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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Supply Current | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Lifecycle Status | Pbfree Code | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Max Frequency | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Supplier Device Package | Data Rate | Memory Size | Number of I/O | Memory Type | Peripherals | Core Architecture | RAM Size | Data Bus Width | Speed Grade | Architecture | Number of Outputs | Speed | uPs/uCs/Peripheral ICs Type | Number of Registers | Number of Inputs | RAM (words) | Bus Compatibility | Boundary Scan | Clock Frequency | Number of Gates | UV Erasable | Core Processor | Connectivity | Number of Logic Elements/Cells | Number of Logic Blocks (LABs) | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Flash Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| M2S005-TQG144I | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 1.6mm | RoHS Compliant | 2000 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 144-LQFP | 20mm | 20mm | 1.2V | Lead Free | 144 | 8 Weeks | 144 | IN PRODUCTION (Last Updated: 1 month ago) | 8542.39.00.01 | e3 | MATTE TIN | YES | QUAD | GULL WING | NOT SPECIFIED | 1.2V | 0.5mm | 1.26V | NOT SPECIFIED | Field Programmable Gate Arrays | Not Qualified | 84 | DDR | 64KB | MCU, FPGA | 84 | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | |||||||||||||||||||||||||||||||||||||||
| XC7Z007S-2CLG400E | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Zynq®-7000 | 0°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2016 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 400-LFBGA, CSPBGA | 17mm | 17mm | 400 | 10 Weeks | yes | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | 1.05V | 0.95V | NOT SPECIFIED | S-PBGA-B400 | 100 | DMA | 256KB | MCU, FPGA | 766MHz | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | 800MHz | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Artix™-7 FPGA, 23K Logic Cells | ||||||||||||||||||||||||||||||||||||||||||
| XCZU4EG-1SFVC784E | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 784-BFBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 252 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 10AS016E3F29E2SG | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Arria 10 SX | 0°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 3.35mm | RoHS Compliant | /files/intel-10as016e3f27e2sg-datasheets-1713.pdf | 780-BBGA, FCBGA | 29mm | 29mm | 780 | 8 Weeks | 8542.39.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | 0.93V | 0.87V | NOT SPECIFIED | Field Programmable Gate Arrays | 0.9V | Not Qualified | S-PBGA-B780 | 288 | DMA, POR, WDT | 256KB | MCU, FPGA | 288 | 1.5GHz | 288 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 160K Logic Elements | 160000 | |||||||||||||||||||||||||||||||||||||||||||
| M2S005-FGG484 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | 85°C | 0°C | 166MHz | RoHS Compliant | 2009 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 484-BGA | 23mm | 23mm | 1.2V | 11 Weeks | 484 | CAN, Ethernet, I2C, SPI, UART, USART, USB | IN PRODUCTION (Last Updated: 1 month ago) | M2S005 | 484-FPBGA (23x23) | 23.9kB | 209 | DDR | ARM | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 6060 | 505 | FPGA - 5K Logic Modules | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||
| 5CSEBA6U19I7N | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Cyclone® V SE | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 1.9mm | RoHS Compliant | 2018 | /files/terasicinc-p0286-datasheets-0308.pdf | 484-FBGA | 19mm | 19mm | 484 | 8 Weeks | 8542.39.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | 5CSEBA6 | 1.13V | 1.07V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.11.2/3.32.5V | Not Qualified | S-PBGA-B484 | MCU - 151, FPGA - 66 | DMA, POR, WDT | 64KB | MCU, FPGA | 66 | 800MHz | 66 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 110K Logic Elements | 110000 | |||||||||||||||||||||||||||||||||||||||||
| M2S060-FCSG325I | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 1.01mm | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 325-TFBGA, CSPBGA | 11mm | 11mm | 1.2V | 325 | 10 Weeks | 325 | IN PRODUCTION (Last Updated: 2 weeks ago) | LG-MIN, WD-MIN | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | 1.26V | NOT SPECIFIED | Field Programmable Gate Arrays | Not Qualified | 200 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 200 | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | |||||||||||||||||||||||||||||||||||||||
