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ContactApplication Specific Microcontrollers(1956)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Number of Pins | Interface | Lifecycle Status | Pbfree Code | Thickness | Contact Plating | Radiation Hardening | Max Frequency | HTS Code | Number of Functions | JESD-609 Code | Terminal Finish | Applications | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Telecom IC Type | Analog IC - Other Type | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | JESD-30 Code | Supplier Device Package | Number of I/O | Memory Type | Core Architecture | RAM Size | Data Bus Width | uPs/uCs/Peripheral ICs Type | Bit Size | Number of Timers/Counters | Bus Compatibility | Max I/O Voltage | Core Processor | Program Memory Type | Programmable Logic Type | Controller Series |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| A7102CGHN1/T0B041J | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~90°C TA | Tape & Reel (TR) | 2011 | 32-VFQFN Exposed Pad | I2C | Authentication | 1.62V~3.6V | MX51 | EEPROM (20kB) | A710x | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7102CGUK/T0B0494Z | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~90°C TA | Tape & Reel (TR) | 2011 | 12-UFBGA, WLCSP | 16 Weeks | I2C | Authentication | 1.62V~3.6V | MX51 | EEPROM (20kB) | A710x | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| PM5981B-FEI | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | ROHS3 Compliant | 1932 | 5 Weeks | 1 | YES | BOTTOM | BALL | TELECOM CIRCUIT | S-PBGA-B1932 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| WP3161W6NFEI-320B1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | RoHS Compliant | /files/microsemicorporation-wp3260w2efei400b2-datasheets-3005.pdf | 896-BGA, FCBGA | 8 Weeks | I2C, RMII, UART | Network Processor | 896-FCBGA (31x31) | MIPS32® 34Kc™ | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| WP3160W6NFEI-320B1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | RoHS Compliant | 896-BGA, FCBGA | 7 Weeks | I2C, RMII, UART | Network Processor | MIPS32® 34Kc™ | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| WP3232M6NFEI-320B2 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | RoHS Compliant | /files/microsemicorporation-wp3260w2efei400b2-datasheets-3005.pdf | 896-BGA, FCBGA | 8 Weeks | I2C, RMII, UART | Network Processor | MIPS32® 34Kc™ | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7002CGHN1/T1AG502 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~90°C | 2011 | 32-VFQFN Exposed Pad | I2C | Authentication | 1.62V~5.5V | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| WP33C2D4NFEI-450B2 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | RoHS Compliant | /files/microsemicorporation-wp3260w2efei400b2-datasheets-3005.pdf | 896-BGA, FCBGA | 6 Weeks | I2C, RMII, UART | Network Processor | MIPS32® 34Kc™ | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| WP33C2A1EFEI-450B2 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | RoHS Compliant | /files/microsemicorporation-wp3260w2efei400b2-datasheets-3005.pdf | 896-BGA, FCBGA | 6 Weeks | I2C, RMII, UART | Network Processor | MIPS32® 34Kc™ | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| WP34C2R4EFEI-400B2 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | RoHS Compliant | /files/microsemicorporation-wp3260w2efei400b2-datasheets-3005.pdf | 896-BGA, FCBGA | 8 Weeks | I2C, RMII, UART | Network Processor | MIPS32® 34Kc™ | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| WP32C2M6NHEI-400B2 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | RoHS Compliant | /files/microsemicorporation-wp3260w2efei400b2-datasheets-3005.pdf | 896-BGA, FCBGA | 8 Weeks | I2C, RMII, UART | Network Processor | MIPS32® 34Kc™ | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| WP3160W3NFEI-320B1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | RoHS Compliant | /files/microchiptechnology-wp3160w3nfei320b1-datasheets-3685.pdf | 896-BGA, FCBGA | I2C, RMII, UART | Network Processor | MIPS32® 34Kc™ | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7002CIHN1/T1AGBEL | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~90°C | 2011 | 32-VFQFN Exposed Pad | 14 Weeks | I2C | Authentication | 1.62V~5.5V | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| WIN847W6NHEI-250A1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | RoHS Compliant | 18 Weeks | Ethernet, PCI, SPI, USB | Network Processor | MIPS32® 24Kc™ | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| WP32C2W3EFEI-320B2 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | RoHS Compliant | /files/microsemicorporation-wp3260w2efei400b2-datasheets-3005.pdf | 896-BGA, FCBGA | 8 Weeks | I2C, RMII, UART | Network Processor | MIPS32® 34Kc™ | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7102CGTK2/T0B042J | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~90°C TA | Tape & Reel (TR) | 2011 | 8-VDFN Exposed Pad | I2C | Authentication | 1.62V~3.6V | MX51 | EEPROM (20kB) | A710x | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7005CGHN1/T1AGBFJ | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~85°C TA | Tape & Reel (TR) | 2011 | 32-VFQFN Exposed Pad | 26 Weeks | I2C | Authentication | 1.62V~5.5V | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| WP34C2R6NFEI450B2R | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | RoHS Compliant | 1997 | /files/microsemicorporation-wp3260w2efei400b2-datasheets-3005.pdf | 896-BGA, FCBGA | 6 Weeks | I2C, RMII, UART | Network Processor | MIPS32® 34Kc™ | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7101CGHN1/T0B0406 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~90°C TA | Tape & Reel (TR) | 2011 | 32-VFQFN Exposed Pad | 20 Weeks | I2C | Authentication | 1.62V~3.6V | MX51 | EEPROM (20kB) | A710x | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| WP3232M5NHEI-320B2 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | RoHS Compliant | /files/microsemicorporation-wp3260w2efei400b2-datasheets-3005.pdf | 896-BGA, FCBGA | 8 Weeks | I2C, RMII, UART | Network Processor | MIPS32® 34Kc™ | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7004CGHN1/T1AGBEL | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~90°C TA | 2011 | 32-VFQFN Exposed Pad | I2C | Authentication | 1.62V~5.5V | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| WIN867M6NHEI-300A1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | RoHS Compliant | 18 Weeks | Ethernet, PCI, SPI, USB | Network Processor | MIPS32® 24Kc™ | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MM912H634DM1AER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2010 | 48-LQFP Exposed Pad | 16 Weeks | LIN, SCI | e3 | Matte Tin (Sn) | Automotive | 2.25V~5.5V | 260 | MM912H634 | ANALOG CIRCUIT | 40 | 9 | 6K x 8 | S12 | FLASH (64kB) | HCS12 | |||||||||||||||||||||||||||||||||||||||||||
| PM5990B-FEI | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | ROHS3 Compliant | 1932 | 3 Weeks | 1 | Network Processor | YES | BOTTOM | BALL | TELECOM CIRCUIT | S-PBGA-B1932 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PM5441A-FEI | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | ROHS3 Compliant | 2 Weeks | Network Processor | OTN | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7101CGUK/T0B0407, | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~90°C TA | Tape & Reel (TR) | 2011 | 12-UFBGA, WLCSP | 16 Weeks | I2C | Authentication | 1.62V~3.6V | MX51 | EEPROM (20kB) | A710x | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| NS7520B-1-I55 | Digi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | NET+ARM® | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | RoHS Compliant | 2006 | /files/digi-ns7520b1i55-datasheets-3607.pdf | 177-LFBGA | 1.5V | Lead Free | 177 | 9 Weeks | 177 | EBI/EMI, Ethernet, DMA, SPI, UART | No | 55MHz | 8542.39.00.01 | Network Processor | 1.4V~3.6V | BOTTOM | BALL | 0.8mm | Field Programmable Gate Arrays | 1.53.3V | 16 | External Program Memory | ARM | External | 32b | 3.6V | ARM7® | External Program Memory | FIELD PROGRAMMABLE GATE ARRAY | ||||||||||||||||||||||||||||||
| WP3161D4NFEI-400B1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | RoHS Compliant | 896-BGA, FCBGA | 8 Weeks | I2C, RMII, UART | Network Processor | MIPS32® 34Kc™ | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CP3SP33SMS/NOPB | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 224-LFBGA | 13mm | 1.4mm | 13mm | 3.6V | Lead Free | 224 | 6 Weeks | 224 | ACCESS.bus, Audio, Bluetooth, CAN, EBI/EMI, I2S, Microwire/SPI, UART/USART, USB OTG | ACTIVE (Last Updated: 1 week ago) | yes | 1.4mm | Copper, Silver, Tin | No | 96MHz | e0 | Tin/Lead (Sn/Pb) | Connectivity Processor | 3V~3.3V | BOTTOM | BALL | 260 | 1.8V | 0.8mm | CP3SP33 | 224 | Microcontrollers | 1.8V | 200mA | 64 | Cache, External Program Memory, RAM | RISC | 44K x 8 | 32b | MICROPROCESSOR CIRCUIT | 16 | 5 | I2C; I2S; SPI; UART; USB | CR16C | External Program Memory | CP3000 | ||||||||||||||||
| A7101CGT1/T0B0408, | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~90°C TA | Tape & Reel (TR) | 1 (Unlimited) | 2011 | 8-SOIC (0.154, 3.90mm Width) | I2C | Authentication | 1.62V~3.6V | MX51 | EEPROM (20kB) | A710x |
