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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Max Supply Current | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | Screening Level | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Clock Frequency | Address Bus Width | Organization | Memory Width | Memory Density | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | I/O Type | Standby Voltage-Min |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 7130SA25PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7130sa25pf8-datasheets-5547.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 8 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 220mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.8mm | 64 | COMMERCIAL | 20 | SRAMs | 5V | 1kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 20b | 1KX8 | 0.015A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||
| 71V35761S166BGG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | 2.36mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v35761s166bgg-datasheets-5546.pdf | BGA | 14mm | 22mm | 3.3V | Lead Free | 119 | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | yes | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 320mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 119 | COMMERCIAL | 30 | SRAMs | 512kB | RAM, SDR, SRAM | 166MHz | 3-STATE | 3.5 ns | 17b | 0.03A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||
| 71V3556S166PFGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 166MHz | RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3556s166pfgi-datasheets-5519.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 12 Weeks | 3.465V | 3.135V | 100 | Parallel | 4.5 Mb | yes | 1.4mm | 1 | No | 1 | 360mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 30 | SRAMs | 512kB | RAM, SDR, SRAM | 166MHz | 3-STATE | 3.5 ns | 17b | 0.045A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||
| 71V35761SA200BG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 200MHz | 2.36mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v35761sa200bg-datasheets-5497.pdf | BGA | 14mm | 22mm | 3.3V | Contains Lead | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | no | 2.15mm | 1 | PIPELINED ARCHITECTURE | 1 | 360mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 119 | COMMERCIAL | 20 | SRAMs | Not Qualified | 512kB | RAM, SDR, SRAM | 200MHz | 3-STATE | 3.1 ns | 17b | 0.03A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||
| 70T3599S200BCG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | 200MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3599s200bcg-datasheets-5499.pdf | 17mm | 17mm | 2.5V | Lead Free | 7 Weeks | 2.6V | 2.4V | 256 | Parallel | 4.5 Mb | 1.4mm | 2 | No | 525mA | 512kB | RAM, SDR, SRAM | 200MHz | 3.4 ns | 34b | 36b | Synchronous | |||||||||||||||||||||||||||||||||||||||||||||
| 71256L45DB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | 125°C | -55°C | CMOS | 5.08mm | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71256l45db-datasheets-5496.pdf | CDIP | 37.2mm | 15.24mm | 5V | Contains Lead | 28 | 10 Weeks | 5.5V | 4.5V | 28 | Parallel | 256 kb | no | 1.65mm | 1 | No | 1 | e0 | Tin/Lead (Sn63Pb37) | NO | DUAL | THROUGH-HOLE | 240 | 5V | 2.54mm | 28 | MILITARY | SRAMs | 5V | MIL-STD-883 Class B | 32kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 45 ns | 15b | 32KX8 | 0.0005A | COMMON | 2V | ||||||||||||||||||||||||||
| 70T651S12BFGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t651s12bfgi8-datasheets-5422.pdf | 15mm | 15mm | 2.5V | Lead Free | 208 | 7 Weeks | 2.6V | 2.4V | 208 | Parallel | 9 Mb | yes | 1.4mm | 2 | No | 1 | 395mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 2.5V | 0.8mm | 208 | INDUSTRIAL | 30 | SRAMs | 1.1MB | RAM, SDR, SRAM | 3-STATE | 12 ns | 18b | 36b | Asynchronous | COMMON | |||||||||||||||||||||||||||||
| 71V35761S183BGG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | 183MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v35761s183bgg-datasheets-5310.pdf | BGA | 14mm | 22mm | 3.3V | Lead Free | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | yes | 2.15mm | 1 | No | 340mA | 119 | 512kB | RAM, SDR, SRAM | 183MHz | 3.3 ns | 17b | 36b | Synchronous | |||||||||||||||||||||||||||||||||||||||||||
| 7005L45J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7005l45j-datasheets-5312.pdf | PLCC | 24mm | 24mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 64 kb | 3.63mm | 2 | No | 8kB | RAM, SDR, SRAM | 45 ns | 26b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||
| 70T651S12BFGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t651s12bfgi-datasheets-5099.pdf | 15mm | 15mm | 2.5V | Lead Free | 208 | 7 Weeks | 2.6V | 2.4V | 208 | Parallel | 9 Mb | yes | 1.4mm | 2 | No | 1 | 395mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 2.5V | 0.8mm | 208 | INDUSTRIAL | 30 | SRAMs | 1.1MB | RAM, SDR, SRAM | 3-STATE | 12 ns | 18b | 36b | Asynchronous | COMMON | ||||||||||||||||||||||||||||
