS3 Compliant | 2004 | https://pdf.utmel.com/r/datasheets/microchiptechnology-25lc160ip-datasheets-5425.pdf | 8-DIP (0.300, 7.62mm) | 9.46mm | 7.62mm | 5V | Lead Free | 8 | 7 Weeks | 8 | SPI, Serial | 16 kb | yes | No | 1 | 5mA | e3 | Matte Tin (Sn) | NO | 4.5V~5.5V | DUAL | 5V | 2.54mm | 25C160 | 8 | 5V | 16Kb 2K x 8 | Non-Volatile | 150 ns | 3MHz | EEPROM | SPI | 8 | 5ms | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | ||||||||||||||||||||||||||||||||||||||||||
| W25Q32JVTBIQ TR | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q32jvssiqtr-datasheets-9691.pdf | 24-TBGA | 10 Weeks | 2.7V~3.6V | 32Mb 4M x 8 | Non-Volatile | 133MHz | FLASH | SPI - Quad I/O | 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SST26WF080BT-104I/SN | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SST26 SQI® | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 1 (Unlimited) | CMOS | SYNCHRONOUS | 1.75mm | ROHS3 Compliant | 2014 | https://pdf.utmel.com/r/datasheets/microchiptechnology-sst26wf040bt104inp-datasheets-2144.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | 8 | 7 Weeks | SPI | 1 | e3 | Matte Tin (Sn) - annealed | YES | 1.65V~1.95V | DUAL | 260 | 1.8V | 1.27mm | SST26WF080 | 1.95V | 1.65V | 40 | R-PDSO-G8 | TS 16949 | 8Mb 1M x 8 | Non-Volatile | 1.8V | 104MHz | FLASH | SPI - Quad I/O | 80MX1 | 1 | 1.5ms | 83886080 bit | SERIAL | ||||||||||||||||||||||||||||||||||||||||||||||
| W25Q32JVTCIQ TR | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2014 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q32jvssiqtr-datasheets-9691.pdf | 24-TBGA | 10 Weeks | 2.7V~3.6V | 32Mb 4M x 8 | Non-Volatile | 133MHz | FLASH | SPI - Quad I/O | 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S29AL016J70FFI023 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | AL-J | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | ASYNCHRONOUS | 1.4mm | ROHS3 Compliant | 2015 | https://pdf.utmel.com/r/datasheets/cypresssemiconductorcorp-s29al016j70tfi010-datasheets-7996.pdf | 64-LBGA | 9mm | 9mm | 64 | 18 Weeks | 64 | EAR99 | BOTTOM BOOT BLOCK | 8542.32.00.51 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | 2.7V~3.6V | BOTTOM | 260 | 3V | 1mm | 3.6V | 2.7V | 40 | 3/3.3V | 0.03mA | Not Qualified | 16Mb 2M x 8 1M x 16 | Non-Volatile | 3V | FLASH | Parallel | 1MX16 | 16 | 70ns | 16777216 bit | 8 | 0.000005A | 70 ns | YES | YES | YES | 12131 | YES | BOTTOM | YES | |||||||||||||||||||||||||||||||||||
| IS25WP016D-JMLE-TR | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 2.65mm | ROHS3 Compliant | 16-SOIC (0.295, 7.50mm Width) | 10.31mm | 7.49mm | 16 | 1 | YES | 1.65V~1.95V | DUAL | NOT SPECIFIED | 1.8V | 1.27mm | 1.95V | 1.65V | NOT SPECIFIED | R-PDSO-G16 | 16Mb 2M x 8 | Non-Volatile | 1.8V | 133MHz | FLASH | SPI - Quad I/O, QPI, DTR | 2MX8 | 8 | 800μs | 16777216 bit | SERIAL | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S25FL064LABBHV033 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | FL-L | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 1.2mm | ROHS3 Compliant | 24-TBGA | 8mm | 6mm | 24 | 13 Weeks | IT ALSO HAVE X1 MEMORY WIDTH | 8542.32.00.51 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | 2.7V~3.6V | BOTTOM | NOT SPECIFIED | 3V | 1mm | 3.6V | 2.7V | NOT SPECIFIED | R-PBGA-B24 | 64Mb 8M x 8 | Non-Volatile | 3V | 108MHz | FLASH | SPI - Quad I/O, QPI | 16MX4 | 4 | 67108864 bit | SERIAL | 2 | |||||||||||||||||||||||||||||||||||||||||||||||||