| 10AS027E3F29I2SG | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Arria 10 SX | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 3.35mm | RoHS Compliant | /files/terasicinc-p0578-datasheets-5343.pdf | 780-BBGA, FCBGA | 29mm | 29mm | 780 | 8 Weeks | 8542.39.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | 0.93V | 0.87V | NOT SPECIFIED | Field Programmable Gate Arrays | 0.9V | Not Qualified | S-PBGA-B780 | 360 | DMA, POR, WDT | 256KB | MCU, FPGA | 360 | 1.5GHz | 360 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 270K Logic Elements | 270000 | |||||||||||||||||||||||||||||||||||||||||||
| 10AS048E3F29I2SG | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Arria 10 SX | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 3.35mm | RoHS Compliant | /files/terasicinc-p0578-datasheets-5343.pdf | 780-BBGA, FCBGA | 29mm | 29mm | 780 | 8 Weeks | 8542.39.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | 0.93V | 0.87V | NOT SPECIFIED | Field Programmable Gate Arrays | 0.9V | Not Qualified | S-PBGA-B780 | 360 | DMA, POR, WDT | 256KB | MCU, FPGA | 360 | 1.5GHz | 360 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 480K Logic Elements | 480000 | |||||||||||||||||||||||||||||||||||||||||||
| 5CSEMA6F31I7N | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Cyclone® V SE | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 2mm | RoHS Compliant | 2018 | /files/terasicinc-p0286-datasheets-0308.pdf | 896-BGA | 31mm | 31mm | 896 | 8 Weeks | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | 5CSEMA6 | 1.13V | 1.07V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.11.2/3.32.5V | Not Qualified | S-PBGA-B896 | MCU - 181, FPGA - 288 | DMA, POR, WDT | 64KB | MCU, FPGA | 288 | 800MHz | 288 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 110K Logic Elements | 110000 | |||||||||||||||||||||||||||||||||||||||
| 5CSXFC5D6F31I7N | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Cyclone® V SX | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 2mm | RoHS Compliant | 2018 | /files/intel-5cseba5u19c8sn-datasheets-5654.pdf | 896-BGA | 31mm | 31mm | 896 | 8 Weeks | 8542.39.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | 5CSXFC5 | 1.13V | 1.07V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.11.2/3.32.5V | Not Qualified | S-PBGA-B896 | MCU - 181, FPGA - 288 | DMA, POR, WDT | 64KB | MCU, FPGA | 288 | 800MHz | 288 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 85K Logic Elements | 85000 | |||||||||||||||||||||||||||||||||||||||||
| XCZU2CG-2SBVA484I | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Zynq® UltraScale+™ MPSoC CG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 484-BFBGA, FCBGA | 484 | 11 Weeks | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.85V | 0.876V | NOT SPECIFIED | R-PBGA-B484 | 82 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| XAZU3EG-1SFVA625I | Xilinx Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | 3.43mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/xilinxinc-xazu5ev1sfvc784q-datasheets-4797.pdf | 625-BFBGA, FCBGA | 21mm | 21mm | 625 | 11 Weeks | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.85V | 0.8mm | NOT SPECIFIED | S-PBGA-B625 | 128 | DMA, WDT | 1.8MB | MPU, FPGA | 500MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, I2C, SPI, UART/USART, USB | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S050-FGG484I | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | RoHS Compliant | 2014 | /files/microsemicorporation-m2s050tfgg484-datasheets-1246.pdf | 484-BGA | 23mm | 23mm | 484 | 4 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B484 | 267 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 267 | 166MHz | 267 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 256KB | ||||||||||||||||||||||||||||||||||||||
| M2S050-FGG484 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | 85°C | 0°C | 166MHz | RoHS Compliant | 2009 | /files/microsemicorporation-m2s050tfgg484-datasheets-1246.pdf | 484-BGA | 1.2V | 11 Weeks | 484 | CAN, Ethernet, I2C, SPI, UART, USART, USB | IN PRODUCTION (Last Updated: 1 month ago) | 400MHz | M2S050 | 484-FPBGA (23x23) | 667 Mbps | 256kB | 267 | DDR, PCIe, SERDES | ARM | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 56340 | 4695 | FPGA - 50K Logic Modules | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||