| 71V67903S85BQI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v67903s85bqi8-datasheets-5085.pdf | 15mm | 13mm | 3.3V | Contains Lead | 165 | 7 Weeks | 165 | Parallel | 9 Mb | no | 1.2mm | 1 | FLOW-THROUGH ARCHITECTURE | No | 1 | e0 | TIN LEAD | YES | BOTTOM | BALL | 225 | 3.3V | 165 | INDUSTRIAL | 3.465V | 20 | SRAMs | RAM, SRAM | 3-STATE | 87MHz | 19b | 0.07A | 8.5 ns | COMMON | |||||||||||||||||||||||||||||||
| 70V3319S133BF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3319s133bf8-datasheets-5073.pdf | 15mm | 1.4mm | 15mm | 3.3V | Contains Lead | 400mA | 208 | 7 Weeks | 3.45V | 3.15V | 208 | Parallel | 4.5 Mb | no | 1.4mm | 2 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | No | 1 | 400mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 0.8mm | 208 | COMMERCIAL | SRAMs | 512kB | RAM, SDR, SRAM | 133MHz | 3-STATE | 4.2 ns | 18b | 0.03A | 18b | Synchronous | COMMON | ||||||||||||||||||||||||
| 71V2556SA166BG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | 2.36mm | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v2556sa166bg-datasheets-5039.pdf | BGA | 14mm | 22mm | 3.3V | Contains Lead | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | no | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 350mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 119 | COMMERCIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 3.5 ns | 17b | 0.04A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||
| IDT71V67602S133BG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | SYNCHRONOUS | 2.36mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v67602s133bg-datasheets-4784.pdf | BGA | 22mm | 14mm | 119 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 1.27mm | 119 | COMMERCIAL | 3.465V | 3.135V | NOT SPECIFIED | SRAMs | 2.53.3V | 0.28mA | Not Qualified | RAM, SRAM | 3-STATE | 256KX36 | 36 | 9437184 bit | 0.07A | 4.2 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||
| IDT71P74804S200BQ | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 200MHz | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71p74804s200bq-datasheets-4770.pdf | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 1.8V | 1mm | 165 | COMMERCIAL | 1.9V | 1.7V | 20 | SRAMs | 1.5/1.81.8V | 0.75mA | Not Qualified | QDR, RAM, SRAM | 3-STATE | 1MX18 | 18 | 18874368 bit | 0.335A | 0.45 ns | SEPARATE | 1.7V | ||||||||||||||||||||||||||||
| 6116LA20SOG | Integrated Device Technology (IDT) | $3.37 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | 70°C | 0°C | CMOS | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-6116la20sog-datasheets-4940.pdf | SOIC | 15.4mm | 7.6mm | 5V | Lead Free | 24 | 7 Weeks | 5.5V | 4.5V | 24 | Parallel | 16 kb | yes | 2.34mm | 1 | EAR99 | No | 1 | e3 | Matte Tin (Sn) - annealed | YES | DUAL | GULL WING | 260 | 5V | 24 | COMMERCIAL | 30 | SRAMs | 5V | 2kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 20 ns | 11b | 2KX8 | 0.00003A | COMMON | 2V | ||||||||||||||||||||||||||
| 71V416L12PHGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v416l12phgi-datasheets-4909.pdf | TSOP | 18.41mm | 10.16mm | 3.3V | Lead Free | 44 | 12 Weeks | 3.6V | 3V | 44 | Parallel | 4 Mb | yes | 1mm | 1 | No | 1 | 170mA | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 3.3V | 0.8mm | 44 | INDUSTRIAL | 30 | SRAMs | 512kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 12 ns | 18b | 16b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||||
| 71V256SA20PZG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v256sa20pzg8-datasheets-4861.pdf | TSOP | 8mm | 11.8mm | 3.3V | Lead Free | 28 | 7 Weeks | 3.6V | 3V | 28 | Parallel | 256 kb | yes | 1mm | 1 | EAR99 | No | 1 | e3 | Matte Tin (Sn) | YES | DUAL | GULL WING | 260 | 3.3V | 0.55mm | 28 | COMMERCIAL | 30 | 32kB | RAM, SDR, SRAM - Asynchronous | 20 ns | 15b | 32KX8 | ||||||||||||||||||||||||||||||||
| 71V65603S100BG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 100MHz | 2.36mm | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v65603s100bg8-datasheets-4816.pdf | BGA | 14mm | 22mm | 3.3V | Contains Lead | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 9 Mb | no | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 250mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 119 | COMMERCIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 5 ns | 18b | 256KX36 | 0.04A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||
| 70V3319S133BC8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | 1.7mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3319s133bc8-datasheets-4817.pdf | 17mm | 17mm | 3.3V | Contains Lead | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 4.5 Mb | no | 1.4mm | 2 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | No | 1 | 400mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 1mm | 256 | COMMERCIAL | SRAMs | RAM, SRAM | 3-STATE | 15 ns | 36b | 0.03A | 18b | Synchronous | COMMON | ||||||||||||||||||||||||||
