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ContactTelecom Interface ICs(3995)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | Max Operating Temperature | Min Operating Temperature | Technology | Operating Supply Current | Current - Supply | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | REACH SVHC | Number of Pins | Interface | Lifecycle Status | Pbfree Code | Thickness | ECCN Code | Contact Plating | Radiation Hardening | Reach Compliance Code | Number of Functions | JESD-609 Code | Terminal Finish | Applications | Polarity | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Temperature Grade | Telecom IC Type | Operating Temperature (Max) | Operating Temperature (Min) | Time@Peak Reflow Temperature-Max (s) | Input Bias Current | Subcategory | Power Supplies | Slew Rate | Number of Circuits | Qualification Status | JESD-30 Code | Supplier Device Package | Data Rate | Differential Output | Input Characteristics | Gain Bandwidth Product | Propagation Delay | Function | Power (Watts) | Number of Transmitters | Supply Voltage1-Nom | Number of Input Lines | Negative Supply Voltage-Nom | Driver Number of Bits | Interface Standard | Transmit Delay-Max | Output Characteristics | Max I/O Voltage |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 82V2042EPFG | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/renesaselectronicsamericainc-82v2042epfg-datasheets-3158.pdf | 80-LQFP | 13 Weeks | LIU | 3.13V~3.47V | IDT82V2042E | 80-TQFP (14x14) | Line Interface Unit (LIU) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LE87285NQC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | ROHS3 Compliant | /files/microchiptechnology-le87285nqc-datasheets-3273.pdf | 16-QFN | 4mm | 4mm | 16 | 10 Weeks | YES | QUAD | NO LEAD | 12V | 0.65mm | INDUSTRIAL | 85°C | -40°C | 1 | NO | STANDARD | Line Driver | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LE87271EQCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | 26.1mA | ROHS3 Compliant | 20-VFQFN Exposed Pad | 7 Weeks | 12.6V~15.4V | 1 | Line Driver | 1.37W | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| VSC8479YYY | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -5°C~90°C | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 244-BBGA, FCBGA | 7 Weeks | I2C, SPI | IN PRODUCTION (Last Updated: 1 month ago) | YES | 1.8V | BOTTOM | BALL | 1.8V | 1 | S-PBGA-B244 | 11.3 Gbps | Transceiver | 16 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 78P2352-IGT/F | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Bulk | 3 (168 Hours) | 325mA | 1.6mm | ROHS3 Compliant | 2006 | /files/maximintegrated-78p2352igtf-datasheets-3165.pdf | 128-LQFP Exposed Pad | 14mm | 14mm | 128 | 10 Weeks | CMOS | no | 5A991 | Tin | SONET;SDH | 3.15V~3.45V | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.4mm | 78P2352 | ATM/SONET/SDH TRANSCEIVER | NOT SPECIFIED | Digital Transmission Interfaces | 3.3V | 2 | Not Qualified | Line Interface Unit (LIU) | |||||||||||||||||||||||||||||||||||||||||||||
| DS21448L+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | 320mA | 1.6mm | ROHS3 Compliant | 2006 | /files/maximintegrated-ds21448l-datasheets-3172.pdf | 128-LQFP | 20mm | Lead Free | 128 | 16 Weeks | 128 | yes | EAR99 | e3 | Matte Tin (Sn) | YES | 3.135V~3.465V | QUAD | GULL WING | 260 | 3.3V | 0.5mm | DS21448 | PCM TRANSCEIVER | 30 | Digital Transmission Interfaces | 3.3V | 4 | Not Qualified | Line Interface Unit (LIU) | |||||||||||||||||||||||||||||||||||||||||||||
| DS2148T+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | CMOS | 95mA | ROHS3 Compliant | 2006 | /files/maximintegrated-ds2148t-datasheets-3182.pdf | 44-TQFP | Lead Free | 44 | 6 Weeks | LIU | yes | EAR99 | e3 | Matte Tin (Sn) | YES | 4.75V~5.25V | QUAD | GULL WING | 260 | 5V | 0.8mm | DS2148 | PCM TRANSCEIVER | 30 | Digital Transmission Interfaces | 5V | 1 | Not Qualified | S-PQFP-G44 | Line Interface Unit (LIU) | |||||||||||||||||||||||||||||||||||||||||||||
