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ContactTelecom Interface ICs(3995)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Operating Supply Current | Current - Supply | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Max Supply Current | Number of Terminations | Factory Lead Time | Weight | REACH SVHC | Min Supply Voltage | Number of Pins | Interface | Lifecycle Status | Pbfree Code | ECCN Code | Contact Plating | Radiation Hardening | HTS Code | Number of Functions | JESD-609 Code | Terminal Finish | Applications | Surface Mount | Max Power Dissipation | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Temperature Grade | Telecom IC Type | Operating Temperature (Max) | Operating Temperature (Min) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Number of Circuits | Qualification Status | JESD-30 Code | Supplier Device Package | Data Rate | Logic Function | Function | Power (Watts) | Bus Compatibility | Boundary Scan | Low Power Mode | Number of Serial I/Os | Number of Transceivers | Clock Frequency | Communication Protocol | Neg Supply Voltage-Nom | Data Encoding/Decoding Method | Carrier Type |
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| PM4329-FEI | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 (72 Hours) | CMOS | ROHS3 Compliant | 276 | 8 Weeks | E1, J1, T1 | YES | BOTTOM | BALL | 1.8V | INDUSTRIAL | HDB3 ENCODER/DECODER | 85°C | -40°C | S-PBGA-B276 | Transceiver | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS2149Q+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tube | 3 (168 Hours) | 4.57mm | ROHS3 Compliant | 2003 | /files/maximintegrated-ds2149qntr-datasheets-6219.pdf | 28-LCC (J-Lead) | Lead Free | 28 | 6 Weeks | LIU | yes | EAR99 | e3 | Matte Tin (Sn) | YES | 4.75V~5.25V | QUAD | J BEND | 260 | 5V | DS2149 | PCM TRANSCEIVER | NOT SPECIFIED | Digital Transmission Interfaces | 5V | 1 | Not Qualified | S-PQCC-J28 | Line Interface Unit (LIU) | ||||||||||||||||||||||||||||||||||||||||||||||
| CMX605D4 | CML Microcircuits |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | 1 (Unlimited) | CMOS | 2.67mm | ROHS3 Compliant | 2012 | 16-SOIC (0.295, 7.50mm Width) | 10.26mm | 7.425mm | 16 | 10 Weeks | yes | 8542.39.00.01 | 1 | e3 | Matte Tin (Sn) | YES | DUAL | GULL WING | 260 | 3.3V | 1.27mm | 16 | TELECOM CIRCUIT | 40 | Other Telecom ICs | 3/5V | 0.011mA | Not Qualified | R-PDSO-G16 | |||||||||||||||||||||||||||||||||||||||||||||||
| PM5377-FEI | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | ROHS3 Compliant | /files/microchiptechnology-pm5377fgi-datasheets-2639.pdf | 10 Weeks | Microprocessor | YES | 1.2V | BOTTOM | BALL | 1.2V | 1 | SONET/SDH | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CMX641AD2 | CML Microcircuits |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | 3 (168 Hours) | CMOS | 5mA | ROHS3 Compliant | 2007 | 24-SOIC (0.295, 7.50mm Width) | 15.4mm | 7.5mm | 24 | 10 Weeks | yes | e3 | Matte Tin (Sn) | YES | 2.7V~5.5V | DUAL | GULL WING | 260 | 3V | TONE DECODER CIRCUIT | 40 | Telecom Signaling Circuits | 3/5V | 2 | Not Qualified | Detector/Generator | 800mW | |||||||||||||||||||||||||||||||||||||||||||||||||
