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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Max Supply Current | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Clock Frequency | Address Bus Width | Organization | Memory Width | Memory Density | Alternate Memory Width | Standby Current-Max | Word Size | Serial Bus Type | Endurance | Data Retention Time-Min | Write Protection | Access Time (Max) | Sync/Async | I/O Type | Standby Voltage-Min | Output Enable |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 7005L35FB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 125°C | -55°C | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7005l35fb-datasheets-1047.pdf | 24mm | 24mm | 5V | Contains Lead | 10 Weeks | 5.5V | 4.5V | 68 | Parallel | 64 kb | 2mm | 2 | No | 250mA | RAM, SRAM | 35 ns | 26b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71124S15Y | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.683mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71124s15y-datasheets-1035.pdf | 20.955mm | 10.16mm | 32 | 32 | Parallel | 1 | 3A991.B.2.B | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | J BEND | 225 | 5V | 1.27mm | 32 | COMMERCIAL | 5.5V | 4.5V | 30 | SRAMs | 5V | 0.155mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 128KX8 | 8 | 1048576 bit | 0.01A | 15 ns | COMMON | 4.5V | YES | ||||||||||||||||||||||||||||||||||||
| IDT71V3577SA80BQI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3577sa80bqi-datasheets-0962.pdf | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 3.3V | 1mm | 165 | INDUSTRIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.21mA | Not Qualified | RAM, SRAM | 3-STATE | 100MHz | 128KX36 | 36 | 4718592 bit | 0.035A | 8 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||||||
| IDT71016S12Y8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.683mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71016s12y8-datasheets-0944.pdf | 28.575mm | 10.16mm | 44 | 44 | Parallel | no | 1 | 3A991.B.2.B | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | J BEND | 225 | 5V | 1.27mm | 44 | COMMERCIAL | 5.5V | 4.5V | 30 | SRAMs | 5V | 0.21mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 64KX16 | 16 | 1048576 bit | 0.01A | 12 ns | COMMON | 4.5V | YES | |||||||||||||||||||||||||||||||||
| 7007S25J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7007s25j8-datasheets-0860.pdf | PLCC | 24mm | 24mm | 5V | Contains Lead | 68 | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 256 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 305mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 32kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 15b | 0.015A | 8b | Asynchronous | COMMON | ||||||||||||||||||||||||||||||
| 70V3379S6BC8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 83.3MHz | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3379s6bc8-datasheets-0849.pdf | 17mm | 17mm | 3.3V | Contains Lead | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 576 kb | no | 1.4mm | 2 | No | 1 | 310mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 1mm | 256 | COMMERCIAL | SRAMs | RAM, SRAM | 3-STATE | 6 ns | 30b | 0.015A | 18b | Synchronous | COMMON | ||||||||||||||||||||||||||||||||
| IDT71V3577SA80BQGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | SYNCHRONOUS | 1.2mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3577sa80bqgi-datasheets-0840.pdf | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | 8542.32.00.41 | 1 | e1 | TIN SILVER COPPER | YES | BOTTOM | BALL | 260 | 3.3V | 1mm | 165 | INDUSTRIAL | 3.465V | 3.135V | 30 | Not Qualified | RAM, SRAM | 128KX36 | 36 | 4718592 bit | 8 ns | ||||||||||||||||||||||||||||||||||||||||||
| 7052S30GB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 125°C | -55°C | RoHS Compliant | 2001 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7052s30gb-datasheets-0839.pdf | 30.48mm | 30.48mm | 5V | Contains Lead | 5.5V | 4.5V | 108 | Parallel | 16 kb | 3.68mm | 4 | No | RAM, SRAM | 30 ns | 11b | 8b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71124S12YI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 3.683mm | Non-RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71124s12yi-datasheets-0833.pdf | 20.955mm | 10.16mm | 32 | 32 | Parallel | 3A991.B.2.B | not_compliant | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | J BEND | 225 | 5V | 1.27mm | 32 | INDUSTRIAL | 5.5V | 4.5V | 30 | SRAMs | 5V | 0.16mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 128KX8 | 8 | 1048576 bit | 0.01A | 12 ns | COMMON | 4.5V | |||||||||||||||||||||||||||||||||||||
