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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Max Supply Current | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Clock Frequency | Address Bus Width | Organization | Memory Width | Memory Density | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | I/O Type | Standby Voltage-Min |
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| 70V3379S4PRFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3379s4prfg-datasheets-9864.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 128 | 7 Weeks | 3.45V | 3.15V | 128 | Parallel | 576 kb | yes | 1.4mm | 2 | PIPELINED OUTPUT MODE; SELF TIMED WRITE CYCLE | No | 1 | e3 | Matte Tin (Sn) - annealed | YES | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 128 | COMMERCIAL | 30 | SRAMs | 0.46mA | 72kB | RAM, SDR, SRAM | 3-STATE | 4.2 ns | 133MHz | 15b | 0.015A | COMMON | ||||||||||||||||||||||||
| 7142SA55J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7142sa55j8-datasheets-9854.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 16 kb | 3.63mm | 2 | No | 155mA | 2kB | RAM, SDR, SRAM | 55 ns | 22b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||
| 71V016SA12BFGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v016sa12bfgi8-datasheets-9807.pdf | 7mm | 7mm | 3.3V | Lead Free | 48 | 12 Weeks | 3.6V | 3V | 48 | Parallel | 1 Mb | yes | 1.4mm | 1 | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 0.75mm | 48 | INDUSTRIAL | 30 | SRAMs | 128kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 12 ns | 16b | COMMON | 3V | |||||||||||||||||||||||||||||
| 71421SA55J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71421sa55j-datasheets-9803.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 16 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN | No | 1 | 155mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 2kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 22b | 0.015A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||||
| 71V67703S75BGG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 117MHz | 2.36mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v67703s75bgg-datasheets-9785.pdf | BGA | 14mm | 22mm | 3.3V | Lead Free | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 9 Mb | yes | 2.15mm | 1 | FLOW-THROUGH ARCHITECTURE | No | 1 | 265mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 119 | COMMERCIAL | 30 | SRAMs | RAM, SRAM | 3-STATE | 7.5 ns | 18b | 256KX36 | 0.05A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||
| 70T659S10BFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.5mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t659s10bfi-datasheets-9726.pdf | 15mm | 15mm | 2.5V | Contains Lead | 208 | 7 Weeks | 2.6V | 2.4V | 208 | Parallel | 4.5 Mb | no | 1.4mm | 2 | No | 1 | 445mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 0.8mm | 208 | INDUSTRIAL | SRAMs | 512kB | RAM, SDR, SRAM | 3-STATE | 10 ns | 17b | 36b | Asynchronous | COMMON | |||||||||||||||||||||||||||
| 71V432S6PFG | Integrated Device Technology (IDT) | $3.86 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 83MHz | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v432s6pfg-datasheets-9716.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 3.63V | 3.135V | 100 | Parallel | 1 Mb | yes | 1.4mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 180mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | COMMERCIAL | 30 | SRAMs | 128kB | RAM, SDR, SRAM | 83MHz | 3-STATE | 6 ns | 15b | 32KX32 | 32b | Synchronous | COMMON | |||||||||||||||||||||||
| 70V08S25PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v08s25pf8-datasheets-9713.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 512 kb | no | 1.4mm | 2 | EAR99 | SEMAPHORE | No | 1 | 205mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 64kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 32b | 64KX8 | 0.006A | 8b | Asynchronous | COMMON | 3V | |||||||||||||||||||||
| 70261S55PFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70261s55pfg-datasheets-9648.pdf | TQFP | 14mm | 14mm | 5V | Lead Free | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 256 kb | yes | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE | No | 1 | 270mA | e3 | Matte Tin (Sn) | QUAD | GULL WING | 260 | 5V | 100 | COMMERCIAL | 32kB | RAM, SDR, SRAM | 55 ns | 28b | 16KX16 | 16b | Asynchronous | |||||||||||||||||||||||||||||
| 71T75602S166BGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 166MHz | 2.36mm | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71t75602s166bgi8-datasheets-9571.pdf | BGA | 14mm | 22mm | 2.5V | Contains Lead | 119 | 8 Weeks | 2.625V | 2.375V | 119 | Parallel | 18 Mb | no | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 265mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 119 | INDUSTRIAL | SRAMs | RAM, SRAM | 3-STATE | 3.5 ns | 19b | 0.06A | 36b | Synchronous | COMMON | 2.38V | ||||||||||||||||||||||||
