XCV200-4BG256C

FPGAs Virtex® Series 256-BBGA

Manufacturer: Xilinx Inc.
NO: 903-XCV200-4BG256C
Package: 256-BBGA
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Stock: 5592
Description: FPGAs Virtex® Series 256-BBGA (Kg)

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SPECIFICATIONS

Parameters
Mount	Surface Mount
Mounting Type	Surface Mount
Package / Case	256-BBGA
Number of Pins	256
Supplier Device Package	256-PBGA (27x27)
Operating Temperature	0°C~85°C TJ
Packaging	Tray
Series	Virtex®
Published	2002
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Max Operating Temperature	85°C
Min Operating Temperature	0°C
Voltage - Supply	2.375V~2.625V
Base Part Number	XCV200
Number of I/O	180
RAM Size	7kB
Number of Logic Elements/Cells	5292
Total RAM Bits	57344
Number of Gates	236666
Number of LABs/CLBs	1176
Number of Logic Blocks (LABs)	1176
RoHS Status	Non-RoHS Compliant
Lead Free	Contains Lead

XCV200-4BG256C Overview

In the package 256-BBGA, this product is provided. A total of 180 I/Os are programmed to ensure a more coherent data transfer. The basic building blocks of logic contain 5292 logic elements/cells. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 2.375V~2.625V, this device operates with ease. This is a type of FPGA that is part of the Virtex® series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. As a result of space limitations, this FPGA model has been included in Tray. Fpga electronics is worth mentioning that this device provides 57344 bfpga electronics s of RAM. XCV200 is the base part number that can be used to identify related parts. The RAM si7kBe of this FPGA module reaches 7kB so as to guarantee the normal operation of the program during operation. The device has 256 pins which are included in the design. The FPGA is built as an array of 1176 latches or CLBs. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. This module can reach a maximum operating temperature of 85°C when operating at its maximum power. Fpga electronics is necessary to maintain an operating temperature higher than 0°C. A basic building block for this type of building block consists of 236666 gates. 1176 logic blocks (LABs) constitute its basic building block. As a supplier, 256-PBGA (27x27) is responsible for the package of its devices.

XCV200-4BG256C Features

180 I/Os
Up to 57344 RAM bits
256 LABs/CLBs
85°C gates
1176 logic blocks (LABs)

XCV200-4BG256C Applications

There are a lot of Xilinx Inc.
XCV200-4BG256C FPGAs applications.

Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics
Audio
Automotive
Consumer Electronics
Distributed Monetary Systems
Data Center

XCV200-4BG256C

In Stock

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SPECIFICATIONS

XCV200-4BG256C Overview

XCV200-4BG256C Features

XCV200-4BG256C Applications

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