IS42S16400J

SDRAM Memory IC 64Mbit Parallel 143 MHz 5.4 ns 54-TSOP II


  • Manufacturer: Integrated Silicon Solution, Inc. (ISSI)
  • NO: feilidi-IS42S16400J
  • Package: TSOP54
  • Datasheet: -
  • Stock: 1740
  • Description: SDRAM Memory IC 64Mbit Parallel 143 MHz 5.4 ns 54-TSOP II(Kg)

Qty

Unit Price

Ext Price

  • 10

    $9.05

    $90.52

  • 100

    $8.54

    $853.94

  • 500

    $8.06

    $4,028.00

  • 1000

    $7.60

    $7,600.00

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FedEx International, 5-7 business days.

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SPECIFICATIONS

Parameters

The 64Mb SDRAM is a high speed CMOS, dynamic

random-access memory designed to operate in 3.3V

memory systems containing 67,108,864 bits. Internally

configured as a quad-bank DRAM with a synchronous

interface. Each 16,777,216-bit bank is organized as 4,096

rows by 256 columns by 16 bits.

The 64Mb SDRAM includes an AUTO REFRESH MODE,

and a power-saving, power-down mode. All signals are

registered on the positive edge of the clock signal, CLK.

All inputs and outputs are LVTTL compatible.

The 64Mb SDRAM has the ability to synchronously burst

data at a high data rate with automatic column-address

generation, the ability to interleave between internal banks

to hide precharge time and the capability to randomly

change column addresses on each clock cycle during

burst access.

A self-timed row precharge initiated at the end of the burst

sequence is available with the AUTO PRECHARGE function

enabled. Precharge one bank while accessing one of the

other three banks will hide the precharge cycles and provide

seamless, high-speed, random-access operation.

SDRAM read and write accesses are burst oriented starting

at a selected location and continuing for a programmed

number of locations in a programmed sequence. The

registration of an ACTIVE command begins accesses,

followed by a READ or WRITE command. The ACTIVE

command in conjunction with address bits registered are

used to select the bank and row to be accessed (BA0,

BA1 select the bank; A0-A11 select the row). The READ

or WRITE commands in conjunction with address bits

registered are used to select the starting column location

for the burst access.

Programmable READ or WRITE burst lengths consist of

1, 2, 4 and 8 locations, or full page, with a burst terminate

option. 

FEATURES

• Clock frequency: 200, 166, 143, 133 MHz

• Fully synchronous; all signals referenced to a

positive clock edge

• Internal bank for hiding row access/precharge

• Single 3.3V power supply

• LVTTL interface

• Programmable burst length

– (1, 2, 4, 8, full page)

• Programmable burst sequence:

Sequential/Interleave

• Self refresh modes

• Auto refresh (CBR)

• 4096 refresh cycles every 64 ms (Com, Ind, A1

grade) or 16ms (A2 grade)

• Random column address every clock cycle

• Programmable CAS latency (2, 3 clocks)

• Burst read/write and burst read/single write

operations capability

• Burst termination by burst stop and precharge

command

OPTIONS

• Package:

54-pin TSOP II

54-ball TF-BGA (8mm x 8mm)

60-ball TF-BGA (10.1mm x 6.4mm)

• Operating Temperature Range

Commercial (0o

C to +70o

C)

Industrial (-40o

C to +85o

C)

Automotive Grade A1 (-40o

C to +85o

C)

Automotive Grade A2 (-40o

C to +105o

C)


In Stock

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