| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | REACH SVHC | Number of Pins | Interface | Lifecycle Status | Pbfree Code | Thickness | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Screening Level | Memory Size | Number of ADC Channels | Oscillator Type | Number of I/O | Peripherals | Core Architecture | RAM Size | Data Bus Width | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Watchdog Timer | Number of Timers/Counters | On Chip Program ROM Width | CPU Family | Number of SPI Channels | ROM (words) | RAM (words) | Bus Compatibility | Boundary Scan | Low Power Mode | Format | Number of A/D Converters | Number of PWM Channels | RAM (bytes) | Number of I2C Channels | Access Time | Clock Frequency | Address Bus Width | External Data Bus Width | Barrel Shifter | Internal Bus Architecture | Core Processor | Voltage - Supply (Vcc/Vdd) | Program Memory Type | Core Size | Program Memory Size | Connectivity | Data Converter | EEPROM Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| SPC5602DF1MLL4 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC56xx Qorivva | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | CMOS | 1.7mm | ROHS3 Compliant | 2006 | 100-LQFP | 14mm | 14mm | 100 | 12 Weeks | 3A991.A.2 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 3.3V | 0.5mm | SPC5602 | 3.6V | 3V | 40 | Microcontrollers | 3.3/5V | 130mA | Not Qualified | S-PQFP-G100 | AEC-Q100 | Internal | 79 | DMA, POR, PWM, WDT | 16K x 8 | 48MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 262144 | 16MHz | e200z0h | 3V~5.5V | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, LINbus, SCI, SPI | A/D 33x12b | 4K x 16 | |||||||||||||||||||||||||||||||||||||||||||
| STM32L476ZGT3 | STMicroelectronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | STM32L4 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | 80MHz | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/stmicroelectronics-stm32l476vgt6tr-datasheets-4706.pdf | 144-LQFP | 20mm | 20mm | 144 | 12 Weeks | CAN, EBI/EMI, I2C, IrDA, LIN, MMC, SD, SPI, UART, USART, USB | ACTIVE (Last Updated: 7 months ago) | YES | QUAD | GULL WING | NOT SPECIFIED | 1.8V | 0.5mm | STM32L476 | 3.6V | 1.71V | NOT SPECIFIED | 1MB | Internal | 114 | Brown-out Detect/Reset, DMA, LCD, PWM, WDT | ARM | 128K x 8 | MICROCONTROLLER, RISC | 32 | YES | YES | YES | 26 | 16 | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SAI, SPI, SWPMI, UART/USART, USB OTG | A/D 24x12b; D/A 2x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| SPC5602PEF0MLL6 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC56xx Qorivva | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2007 | 100-LQFP | 14mm | 14mm | 100 | 12 Weeks | 8542.31.00.01 | YES | QUAD | GULL WING | 5V | 0.5mm | SPC5602 | 5.5V | 4.5V | Microcontrollers | 3.3/5V | 65mA | Not Qualified | S-PQFP-G100 | AEC-Q100 | Internal | 79 | DMA, POR, PWM, WDT | 20K x 8 | 64MHz | MICROCONTROLLER RISC | 32 | YES | YES | YES | 262144 | 40MHz | e200z0h | 3V~5.5V | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, LINbus, SCI, SPI | A/D 16x10b | 4K x 16 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| MSP430F67791IPEU | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MSP430F6xx | Surface Mount | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 25MHz | ROHS3 Compliant | 128-LQFP | 20mm | 1.6mm | 14mm | 3.3V | Lead Free | 128 | 6 Weeks | 128 | I2C, IrDA, LIN, SPI, UART, USART | ACTIVE (Last Updated: 4 days ago) | yes | 1.4mm | EAR99 | Gold | e4 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | MSP430 | 128 | 3.6V | NOT SPECIFIED | Microcontrollers | 11.75mA | Not Qualified | 512kB | Internal | 90 | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT, 7x24b Sigma Delta Converter | 32K x 8 | 16b | MICROPROCESSOR CIRCUIT | 16 | YES | 4 | 32 | I2C; SPI; UART | 8 | CPUXV2 | 1.8V~3.6V | FLASH | 16-Bit | 512KB 512K x 8 | I2C, IrDA, LINbus, SPI, UART/USART | A/D 8x10b | |||||||||||||||||||||||||||||||||||||||||
