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ContactFI-SEB20P-HFE
FI Series 1-Row Receptacle Solder Copper Alloy Strip Board Edge, Cutout; Surface Mount, Right Angle Gold Liquid Crystal Polymer (LCP), Glass Filled 20-Position Board to Cable/Wire 0.077 1.95mm Height
- Manufacturer: JAE Electronics
- NO: 398-FI-SEB20P-HFE
- Package: -
- Datasheet:
- Stock: 668
- Description: FI Series 1-Row Receptacle Solder Copper Alloy Strip Board Edge, Cutout; Surface Mount, Right Angle Gold Liquid Crystal Polymer (LCP), Glass Filled 20-Position Board to Cable/Wire 0.077 1.95mm Height (Kg)
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| Parameters | |
|---|---|
| Current Rating | 1A |
| Pitch - Mating | 0.049 1.25mm |
| Insulation Color | Beige |
| Shrouding | Shrouded - 4 Wall |
| Lead Pitch | 1.25mm |
| Contact Finish - Post | Tin or Tin-Alloy |
| Insulation Resistance | 100MOhm |
| Contact Location | Side |
| Material Flammability Rating | UL94 V-0 |
| RoHS Status | RoHS Compliant |
| Flammability Rating | UL94 V-0 |
| Lead Free | Lead Free |
| Factory Lead Time | 14 Weeks |
| Contact Material | Copper Alloy |
| Mount | Edge |
| Mounting Type | Board Edge, Cutout; Surface Mount, Right Angle |
| Contact Shape | Square |
| Insulation Material | Liquid Crystal Polymer (LCP), Glass Filled |
| Housing Material | Polymer |
| Operating Temperature | -40°C~80°C |
| Packaging | Strip |
| Series | FI |
| Published | 2000 |
| Feature | Shielded, Solder Retention |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| Connector Type | Receptacle |
| Number of Positions | 20 |
| Number of Rows | 1 |
| Gender | Female |
| Voltage - Rated | 200V |
| Fastening Type | Friction Lock |
| Contact Finish - Mating | Gold |
| Contact Type | Male Pin |
| Current Rating (Amps) | 1A per Contact |
| Insulation Height | 0.077 1.95mm |
| Style | Board to Cable/Wire |
| Number of Positions Loaded | All |
