| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Pbfree Code | ECCN Code | Radiation Hardening | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Source Url Status Check Date | Supplier Device Package | Memory Size | Oscillator Type | Number of I/O | Memory Type | Peripherals | RAM Size | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Watchdog Timer | Number of Timers/Counters | CPU Family | ROM (words) | Access Time | Clock Frequency | Address Bus Width | External Data Bus Width | Core Processor | Voltage - Supply (Vcc/Vdd) | Program Memory Type | Core Size | Program Memory Size | Connectivity | Data Converter | EEPROM Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MK20DX256VML7 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K20 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/nxpusainc-mk20dx256vml7-datasheets-6688.pdf | 104-LFBGA | MK20DX256 | Internal | DMA, I2S, LVD, POR, PWM, WDT | 64K x 8 | 72MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG | 2K x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCHRC705KJ1CDWE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC05 | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68hc705kj1cp-datasheets-9617.pdf | 16-SOIC (0.295, 7.50mm Width) | MCHC705 | 16-SOIC | Internal | 10 | POR, WDT | 64 x 8 | 4MHz | HC05 | 3V~5.5V | OTP | 8-Bit | 1.2KB 1.2K x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PK61FN1M0VMD15 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K60 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/nxpusainc-mk60fn1m0vlq12-datasheets-1199.pdf | 144-LBGA | PK61FN1M0 | Internal | 95 | DMA, I2S, LVD, POR, PWM, WDT | 128K x 8 | 150MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 53x16b; D/A 2x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC908QB4CDTE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | 2000 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc908qb8cdwe-datasheets-8087.pdf | 16-TSSOP (0.173, 4.40mm Width) | MC908QB4 | Internal | 13 | LVD, POR, PWM | 128 x 8 | 8MHz | 2.7V~5.5V | FLASH | 8-Bit | 4KB 4K x 8 | SCI, SPI | A/D 10x10b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MK30DN512ZVMD10 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K30 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2013 | /files/nxpusainc-mk30dn512zvlq10-datasheets-8583.pdf&product=nxpusainc-mk30dn512zvmd10-4941540 | 144-LBGA | MK30DN512 | Internal | 102 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 128K x 8 | 100MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | A/D 46x16b; D/A 2x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCL908LJ12CPBE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68hc98lj12cfue-datasheets-9355.pdf | 64-LQFP | MCL908LJ12 | Internal | 32 | LCD, LVD, POR, PWM | 512 x 8 | 8MHz | 3V~5.5V | FLASH | 8-Bit | 12KB 12K x 8 | IRSCI, SPI | A/D 6x10b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MK30DX128VMB7 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K30 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2016 | 81-LBGA | MK30DX128 | Internal | 56 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 32K x 8 | 72MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, I2C, IrDA, SD, SPI, UART/USART | A/D 31x16b; D/A 1x12b | 2K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PK60FN1M0VLQ15 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K60 | Surface Mount | -40°C~105°C TA | Bulk | 3 (168 Hours) | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/nxpusainc-mk60fn1m0vlq12-datasheets-1199.pdf | 144-LQFP | PK60FN1M0 | Internal | 100 | DMA, I2S, LVD, POR, PWM, WDT | 128K x 8 | 150MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 48x16b; D/A 2x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCHRC908JK1CPE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Through Hole | -40°C~85°C TA | Tube | 1 (Unlimited) | ROHS3 Compliant | 20-DIP (0.300, 7.62mm) | MCHRC908JK1 | External | 14 | LED, LVD, POR, PWM | 128 x 8 | 8MHz | 2.7V~3.3V | FLASH | 8-Bit | 1.5KB 1.5K x 8 | A/D 12x8b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S912XEQ512J3CAL | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12X | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2012 | 112-LQFP | S912XEQ512 | External | 91 | LVD, POR, PWM, WDT | 32K x 8 | 50MHz | 1.72V~5.5V | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | A/D 16x12b | 4K x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC908QY2AVDWER | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~105°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68hc908qy4cdte-datasheets-4172.pdf | 16-SOIC (0.295, 7.50mm Width) | MC908QY2 | Internal | 13 | LVD, POR, PWM | 128 x 8 | 8MHz | 2.7V~5.5V | FLASH | 8-Bit | 1.5KB 1.5K x 8 | A/D 6x10b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LPC11U37FBD48/501, | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | LPC11Uxx | Surface Mount | -40°C~85°C TA | Tray | 1 (Unlimited) | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/nxpusainc-lpc11u35fbd48401-datasheets-3345.pdf | 48-LQFP | LPC11U | 48 | Internal | 40 | Brown-out Detect/Reset, POR, WDT | 12K x 8 | 50MHz | ARM® Cortex®-M0 | 1.8V~3.6V | FLASH | 32-Bit | 128KB 128K x 8 | I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB | A/D 8x10b | 4K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SPC5675KFF0MMM2R | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC56xx Qorivva | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/nxpusainc-spc5675kff0mms2-datasheets-5063.pdf | 257-LFBGA | SPC5675 | Internal | DMA, POR, PWM, WDT | 512K x 8 | 180MHz | e200z7d | 1.14V~5.5V | FLASH | 32-Bit Dual-Core | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI | A/D 22x12b | 64K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S9S12P64J0CFTR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 1998 | 48-TFQFN Exposed Pad | S9S12P64 | Internal | 34 | LVD, POR, PWM, WDT | 4K x 8 | 32MHz | 1.72V~5.5V | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, SCI, SPI | A/D 10x12b | 4K x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PK52N512CLQ100 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K50 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2013 | 144-LQFP | PK52N512 | Internal | 96 | DMA, I2S, LVD, POR, PWM, WDT | 128K x 8 | 100MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 25x16b; D/A 2x12b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MK10DX256VML7 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K10 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/nxpusainc-mk10dx256vml7-datasheets-6667.pdf | 121-LFBGA | MK10DX256 | Internal | 74 | DMA, I2S, LVD, POR, PWM, WDT | 64K x 8 | 72MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART | A/D 39x16b; D/A 1x12b | 2K x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC56F84585VLK | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 56F8xxx | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2012 | 80-LQFP | 7mm | 7mm | 80 | YES | QUAD | GULL WING | 3.3V | 0.5mm | MC56F845 | 3.6V | 2.7V | S-PQFP-G80 | Internal | 68 | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 32K x 8 | 80MHz | MICROCONTROLLER | 32 | YES | YES | YES | YES | 16MHz | 56800EX | 3V~3.6V | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, I2C, LINbus, SCI, SPI | A/D 16x12b, 10x16b; D/A 1x12b | 2K x 8 | ||||||||||||||||||||||||||||||||||||||||
| LPC4072FBD80E | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | LPC40xx | Surface Mount | -40°C~85°C TA | Tray | 2 (1 Year) | ROHS3 Compliant | 2011 | https://pdf.utmel.com/r/datasheets/nxpusainc-lpc4072fbd80e-datasheets-6675.pdf | 80-LQFP | LPC4072 | 80 | Internal | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 24K x 8 | 120MHz | ARM® Cortex®-M4 | 2.4V~3.6V | FLASH | 32-Bit | 64KB 64K x 8 | CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB | A/D 8x12b; D/A 1x10b | 2K x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC9S08AW60MFDE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08aw32cpue-datasheets-8334.pdf | 48-VFQFN Exposed Pad | MC9S08AW60 | 48-QFN-EP (7x7) | Internal | 38 | LVD, POR, PWM, WDT | 2K x 8 | 40MHz | S08 | 2.7V~5.5V | FLASH | 8-Bit | 60KB 60K x 8 | I2C, SCI, SPI | A/D 8x10b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DF38004H10WV | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | 85°C | -40°C | 10MHz | ROHS3 Compliant | 2005 | PQFP | Lead Free | 12 Weeks | 3.6V | 1.8V | 64 | SCI | No | 32kB | Internal | 39 | FLASH, ROM | LCD, PWM, WDT | 1kB | Yes | 2 | 10 μs | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC908MR32VBE | NXP USA Inc. | $91.26 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Through Hole | -40°C~105°C TA | Tube | 1 (Unlimited) | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc908mr16cfue-datasheets-5396.pdf | 56-SDIP (0.600, 15.24mm) | MC908MR32 | Internal | 36 | LVD, POR, PWM | 768 x 8 | 8MHz | 4.5V~5.5V | FLASH | 8-Bit | 32KB 32K x 8 | SCI, SPI | A/D 10x10b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC68CK331CAG16 