| R7FS3A17C3A01CFP#AA0 | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Renesas Synergy™ S3 | Surface Mount | -40°C~105°C | Tray | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/renesaselectronicsamerica-r7fs3a17c3a01cfmaa0-datasheets-0483.pdf | 100-LQFP | 14mm | 14mm | 100 | 12 Weeks | yes | 8542.31.00.01 | YES | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.5mm | 100 | 5.5V | 2.4V | NOT SPECIFIED | Internal | 84 | DMA, LCD, LVD, POR, PWM, WDT | 192K x 8 | 48MHz | MICROCONTROLLER, RISC | YES | YES | YES | 20MHz | 24 | 16 | ARM® Cortex®-M4 | 1.6V~5.5V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SSIE, SPI, UART/USART, USB | A/D 25x14b; D/A 2x8b, 1x12b | 8K x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| R5F36CAENFB#30 | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | M16C™ M16C/60/6C | Surface Mount | -20°C~85°C TA | Tray | 3 (168 Hours) | 32MHz | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/renesaselectronicsamerica-r5f36caenfb30-datasheets-9898.pdf | 100-LQFP | 6mm | 6mm | 5.5V | Lead Free | 48 | 20 Weeks | 100 | EBI/EMI, I2C, UART, USART, USB | yes | YES | QUAD | NO LEAD | 3V | 0.5mm | R5F36C | 100 | 256kB | Internal | 85 | DMA, LVD, POR, PWM, WDT | 20K x 8 | MICROCONTROLLER | 16 | YES | YES | YES | Yes | 11 | 20 | 8 | M16C/60 | 3V~5.5V | FLASH | 16-Bit | 256KB 256K x 8 | EBI/EMI, I2C, SIO, UART/USART, USB | A/D 26x10b; D/A 2x8b | |||||||||||||||||||||||||||||||||||||||||||||||||||
| PIC32MZ1025DAR169T-I/6J | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DAR | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 1.56mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dar176i2j-datasheets-2790.pdf | 169-LFBGA | 11mm | 11mm | 169 | 3 Weeks | YES | BOTTOM | BALL | 1.8V | 0.8mm | 1.9V | 1.7V | S-PBGA-B169 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 256K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~1.9V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| M30260F8AGP#U9A | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | M16C™ M16C/Tiny/26A | Surface Mount | Surface Mount | -20°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 20MHz | 1.7mm | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/renesaselectronicsamerica-m30260f8agpu3a-datasheets-1013.pdf | 48-LQFP | 7mm | Lead Free | 48 | 20 Weeks | 48 | I2C, UART, USART | yes | OPERATES AT 2.7V MINIMUM SUPPLY @ 10 MHZ | No | QUAD | GULL WING | 5V | 0.5mm | M30260 | 48 | 5.5V | 3V | Microcontrollers | 3/5V | 64kB | Internal | 39 | DMA, PWM, Voltage Detect, WDT | 2K x 8 | 16b | MICROCONTROLLER | 16 | YES | YES | YES | NO | Yes | 8 | 69632 | 20 μs | M16C/60 | 2.7V~5.5V | FLASH | 16-Bit | 64KB 64K x 8 | I2C, IEBus, SIO, UART/USART | A/D 12x10b | |||||||||||||||||||||||||||||||||||||||||||
| MC9S12C32CFUE16 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 2.45mm | ROHS3 Compliant | 2005 | /files/nxpusainc-mc9s12gc32cpbe-datasheets-5545.pdf | 80-QFP | 14mm | 14mm | 80 | 10 Weeks | EAR99 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 2.5V | 0.65mm | MC9S12C32 | 2.75V | 2.35V | 40 | Microcontrollers | 2.53.3/5V | 45mA | Not Qualified | S-PQFP-G80 | Internal | 60 | POR, PWM, WDT | 2K x 8 | 16MHz | MICROCONTROLLER | 16 | YES | NO | YES | NO | CPU12 | 32768 | 50MHz | 16 | 16 | 2.35V~5.5V | FLASH | 16-Bit | 32KB 32K x 8 | CANbus, EBI/EMI, SCI, SPI | A/D 8x10b | ||||||||||||||||||||||||||||||||||||||||||