| VSC7224XJV-01 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | 2010 | 48-QFN | 1.2V | Lead Free | 4 Weeks | 2-Wire | IN PRODUCTION (Last Updated: 1 month ago) | 1.2V | 1 | 48-QFN (5x9) | 11.5 Gbps | Channel Extender | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| VSC7421XJQ-02 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SparX™-III-17um | Surface Mount | Tray | 4 (72 Hours) | 125°C | 0°C | ROHS3 Compliant | /files/microchiptechnology-vsc7421xjq02-datasheets-3083.pdf | TQFP | 6 Weeks | Serial | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 1 month ago) | 1V | 1 | 302-TQFP (24x24) | 1 Gbps | Ethernet Switch | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| VSC8486YJB-11 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 (72 Hours) | 1.4mm | ROHS3 Compliant | 2010 | /files/microchiptechnology-vsc8486yjb11-datasheets-2996.pdf | 13mm | 13mm | Lead Free | 144 | 6 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | unknown | 1 | YES | BOTTOM | BALL | 1.2V | 1mm | INDUSTRIAL | ETHERNET TRANSCEIVER | 85°C | -40°C | S-PBGA-B144 | 0.01 Mbps | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| VSC8664XIC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | 90°C | 0°C | ROHS3 Compliant | /files/microchiptechnology-vsc8664xic03-datasheets-2977.pdf | BGA | Lead Free | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 1 | 256-BGA (17x17) | 1.25 Gbps | Ethernet | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| VSC8258YMR-01 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 4 (72 Hours) | ROHS3 Compliant | /files/microchiptechnology-vsc8258ymr01-datasheets-3001.pdf | 256-BBGA, FCBGA | 5 Weeks | SPI | 970mV 1.2V | 4 | 256-FCBGA (17x17) | Ethernet | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| THS6214IPWP | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tube | 2 (1 Year) | SMD/SMT | ROHS3 Compliant | 24-TSSOP (0.173, 4.40mm Width) Exposed Pad | 7.8mm | 1.2mm | 4.4mm | Lead Free | 24 | 6 Weeks | No SVHC | 24 | ACTIVE (Last Updated: 1 week ago) | yes | 1mm | EAR99 | No | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | Non-Inverting | YES | 10V~28V | DUAL | GULL WING | 260 | 6V | 0.65mm | THS6214 | 3.5μA | Line Driver or Receivers | 3800 V/μs | NO | DIFFERENTIAL | 160MHz | 1 μs | VDSL2 Line Driver Amplifier | 12V | 2 | -6V | 1 | GENERAL PURPOSE | 1 ns | DIFFERENTIAL | 50mV | ||||||||||||||||||||||||||||||||
| VSC8489YJU-17 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~110°C | Tray | 4 (72 Hours) | ROHS3 Compliant | /files/microchiptechnology-vsc8489yju17-datasheets-3019.pdf | 196-LBGA, FCBGA | 7 Weeks | SPI | 1V 1.2V | 2 | 196-FCBGA (15x15) | Ethernet | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS21348T+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | 66mA | ROHS3 Compliant | 2002 | /files/maximintegrated-ds21348tn-datasheets-2887.pdf | 44-TQFP | Lead Free | 44 | 13 Weeks | 44 | yes | EAR99 | e3 | Matte Tin (Sn) | YES | 3.135V~3.465V | QUAD | GULL WING | 260 | 3.3V | 0.8mm | DS21348 | PCM TRANSCEIVER | 30 | Digital Transmission Interfaces | 3.3V | 1 | Not Qualified | Line Interface Unit (LIU) | |||||||||||||||||||||||||||||||||||||||||||||||
| VSC8658XHJ | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 4 (72 Hours) | 90°C | 0°C | ROHS3 Compliant | /files/microchiptechnology-vsc8658xhj-datasheets-3025.pdf | 444-BGA Exposed Pad | 7 Weeks | 444 | Ethernet | IN PRODUCTION (Last Updated: 1 month ago) | 1 | 444-BGA (27x27) | 1.25 Gbps | Ethernet | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS21354LB+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | CMOS | 75mA | ROHS3 Compliant | 2004 | /files/maximintegrated-ds21354ln-datasheets-2737.pdf | 100-LQFP | 100 | 10 Weeks | E1, HDLC | yes | EAR99 | e3 | Matte Tin (Sn) | YES | 3.14V~3.47V | QUAD | GULL WING | 260 | 3.3V | 0.5mm | DS21354 | PCM TRANSCEIVER | NOT SPECIFIED | 1 | Not Qualified | Single-Chip Transceiver | |||||||||||||||||||||||||||||||||||||||||||||||||