| 10AS048E4F29I3SG | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Arria 10 SX | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 3.35mm | RoHS Compliant | /files/intel-10as016e3f27e2sg-datasheets-1713.pdf | 780-BBGA, FCBGA | 29mm | 29mm | 780 | 8 Weeks | 8542.39.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | 0.93V | 0.87V | NOT SPECIFIED | Field Programmable Gate Arrays | 0.9V | Not Qualified | S-PBGA-B780 | 360 | DMA, POR, WDT | 256KB | MCU, FPGA | 360 | 1.5GHz | 360 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 480K Logic Elements | 480000 | |||||||||||||||||||||||||||||||||||||||||||
| 5CSEBA5U23C8N | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Cyclone® V SE | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 1.85mm | RoHS Compliant | 2018 | /files/terasicinc-p0286-datasheets-0308.pdf | 672-FBGA | 23mm | 23mm | 672 | 8 Weeks | 8542.39.00.01 | e1 | TIN SILVER COPPER | YES | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | 5CSEBA5 | 1.13V | 1.07V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.11.2/3.32.5V | Not Qualified | S-PBGA-B672 | MCU - 181, FPGA - 145 | DMA, POR, WDT | 64KB | MCU, FPGA | 145 | 600MHz | 145 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 85K Logic Elements | 85000 | |||||||||||||||||||||||||||||||||||||||
| XC7Z030-1SBG485I | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Zynq®-7000 | Surface Mount | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | 667MHz | 2.44mm | ROHS3 Compliant | 2009 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 484-FBGA, FCBGA | 19mm | 485 | 10 Weeks | 485 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | EAR99 | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | Copper, Silver, Tin | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | 1.05V | 0.95V | NOT SPECIFIED | Other Microprocessor ICs | 11.8V | Not Qualified | 130 | DMA | ARM | 256KB | 32b | MCU, FPGA | MICROPROCESSOR CIRCUIT | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | N | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 125K Logic Cells | ||||||||||||||||||||||||||||||||||
| 5CSTFD6D5F31I7N | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Cyclone® V ST | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 2mm | RoHS Compliant | 2018 | /files/terasicinc-p0286-datasheets-0308.pdf | 896-BGA | 31mm | 31mm | 896 | 8 Weeks | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | 5CSTFD6 | 1.13V | 1.07V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.11.2/3.32.5V | Not Qualified | S-PBGA-B896 | MCU - 181, FPGA - 288 | DMA, POR, WDT | 64KB | MCU, FPGA | 288 | 800MHz | 288 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 110K Logic Elements | 110000 | |||||||||||||||||||||||||||||||||||||||
| A2F500M3G-1FGG484 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion® | Surface Mount | 0°C~85°C TJ | Tray | 3 (168 Hours) | 85°C | 0°C | 100MHz | 16.5mA | RoHS Compliant | 2011 | /files/microsemicorporation-a2f500m3gfgg484i-datasheets-0641.pdf | 484-BGA | 1.5V | 12 Weeks | 1.575V | 1.425V | 484 | EBI/EMI, Ethernet, I2C, SPI, UART, USART | No | 120MHz | A2F500M3G | 484-FPBGA (23x23) | 400 kbps | 13.5kB | MCU - 41, FPGA - 128 | DMA, POR, WDT | ARM | 64KB | 1 | MCU, FPGA | 100MHz | 11520 | 500000 | ARM® Cortex®-M3 | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 5500 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | |||||||||||||||||||||||||||||||||||||||||||
| M2S010-FGG484 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | 85°C | 0°C | 166MHz | RoHS Compliant | 2009 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 484-BGA | 23mm | 23mm | 1.2V | Lead Free | 11 Weeks | 484 | CAN, Ethernet, I2C, SPI, UART, USART, USB | IN PRODUCTION (Last Updated: 1 month ago) | M2S010 | 484-FPBGA (23x23) | 50kB | 233 | DDR, PCIe, SERDES | ARM | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 12084 | 1007 | FPGA - 10K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||
| 5CSEMA6F31C6N | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Cyclone® V SE | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 2mm | RoHS Compliant | 2018 | /files/terasicinc-p0286-datasheets-0308.pdf | 896-BGA | 31mm | 31mm | 896 | 8 Weeks | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | 5CSEMA6 | 1.13V | 1.07V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.11.2/3.32.5V | Not Qualified | S-PBGA-B896 | MCU - 181, FPGA - 288 | DMA, POR, WDT | 64KB | MCU, FPGA | 288 | 925MHz | 288 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 110K Logic Elements | 110000 | |||||||||||||||||||||||||||||||||||||||