| MK60DX256ZVLL10 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K60 | Surface Mount | -40°C~105°C TA | Tray | 1 (Unlimited) | CMOS | 1.7mm | ROHS3 Compliant | 2002 | /files/nxpusainc-mk60fn1m0vlq12-datasheets-1199.pdf&product=nxpusainc-mk60dx256zvll10-4851520 | 100-LQFP | 14mm | 14mm | 100 | 3A991.A.2 | 8542.31.00.01 | e3 | MATTE TIN | YES | QUAD | GULL WING | 260 | 3V | 0.5mm | MK60DX256 | 3.6V | 1.71V | 40 | Not Qualified | S-PQFP-G100 | Internal | 66 | DMA, I2S, LVD, POR, PWM, WDT | 64K x 8 | 100MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | 32MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 33x16b; D/A 1x12b | 4K x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||
| MCF51AC256AVPUE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF51AC | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/nxpusainc-mcf51ac128acfue-datasheets-5098.pdf | 64-LQFP | 10mm | 10mm | 64 | 10 Weeks | 3A991.A.2 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 5V | 0.5mm | MCF51AC256 | 5.5V | 2.7V | 40 | Microcontrollers | 3/5V | Not Qualified | S-PQFP-G64 | External | 54 | LVD, PWM, WDT | 32K x 8 | 50MHz | MICROCONTROLLER | 32 | YES | NO | YES | NO | 262144 | 16MHz | Coldfire V1 | 2.7V~5.5V | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, I2C, SCI, SPI | A/D 20x12b | ||||||||||||||||||||||||||||||||||||||||||||||
| R5F5630ACDFB#V0 | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | RX600 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 100MHz | 1.7mm | ROHS3 Compliant | 2011 | https://pdf.utmel.com/r/datasheets/renesaselectronicsamerica-r5f56308ddfpv0-datasheets-7196.pdf | 144-LQFP | 20mm | 20mm | 144 | 20 Weeks | 144 | EBI/EMI, I2C, LIN, SCI, SPI, USB | yes | 8542.31.00.01 | YES | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.5mm | R5F5630A | 144 | 3.6V | 2.7V | NOT SPECIFIED | Microcontrollers | 3/3.3V | 100mA | Not Qualified | 768kB | Internal | 117 | DMA, LVD, POR, PWM, WDT | 96K x 8 | MICROCONTROLLER | 32 | YES | YES | YES | YES | RX | 786432 | 24 | 16 | RX | 2.7V~3.6V | FLASH | 32-Bit | 768KB 768K x 8 | EBI/EMI, I2C, LINbus, SCI, SPI, USB | A/D 8x10b, 21x12b; D/A 2x10b | 32K x 8 | ||||||||||||||||||||||||||||||||||||||||
| PIC32MZ1025DAK169-I/HF | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DAK | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.4mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dar176i2j-datasheets-2790.pdf | 169-LFBGA | 11mm | 11mm | 169 | 7 Weeks | YES | BOTTOM | BALL | 1.8V | 0.8mm | 1.9V | 1.7V | S-PBGA-B169 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 256K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~1.9V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| LPC1778FET180,551 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | LPC17xx | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.2mm | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/nxpusainc-lpc1788fbd208551-datasheets-2230.pdf | 180-TFBGA | 12mm | 12mm | 180 | 12 Weeks | EAR99 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 0.8mm | LPC1778 | 180 | 3.6V | 2.4V | NOT SPECIFIED | Microcontrollers | 3.3V | Not Qualified | S-PBGA-B180 | Internal | 141 | Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT | 96K x 8 | 120MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | CORTEX-M3 | 524288 | 25MHz | 20 | 16 | ARM® Cortex®-M3 | 2.4V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG | A/D 8x12b; D/A 1x10b | 4K x 8 | ||||||||||||||||||||||||||||||||||||||||