| CMX631AD5 | CML Microcircuits |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | 1 (Unlimited) | 2.2mA | 2mm | ROHS3 Compliant | 2007 | 24-SSOP (0.209, 5.30mm Width) | 8.2mm | 5.3mm | 24 | 10 Weeks | yes | e3 | Matte Tin (Sn) | YES | 2.7V~5.5V | DUAL | GULL WING | 260 | 3V | 0.65mm | TONE DECODER CIRCUIT | 40 | Telecom Signaling Circuits | 3/5V | 1 | Not Qualified | R-PDSO-G24 | SPM Detector | 550mW | |||||||||||||||||||||||||||||||||||||||||||||||
| CMX602BE4 | CML Microcircuits |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | 1 (Unlimited) | CMOS | 2mA | ROHS3 Compliant | 1998 | 16-TSSOP (0.173, 4.40mm Width) | 5mm | 4.4mm | 16 | 10 Weeks | yes | e3 | Matte Tin (Sn) | YES | 2.7V~5.5V | DUAL | GULL WING | 260 | 3V | 0.65mm | TELEPHONE CALLING NO IDENTIFICATION CIRCUIT | 40 | Telecom Signaling Circuits | 3/5V | 1 | Not Qualified | Calling Line Identifier | 300mW | ||||||||||||||||||||||||||||||||||||||||||||||||
| BA1604F-E2 | ROHM Semiconductor |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 1 (Unlimited) | 10mA | ROHS3 Compliant | 1998 | /files/rohmsemiconductor-ba1604-datasheets-5948.pdf | 8-SOIC (0.173, 4.40mm Width) | 5mm | 4.4mm | 6V | Lead Free | 8 | 10 Weeks | 8 | yes | e3/e2 | TIN/TIN COPPER | 350mW | 4.75V~9V | DUAL | GULL WING | 260 | 5V | BA1604 | 10 | 1 | Not Qualified | Decoder | Tone Decoder | ||||||||||||||||||||||||||||||||||||||||||||||
| MT8952BP1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tube | 3 (168 Hours) | CMOS | 1μA | ROHS3 Compliant | 2001 | /files/microchiptechnology-mt8952bs1-datasheets-2859.pdf | 28-LCC (J-Lead) | 11.58mm | 4.57mm | 11.58mm | 5V | 28 | 7 Weeks | 1.182714g | 28 | yes | No | e3 | MATTE TIN | 4.75V~5.25V | QUAD | J BEND | 260 | 5V | 30 | 5V | 1 | 2.5 Mbps | Controller | 6800; 6809 | NO | NO | 1 | 5MHz | SYNC, HDLC; X.25 | NRZ | ||||||||||||||||||||||||||||||||||||||
| VSC7420XJQ-02 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SparX™-III-10um | Surface Mount | Tray | 4 (72 Hours) | 125°C | 0°C | ROHS3 Compliant | /files/microchiptechnology-vsc7421xjq02-datasheets-3083.pdf | TQFP | Lead Free | Serial | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 1 month ago) | 1V | 1 | 302-TQFP (24x24) | Ethernet Switch | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS2149QN+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tube | 3 (168 Hours) | 4.57mm | ROHS3 Compliant | 2003 | /files/maximintegrated-ds2149qntr-datasheets-6219.pdf | 11.5062mm | 11.5062mm | Lead Free | 28 | 13 Weeks | yes | EAR99 | 8542.39.00.01 | 1 | e3 | Matte Tin (Sn) | YES | QUAD | J BEND | 260 | 5V | 1.27mm | 28 | INDUSTRIAL | PCM TRANSCEIVER | 85°C | -40°C | NOT SPECIFIED | Digital Transmission Interfaces | 5V | Not Qualified | S-PQCC-J28 | |||||||||||||||||||||||||||||||||||||||||||||
| VSC8522XJQ-04 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 1 (Unlimited) | 125°C | -40°C | ROHS3 Compliant | /files/microchiptechnology-vsc8522xjq02-datasheets-3141.pdf | 302-TQFP | 12 Weeks | 302-TQFP (24x24) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS21554LN+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | CMOS | 75mA | ROHS3 Compliant | 2003 | /files/maximintegrated-ds21354ln-datasheets-2737.pdf | 100-LQFP | Lead Free | 100 | 16 Weeks | E1, HDLC, J1, T1 | yes | EAR99 | e3 | Tin (Sn) | YES | 4.75V~5.25V | QUAD | GULL WING | 260 | 5V | 0.5mm | DS21554 | PCM TRANSCEIVER | 30 | Other Telecom ICs | 5V | 1 | Not Qualified | Single-Chip Transceiver | |||||||||||||||||||||||||||||||||||||||||||||
