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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Max Supply Current | Number of Terminations | Factory Lead Time | Weight | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Clock Frequency | Address Bus Width | Organization | Memory Width | Memory Density | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | I/O Type | Standby Voltage-Min | Output Enable |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 71V3578S150PFGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 150MHz | RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3578s150pfgi8-datasheets-9495.pdf | LQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 12 Weeks | 3.465V | 3.135V | 100 | Parallel | 4.5 Mb | yes | 1.4mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 305mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 30 | SRAMs | RAM, SRAM | 3-STATE | 3.8 ns | 18b | 0.035A | 18b | Synchronous | COMMON | |||||||||||||||||||||||||||
| 7008L35J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7008l35j-datasheets-9496.pdf | PLCC | 29.21mm | 29.21mm | 5V | Contains Lead | 84 | 7 Weeks | 5.5V | 4.5V | 84 | Parallel | 512 kb | no | 3.63mm | 2 | EAR99 | No | 1 | 255mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 84 | COMMERCIAL | SRAMs | 5V | 64kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 32b | 64KX8 | 0.005A | 8b | Asynchronous | COMMON | ||||||||||||||||||||||||||
| IDT71T016SA12BF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.34mm | Non-RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71t016sa12bf8-datasheets-9491.pdf | 7mm | 7mm | 48 | 48 | Parallel | 3A991.B.2.B | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 2.5V | 0.75mm | 48 | COMMERCIAL | 2.625V | 2.375V | 20 | SRAMs | 2.5V | 0.15mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 64KX16 | 16 | 0.015A | 12 ns | COMMON | 2.38V | |||||||||||||||||||||||||||||||||
| 7130LA55PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7130la55pf8-datasheets-9488.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 8 kb | 1.4mm | 2 | No | 110mA | 1kB | RAM, SDR, SRAM | 55 ns | 20b | 8b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71V3557SA85BGG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 2.36mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3557sa85bgg-datasheets-9468.pdf | BGA | 22mm | 14mm | 119 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | unknown | 8542.32.00.41 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 1.27mm | 119 | COMMERCIAL | 3.465V | 3.135V | 30 | SRAMs | 3.3V | 0.225mA | Not Qualified | RAM, SRAM | 3-STATE | 90MHz | 128KX36 | 36 | 4718592 bit | 0.04A | 8.5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||||
| 7027S15PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7027s15pf-datasheets-9417.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 512 kb | no | 1.4mm | 2 | No | 1 | 365mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 5V | 64kB | RAM, SDR, SRAM | 3-STATE | 15 ns | 30b | 0.015A | 16b | Asynchronous | COMMON | |||||||||||||||||||||||||||
| IDT71P79804S267BQ8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 70°C | 0°C | 267MHz | Non-RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71p79804s267bq8-datasheets-9389.pdf | 165 | Parallel | DDR, RAM, SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 71V3578S133PFG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3578s133pfg8-datasheets-9340.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 12 Weeks | 3.465V | 3.135V | 100 | Parallel | 4.5 Mb | yes | 1.4mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 250mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | COMMERCIAL | 30 | SRAMs | 512kB | RAM, SDR, SRAM | 133MHz | 3-STATE | 4.2 ns | 18b | 0.03A | 18b | Synchronous | COMMON | |||||||||||||||||||||||||
| 70T631S10BF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t631s10bf-datasheets-9325.pdf | 15mm | 15mm | 2.5V | Contains Lead | 208 | 7 Weeks | 2.6V | 2.4V | 208 | Parallel | 4 Mb | no | 1.4mm | 2 | No | 1 | 405mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 0.8mm | 208 | COMMERCIAL | SRAMs | 512kB | RAM, SDR, SRAM | 3-STATE | 10 ns | 36b | 0.01A | 18b | Asynchronous | COMMON | |||||||||||||||||||||||||||||
| 7130LA35C | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 70°C | 0°C | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7130la35c-datasheets-9313.pdf | DIP | 61.72mm | 15.24mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 48 | Parallel | 8 kb | 3.3mm | 2 | No | 120mA | 1kB | RAM, SDR, SRAM | 35 ns | 20b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||
