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ContactWB3M200VD1T
WB3M200VD1T datasheet pdf and Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) product details from JAE Electronics stock available at Feilidi
- Manufacturer: JAE Electronics
- NO: 398-WB3M200VD1T
- Package: -
- Datasheet:
- Stock: 5008
- Description: WB3M200VD1T datasheet pdf and Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) product details from JAE Electronics stock available at Feilidi(Kg)
- Delivery:
- Payment:
In Stock
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| Parameters | |
|---|---|
| Contact Plating | Gold |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Housing Material | Thermoplastic |
| Packaging | Tray |
| Published | 2004 |
| Series | WB3 |
| Feature | Board Guide, Solder Retention |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | SMD/SMT |
| Connector Type | Plug, Outer Shroud Contacts |
| Number of Positions | 200 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Number of Rows | 2 |
| Pitch | 0.020 0.50mm |
| Current Rating | 500mA |
| Contact Finish | Gold |
| Housing Color | Black |
| Height | 4.7mm |
| Length | 56.7mm |
| Width | 7.1mm |
| Contact Finish Thickness | 30.0μin 0.76μm |
| Height Above Board | 0.185 4.70mm |
| Stack Height (Mating) | 5mm |
| RoHS Status | RoHS Compliant |
| Flammability Rating | UL94 V-0 |
| Lead Free | Lead Free |
WB3M200VD1T Description
WB3M200VD1T is a board-to-board connector compatible with PCI express. WB3M200VD1T is a board-to-board connector satisfying the specification of the transmission characteristics of PCI Express standard. The connector is suitable for connections between units that need TMDS transmissions， such as graphic cards and PCI Express. The Operating and Storage Temperature Range is between -40 and 85℃. And the transistor WB3M200VD1T is in the tray package.
WB3M200VD1T Features
Compliant with PCI Express Card Electrical Mechanical SPEC
High density 0.5mm pitch type yet having a high-level transmission characteristic and high-speed transmission is possible.
Contact configuration that enables transmission of PCI Express(X16), TMDS, VGA, and others.
IParallel board-to-board connection is possible. Stacking heights, 4mm, and 5mm are available.
IEMI shielding is applied.
Compatible with automatic mounting.
Available in embossed tape package.
WB3M200VD1T Applications
Automotive
Body electronics & lighting
Communications equipment
Datacom module
Personal electronics
Connected peripherals & printers