| CMX654D4 | CML Microcircuits |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | 1 (Unlimited) | CMOS | 2.5mA | 2.65mm | ROHS3 Compliant | 1998 | 16-SOIC (0.295, 7.50mm Width) | 7.5mm | 16 | 10 Weeks | yes | e3 | Matte Tin (Sn) | YES | 3V~3.6V | DUAL | GULL WING | 260 | 3V | MODEM-MODULATOR | 40 | Modems | 3.3/5V | 1 | Not Qualified | Transmit Modulator | 800mW | |||||||||||||||||||||||||||||||||||||||||||||||||
| PM4351-RGI | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | 3 (168 Hours) | ROHS3 Compliant | /files/microchiptechnology-pm4351ngi-datasheets-6432.pdf | 80-QFP | 8 Weeks | E1, J1, T1 | 3.3V | 80-MQFP (14x14) | Transceiver | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS21354LC1+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | CMOS | 75mA | ROHS3 Compliant | 2004 | /files/maximintegrated-ds21354ln-datasheets-2737.pdf | 100-LQFP | 3.3V | 75mA | 100 | 10 Weeks | 100 | E1, HDLC | yes | EAR99 | No | e3 | Matte Tin (Sn) | 3.14V~3.47V | QUAD | GULL WING | 260 | 3.3V | 0.5mm | DS21354 | 1 | 1.544 Mbps | Transceiver | Single-Chip Transceiver | |||||||||||||||||||||||||||||||||||||||||||||
| VSC7424XJG-02 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SparX™-III-10 | Surface Mount | Tray | 4 (72 Hours) | ROHS3 Compliant | 672-BGA | Lead Free | 11 Weeks | Serial | IN PRODUCTION (Last Updated: 1 month ago) | 1V | 1 | 672-HSBGA (27x27) | 1 Gbps | Ethernet Switch | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| BCM63381KMMLG | Broadcom |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | ROHS3 Compliant | 22 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT9076BP1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tube | 3 (168 Hours) | 85mA | 4.57mm | ROHS3 Compliant | 2011 | /files/microchiptechnology-mt9076bb1-datasheets-3854.pdf | 68-LCC (J-Lead) | 24.23mm | 24.23mm | 3.3V | 98mA | 68 | 7 Weeks | 68 | No | e3 | MATTE TIN | 3V~3.6V | QUAD | J BEND | 260 | 3.3V | FRAMER | 30 | Other Telecom ICs | 1 | 8.192 Mbps | Transceiver | ||||||||||||||||||||||||||||||||||||||||||||||
| VSC7422XJQ-02 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SparX™-III-25um | Surface Mount | Tray | 4 (72 Hours) | ROHS3 Compliant | /files/microchiptechnology-vsc7421xjq02-datasheets-3083.pdf | 5 Weeks | Serial | 1V | 1 | 302-TQFP (24x24) | Ethernet Switch | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| BCM63168UKFEBG | Broadcom |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 (72 Hours) | ROHS3 Compliant | 22 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS21554L+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | CMOS | 75mA | ROHS3 Compliant | 2003 | /files/maximintegrated-ds21354ln-datasheets-2737.pdf | 100-LQFP | Lead Free | 100 | 13 Weeks | E1, HDLC, J1, T1 | yes | EAR99 | e3 | Matte Tin (Sn) | YES | 4.75V~5.25V | QUAD | GULL WING | 260 | 5V | 0.5mm | DS21554 | PCM TRANSCEIVER | 30 | Other Telecom ICs | 5V | 1 | Not Qualified | Single-Chip Transceiver | |||||||||||||||||||||||||||||||||||||||||||||