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | M683xx | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 1997 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68331cag16-datasheets-1717.pdf | 144-LQFP | MC68CK331 | Internal | 18 | POR, PWM, WDT | 16MHz | CPU32 | 4.5V~5.5V | ROMless | 32-Bit | EBI/EMI, SCI, SPI, UART/USART | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| P87C51SFPN,112 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 87C | Through Hole | -40°C~85°C TA | Tube | 1 (Unlimited) | CMOS | 4.7mm | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/nxpusainc-p87c52sbpn112-datasheets-0359.pdf | 40-DIP (0.600, 15.24mm) | 52mm | 15.24mm | 40 | 8542.31.00.01 | e3 | Matte Tin (Sn) | NO | DUAL | 245 | 5V | 2.54mm | P87C51 | 40 | 5.5V | 2.7V | 40 | Microcontrollers | 3/5V | 50mA | Not Qualified | R-PDIP-T40 | Internal | 32 | POR | 128 x 8 | 16MHz | MICROCONTROLLER | 8 | NO | NO | NO | NO | 4096 | 16MHz | 16 | 8 | 8051 | 2.7V~5.5V | OTP | 8-Bit | 4KB 4K x 8 | EBI/EMI, UART/USART | ||||||||||||||||||||||||||||
| P87C52UBPN,112 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 87C | Through Hole | 0°C~70°C TA | Tube | 1 (Unlimited) | CMOS | 4.7mm | ROHS3 Compliant | 2014 | https://pdf.utmel.com/r/datasheets/nxpusainc-p87c52sbpn112-datasheets-0359.pdf | 40-DIP (0.600, 15.24mm) | 52mm | 15.24mm | 40 | 8542.31.00.01 | e3 | Tin (Sn) | NO | DUAL | NOT SPECIFIED | 5V | 2.54mm | P87C52 | 40 | 5.5V | 4.5V | NOT SPECIFIED | Microcontrollers | 5V | 30.8mA | Not Qualified | R-PDIP-T40 | Internal | 32 | POR | 256 x 8 | 33MHz | MICROCONTROLLER | 8 | NO | NO | NO | NO | 8192 | 33MHz | 16 | 8 | 8051 | 4.5V~5.5V | OTP | 8-Bit | 8KB 8K x 8 | EBI/EMI, UART/USART | ||||||||||||||||||||||||||||
| LPC1114FN28/102,12 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | LPC1100L | Through Hole | -40°C~85°C TA | Tube | Not Applicable | CMOS | 5.1mm | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/nxpusainc-lpc1114fhn333335-datasheets-0622.pdf | 28-DIP (0.600, 15.24mm) | 35.5mm | 15.24mm | 28 | 39 Weeks | NO | DUAL | NOT SPECIFIED | 3.3V | 2.54mm | LPC1114 | 28 | 3.6V | 1.8V | NOT SPECIFIED | Microcontrollers | 3.3V | Not Qualified | R-PDIP-T28 | 2013-06-14 00:00:00 | Internal | 22 | Brown-out Detect/Reset, POR, WDT | 4K x 8 | 50MHz | MICROCONTROLLER, RISC | 32 | YES | NO | NO | NO | CORTEX-M0 | 32768 | 25MHz | ARM® Cortex®-M0 | 1.8V~3.6V | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | A/D 6x10b | ||||||||||||||||||||||||||||||
| SPC5633MF1MLU60 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC56xx Qorivva | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2007 | 176-LQFP | SPC5633 | 176-LQFP (24x24) | Internal | 80 | DMA, POR, PWM, WDT | 64K x 8 | 60MHz | e200z3 | 4.5V~5.25V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART | A/D 34x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| P89C60X2BA/00,512 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 89C | Surface Mount | 0°C~70°C TA | Tube | 3 (168 Hours) | CMOS | 4.57mm | ROHS3 Compliant | 2003 | https://pdf.utmel.com/r/datasheets/nxpusainc-p89c60x2bbd00557-datasheets-6366.pdf | 44-LCC (J-Lead) | 16.5862mm | 16.5862mm | 44 | yes | 3A991.A.2 | 8542.31.00.01 | YES | QUAD | J BEND | 245 | 5V | 1.27mm | P89C60 | 44 | 5.5V | 4.5V | 40 | Microcontrollers | 5V | Not Qualified | S-PQCC-J44 | Internal | 32 | POR, WDT | 512 x 8 | 33MHz | MICROCONTROLLER | 8 | NO | NO | NO | NO | 65536 | 33MHz | 16 | 8 | 8051 | 4.5V~5.5V | FLASH | 8-Bit | 64KB 64K x 8 | UART/USART | ||||||||||||||||||||||||||||
| CV8612DH,518 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 1 (Unlimited) | ROHS3 Compliant | 2015 | CV8612 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SPC5668EK0MMGR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC56xx Qorivva | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2006 | 208-BGA | unknown | NOT SPECIFIED | SPC5668 | NOT SPECIFIED | Internal | 155 | DMA, POR, PWM, WDT | 128K x 8 | 116MHz | MICROCONTROLLER | e200z650 | 3V~5.5V | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, I2C, LINbus, SCI, SPI | A/D 64x10b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PK60N256VMC100 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K60 | Surface Mount | -40°C~105°C TA | Bulk | 3 (168 Hours) | ROHS3 Compliant | 2013 | 121-LFBGA | PK60N256 | Internal | 86 | DMA, I2S, LVD, POR, PWM, WDT | 64K x 8 | 100MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 21x16b; D/A 2x12b |
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