| IDT71P79804S267BQ | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 267MHz | SYNCHRONOUS | 1.2mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71p79804s267bq-datasheets-9273.pdf | FBGA | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 1.8V | 1mm | 165 | COMMERCIAL | 1.9V | 1.7V | 20 | SRAMs | 1.5/1.81.8V | 0.95mA | Not Qualified | DDR, RAM, SRAM | 3-STATE | 1MX18 | 18 | 18874368 bit | 0.42A | 0.45 ns | SEPARATE | 1.7V | |||||||||||||||||||||||||||||||
| 71V65903S80PFG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 95MHz | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v65903s80pfg8-datasheets-9208.pdf | TQFP | 20mm | 1.4mm | 14mm | 3.3V | Lead Free | 250mA | 100 | 8 Weeks | 657.000198mg | 3.465V | 3.135V | 100 | Parallel | 9 Mb | yes | 1.4mm | 1 | FLOW-THROUGH | No | 1 | 250mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 100 | COMMERCIAL | 30 | 1.1MB | RAM, SDR, SRAM | 8 ns | 19b | 18b | Synchronous | |||||||||||||||||||||||||||||
| IDT71024S15Y8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Tape and Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.683mm | Non-RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71024s15y8-datasheets-9186.pdf | 20.955mm | 5V | 32 | 5.5V | 4.5V | 32 | Parallel | 1 Mb | 1 | not_compliant | 1 | 155mA | e0 | DUAL | J BEND | 225 | 5V | 32 | COMMERCIAL | 30 | SRAMs | 5V | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 15 ns | 17b | 8 | 8b | Asynchronous | COMMON | YES | ||||||||||||||||||||||||||||||||||
| IDT71V416S10PHI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.2mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v416s10phi8-datasheets-9176.pdf | TSOP | 18.41mm | 10.16mm | 44 | Parallel | no | 3A991.B.2.A | 8542.32.00.41 | 1 | e0 | TIN LEAD | YES | DUAL | GULL WING | 225 | 3.3V | 0.8mm | 44 | INDUSTRIAL | 3.6V | 3V | 20 | Not Qualified | R-PDSO-G44 | RAM, SRAM - Asynchronous | 256KX16 | 16 | 4194304 bit | 10 ns | ||||||||||||||||||||||||||||||||||||||
| 71V65803S133BGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | 2.36mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v65803s133bgi8-datasheets-9168.pdf | BGA | 14mm | 22mm | 3.3V | Contains Lead | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 9 Mb | no | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 320mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 119 | INDUSTRIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 4.2 ns | 19b | 0.06A | 18b | Synchronous | COMMON | |||||||||||||||||||||||||||
| IDT71P79804S250BQI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 250MHz | SYNCHRONOUS | Non-RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71p79804s250bqi8-datasheets-9170.pdf | 165 | 165 | Parallel | not_compliant | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 1mm | SRAMs | 1.5/1.81.8V | 0.9mA | Not Qualified | DDR, RAM, SRAM | 3-STATE | 1MX18 | 18 | 18874368 bit | 0.41A | 0.45 ns | SEPARATE | 1.7V | |||||||||||||||||||||||||||||||||||||||||||
| 7007S55PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7007s55pf8-datasheets-9163.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 80 | 7 Weeks | 5.5V | 4.5V | 80 | Parallel | 256 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 270mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.65mm | 80 | COMMERCIAL | 20 | SRAMs | 5V | 32kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 30b | 0.015A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||||
| 7142LA55J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7142la55j-datasheets-9148.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 16 kb | 3.63mm | 2 | No | 110mA | 2kB | RAM, SDR, SRAM | 55 ns | 22b | 8b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71P79804S250BQI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 250MHz | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71p79804s250bqi-datasheets-9072.pdf | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 1.8V | 1mm | 165 | INDUSTRIAL | 1.9V | 1.7V | 20 | SRAMs | 1.5/1.81.8V | 0.9mA | Not Qualified | DDR, RAM, SRAM | 3-STATE | 1MX18 | 18 | 18874368 bit | 0.41A | 0.45 ns | SEPARATE | 1.7V | |||||||||||||||||||||||||||||||
| 7142LA20JG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 70°C | 0°C | RoHS Compliant | 2001 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7142la20jg8-datasheets-9061.pdf | PLCC | 19mm | 19mm | 5V | Lead Free | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 16 kb | 3.63mm | 2 | No | 200mA | 2kB | RAM, SDR, SRAM | 20 ns | 22b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||
