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ContactTelecom Interface ICs(3995)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Current - Supply | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Number of Pins | Interface | Pbfree Code | ECCN Code | Radiation Hardening | Reach Compliance Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Temperature Grade | Telecom IC Type | Operating Temperature (Max) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Number of Circuits | Qualification Status | JESD-30 Code | Supplier Device Package | Data Rate | Function | Power (Watts) | Number of Transceivers | Neg Supply Voltage-Nom |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| CYP15G0402DXB-BGXC | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HOTlink II™ | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | BICMOS | 830mA | ROHS3 Compliant | /files/rochesterelectronicsllc-cyp15g0402dxbbgxc-datasheets-4300.pdf | 256-LBGA Exposed Pad | 27mm | 27mm | 256 | LVTTL | yes | unknown | 1 | e1 | TIN SILVER COPPER | YES | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | 1.27mm | 256 | TELECOM CIRCUIT | 20 | 4 | COMMERCIAL | S-PBGA-B256 | |||||||||||||||||||||||
| LE87614MQC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 1mm | ROHS3 Compliant | 5mm | 4mm | 28 | 10 Weeks | 1 | YES | QUAD | NO LEAD | 12V | 0.5mm | OTHER | SLIC | 85°C | R-XQCC-N28 | ||||||||||||||||||||||||||||||||||||||
| CYP15G0401RB-BGXC | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HOTlink II™ | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | BICMOS | 640mA | ROHS3 Compliant | /files/rochesterelectronicsllc-cyp15g0401rbbgxc-datasheets-4303.pdf | 256-LBGA Exposed Pad | 27mm | 27mm | 256 | LVTTL | yes | unknown | e1 | TIN SILVER COPPER | YES | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | 1.27mm | TELECOM CIRCUIT | 20 | 4 | COMMERCIAL | S-PBGA-B256 | Receiver | ||||||||||||||||||||||||
| DS21Q48A3N | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tube | 3 (168 Hours) | 95mA | Non-RoHS Compliant | /files/rochesterelectronicsllc-ds21q48a3n-datasheets-4304.pdf | 144-BBGA | LIU | 4.75V~5.25V | 144-PBGA (17x17) | Line Interface Unit (LIU) | |||||||||||||||||||||||||||||||||||||||||||
| DS2176Q+ | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tube | 1 (Unlimited) | 5mA | ROHS3 Compliant | /files/rochesterelectronicsllc-ds2176q-datasheets-4305.pdf | 28-LCC (J-Lead) | TDM | 1 | 28-PLCC (11.51x11.51) | Receive Buffer | |||||||||||||||||||||||||||||||||||||||||||
| DS2194 | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS3152B1 | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 150mA | 1.76mm | Non-RoHS Compliant | /files/rochesterelectronicsllc-ds3151-datasheets-4167.pdf | 144-BGA, CSPBGA | 13mm | 13mm | 144 | LIU | no | NOT SPECIFIED | YES | 3.135V~3.465V | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 1mm | PCM TRANSCEIVER | NOT SPECIFIED | 2 | COMMERCIAL | S-PBGA-B144 | Line Interface Unit (LIU) | |||||||||||||||||||||||||||
| HC55185AIM | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | RSLIC18 | Surface Mount | -40°C~85°C | Tube | 1 (Unlimited) | BIPOLAR | 4.57mm | Non-RoHS Compliant | /files/rochesterelectronicsllc-hc5526cp-datasheets-2669.pdf | 28-LCC (J-Lead) | 28 | no | e0 | TIN LEAD | YES | QUAD | J BEND | 225 | 5V | 30 | 1 | Not Qualified | S-PQCC-J28 | Subscriber Line Interface Concept (SLIC) | |||||||||||||||||||||||||||||||
| DS21Q42TN | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tube | 3 (168 Hours) | CMOS | 75mA | 1.6mm | Non-RoHS Compliant | /files/rochesterelectronicsllc-ds21q42tn-datasheets-4241.pdf | 128-LQFP | 20mm | 128 | Parallel/Serial | no | unknown | 1 | e0 | TIN LEAD | YES | 2.97V~3.63V | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 128 | FRAMER | 20 | 4 | COMMERCIAL | R-PQFP-G128 | ||||||||||||||||||||||||