| 71V3556SA166BQ | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3556sa166bq-datasheets-4795.pdf | 15mm | 1.2mm | 13mm | 3.3V | Contains Lead | 350mA | 165 | 11 Weeks | 3.465V | 3.135V | 165 | Parallel | 4.5 Mb | no | 1.2mm | 1 | No | 1 | 350mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 165 | COMMERCIAL | 20 | SRAMs | 512kB | RAM, SDR, SRAM | 166MHz | 3-STATE | 3.5 ns | 17b | 0.04A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||
| 70V3399S133BCI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | 1.7mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3399s133bci-datasheets-4733.pdf | 17mm | 17mm | 3.3V | Contains Lead | 256 | 16 Weeks | 3.45V | 3.15V | 256 | Parallel | 2.3 Mb | no | 1.4mm | 2 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | No | 1 | 480mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 1mm | 256 | INDUSTRIAL | SRAMs | 256kB | RAM, SDR, SRAM | 133MHz | 3-STATE | 4.2 ns | 34b | 0.04A | 18b | Synchronous | COMMON | |||||||||||||||||||||||||
| 70T651S10BFGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2009 | /files/integrateddevicetechnology-70t651s10bfgi8-datasheets-4726.pdf | 15mm | 15mm | 2.5V | Lead Free | 208 | 7 Weeks | 2.6V | 2.4V | 208 | Parallel | 9 Mb | yes | 1.4mm | 2 | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 2.5V | 0.8mm | 208 | INDUSTRIAL | 30 | SRAMs | 0.445mA | 1.1MB | RAM, SDR, SRAM | 3-STATE | 10 ns | 18b | COMMON | |||||||||||||||||||||||||||||||
| 71V35761S166BG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | 2.36mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v35761s166bg-datasheets-4711.pdf | BGA | 14mm | 22mm | 3.3V | Contains Lead | 119 | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | no | 2.15mm | 1 | PIPELINED ARCHITECTURE | 1 | 320mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 119 | COMMERCIAL | 20 | SRAMs | Not Qualified | 512kB | RAM, SDR, SRAM | 166MHz | 3-STATE | 3.5 ns | 17b | 0.03A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||
| 70914S20PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 50MHz | 1.6mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70914s20pf-datasheets-4713.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 80 | 7 Weeks | 5.5V | 4.5V | 80 | Parallel | 36 kb | no | 1.4mm | 2 | EAR99 | 1 | 290mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.65mm | 80 | COMMERCIAL | 20 | SRAMs | 5V | Not Qualified | 4.5kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 24b | 4KX9 | 0.015A | 9b | Synchronous | COMMON | ||||||||||||||||||||||
| IDT71P74604S250BQ | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 250MHz | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71p74604s250bq-datasheets-4644.pdf | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 1.8V | 1mm | 165 | COMMERCIAL | 1.9V | 1.7V | 20 | SRAMs | 1.5/1.81.8V | 1.1mA | Not Qualified | QDR, RAM, SRAM | 3-STATE | 512KX36 | 36 | 18874368 bit | 0.375A | 0.45 ns | SEPARATE | 1.7V | ||||||||||||||||||||||||||||
| 70T651S10BFGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t651s10bfgi-datasheets-4626.pdf | 15mm | 15mm | 2.5V | Lead Free | 208 | 7 Weeks | 2.6V | 2.4V | 208 | Parallel | 9 Mb | yes | 1.4mm | 2 | No | 1 | 445mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 2.5V | 0.8mm | 208 | INDUSTRIAL | 30 | SRAMs | 1.1MB | RAM, SDR, SRAM | 3-STATE | 10 ns | 36b | 36b | Asynchronous | COMMON | ||||||||||||||||||||||||||||
| 70V3319S133BC | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 40MHz | 1.7mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3319s133bc-datasheets-4647.pdf | 17mm | 17mm | 3.3V | Contains Lead | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 4.5 Mb | no | 1.4mm | 2 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | No | 1 | 400mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 1mm | 256 | COMMERCIAL | SRAMs | 512kB | RAM, SDR, SRAM | 133MHz | 3-STATE | 15 ns | 36b | 0.03A | 18b | Synchronous | COMMON | ||||||||||||||||||||||||
| 71V424S15PHG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v424s15phg-datasheets-4606.pdf | TSOP | 18.41mm | 10.16mm | 3.3V | Lead Free | 44 | 12 Weeks | 3.6V | 3V | 44 | Parallel | 4 Mb | yes | 1mm | 1 | No | 1 | 160mA | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 3.3V | 0.8mm | 44 | COMMERCIAL | 30 | SRAMs | 512kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 15 ns | 19b | 0.02A | 8b | Asynchronous | COMMON | 3V | ||||||||||||||||||||||||||
| 7015S20PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7015s20pf-datasheets-4548.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 80 | 7 Weeks | 5.5V | 4.5V | 80 | Parallel | 72 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 290mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.65mm | 80 | COMMERCIAL | 20 | SRAMs | 5V | 9kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 26b | 8KX9 | 0.015A | 9b | Asynchronous | COMMON |