| 70V261S35PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2001 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v261s35pf-datasheets-9043.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 7 Weeks | 3.6V | 3V | 100 | Parallel | 256 kb | 1.4mm | 2 | No | 140mA | 32kB | RAM, SDR, SRAM | 35 ns | 28b | 16b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||||
| 71V124SA12YG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.683mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v124sa12yg8-datasheets-9030.pdf | 20.9mm | 10.2mm | 3.3V | Lead Free | 32 | 7 Weeks | 3.6V | 3V | 32 | Parallel | 1 Mb | yes | 2.2mm | 1 | No | 1 | 130mA | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 3.3V | 32 | COMMERCIAL | SRAMs | 128kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 12 ns | 17b | 8b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||||||||
| 7142LA20JG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7142la20jg-datasheets-9023.pdf | PLCC | 19mm | 19mm | 5V | Lead Free | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 16 kb | 3.63mm | 2 | No | 200mA | 2kB | RAM, SDR, SRAM | 20 ns | 22b | 8b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||||
| 71V016SA20PHGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v016sa20phgi-datasheets-9009.pdf | TSOP | 18.41mm | 10.16mm | 3.3V | Lead Free | 44 | 12 Weeks | 3.6V | 3V | 44 | Parallel | 1 Mb | yes | 1mm | 1 | No | 1 | 120mA | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 3.3V | 0.8mm | 44 | INDUSTRIAL | 30 | SRAMs | 128kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 20 ns | 16b | 16b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||||||
| 71T75602S133PFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71t75602s133pfg-datasheets-8998.pdf | TQFP | 20mm | 14mm | 2.5V | Lead Free | 100 | 8 Weeks | 2.625V | 2.375V | 100 | Parallel | 18 Mb | yes | 1.4mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 195mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 100 | COMMERCIAL | 30 | SRAMs | 2.3MB | RAM, SDR, SRAM | 133MHz | 3-STATE | 4.2 ns | 19b | 0.04A | 36b | Synchronous | COMMON | 2.38V | |||||||||||||||||||||||||
| 70V3319S133PRFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3319s133prfi8-datasheets-8969.pdf | TQFP | 20mm | 14mm | 3.3V | Contains Lead | 128 | 7 Weeks | 3.45V | 3.15V | 128 | Parallel | 4.5 Mb | no | 1.4mm | 2 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | No | 1 | 480mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 128 | INDUSTRIAL | SRAMs | RAM, SRAM | 3-STATE | 15 ns | 18b | 0.04A | 18b | Synchronous | COMMON | |||||||||||||||||||||||||||
| 7024L20PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2000 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7024l20pf8-datasheets-8954.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 64 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 240mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 5V | 8kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 12b | 4KX16 | 0.0015A | 16b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||
| IDT71P79804S250BQGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 85°C | -40°C | 250MHz | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71p79804s250bqgi8-datasheets-8941.pdf | 165 | Parallel | DDR, RAM, SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71V416S10BEI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 4 (72 Hours) | 85°C | -40°C | CMOS | 1.2mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v416s10bei8-datasheets-8939.pdf | TFBGA | 9mm | 9mm | 48 | Parallel | 3A991.B.2.A | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 3.3V | 0.75mm | 48 | INDUSTRIAL | 3.6V | 3V | 30 | SRAMs | 3.3V | 0.2mA | Not Qualified | S-PBGA-B48 | RAM, SRAM - Asynchronous | 3-STATE | 256KX16 | 16 | 4194304 bit | 0.02A | 10 ns | COMMON | 3V | |||||||||||||||||||||||||||||||
| 71V321L25TF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v321l25tf-datasheets-8936.pdf | TQFP | 10mm | 10mm | 3.3V | Contains Lead | 64 | 7 Weeks | 3.6V | 3V | 64 | Parallel | 16 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 100mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 64 | INDUSTRIAL | 20 | SRAMs | 2kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 22b | 0.0015A | 8b | Asynchronous | COMMON | 2V |