| DS3151NB1 | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 75mA | Non-RoHS Compliant | 144-BGA, CSPBGA | LIU | 3.135V~3.465V | 1 | 144-TECSBGA (13x13) | Line Interface Unit (LIU) | |||||||||||||||||||||||||||||||||||||||||||
| DS21Q44T | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tube | 3 (168 Hours) | CMOS | 75mA | 1.6mm | Non-RoHS Compliant | /files/rochesterelectronicsllc-ds21q44t-datasheets-4242.pdf | 128-LQFP | 20mm | 128 | Parallel/Serial | no | unknown | 1 | e0 | TIN LEAD | YES | 2.97V~3.63V | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 128 | FRAMER | 20 | 4 | COMMERCIAL | R-PQFP-G128 | ||||||||||||||||||||||||
| SI32176-B-FM1R | Silicon Labs |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ProSLIC® | Surface Mount | Surface Mount | 0°C~70°C | Tape & Reel (TR) | 3 (168 Hours) | RoHS Compliant | 2000 | /files/siliconlabs-si32176bgm1r-datasheets-3570.pdf | 42-WFQFN Exposed Pad | 8 Weeks | GCI, PCM, SPI | yes | 3.3V | TELECOM CIRCUIT | 1 | Subscriber Line Interface Concept (SLIC), CODEC | ||||||||||||||||||||||||||||||||||||||
| LC85405JE-E | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| CYP15G0201DXB-BBXC | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HOTlink II™ | Surface Mount | Surface Mount | 0°C~70°C | Tray | 5 (48 Hours) | BICMOS | 570mA | 1.5mm | ROHS3 Compliant | 2003 | /files/cypresssemiconductorcorp-cyp15g0201dxbbbxc-datasheets-4216.pdf | 196-LBGA | 15mm | 3.3V | Lead Free | 196 | 13 Weeks | 196 | LVTTL | yes | 5A991.B.1 | No | 700mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | 1mm | CY*15G02 | 20 | Network Interfaces | 2 | 1500000 Mbps | Transceiver | 2 | ||||||||||||||||
| DS2174Q | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tube | 3 (168 Hours) | 50mA | 4.57mm | Non-RoHS Compliant | /files/rochesterelectronicsllc-ds2174qn-datasheets-4178.pdf | 44-LCC (J-Lead) | 44 | E1, J1, T1 | no | unknown | e0 | TIN LEAD | YES | 3V~3.6V | QUAD | J BEND | 245 | 3.3V | TELECOM CIRCUIT | NOT SPECIFIED | 1 | COMMERCIAL | S-PQCC-J44 | Enhanced Bit Error Rate Tester (EBERT) | ||||||||||||||||||||||||||||
| HC55130IM | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | UniSLIC14 | Surface Mount | -40°C~85°C | Tube | 3 (168 Hours) | 2.25mA | Non-RoHS Compliant | /files/rochesterelectronicsllc-hc55150cm-datasheets-4082.pdf | 28-LCC (J-Lead) | 28 | YES | 4.75V~5.25V | QUAD | J BEND | 5V | 1 | COMMERCIAL | S-PQCC-J28 | Subscriber Line Interface Concept (SLIC) | 1.5W | |||||||||||||||||||||||||||||||||||
| DS3253A3 | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 220mA | Non-RoHS Compliant | 144-BGA, CSPBGA | LIU | 3.135V~3.465V | 3 | 144-TECSBGA (13x13) | Line Interface Unit (LIU) | |||||||||||||||||||||||||||||||||||||||||||
| DS2155L | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | 75mA | Non-RoHS Compliant | /files/rochesterelectronicsllc-ds2155gnb-datasheets-4140.pdf | 100-LQFP | 100 | E1, HDLC, J1, T1 | no | unknown | e0 | TIN LEAD | YES | 3.14V~3.47V | QUAD | GULL WING | 240 | 3.3V | 0.5mm | FRAMER | 20 | 1 | COMMERCIAL | Single-Chip Transceiver | |||||||||||||||||||||||||||||
| DS3152+ | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | 150mA | 1.76mm | ROHS3 Compliant | /files/rochesterelectronicsllc-ds3151-datasheets-4167.pdf | 144-BGA, CSPBGA | 13mm | 13mm | 144 | LIU | yes | unknown | e1 | TIN SILVER COPPER | YES | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | 1mm | PCM TRANSCEIVER | NOT SPECIFIED | 2 | COMMERCIAL | S-PBGA-B144 | Line Interface Unit (LIU) | |||||||||||||||||||||||||
| HC5513BIM | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | UniSLIC14 | Through Hole | -40°C~85°C | Tube | 3 (168 Hours) | 2.25mA | Non-RoHS Compliant | /files/rochesterelectronicsllc-hc5513bim-datasheets-4225.pdf | 22-DIP (0.400, 10.16mm) | 28 | no | e0 | TIN LEAD | YES | QUAD | J BEND | NOT SPECIFIED | 5V | NOT SPECIFIED | 1 | COMMERCIAL | S-PQCC-J28 | Subscriber Line Interface Concept (SLIC) | 1.5W | -5V | ||||||||||||||||||||||||||||||