| VSC8662XIC-03 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | 100°C | -40°C | 2mm | ROHS3 Compliant | /files/microchiptechnology-vsc8662xic-datasheets-6374.pdf | 256-BGA | 256 | 9 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | YES | BOTTOM | BALL | 1.2V | INDUSTRIAL | 1 | S-PBGA-B256 | 1.25 Gbps | Ethernet | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS21554LB+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | CMOS | 75mA | ROHS3 Compliant | 2003 | /files/maximintegrated-ds21354ln-datasheets-2737.pdf | 100-LQFP | 5V | Contains Lead | 75mA | 100 | 13 Weeks | 1.319103g | 100 | E1, HDLC, J1, T1 | yes | EAR99 | No | e3 | Matte Tin (Sn) | 4.75V~5.25V | QUAD | GULL WING | 260 | 5V | 0.5mm | DS21554 | 1.544 Mbps | Transceiver | Single-Chip Transceiver | 1 | |||||||||||||||||||||||||||||||||||||||||||
| DS21Q59L+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | CMOS | 230mA | 1.6mm | ROHS3 Compliant | 2004 | /files/maximintegrated-ds21q59l-datasheets-6046.pdf | 100-LQFP | Lead Free | 100 | 12 Weeks | E1 | yes | EAR99 | e3 | Matte Tin (Sn) | YES | 3.14V~3.47V | QUAD | GULL WING | 260 | 3.3V | 0.5mm | DS21Q59 | FRAMER | NOT SPECIFIED | Other Telecom ICs | 3.3V | 4 | Not Qualified | S-PQFP-G100 | Transceiver | CEPT PCM-30/E-1 | ||||||||||||||||||||||||||||||||||||||||||
| LT1684CS#PBF | Linear Technology / Analog Devices |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~125°C | Tube | 1 (Unlimited) | BIPOLAR | ROHS3 Compliant | 2000 | /files/lineartechnologyanalogdevices-lt1684cnpbf-datasheets-5756.pdf | 14-SOIC (0.154, 3.90mm Width) | 8.649mm | 3.899mm | 10V | Lead Free | 14 | 8 Weeks | 6.5V | 14 | PRODUCTION (Last Updated: 6 days ago) | EAR99 | e3 | Matte Tin (Sn) | DUAL | GULL WING | 260 | 10V | LT1684 | TELEPHONE RINGER CIRCUIT | 30 | Telephone Circuits | 0.00095mA | 1 | Not Qualified | Tone Generator | -10V | |||||||||||||||||||||||||||||||||||||||||||
| VSC8502XML-03 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 4 (72 Hours) | 125°C | -40°C | ROHS3 Compliant | 2010 | /files/microchiptechnology-vsc8502xml-datasheets-2919.pdf | QFN | 7 Weeks | Ethernet | 3.3V | 1 | 135-QFN (12x12) | Ethernet | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| VSC7426XJG-02 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SparX™-III-24 | Surface Mount | Tray | 4 (72 Hours) | 2.44mm | ROHS3 Compliant | 672-BGA | 27mm | 27mm | 672 | 11 Weeks | Serial | YES | 1V | BOTTOM | BALL | 1V | OTHER | TELECOM CIRCUIT | 1 | S-PBGA-B672 | Ethernet Switch | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 78P2351-IGT/F | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | CMOS | 160mA | ROHS3 Compliant | 2006 | /files/maximintegrated-78p2351igtrf-datasheets-1318.pdf | 100-LQFP | 100 | 6 Weeks | 1.319103g | Unknown | 100 | no | Tin | 1 | e3 | SDH | 3.15V~3.45V | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.5mm | 78P2351 | 100 | ATM/SONET/SDH TRANSCEIVER | NOT SPECIFIED | Digital Transmission Interfaces | 3.3V | 1 | Not Qualified | 140 Mbps | ||||||||||||||||||||||||||||||||||||||||||
| DS21352L+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | CMOS | 75mA | ROHS3 Compliant | 2001 | /files/maximintegrated-ds21552l-datasheets-5397.pdf | 100-LQFP | Lead Free | 100 | 13 Weeks | HDLC, T1 | yes | EAR99 | e3 | Matte Tin (Sn) | YES | 3.14V~3.47V | QUAD | GULL WING | 260 | 3.3V | 0.5mm | DS21352 | PCM TRANSCEIVER | 30 | Other Telecom ICs | 3.3V | 1 | Not Qualified | Single-Chip Transceiver |
