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ContactApplication Specific Microcontrollers(1956)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Weight | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | ECCN Code | Reach Compliance Code | HTS Code | Number of Functions | JESD-609 Code | Terminal Finish | Applications | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Telecom IC Type | Analog IC - Other Type | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Supplier Device Package | Screening Level | Number of I/O | Memory Type | Core Architecture | RAM Size | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | ROM Programmability | Number of Timers/Counters | On Chip Program ROM Width | ROM (words) | Access Time | Clock Frequency | Address Bus Width | External Data Bus Width | Core Processor | Program Memory Type | Controller Series |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MM912F634DV1AER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2010 | /files/nxpusainc-mm912f634bv1aer2-datasheets-3202.pdf | 48-LQFP Exposed Pad | 7mm | 7mm | 48 | 16 Weeks | LIN, SCI | e3 | Matte Tin (Sn) | Automotive | YES | 2.25V~5.5V | QUAD | GULL WING | 260 | 7V | 0.5mm | MM912F634 | 40 | S-PQFP-G48 | 9 | 2K x 8 | MICROPROCESSOR CIRCUIT | S12 | FLASH (32KB) | HCS12 | |||||||||||||||||||||||||||||||||||||||||||
| CY7C68013-56PVC | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | EZ-USB FX2LP™ | Surface Mount | Surface Mount | 0°C~70°C | Tube | 3 (168 Hours) | CMOS | 48MHz | 2.794mm | Non-RoHS Compliant | 2003 | /files/cypresssemiconductorcorp-cy7c6801356pvc-datasheets-3844.pdf | 56-BSSOP (0.295, 7.50mm Width) | 18.796mm | 7.5057mm | 3.3V | Contains Lead | 56 | 56 | I2C, USB, USART | not_compliant | e0 | Tin/Lead (Sn/Pb) | USB Microcontroller | 3V~3.6V | DUAL | GULL WING | 220 | 3.3V | CY7C68013 | 56 | NOT SPECIFIED | Microcontrollers | 260mA | Not Qualified | 24 | 16K x 8 | 8 | NO | NO | NO | NO | EEPROM | 3 | 48 μs | 16 | 8 | 8051 | ROMless | CY7C680xx | |||||||||||||||||||||||||||
| MM912G634DM1AE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2010 | 48-LQFP Exposed Pad | 16 Weeks | LIN, SCI | e3 | Matte Tin (Sn) | Automotive | 2.25V~5.5V | 260 | MM912G634 | ANALOG CIRCUIT | 40 | 9 | 2K x 8 | S12 | FLASH (48kB) | HCS12 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CY7C63221A-PC | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | enCoRe™ | Through Hole | Through Hole | 0°C~70°C | Tube | 3 (168 Hours) | CMOS | 12MHz | Non-RoHS Compliant | 1997 | /files/cypresssemiconductorcorp-cy7c63221apc-datasheets-3858.pdf | 16-DIP (0.300, 7.62mm) | 19.177mm | 7.62mm | Contains Lead | 16 | 16 | USB | not_compliant | e0 | Tin/Lead (Sn/Pb) | USB Microcontroller | 3.5V~5.5V | DUAL | NOT SPECIFIED | 5V | 2.54mm | CY7C63221 | 16 | NOT SPECIFIED | Microcontrollers | 5V | 25mA | Not Qualified | 8 | OTP | M8C | 96 x 8 | MICROCONTROLLER, RISC | 8 | NO | NO | NO | NO | 3072 | 12 μs | M8B | OTP (3kB) | CY7C632xx | ||||||||||||||||||||||||||||
| CYPD1122-40LQXI | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | EZ-PD™ CCG1 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 0.6mm | ROHS3 Compliant | 2015 | /files/cypresssemiconductorcorp-cypd110335fnxit-datasheets-1908.pdf | 40-UFQFN Exposed Pad | 6mm | 6mm | 40 | 7 Weeks | I2C, SPI, UART/USART, USB | 3A991.A.3 | 8542.39.00.01 | USB Type C | YES | 1.71V~5.5V | QUAD | NO LEAD | 3.3V | 0.5mm | S-XQCC-N40 | 34 | FLASH | ARM | 4K x 8 | MICROPROCESSOR CIRCUIT | ARM® Cortex®-M0 | FLASH (32KB) | ||||||||||||||||||||||||||||||||||||||||||||