| VSC7435XMT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Serval™-TE | Surface Mount | Tray | 4 (72 Hours) | ROHS3 Compliant | 2017 | /files/microchiptechnology-vsc7435xmt-datasheets-4226.pdf | 324-BGA | 7 Weeks | 324-BGA (19x19) | |||||||||||||||||||||||||||||||||||||||||||||
| DS3253N | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 220mA | 1.76mm | Non-RoHS Compliant | /files/rochesterelectronicsllc-ds3251n-datasheets-4152.pdf | 144-BGA, CSPBGA | 144 | LIU | no | NOT SPECIFIED | YES | 3.135V~3.465V | BOTTOM | BALL | 240 | 3.3V | 1mm | PCM TRANSCEIVER | 20 | 3 | COMMERCIAL | S-PBGA-B144 | Line Interface Unit (LIU) | |||||||||||||||||||||||||||||
| DS2175+ | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | -40°C~85°C | Tube | 1 (Unlimited) | CMOS | 9mA | 2.65mm | ROHS3 Compliant | /files/rochesterelectronicsllc-ds2175sn-datasheets-4106.pdf | 16-DIP (0.300, 7.62mm) | 7.5mm | 16 | PCM | no | e0 | TIN LEAD | YES | 4.5V~5.5V | DUAL | GULL WING | 245 | 5V | ELASTIC BUFFER | NOT SPECIFIED | 1 | COMMERCIAL | Elastic Store | ||||||||||||||||||||||||||||
| BGT60E6327XTSA1 | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | 1mA~4mA | Non-RoHS Compliant | 119-WFBGA, WLBGA | 1 | PG-WFWLB-119-1 | Transceiver | ||||||||||||||||||||||||||||||||||||||||||||||
| DS2151QNB | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tube | 3 (168 Hours) | CMOS | 65mA | 4.572mm | Non-RoHS Compliant | /files/rochesterelectronicsllc-ds2151qb-datasheets-4208.pdf | 44-LCC (J-Lead) | 44 | T1 | no | e0 | TIN LEAD | YES | 4.75V~5.25V | QUAD | J BEND | 240 | 5V | FRAMER | 20 | 1 | COMMERCIAL | S-PQCC-J44 | Single-Chip Transceiver | ||||||||||||||||||||||||||||
| DS3152N+ | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 150mA | 1.76mm | ROHS3 Compliant | /files/rochesterelectronicsllc-ds3151-datasheets-4167.pdf | 144-BGA, CSPBGA | 13mm | 13mm | 144 | LIU | yes | unknown | e1 | TIN SILVER COPPER | YES | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | 1mm | PCM TRANSCEIVER | NOT SPECIFIED | 2 | COMMERCIAL | S-PBGA-B144 | Line Interface Unit (LIU) | |||||||||||||||||||||||||
| CYP15G0401TB-BGI | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HOTlink II™ | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | BICMOS | 590mA | Non-RoHS Compliant | /files/rochesterelectronicsllc-cyp15g0401tbbgc-datasheets-4172.pdf | 256-LBGA Exposed Pad | 27mm | 27mm | 256 | LVTTL | no | unknown | e0 | TIN LEAD | YES | 3.135V~3.465V | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 1.27mm | TELECOM CIRCUIT | NOT SPECIFIED | 4 | COMMERCIAL | S-PBGA-B256 | Driver | ||||||||||||||||||||||||
| ISL5585GCM | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~85°C | Tube | 1 (Unlimited) | BIPOLAR | 4.57mm | Non-RoHS Compliant | /files/rochesterelectronicsllc-isl5585fcm-datasheets-4113.pdf | 28-LCC (J-Lead) | 28 | no | e0 | TIN LEAD | YES | 3.3V | QUAD | J BEND | 240 | 3.3V | NOT SPECIFIED | 1 | COMMERCIAL | S-PQCC-J28 | Subscriber Line Interface Concept (SLIC) | 305mW | ||||||||||||||||||||||||||||||
| CYP15G0401RB-BGI | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HOTlink II™ | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | BICMOS | 640mA | Non-RoHS Compliant | /files/rochesterelectronicsllc-cyp15g0401rbbgi-datasheets-4193.pdf | 256-LBGA Exposed Pad | 27mm | 27mm | 256 | LVTTL | no | unknown | e0 | TIN LEAD | YES | 3.135V~3.465V | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 1.27mm | TELECOM CIRCUIT | NOT SPECIFIED | 4 | COMMERCIAL | S-PBGA-B256 | Receiver | ||||||||||||||||||||||||
| DS3252+ | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | 150mA | ROHS3 Compliant | /files/rochesterelectronicsllc-ds3251n-datasheets-4152.pdf | 144-BGA, CSPBGA | LIU | 3.3V | 2 | 144-TECSBGA (13x13) | Line Interface Unit (LIU) |