| 71V67903S80PFG | Integrated Device Technology (IDT) | $16.73 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 100MHz | RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v67903s80pfg-datasheets-9568.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 8 Weeks | 3.465V | 3.135V | 100 | Parallel | 9 Mb | yes | 1.4mm | 1 | FLOW-THROUGH ARCHITECTURE | No | 1 | 210mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | COMMERCIAL | 30 | SRAMs | 1.1MB | RAM, SDR, SRAM | 100MHz | 3-STATE | 8 ns | 19b | 0.05A | 18b | Synchronous | COMMON | ||||||||||||||||||||||
| IDT71V124SA15TYI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 3.7592mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v124sa15tyi-datasheets-6572.pdf | 20.955mm | 7.62mm | 32 | 32 | Parallel | no | 3A991.B.2.B | not_compliant | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | J BEND | 225 | 3.3V | 1.27mm | 32 | INDUSTRIAL | 3.6V | 3.15V | 30 | SRAMs | 3.3V | 0.12mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 128KX8 | 8 | 1048576 bit | 0.01A | 15 ns | COMMON | 3V | ||||||||||||||||||||||||||||||
| IDT71P73604S250BQ | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 250MHz | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71p73604s250bq-datasheets-6540.pdf | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 1.8V | 1mm | 165 | COMMERCIAL | 1.9V | 1.7V | 20 | SRAMs | 1.5/1.81.8V | 0.8mA | Not Qualified | DDR2, RAM, SRAM | 3-STATE | 512KX36 | 36 | 18874368 bit | 0.325A | 0.45 ns | COMMON | 1.7V | |||||||||||||||||||||||||||
| IDT71V67602S133BQGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 85°C | -40°C | 133MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v67602s133bqgi8-datasheets-6528.pdf | 165 | Parallel | RAM, SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 7008L55G | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 1 (Unlimited) | 70°C | 0°C | CMOS | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7008l55g-datasheets-9315.pdf | 27.94mm | 27.94mm | 5V | Contains Lead | 84 | 7 Weeks | 5.5V | 4.5V | 84 | Parallel | 512 kb | no | 3.68mm | 2 | EAR99 | No | 1 | 230mA | e0 | TIN LEAD | PERPENDICULAR | PIN/PEG | 240 | 5V | 84 | COMMERCIAL | SRAMs | 5V | 64kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 32b | 64KX8 | 0.005A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||||
| 71V016SA10YG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.683mm | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v016sa10yg-datasheets-9313.pdf | 28.6mm | 10.2mm | 3.3V | Lead Free | 44 | 12 Weeks | 3.6V | 3.15V | 44 | Parallel | 1 Mb | yes | 2.9mm | 1 | No | 1 | 160mA | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 3.3V | 44 | COMMERCIAL | 30 | SRAMs | 128kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 10 ns | 16b | 16b | Asynchronous | COMMON | ||||||||||||||||||||||||||||
| 71V67603S150BGGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 85°C | -40°C | CMOS | 150MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v67603s150bggi-datasheets-9312.pdf | BGA | 14mm | 2.15mm | 22mm | 3.3V | Lead Free | 325mA | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 9 Mb | yes | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 119 | INDUSTRIAL | 30 | SRAMs | 1.1MB | RAM, SDR, SRAM | 150MHz | 3-STATE | 3.8 ns | 18b | 256KX36 | 0.07A | COMMON | ||||||||||||||||||||||||
| 70V28L20PFG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v28l20pfg8-datasheets-9300.pdf | TQFP | 14mm | 14mm | 3.3V | Lead Free | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 1 Mb | yes | 1.4mm | 2 | No | 1 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 100 | COMMERCIAL | 128kB | RAM, SDR, SRAM | 20 ns | 32b | 64KX16 | |||||||||||||||||||||||||||||||
| 70V3319S166BF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3319s166bf8-datasheets-9212.pdf | 15mm | 1.4mm | 15mm | 3.3V | Contains Lead | 500mA | 208 | 7 Weeks | 3.45V | 3.15V | 208 | Parallel | 4.5 Mb | no | 1.4mm | 2 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | No | 1 | 500mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 0.8mm | 208 | COMMERCIAL | SRAMs | 512kB | RAM, SDR, SRAM | 166MHz | 3-STATE | 3.6 ns | 18b | 0.03A | 18b | Synchronous | COMMON | |||||||||||||||||||||||
| 70V9369L6PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 52.6MHz | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9369l6pf-datasheets-9198.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 288 kb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 350mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | COMMERCIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 15 ns | 28b | 16KX18 | 0.005A | 18b | Synchronous | COMMON | 3V | ||||||||||||||||||||||