| MK40DX256VLQ10 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K40 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2012 | /files/nxpusainc-mk40dx128vmd10-datasheets-9444.pdf | 144-LQFP | 20mm | 20mm | 144 | 13 Weeks | 3A991.A.2 | 8542.31.00.01 | e3 | MATTE TIN | YES | QUAD | GULL WING | 260 | 3.3V | 0.5mm | MK40DX256 | 3.6V | 1.71V | 40 | Microcontrollers | 1.8/3.3V | 77mA | Not Qualified | S-PQFP-G144 | Internal | 98 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 64K x 8 | 100MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | CORTEX-M4 | 262144 | 32MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 42x16b; D/A 2x12b | 4K x 8 | ||||||||||||||||||||||||||||||||||||||||||
| PIC32MZ2025DAL176T-I/2J | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DAL | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dar176i2j-datasheets-2790.pdf | 176-LQFP Exposed Pad | 20mm | 20mm | 176 | 8 Weeks | YES | QUAD | GULL WING | 1.8V | 0.4mm | 1.9V | 1.7V | S-PQFP-G176 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 256K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~1.9V | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| STM32F405ZGT6W | STMicroelectronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | STM32F4 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | 168MHz | ROHS3 Compliant | /files/stmicroelectronics-stm32f405rgt6-datasheets-1237.pdf | 144-LQFP | 20mm | 144 | 12 Weeks | No SVHC | 144 | CAN, EBI/EMI, I2C, IrDA, LIN, SPI, UART, USART, USB | ACTIVE (Last Updated: 7 months ago) | YES | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.5mm | STM32F405 | 3.6V | 1.8V | NOT SPECIFIED | 1MB | Internal | 114 | Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT | ARM | 192K x 8 | 32b | MICROCONTROLLER, RISC | 32 | YES | YES | YES | 32 | ARM® Cortex®-M4 | 1.8V~3.6V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, I2C, IrDA, LINbus, SPI, UART/USART, USB OTG | A/D 24x12b; D/A 2x12b | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| R7FS3A17C3A01CNB#AC0 | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Renesas Synergy™ S3 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/renesaselectronicsamerica-r7fs3a17c3a01cfmaa0-datasheets-0483.pdf | 64-WFQFN Exposed Pad | 8mm | 8mm | 64 | 12 Weeks | 64 | yes | 8542.31.00.01 | YES | QUAD | NO LEAD | NOT SPECIFIED | 3.3V | 0.4mm | 64 | 5.5V | 2.4V | NOT SPECIFIED | Internal | 52 | DMA, LCD, LVD, POR, PWM, WDT | 192K x 8 | 48MHz | MICROCONTROLLER, RISC | YES | YES | YES | 20MHz | 24 | 16 | ARM® Cortex®-M4 | 1.6V~5.5V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SSIE, SPI, UART/USART, USB | A/D 18x14b; D/A 1x12b | 8K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| MK20DN512ZVMC10 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K20 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.52mm | ROHS3 Compliant | 2002 | /files/nxpusainc-mk20dn512zvmc10-datasheets-9729.pdf&product=nxpusainc-mk20dn512zvmc10-4851513 | 121-LFBGA | 8mm | 8mm | 121 | 3A991.A.2 | 8542.31.00.01 | e1 | TIN SILVER COPPER | YES | BOTTOM | BALL | 260 | 3.3V | 0.65mm | MK20DN512 | 3.6V | 1.71V | 40 | Not Qualified | S-PBGA-B121 | Internal | 86 | DMA, I2S, LVD, POR, PWM, WDT | 128K x 8 | 100MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | 50MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 38x16b; D/A 2x12b | |||||||||||||||||||||||||||||||||||||||||||||||||
| MK20DX256ZVLQ10 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K20 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2002 | /files/nxpusainc-mk20dn512zvlq10-datasheets-6452.pdf | 144-LQFP | 20mm | 20mm | 144 | 15 Weeks | 3A991.A.2 | 8542.31.00.01 | e3 | MATTE TIN | YES | QUAD | GULL WING | 260 | 3.3V | 0.5mm | MK20DX256 | 3.6V | 1.71V | 40 | Not Qualified | S-PQFP-G144 | Internal | 100 | DMA, I2S, LVD, POR, PWM, WDT | 64K x 8 | 100MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | 50MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 42x16b; D/A 2x12b | 4K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||
