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ContactTelecom Interface ICs(3995)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Current - Supply | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Number of Terminations | Factory Lead Time | Interface | Lifecycle Status | Pbfree Code | Reach Compliance Code | Number of Functions | JESD-609 Code | Terminal Finish | Surface Mount | Max Power Dissipation | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Temperature Grade | Telecom IC Type | Operating Temperature (Max) | Operating Temperature (Min) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Number of Circuits | Qualification Status | JESD-30 Code | Supplier Device Package | Function | Power (Watts) |
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| VSC7224EV | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Not Applicable | /files/microchiptechnology-vsc7224ev-datasheets-3139.pdf | ||||||||||||||||||||||||||||||||||||||||||||||||
| VSC7111PCIEEV | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Not Applicable | /files/microchiptechnology-vsc7111ev-datasheets-2842.pdf | ||||||||||||||||||||||||||||||||||||||||||||||||
| VSC8584EV | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Not Applicable | |||||||||||||||||||||||||||||||||||||||||||||||||
| MAX20803ECM+T | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ||||||||||||||||||||||||||||||||||||||||||||||||||
| BCM88562A0KFSBG | Broadcom |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Vendor Undefined | |||||||||||||||||||||||||||||||||||||||||||||||||
| TDA18256HN/C1K | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | ROHS3 Compliant | 2017 | |||||||||||||||||||||||||||||||||||||||||||||||
| M83160G13 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | ROHS3 Compliant | 2014 | |||||||||||||||||||||||||||||||||||||||||||||||
| TDA18284HN/C1Y | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | ||||||||||||||||||||||||||||||||||||||||||||||
| BCM84540A1IFSBLG | Broadcom Limited |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ROHS3 Compliant | SPI | 4 | Ethernet | ||||||||||||||||||||||||||||||||||||||||||||||
| TDA18256HN/C1E | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | ROHS3 Compliant | 2017 | |||||||||||||||||||||||||||||||||||||||||||||||
| TEA1062AT/C4,112 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~75°C | Tube | 1 (Unlimited) | 900μA | ROHS3 Compliant | 1997 | /files/nxpusainc-tea1062ac4m1112-datasheets-2872.pdf | 16-SOIC (0.154, 3.90mm Width) | 9.9mm | 3.9mm | 16 | yes | e4 | NICKEL PALLADIUM GOLD | YES | 3.4V | DUAL | GULL WING | 260 | 2.7V | TEA1062 | TELEPHONE SPEECH CIRCUIT | 30 | 1 | Not Qualified | Low Voltage Transmission | 454mW | ||||||||||||||||||||||
| M83263G13 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 (72 Hours) | ROHS3 Compliant | 12 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||
| VSC7454YIH-02 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 (72 Hours) | /files/microchiptechnology-vsc7454yih02-datasheets-2928.pdf | ||||||||||||||||||||||||||||||||||||||||||||||||
| M82108G13 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | ROHS3 Compliant | 2014 | 672-BGA | ||||||||||||||||||||||||||||||||||||||||||||
| M83240G13 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | ROHS3 Compliant | 2014 | 12 Weeks | ||||||||||||||||||||||||||||||||||||||||||||||
| VSC7108VP-01 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~110°C | Tray | 1 (Unlimited) | RoHS Compliant | 2004 | /files/microchiptechnology-vsc7104xvp01-datasheets-1277.pdf | 36-FBGA | TTL/CMOS | 2.65W | 2.5V 3.3V | 8 | Octal Signal Conditioner | ||||||||||||||||||||||||||||||||||||
| VSC8489EV | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Not Applicable | |||||||||||||||||||||||||||||||||||||||||||||||||
| TDA18264HB/C1,557 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | 2016 | 80-TFQFN Exposed Pad | 13 Weeks | 16 | Transceiver | 2.55W | ||||||||||||||||||||||||||||||||||||||||
| TDA18285HN/C1Y | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | ||||||||||||||||||||||||||||||||||||||||||||||
| TDA18267HB/C1Y | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2016 | 13 Weeks | |||||||||||||||||||||||||||||||||||||||||||||
| TDA18264HB/C1Y | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2016 | 80-TFQFN Exposed Pad | 13 Weeks | 16 | Transceiver | 2.55W | ||||||||||||||||||||||||||||||||||||||||
| VSC8490YJU-13 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 4 (72 Hours) | 1.4mm | 15mm | 15mm | 196 | compliant | 1 | YES | BOTTOM | BALL | 1V | 1mm | INDUSTRIAL | TELECOM CIRCUIT | 110°C | -40°C | S-PBGA-B196 | ||||||||||||||||||||||||||||||||
| VSC7104VP-01 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~110°C | Tray | 1 (Unlimited) | 110°C | 0°C | RoHS Compliant | 2004 | /files/microchiptechnology-vsc7104xvp01-datasheets-1277.pdf | 69-FBGA | TTL/CMOS | 1.5W | 2.5V 3.3V | 4 | 69-BGA | Quad Signal Conditioner | 1.5W | ||||||||||||||||||||||||||||||||
| VSC8489YJU-10 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 (72 Hours) | 1.4mm | 15mm | 15mm | 196 | compliant | 1 | YES | BOTTOM | BALL | 1V | 1mm | INDUSTRIAL | ETHERNET TRANSCEIVER | 110°C | -40°C | S-PBGA-B196 | |||||||||||||||||||||||||||||||||
| BCM84793A1KFSBLG | Broadcom |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ROHS3 Compliant | /files/broadcomlimited-bcm84754a1kfsblg-datasheets-2845.pdf | Ethernet | 1 | Switch | |||||||||||||||||||||||||||||||||||||||||||||
| BU8874F | ROHM Semiconductor |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -10°C~70°C | 1 (Unlimited) | CMOS | 2.2mA | ROHS3 Compliant | /files/rohmsemiconductor-bu8874-datasheets-6078.pdf | 18-SOIC (0.213, 5.40mm Width) | 5.4mm | 18 | yes | e3/e2 | TIN/TIN COPPER | YES | 4.75V~5.25V | DUAL | GULL WING | 260 | 5V | DTMF SIGNALING CIRCUIT | 10 | Telecom Signaling Circuits | 5V | 1 | Not Qualified | Receiver, DTMF | 550mW | |||||||||||||||||||||||
| VSC7468YIH-01 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 (72 Hours) | Non-RoHS Compliant | /files/microchiptechnology-vsc7468yih01-datasheets-2903.pdf | LIMITED TIME BUY (Last Updated: 1 month ago) | ||||||||||||||||||||||||||||||||||||||||||||||
| MC34118DW | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -20°C~60°C | Tube | 1 (Unlimited) | 5.5mA | Non-RoHS Compliant | 2003 | /files/nxpusainc-mc34118dw-datasheets-2885.pdf | 28-SOIC (0.295, 7.50mm Width) | unknown | 3.5V~6.5V | MC34118 | SPEAKER PHONE CIRCUIT | 1 | Voice-Switched Speakerphone | |||||||||||||||||||||||||||||||||||
| MC33215BE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | -20°C~70°C | Tube | 1 (Unlimited) | ROHS3 Compliant | 1997 | /files/nxpusainc-mc33215be-datasheets-2904.pdf | 42-SDIP (0.600, 15.24mm) | MC33215 | 1 | 42-PDIP | Voice-Switched Speakerphone | ||||||||||||||||||||||||||||||||||||||
| BCM84756CKFSBLG | Broadcom |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ROHS3 Compliant | /files/broadcomlimited-bcm84754a1kfsblg-datasheets-2845.pdf | Serial | 4 | Line Card Access Switch |