| 10AS027E4F29E3SG | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Arria 10 SX | 0°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 3.35mm | RoHS Compliant | /files/terasicinc-p0578-datasheets-5343.pdf | 780-BBGA, FCBGA | 29mm | 29mm | 780 | 8 Weeks | 8542.39.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | 0.93V | 0.87V | NOT SPECIFIED | Field Programmable Gate Arrays | 0.9V | Not Qualified | S-PBGA-B780 | 360 | DMA, POR, WDT | 256KB | MCU, FPGA | 360 | 1.5GHz | 360 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 270K Logic Elements | 270000 | |||||||||||||||||||||||||||||||||||||||||||
| 5CSEMA6U23I7N | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Cyclone® V SE | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 1.85mm | RoHS Compliant | 2018 | /files/terasicinc-p0286-datasheets-0308.pdf | 672-FBGA | 23mm | 23mm | 672 | 8 Weeks | 8542.39.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | 5CSEMA6 | 1.13V | 1.07V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.11.2/3.32.5V | Not Qualified | S-PBGA-B672 | MCU - 181, FPGA - 145 | DMA, POR, WDT | 64KB | MCU, FPGA | 145 | 800MHz | 145 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 110K Logic Elements | 110000 | |||||||||||||||||||||||||||||||||||||||||
| XC7Z012S-1CLG485I | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Zynq®-7000 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2016 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 484-LFBGA, CSPBGA | 19mm | 19mm | 485 | 10 Weeks | yes | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | 1.05V | 0.95V | NOT SPECIFIED | S-PBGA-B485 | 150 | DMA | 256KB | MCU, FPGA | 667MHz | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | 667MHz | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Artix™-7 FPGA, 55K Logic Cells | ||||||||||||||||||||||||||||||||||||||||||
| 10AS027E3F27E2SG | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Arria 10 SX | 0°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 3.25mm | RoHS Compliant | /files/intel-10as016e3f27e2sg-datasheets-1713.pdf | 672-BBGA, FCBGA | 27mm | 27mm | 672 | 8 Weeks | 8542.39.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | 0.93V | 0.87V | NOT SPECIFIED | Field Programmable Gate Arrays | 0.9V | Not Qualified | S-PBGA-B672 | 240 | DMA, POR, WDT | 256KB | MCU, FPGA | 240 | 1.5GHz | 240 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 270K Logic Elements | 270000 | |||||||||||||||||||||||||||||||||||||||||||
| 5CSEMA5F31I7N | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Cyclone® V SE | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 2mm | RoHS Compliant | 2018 | /files/terasicinc-p0286-datasheets-0308.pdf | 896-BGA | 31mm | 31mm | 896 | 8 Weeks | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | 5CSEMA5 | 1.13V | 1.07V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.11.2/3.32.5V | Not Qualified | S-PBGA-B896 | MCU - 181, FPGA - 288 | DMA, POR, WDT | 64KB | MCU, FPGA | 288 | 800MHz | 288 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 85K Logic Elements | 85000 | |||||||||||||||||||||||||||||||||||||||
| M2S010-VFG256I | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 1.56mm | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 256-LFBGA | 14mm | 14mm | Lead Free | 256 | 8 Weeks | 1.26V | 1.14V | 256 | IN PRODUCTION (Last Updated: 1 month ago) | LG-MIN, WD-MIN | 8542.39.00.01 | e3 | MATTE TIN | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | 138 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 138 | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 256KB | |||||||||||||||||||||||||||||||||||||
| XCZU2CG-1SBVA484I | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Zynq® UltraScale+™ MPSoC CG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 484-BFBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 82 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 1.2GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z045-2FFG900I | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Zynq®-7000 | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | 800MHz | 3.35mm | ROHS3 Compliant | 2009 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 900-BBGA, FCBGA | 31mm | 1V | 900 | 10 Weeks | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 3A991.D | Copper, Silver, Tin | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | YES | BOTTOM | BALL | 245 | 1V | 1mm | XC7Z045 | 1.05V | 30 | S-PBGA-B900 | 130 | ROMless | DMA | ARM | 256KB | 32b | -2 | MCU, FPGA | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 350K Logic Cells |