| VSC8531XMW-05 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | 3 (168 Hours) | ROHS3 Compliant | /files/microchiptechnology-vsc8531xmw02-datasheets-2801.pdf | 48-VFQFN Exposed Pad | 4 Weeks | RMII | 1 | 48-QFN (6x6) | Ethernet | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| TDA19972AEL/C1E | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | ROHS3 Compliant | 2017 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CPC7514Z | IXYS / Littelfuse |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~110°C | Tube | 1 (Unlimited) | 110°C | -40°C | 4.5mA | 4.5mA | ROHS3 Compliant | 2013 | /files/ixys-cpc7514z-datasheets-1903.pdf | 20-SOIC (0.295, 7.50mm Width) | 10 Weeks | 3V~3.6V | 2 | 20-SOIC | Line Card Access Switch | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| VSC7110XJW | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~110°C | Tray | 4 (72 Hours) | ROHS3 Compliant | 2017 | 32-VFQFN Exposed Pad | 7 Weeks | 2.5V | 2 | 32-QFN (5x5) | Signal Conditioner | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| TDA18284HN/C1E | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| VSC7113XJW | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~110°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 32-TFQFN Exposed Pad | 7 Weeks | 2.5V | 2 | 32-QFN (5x5) | Signal Conditioner | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| VSC8541XMV-05 | Microchip Technology | $8.38 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | 3 (168 Hours) | ROHS3 Compliant | /files/microchiptechnology-vsc8541xmv05-datasheets-2956.pdf | 68-VFQFN Exposed Pad | 7 Weeks | GMII, MII, RMII | 1 | 68-QFN (8x8) | Ethernet | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| VSC7414XKT-01 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SparX™-III-11 | Surface Mount | Tray | 4 (72 Hours) | ROHS3 Compliant | 284-TQFP Exposed Pad | 2-Wire | 1.2V | 1 | Channel Extender | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| VSC8584XKS-11 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 4 (72 Hours) | 125°C | 0°C | ROHS3 Compliant | 2013 | /files/microchiptechnology-vsc8584xks11-datasheets-2963.pdf | 256-BGA | 256 | 7 Weeks | GMII, SerDes, SPI, TBI | IN PRODUCTION (Last Updated: 1 month ago) | unknown | YES | 1V | BOTTOM | BALL | 2.5V | OTHER | 1 | S-PBGA-B256 | Ethernet | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| TDA19972BEL/C1E | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | ROHS3 Compliant | 2017 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| VSC8514XMK | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~110°C | Tray | 3 (168 Hours) | 125°C | 0°C | ROHS3 Compliant | /files/microchiptechnology-vsc8514xmk-datasheets-2969.pdf | QFN | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 2.5V | 2 | 138-QFN (12x12) | 1 Gbps | Signal Conditioner | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| VSC8575XKS-11 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/microchiptechnology-vsc8575xks11-datasheets-3063.pdf | 256-BGA | 7 Weeks | 256-PBGA (17x17) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| VSC8664XIC-03 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | 100°C | -40°C | ROHS3 Compliant | /files/microchiptechnology-vsc8664xic03-datasheets-2977.pdf | BGA | Lead Free | 5 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 1 | 256-BGA (17x17) | 1.25 Gbps | Ethernet |