| 71V67803S133BG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | 2.36mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v67803s133bg-datasheets-0796.pdf | BGA | 14mm | 22mm | 3.3V | Contains Lead | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 9 Mb | no | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 260mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 119 | COMMERCIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 4.2 ns | 19b | 0.05A | 18b | Synchronous | COMMON | |||||||||||||||||||||||||||||||
| 71V416S15YG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v416s15yg8-datasheets-0778.pdf | 28.6mm | 10.2mm | 3.3V | Lead Free | 170mA | 44 | 12 Weeks | 3.6V | 3V | 44 | Parallel | 4 Mb | yes | 2.9mm | 1 | No | 1 | 170mA | e3 | MATTE TIN | DUAL | J BEND | 260 | 3.3V | 44 | COMMERCIAL | SRAMs | 512kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 15 ns | 18b | 0.02A | 16b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||||||||||
| IDT71V3577SA80BQG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 1.2mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3577sa80bqg-datasheets-0758.pdf | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | 8542.32.00.41 | 1 | e1 | TIN SILVER COPPER | YES | BOTTOM | BALL | 260 | 3.3V | 1mm | 165 | COMMERCIAL | 3.465V | 3.135V | 30 | Not Qualified | RAM, SRAM | 128KX36 | 36 | 4718592 bit | 8 ns | ||||||||||||||||||||||||||||||||||||||||||
| IDT71124S12Y | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Rail/Tube | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.683mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71124s12y-datasheets-0744.pdf | 20.955mm | 5V | 32 | 5.5V | 4.5V | 32 | Parallel | 1 Mb | 1 | not_compliant | 1 | 160mA | e0 | DUAL | J BEND | 225 | 5V | 32 | COMMERCIAL | 30 | SRAMs | 5V | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 12 ns | 17b | 8 | 8b | Asynchronous | COMMON | YES | |||||||||||||||||||||||||||||||||||||
| 71V67903S75PFGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 117MHz | RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v67903s75pfgi8-datasheets-0688.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 8 Weeks | 3.465V | 3.135V | 100 | Parallel | 9 Mb | yes | 1.4mm | 1 | FLOW-THROUGH ARCHITECTURE | No | 1 | 285mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 30 | SRAMs | RAM, SRAM | 3-STATE | 7.5 ns | 19b | 0.07A | 18b | Synchronous | COMMON | ||||||||||||||||||||||||||||||
| 7027L55PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7027l55pf8-datasheets-0648.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 512 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE | No | 1 | 230mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 5V | 64kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 30b | 0.015A | 16b | Asynchronous | COMMON | ||||||||||||||||||||||||||||
| 7140LA25PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7140la25pf-datasheets-0645.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 8 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 170mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.8mm | 64 | COMMERCIAL | 20 | SRAMs | 5V | 1kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 20b | 1KX8 | 0.0015A | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||||||
| IDT71V3577SA80BQ8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3577sa80bq8-datasheets-0639.pdf | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 3.3V | 1mm | 165 | COMMERCIAL | 3.465V | 3.135V | SRAMs | 3.3V | 0.2mA | Not Qualified | RAM, SRAM | 3-STATE | 100MHz | 128KX36 | 36 | 4718592 bit | 0.03A | 8 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||||||||
| 71421LA35PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71421la35pf-datasheets-0636.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 16 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; BATTERY BACKUP | No | 1 | 120mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.8mm | 64 | COMMERCIAL | 20 | SRAMs | 5V | 2kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 22b | 0.0015A | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||||||
| MX25L3206EZUI-12G | Macronix | $1.63 |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 86MHz | SYNCHRONOUS | 0.6mm | RoHS Compliant | 4mm | 4mm | 3V | Lead Free | 8 | SPI, Serial | 32 Mb | yes | 3A991.B.1.A | 8542.32.00.51 | 1 | e3 | Matte Tin (Sn) - annealed | YES | DUAL | NO LEAD | 260 | 3.3V | 0.8mm | 8 | INDUSTRIAL | 3.6V | 2.7V | 40 | Flash Memories | 0.025mA | Not Qualified | S-PDSO-N8 | FLASH, NOR | 86MHz | 16MX2 | 2 | 1 | 0.00002A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | ||||||||||||||||||||||||||||||||
| 71V256SA15PZGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v256sa15pzgi8-datasheets-0586.pdf | TSOP | 8mm | 11.8mm | 3.3V | Lead Free | 28 | 7 Weeks | 3.6V | 3V | 28 | Parallel | 256 kb | yes | 1mm | 1 | EAR99 | No | 1 | e3 | Matte Tin (Sn) - annealed | YES | DUAL | GULL WING | 260 | 3.3V | 0.55mm | 28 | INDUSTRIAL | 30 | SRAMs | 0.085mA | 32kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 15 ns | 15b | 32KX8 | 0.002A | COMMON | 3V | |||||||||||||||||||||||||||||||