| 70V28L20PFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 70°C | 0°C | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v28l20pfg-datasheets-9181.pdf | TQFP | 14mm | 14mm | 3.3V | Lead Free | 7 Weeks | 3.6V | 3V | 100 | Parallel | 1 Mb | 1.4mm | 2 | No | 205mA | 128kB | RAM, SDR, SRAM | 20 ns | 32b | 16b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||
| 70V7319S166BCGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 85°C | -40°C | CMOS | 166MHz | 1.5mm | RoHS Compliant | 2002 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v7319s166bcgi-datasheets-9164.pdf | 17mm | 17mm | 3.3V | Lead Free | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 4 Mb | yes | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 830mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 1mm | 256 | INDUSTRIAL | 30 | SRAMs | RAM, SRAM | 3-STATE | 12 ns | 36b | 0.00004A | 18b | Synchronous | COMMON | ||||||||||||||||||||||||
| 7006L15J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7006l15j-datasheets-9152.pdf | PLCC | 24mm | 24mm | 5V | Contains Lead | 68 | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 128 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 260mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 16kB | RAM, SDR, SRAM | 3-STATE | 15 ns | 28b | 16KX8 | 0.0015A | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||
| 71V016SA10PHG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v016sa10phg8-datasheets-9145.pdf | TSOP | 18.41mm | 10.16mm | 3.3V | Lead Free | 44 | 12 Weeks | 3.6V | 3.15V | 44 | Parallel | 1 Mb | yes | 1mm | 1 | No | 1 | 160mA | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 3.3V | 0.8mm | 44 | COMMERCIAL | 30 | SRAMs | 128kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 10 ns | 16b | 16b | Asynchronous | COMMON | ||||||||||||||||||||||||||
| 70T651S12BC | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t651s12bc-datasheets-8931.pdf | 17mm | 17mm | 2.5V | Contains Lead | 256 | 7 Weeks | 2.6V | 2.4V | 256 | Parallel | 9 Mb | no | 1.4mm | 2 | No | 1 | 355mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 1mm | 256 | COMMERCIAL | 20 | SRAMs | 1.1MB | RAM, SDR, SRAM | 3-STATE | 12 ns | 18b | 0.01A | 36b | Asynchronous | COMMON | |||||||||||||||||||||||||
| 70V3319S166BC8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | 1.7mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3319s166bc8-datasheets-8930.pdf | 17mm | 17mm | 3.3V | Contains Lead | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 4.5 Mb | no | 1.4mm | 2 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | No | 1 | 500mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 1mm | 256 | COMMERCIAL | SRAMs | RAM, SRAM | 3-STATE | 12 ns | 18b | 0.03A | 18b | Synchronous | COMMON | |||||||||||||||||||||||||
| 70V5388S166BC | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | 1.5mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v5388s166bc-datasheets-8921.pdf | 17mm | 17mm | 3.3V | Contains Lead | 256 | 3.45V | 3.15V | 256 | Parallel | 1.1 Mb | no | 1.4mm | 4 | 3A991.B.2.A | PIPELINED ARCHITECTURE | No | 1 | 395mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 1mm | 256 | INDUSTRIAL | SRAMs | 128kB | RAM, SDR, SRAM | 3-STATE | 6 ns | 16b | 0.015A | 18b | Synchronous | COMMON | |||||||||||||||||||||||||
| 70V657S12BCGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v657s12bcgi-datasheets-8884.pdf | 17mm | 17mm | 3.3V | Lead Free | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 1.1 Mb | yes | 1.4mm | 2 | No | 1 | 515mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 1mm | 256 | INDUSTRIAL | 30 | SRAMs | 128kB | RAM, SDR, SRAM | 3-STATE | 12 ns | 30b | 0.015A | 36b | Asynchronous | COMMON | |||||||||||||||||||||||||
| 70V26L25G | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 70°C | 0°C | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v26l25g-datasheets-8791.pdf | 27.94mm | 27.94mm | 3.3V | Contains Lead | 7 Weeks | 3.6V | 3V | 84 | Parallel | 256 kb | 3.68mm | 2 | No | 32kB | RAM, SDR, SRAM | 25 ns | 14b | |||||||||||||||||||||||||||||||||||||||||||||||||
| 70V3599S166BCG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | 1.7mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3599s166bcg-datasheets-8738.pdf | 17mm | 17mm | 3.3V | Lead Free | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 4.5 Mb | yes | 1.4mm | 2 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 3.3V | 1mm | 256 | COMMERCIAL | SRAMs | 0.5mA | 512kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 34b | 0.03A | COMMON |
