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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Voltage - Rated DC | Package / Case | Length | Width | Operating Supply Voltage | Number of Terminations | Factory Lead Time | Number of Pins | Interface | Density | Pbfree Code | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Voltage | Surface Mount | Voltage - Supply | Terminal Position | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Supplier Device Package | Screening Level | Memory Size | Memory Type | uPs/uCs/Peripheral ICs Type | Output Characteristics | Access Time | Programming Voltage | Clock Frequency | Address Bus Width | Memory Format | Memory Interface | Organization | Memory Width | Write Cycle Time - Word, Page | Memory Density | Parallel/Serial | Alternate Memory Width | Standby Current-Max | Word Size | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Access Time (Max) | Sync/Async | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Ready/Busy | Page Size | I/O Type | Standby Voltage-Min |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MT29F4G16ABBDAHC:D | Micron Technology Inc. | $3.38 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | FLASH - NAND | 1mm | ROHS3 Compliant | 2011 | https://pdf.utmel.com/r/datasheets/micron-mt29f4g16abbdahcd-datasheets-4229.pdf | 63-VFBGA | 13mm | 1.8V | 63 | 63 | 4 Gb | yes | No | 1 | 20mA | 1.7V~1.95V | BOTTOM | 260 | 1.8V | 0.8mm | 1.95V | 1.7V | 30 | 4Gb 256M x 16 | Non-Volatile | 25 ns | 1b | FLASH | Parallel | 256MX16 | 16 | 0.00005A | 16b | Asynchronous | NO | NO | YES | 4K | 64K | YES | 2kB | ||||||||||||||||||||||||||||||||||||||||
| MT29F2G08ABBFAH4-IT:F | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | FLASH - NAND | 1mm | ROHS3 Compliant | 63-VFBGA | 11mm | 1.8V | 63 | 16 Weeks | 63 | 2 Gb | yes | 3A991.B.1.A | 8542.32.00.51 | 1 | 30mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.7V~1.95V | BOTTOM | 260 | 1.8V | 0.8mm | 63 | 1.95V | 1.7V | 30 | 2Gb 256M x 8 | Non-Volatile | 30 ns | 29b | FLASH | Parallel | 256MX8 | 8 | 8b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||
| W25Q128FVEIP | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 0.8mm | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q128fveip-datasheets-5856.pdf | 8-WDFN Exposed Pad | 8mm | 6mm | 8 | 3A991.B.1.A | 8542.32.00.51 | 1 | YES | 2.7V~3.6V | DUAL | 3V | 1.27mm | 8 | 3.6V | 2.7V | R-PDSO-N8 | 128Mb 16M x 8 | Non-Volatile | 3V | 104MHz | FLASH | SPI - Quad I/O, QPI | 128MX1 | 1 | 50μs, 3ms | 134217728 bit | SERIAL | |||||||||||||||||||||||||||||||||||||||||||||||||
| IS62WV25616DBLL-45TI | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | SRAM - Asynchronous | 1.2mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/issiintegratedsiliconsolutioninc-is62wv25616dall55bitr-datasheets-5647.pdf | 44-TSOP (0.400, 10.16mm Width) | 18.41mm | 10.16mm | 44 | 44 | no | 3A991.B.2.A | 8542.32.00.41 | 1 | YES | 2.3V~3.6V | DUAL | NOT SPECIFIED | 0.8mm | 44 | 3.6V | 2.3V | NOT SPECIFIED | 2.5/3.3V | 0.018mA | Not Qualified | 4Mb 256K x 16 | Volatile | 3-STATE | SRAM | Parallel | 256KX16 | 16 | 45ns | 4194304 bit | 0.000007A | 45 ns | COMMON | 1.2V | |||||||||||||||||||||||||||||||||||||||||||||
| MT29F8G16ABBCAM71M3WC1 | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 0°C~70°C TA | Bulk | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 1.8V | 8 Gb | 1.8V | 1.7V~1.95V | 8Gb 512M x 16 | Non-Volatile | FLASH | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MTFC4GMDEA-R1 IT | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | e•MMC™ | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 153-WFBGA | 2.7V~3.6V | 153-WFBGA (11.5x13) | 32Gb 4G x 8 | Non-Volatile | FLASH | MMC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q256FVEIP TR | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q256fvfiptr-datasheets-5790.pdf | 8-WDFN Exposed Pad | 2.7V~3.6V | 256Mb 32M x 8 | Non-Volatile | 104MHz | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MTFC16GJDEC-H1 WT | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | e•MMC™ | -25°C~85°C TA | Bulk | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 1.65V~3.6V | 128Gb 16G x 8 | Non-Volatile | FLASH | MMC | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q256FVCIP | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 1.2mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q256fvfiptr-datasheets-5790.pdf | 24-TBGA | 8mm | 6mm | 24 | 1 | YES | 2.7V~3.6V | BOTTOM | 3V | 1mm | 3.6V | 2.7V | 3/3.3V | 0.025mA | Not Qualified | R-PBGA-B24 | 256Mb 32M x 8 | Non-Volatile | 3V | 104MHz | FLASH | SPI - Quad I/O, QPI | 256MX1 | 1 | 50μs, 3ms | 268435456 bit | SERIAL | 0.00002A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | |||||||||||||||||||||||||||||||||||||||||||||