| 24AA256T-E/SM | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 1 (Unlimited) | CMOS | SYNCHRONOUS | 2.03mm | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/microchiptechnology-24lc256tisn-datasheets-9944.pdf | 8-SOIC (0.209, 5.30mm Width) | 5.26mm | 5.25mm | 8 | 7 Weeks | 8 | I2C, Serial | 256 kb | yes | EAR99 | 1 | e3 | Matte Tin (Sn) | YES | 1.7V~5.5V | DUAL | 260 | 1.27mm | 24AA256 | 8 | 5.5V | 1.7V | 40 | 0.003mA | Not Qualified | 256Kb 32K x 8 | Non-Volatile | 900ns | 400kHz | EEPROM | I2C | 8 | 5ms | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | NO | ||||||||||||||||||||||||||||||||||||||
| SST25VF020B-80-4C-QAE-T | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SST25 | Surface Mount | Surface Mount | 0°C~70°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/microchiptechnology-sst25vf020b804csaet-datasheets-1062.pdf | 8-WDFN Exposed Pad | 3.3V | 8 | 7 Weeks | 8 | SPI, Serial | 2 Mb | yes | 3A991.B.1.A | No | 20mA | e3 | Matte Tin (Sn) - annealed | 2.7V~3.6V | DUAL | 1.27mm | SST25VF020B | 2Mb 256K x 8 | Non-Volatile | 8b | 6 ns | 80MHz | 1b | FLASH | SPI | 8 | 10μs | 0.00002A | 8b | SPI | 100000 Write/Erase Cycles | 100 | HARDWARE/SOFTWARE | Synchronous | |||||||||||||||||||||||||||||||||||||||||||||
| 47L16T-E/ST | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 1 (Unlimited) | EEPROM, SRAM | SYNCHRONOUS | 1.2mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-47l16isn-datasheets-0097.pdf | 8-TSSOP (0.173, 4.40mm Width) | 4.4mm | 3mm | 8 | 6 Weeks | IT ALSO HAS EEPROM BACKUP OF 2K X 8 BITS | 1 | e3 | Matte Tin (Sn) - annealed | YES | 2.7V~3.6V | DUAL | 260 | 3V | 0.65mm | 47L16 | 3.6V | 2.7V | 40 | R-PDSO-G8 | TS 16949 | 16Kb 2K x 8 | Non-Volatile | 400ns | 1MHz | EERAM | I2C | 2KX8 | 8 | 1ms | 16384 bit | |||||||||||||||||||||||||||||||||||||||||||||||||
| 24AA256T-E/ST | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 1 (Unlimited) | CMOS | SYNCHRONOUS | 1.2mm | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/microchiptechnology-24lc256tisn-datasheets-9944.pdf | 8-TSSOP (0.173, 4.40mm Width) | 4.4mm | 3mm | 8 | 6 Weeks | 8 | I2C, Serial | 256 kb | yes | EAR99 | 1 | 3mA | e3 | Matte Tin (Sn) | 1.7V~5.5V | DUAL | 260 | 0.65mm | 24AA256 | 8 | 5.5V | 1.7V | 40 | Not Qualified | 256Kb 32K x 8 | Non-Volatile | 900ns | 400kHz | EEPROM | I2C | 8 | 5ms | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | NO | ||||||||||||||||||||||||||||||||||||||
| SST25VF020-20-4C-QAE | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SST25 | Surface Mount | Surface Mount | 0°C~70°C TA | Tube | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/microchiptechnology-sst25vf020204csaet-datasheets-2060.pdf | 8-WDFN Exposed Pad | 6mm | 3.3V | Lead Free | 8 | 6 Weeks | 8 | SPI, Serial | 2 Mb | yes | 3A991.B.1.A | No | 1 | 10mA | e3 | Matte Tin (Sn) - annealed | 2.7V~3.6V | DUAL | 3V | 1.27mm | SST25VF020 | 8 | 3.6V | 2.7V | 2Mb 256K x 8 | Non-Volatile | 8b | 20 ns | 2.7V | 20MHz | 18b | FLASH | SPI | 2MX1 | 1 | 20μs | 0.000015A | 8b | SPI | 100000 Write/Erase Cycles | 100 | HARDWARE/SOFTWARE | Synchronous |