| WIN860M6NHEI-300A1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | RoHS Compliant | 18 Weeks | Ethernet, PCI, SPI, USB | Network Processor | MIPS32® 24Kc™ | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7005CGHN1/T1AGBEL | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~85°C TA | 2011 | 32-VFQFN Exposed Pad | 22 Weeks | I2C | Authentication | 1.62V~5.5V | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CY7C63743C-QXC | Rochester Electronics, LLC |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | enCoRe™ | Surface Mount | 0°C~70°C | Tube | 1 (Unlimited) | ROHS3 Compliant | /files/rochesterelectronicsllc-cy7c63743cqxc-datasheets-3739.pdf | 24-SSOP (0.154, 3.90mm Width) | PS/2, USB | USB Microcontroller | 3.5V~5.5V | 24-QSOP | 16 | 256 x 8 | M8B | OTP (8kB) | CY7C637xx | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| WIN867W6NHEI-350A1 | Microsemi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | RoHS Compliant | 8 Weeks | Ethernet, PCI, SPI, USB | Network Processor | MIPS32® 24Kc™ | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7002CMHN1/T1AGBEL | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | -40°C~90°C | Tape & Reel (TR) | 1 (Unlimited) | ROHS3 Compliant | 2011 | /files/nxpusainc-a7001aghn1t1ag315-datasheets-3241.pdf | 25 Weeks | I2C, 2-Wire Serial | Authentication | 1.62V~5.5V | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7001CUHN1/T1AAKEL | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ROHS3 Compliant | 26 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MM912F634DV2AER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2010 | /files/nxpusainc-mm912f634bv1aer2-datasheets-3202.pdf | 48-LQFP Exposed Pad | 7mm | 7mm | 48 | 16 Weeks | LIN, SCI | e3 | Matte Tin (Sn) | Automotive | YES | 2.25V~5.5V | QUAD | GULL WING | 260 | 7V | 0.5mm | MM912F634 | 40 | S-PQFP-G48 | 9 | 2K x 8 | MICROPROCESSOR CIRCUIT | S12 | FLASH (32KB) | HCS12 | |||||||||||||||||||||||||||||||||||||||||||
| A7004CIHN1/T1AGBAJ | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~90°C TA | Tape & Reel (TR) | 2011 | 32-VFQFN Exposed Pad | I2C | Authentication | 1.62V~5.5V | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MM912F634DV2AE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2010 | /files/nxpusainc-mm912f634bv1aer2-datasheets-3202.pdf | 48-LQFP Exposed Pad | 7mm | 7mm | 48 | 16 Weeks | LIN, SCI | e3 | Matte Tin (Sn) | Automotive | YES | 2.25V~5.5V | QUAD | GULL WING | 260 | 7V | 0.5mm | MM912F634 | 40 | S-PQFP-G48 | 9 | 2K x 8 | MICROPROCESSOR CIRCUIT | S12 | FLASH (32KB) | HCS12 | |||||||||||||||||||||||||||||||||||||||||||
| MM912H634DV1AER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2010 | 48-LQFP Exposed Pad | 16 Weeks | LIN, SCI | e3 | Matte Tin (Sn) | Automotive | 2.25V~5.5V | 260 | MM912H634 | ANALOG CIRCUIT | 40 | 9 | 6K x 8 | S12 | FLASH (64kB) | HCS12 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7001CGHN1/T1AGBEL | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~85°C TA | 2011 | 32-VFQFN Exposed Pad | 18 Weeks | I2C | Authentication | 1.62V~5.5V | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7101CGTK2/T0B040X | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~90°C TA | Tape & Reel (TR) | 2011 | 8-VDFN Exposed Pad | I2C | Authentication | 1.62V~3.6V | MX51 | EEPROM (20kB) | A710x | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PM5980B-FEI | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | ROHS3 Compliant | 1932 | 3 Weeks | 1 | Network Processor | YES | BOTTOM | BALL | TELECOM CIRCUIT | S-PBGA-B1932 | OTN | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| TLE9832-2QX | Rochester Electronics, LLC |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~150°C TJ | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/rochesterelectronicsllc-tle98322qx-datasheets-3769.pdf | 48-VFQFN Exposed Pad | LIN, SSI, UART | Automotive | 3V~27V | PG-VQFN-48-31 | 11 | 3.25K x 8 | XC800 | FLASH (36kB) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7001CGHN1/T1AGBWJ | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~85°C TA | Tape & Reel (TR) | 2011 | 32-VFQFN Exposed Pad | 22 Weeks | I2C | Authentication | 1.62V~5.5V | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7003CGHN1/T1AGBEL | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~85°C TA | 2011 | 32-VFQFN Exposed Pad | I2C | Authentication | 1.62V~5.5V | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7001CMHN1/T1AGCEL | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | -25°C~85°C | Tape & Reel (TR) | 1 (Unlimited) | ROHS3 Compliant | 2011 | /files/nxpusainc-a7001aghn1t1ag315-datasheets-3241.pdf | I2C, 2-Wire Serial | Authentication | 1.62V~5.5V | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CYUSB2014-BZXIT | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | EZ-USB FX3™ | Surface Mount | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | ROHS3 Compliant | 2011 | /files/cypresssemiconductorcorp-cyusb3acc007-datasheets-5507.pdf | 121-TFBGA | 1.2V | 9 Weeks | 227.901816mg | 1.25V | 1.15V | 121 | I2C, I2S, MMC/SD, SPI, UART, USB | SuperSpeed USB Peripheral Controller | 1.15V~1.25V | 121-FBGA (10x10) | 59 | ARM | 512K x 8 | ARM9® | External Program Memory | CYUSB | |||||||||||||||||||||||||||||||||||||||||||||||||
| A7101CGTK2/T0B0405 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~90°C TA | Tape & Reel (TR) | 2011 | 8-VDFN Exposed Pad | I2C | Authentication | 1.62V~3.6V | MX51 | EEPROM (20kB) | A710x | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CEC1702Q-C2-I/SX | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | CMOS | 0.8mm | ROHS3 Compliant | /files/microchiptechnology-ma990004-datasheets-6606.pdf | 84-WFBGA | 7mm | 7mm | 84 | 5 Weeks | I2C, SPI, UART | Cryptography | YES | 1.71V~3.465V | BOTTOM | BALL | NOT SPECIFIED | 3.3V | CEC1702 | NOT SPECIFIED | S-PBGA-B84 | TS 16949 | 65 | 480KB | 48 MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | NO | FLASH | 8 | 48MHz | ARM® Cortex®-M4F | |||||||||||||||||||||||||||||||||||||||
| A7001CGHN1/T1AGAEL | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~85°C | 2011 | 32-VFQFN Exposed Pad | 22 Weeks | I2C | Authentication | 1.62V~5.5V | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MM912G634DC2APR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2010 | 48-LQFP | 18 Weeks | LIN, SCI | Automotive | 2.25V~5.5V | MM912G634 | 9 | 2K x 8 | S12 | FLASH (48kB) | HCS12 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MM912G634DV1AER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2010 | 48-LQFP Exposed Pad | 16 Weeks | LIN, SCI | e3 | Matte Tin (Sn) | Automotive | 2.25V~5.5V | 260 | MM912G634 | ANALOG CIRCUIT | 40 | 9 | 2K x 8 | S12 | FLASH (48kB) | HCS12 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MM912F634DV1AE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2010 | /files/nxpusainc-mm912f634bv1aer2-datasheets-3202.pdf | 48-LQFP Exposed Pad | 7mm | 7mm | 48 | 16 Weeks | LIN, SCI | e3 | Matte Tin (Sn) | Automotive | YES | 2.25V~5.5V | QUAD | GULL WING | 260 | 7V | 0.5mm | MM912F634 | 40 | S-PQFP-G48 | 9 | 2K x 8 | MICROPROCESSOR CIRCUIT | S12 | FLASH (32KB) | HCS12 | |||||||||||||||||||||||||||||||||||||||||||
| WP33C2D4NFEI-450B2 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | RoHS Compliant | /files/microsemicorporation-wp3260w2efei400b2-datasheets-3005.pdf | 896-BGA, FCBGA | 6 Weeks | I2C, RMII, UART | Network Processor | MIPS32® 34Kc™ | SRAM |