| STM32F469IGH6 | STMicroelectronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | STM32F4 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/stmicroelectronics-stm32f469nih6-datasheets-4176.pdf | 201-UFBGA | 7mm | 7mm | Lead Free | 176 | 12 Weeks | YES | BOTTOM | BALL | 3.3V | 0.5mm | STM32F469 | 3.6V | 1.7V | Internal | 114 | Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT | 384K x 8 | 180MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | 26MHz | 24 | 32 | ARM® Cortex®-M4 | 1.7V~3.6V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SAI, SDIO, SPI, UART/USART, USB, USB OTG | A/D 24x12b; D/A 2x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| R7FA6M3AF3CFP#AA0 | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | RA6M3 | Surface Mount | -40°C~105°C TA | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/renesaselectronicsamerica-r7fa6m3af3cfpaa0-datasheets-9755.pdf | 100-LQFP | 14mm | 14mm | 100 | 12 Weeks | yes | YES | QUAD | GULL WING | 3.3V | 0.5mm | 100 | 3.6V | 2.7V | Internal | 124 | DMA, LVD, POR, PWM, WDT | 640K x 8 | 120MHz | MICROCONTROLLER RISC | 32 | YES | YES | YES | 24MHz | 24 | 16 | ARM® Cortex®-M4 | 2.7V~3.6V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, MMC/SD, SCI, SPI, UART/USART, USB | A/D 19x12b SAR; D/A 2x12b | 64K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CY9BF316NPMC-G-JNE2 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | FM3 MB9B310R | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.7mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/cypresssemiconductorcorp-cy9bf316npmcgjne2-datasheets-9758.pdf | 100-LQFP | 14mm | 14mm | 100 | 20 Weeks | e3 | Tin (Sn) | YES | QUAD | GULL WING | NOT SPECIFIED | 4.5V | 0.5mm | 5.5V | 2.7V | NOT SPECIFIED | S-PQFP-G100 | Internal | 83 | DMA, LVD, POR, PWM, WDT | 64K x 8 | 144MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | NO | 8 | 557056 | 65536 | 48MHz | 25 | 16 | ARM® Cortex®-M3 | 2.7V~5.5V | FLASH | 32-Bit | 544KB 544K x 8 | CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB | A/D 16x12b | ||||||||||||||||||||||||||||||||||||||||||||||||
| ATSAME70Q19B-CN | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SAM E70 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.2mm | https://pdf.utmel.com/r/datasheets/microchiptechnology-atsame70n20bant-datasheets-9837.pdf | 144-FBGA | 10mm | 10mm | 144 | 10 Weeks | compliant | YES | BOTTOM | BALL | 1.2V | 0.8mm | 1.32V | 1.08V | S-PBGA-B144 | TS 16949 | Internal | 114 | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 256K x 8 | 300MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | 8 | 20MHz | 24 | 16 | ARM® Cortex®-M7 | 1.7V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SPI, UART/USART, USB | A/D 24x12b; D/A 2x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| PIC32MZ2048EFH100-250I/GJX | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ | Surface Mount | -40°C~85°C TA | Tray | 6 (Time on Label) | CMOS | 1.06mm | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz0512efe064ipt-datasheets-9385.pdf | 100-TFBGA | 7mm | 7mm | 100 | 11 Weeks | compliant | YES | BOTTOM | BALL | 3.3V | 0.65mm | 3.6V | 2.1V | S-PBGA-B100 | TS 16949 | Internal | 78 | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 512K x 8 | 252MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | MIPS32® M-Class | 2.1V~3.6V | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, PMP, SPI, SQI, UART/USART, USB OTG | A/D 40x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MK50DX256CMD10 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K50 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2002 | 144-LBGA | 13mm | 13mm | 144 | 13 Weeks | 3A991.A.2 | 8542.31.00.01 | e1 | TIN SILVER COPPER | YES | BOTTOM | BALL | 260 | 3.3V | 1mm | MK50DX256 | 3.6V | 1.71V | 40 | Microcontrollers | 1.8/3.3V | 77mA | Not Qualified | S-PBGA-B144 | Internal | 96 | DMA, I2S, LVD, POR, PWM, WDT | 64K x 8 | 100MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | CORTEX-M4 | 262144 | 50MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 256KB 256K x 8 | EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 41x16b; D/A 2x12b | 4K x 8 | ||||||||||||||||||||||||||||||||||||||||||||
| DSPIC30F6011A-20E/PT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | dsPIC™ 30F | Surface Mount | Surface Mount | -40°C~125°C TA | Tray | 4 (72 Hours) | CMOS | 20MHz | ROHS3 Compliant | 2006 | /files/microchiptechnology-dspic30f6011a30ipt-datasheets-0952.pdf | 64-TQFP | 10mm | 1.05mm | 10mm | Lead Free | 64 | 6 Weeks | 64 | CAN, I2C, SPI, UART, USART | yes | No | e3 | Matte Tin (Sn) | QUAD | GULL WING | 260 | 5V | DSPIC30F6011A | 64 | 40 | Digital Signal Processors | 132kB | 16 | Internal | 52 | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 6K x 8 | 16b | MICROCONTROLLER, RISC | 16 | YES | NO | 5 | 2 | FIXED-POINT | 8 | 1 | dsPIC | 2.5V~5.5V | FLASH | 16-Bit | 132KB 44K x 24 | CANbus, I2C, SPI, UART/USART | A/D 16x12b | 2K x 8 | ||||||||||||||||||||||||||||||||||||||||||
| DSP56F801FA60E | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 56F8xx | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 1998 | https://pdf.utmel.com/r/datasheets/nxpusainc-dsp56f801fa80e-datasheets-6109.pdf | 48-LQFP | 7mm | 7mm | 48 | 12 Weeks | 3A991.A.2 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 3.3V | 0.5mm | DSP56F801 | 3.6V | 3V | 40 | Digital Signal Processors | 3.3V | Not Qualified | S-PQFP-G48 | Internal | 11 | POR, PWM, WDT | 1K x 16 | 60MHz | DIGITAL SIGNAL PROCESSOR, OTHER | 16 | 1024 | YES | YES | FIXED POINT | 60MHz | YES | MULTIPLE | 56800 | 3V~3.6V | FLASH | 16-Bit | 16KB 8K x 16 | SCI, SPI | A/D 8x12b | ||||||||||||||||||||||||||||||||||||||||||||
| MK50DN512CMC10 | NXP USA Inc. | $129.70 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K50 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.52mm | ROHS3 Compliant | 2002 | https://pdf.utmel.com/r/datasheets/nxpusainc-mk10dn512vmd10-datasheets-0175.pdf | 121-LFBGA | 8mm | 8mm | 121 | 13 Weeks | 3A991.A.2 | 8542.31.00.01 | e1 | TIN SILVER COPPER | YES | BOTTOM | BALL | 260 | 3.3V | 0.65mm | MK50DN512 | 3.6V | 1.71V | 40 | Microcontrollers | 1.8/3.3V | 77mA | Not Qualified | S-PBGA-B121 | Internal | 78 | DMA, I2S, LVD, POR, PWM, WDT | 128K x 8 | 100MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | CORTEX-M4 | 524288 | 32MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 27x16b; D/A 2x12b | ||||||||||||||||||||||||||||||||||||||||||
| MK10DN512ZVMD10 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K10 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.7mm | ROHS3 Compliant | 2002 | /files/nxpusainc-mk10dn512zvlq10-datasheets-6383.pdf | 144-LBGA | 13mm | 13mm | 144 | 15 Weeks | 3A991.A.2 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3V | 1mm | MK10DN512 | 3.6V | 1.71V | 40 | Not Qualified | S-PBGA-B144 | Internal | 104 | DMA, I2S, LVD, POR, PWM, WDT | 128K x 8 | 100MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | 32MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | A/D 46x16b; D/A 2x12b |
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