| IDT71V424S10YI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 85°C | -40°C | CMOS | 3.683mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v424s10yi8-datasheets-0561.pdf | 23.495mm | 10.16mm | 36 | 36 | Parallel | no | 3A991.B.2.A | 8542.32.00.41 | 1 | e0 | TIN LEAD | YES | DUAL | J BEND | 225 | 3.3V | 1.27mm | 36 | INDUSTRIAL | 3.6V | 3V | 30 | Not Qualified | RAM, SRAM - Asynchronous | 512KX8 | 8 | 4194304 bit | 10 ns | |||||||||||||||||||||||||||||||||||||||||||
| 7026L25J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7026l25j-datasheets-0540.pdf | PLCC | 29.21mm | 29.21mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 84 | Parallel | 256 kb | no | 3.63mm | 2 | EAR99 | No | 265mA | 84 | 32kB | RAM, SDR, SRAM | 25 ns | 28b | 16b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||||
| 71321LA25TFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71321la25tfi-datasheets-0437.pdf | TQFP | 10mm | 10mm | 5V | Contains Lead | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 16 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 220mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 64 | INDUSTRIAL | 20 | SRAMs | 5V | 2kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 22b | 0.004A | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||||||||
| IDT71V3577SA80BQ | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3577sa80bq-datasheets-0433.pdf | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 3.3V | 1mm | 165 | COMMERCIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.2mA | Not Qualified | RAM, SRAM | 3-STATE | 100MHz | 128KX36 | 36 | 4718592 bit | 0.03A | 8 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||||||
| 70V261L25PFGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v261l25pfgi-datasheets-0407.pdf | TQFP | 14mm | 14mm | 3.3V | Lead Free | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 256 kb | yes | 1.4mm | 2 | EAR99 | No | 1 | 185mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 100 | INDUSTRIAL | 40 | SRAMs | 32kB | SDR | 3-STATE | 25 ns | 14b | 16KX16 | 0.003A | 16b | Asynchronous | COMMON | 3V | ||||||||||||||||||||||||||||
| IDT71V65603S133PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | Non-RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v65603s133pfi-datasheets-0343.pdf | TQFP | 20mm | 3.3V | 100 | 3.465V | 3.135V | 100 | Parallel | 9 Mb | 1 | PIPELINED ARCHITECTURE | not_compliant | 1 | 320mA | e0 | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 20 | SRAMs | Not Qualified | RAM, SRAM | 3-STATE | 4.2 ns | 18b | 256KX36 | 36 | 0.06A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||||||||||||
| 71V546S100PFGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 100MHz | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v546s100pfgi8-datasheets-0334.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 12 Weeks | 3.465V | 3.135V | 100 | Parallel | 4.5 Mb | yes | 1.4mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 260mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 30 | SRAMs | 512kB | RAM, SDR, SRAM | 100MHz | 3-STATE | 5 ns | 17b | 0.045A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||||||
| 709279S12PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 33.3MHz | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-709279s12pf8-datasheets-0318.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 512 kb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 345mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 5V | 64kB | RAM, SDR, SRAM | 3-STATE | 12 ns | 15b | 0.015A | 16b | Synchronous | COMMON | ||||||||||||||||||||||||||||
| IDT71V3577SA80BGGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 85°C | -40°C | CMOS | SYNCHRONOUS | 2.36mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3577sa80bggi8-datasheets-0319.pdf | BGA | 22mm | 14mm | 119 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | 8542.32.00.41 | 1 | e1 | TIN SILVER COPPER | YES | BOTTOM | BALL | 3.3V | 1.27mm | 119 | INDUSTRIAL | 3.465V | 3.135V | Not Qualified | RAM, SRAM | 128KX36 | 36 | 4718592 bit | 8 ns | ||||||||||||||||||||||||||||||||||||||||||||
| 7005L20PFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.6mm | RoHS Compliant | 1999 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7005l20pfi8-datasheets-0316.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 64 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE; BATTERY BACKUP | No | 1 | 320mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.8mm | 64 | INDUSTRIAL | 20 | SRAMs | 5V | 8kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 26b | 8KX8 | 0.004A | 8b | Asynchronous | COMMON | 2V |