| IS62WV5128DBLL-45BI-TR | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | SRAM - Asynchronous | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/issiintegratedsiliconsolutioninc-is62wv5128dall55tli-datasheets-5717.pdf | 36-TFBGA | 36 | 2.3V~3.6V | 36-TFBGA (6x8) | 4Mb 512K x 8 | Volatile | 45ns | SRAM | Parallel | 45ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MTFC4GACAANA-4M IT | Micron Technology Inc. | $108.48 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | e•MMC™ | -40°C~85°C TA | Tray | FLASH - NAND | ROHS3 Compliant | 12 Weeks | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 2.7V~3.6V | NOT SPECIFIED | NOT SPECIFIED | 32Gb 4G x 8 | Non-Volatile | MICROPROCESSOR CIRCUIT | FLASH | MMC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IS65WV25616DBLL-45CTLA1-TR | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | SRAM - Asynchronous | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/issiintegratedsiliconsolutioninc-is62wv25616dall55bitr-datasheets-5647.pdf | 44-TSOP (0.400, 10.16mm Width) | 44 | 2.3V~3.6V | 44-TSOP II | 4Mb 256K x 16 | Volatile | 45ns | SRAM | Parallel | 45ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT28HC256-90FM/883-023 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -55°C~125°C TC | Tube | 3 (168 Hours) | EEPROM | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-at28hc25612su-datasheets-3953.pdf | 28-CFlatPack | 4.5V~5.5V | 28-Flatpack, Ceramic Bottom-Brazed | 256Kb 32K x 8 | Non-Volatile | 90ns | EEPROM | Parallel | 10ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT28C256-15UM/883-610 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | -55°C~125°C TC | Tray | 3 (168 Hours) | CMOS | ASYNCHRONOUS | 4.4mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-at28c256e15su-datasheets-4097.pdf | 28-BCPGA | 16.51mm | 13.97mm | 28 | AUTOMATIC WRITE | 1 | NO | 4.5V~5.5V | PERPENDICULAR | 5V | 2.54mm | 5.5V | 4.5V | R-CPGA-P28 | MIL-STD-883 Class C | 256Kb 32K x 8 | Non-Volatile | 150ns | 5V | EEPROM | Parallel | 32KX8 | 8 | 10ms | 262144 bit | 10ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| IS62WV5128DALL-55HLI-TR | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | SRAM - Asynchronous | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/issiintegratedsiliconsolutioninc-is62wv5128dall55tli-datasheets-5717.pdf | 32-TFSOP (0.465, 11.80mm Width) | 32 | 1.65V~2.2V | 32-TSOP I | 4Mb 512K x 8 | Volatile | 55ns | SRAM | Parallel | 55ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT24C512C-CUM-T-834 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-at24c512csshmt-datasheets-0076.pdf | 8-VFBGA, DSBGA | 1.7V~3.6V | AT24C512C | 512Kb 64K x 8 | Non-Volatile | 900ns | 400kHz | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IS62WV5128DALL-55T2LI-TR | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | SRAM - Asynchronous | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/issiintegratedsiliconsolutioninc-is62wv5128dall55tli-datasheets-5717.pdf | 32-SOIC (0.400, 10.16mm Width) | 32 | 1.65V~2.2V | 32-TSOP II | 4Mb 512K x 8 | Volatile | 55ns | SRAM | Parallel | 55ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IS65WV25616DBLL-55CTLA3-TR | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 3 (168 Hours) | SRAM - Asynchronous | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/issiintegratedsiliconsolutioninc-is62wv25616dall55bitr-datasheets-5647.pdf | 44-TSOP (0.400, 10.16mm Width) | 2.3V~3.6V | 44-TSOP II | 4Mb 256K x 16 | Volatile | 55ns | SRAM | Parallel | 55ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT29F2G08ABAFAH4-IT:F | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 2013 | 63-VFBGA | 3.3V | 9 Weeks | 63 | 2 Gb | Copper, Silver, Tin | 30mA | 2.7V~3.6V | 2Gb 256M x 8 | Non-Volatile | 30 ns | 2.7V | 29b | FLASH | Parallel | 8b | Asynchronous | 2kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IS66WVE2M16ALL-7010BLI | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | PSRAM (Pseudo SRAM) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/issiintegratedsiliconsolutioninc-is66wve2m16all7010bli-datasheets-5772.pdf | 48-TFBGA | 1.7V~1.95V | 32Mb 2M x 16 | Volatile | PSRAM | Parallel | 70ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q256FVEIP | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 0.8mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q256fvfiptr-datasheets-5790.pdf | 8-WDFN Exposed Pad | 8mm | 6mm | 8 | 1 | YES | 2.7V~3.6V | DUAL | 3V | 1.27mm | 3.6V | 2.7V | 3/3.3V | 0.025mA | Not Qualified | R-PDSO-N8 | 256Mb 32M x 8 | Non-Volatile | 3V | 104MHz | FLASH | SPI - Quad I/O, QPI | 256MX1 | 1 | 50μs, 3ms | 268435456 bit | SERIAL | 0.00002A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | |||||||||||||||||||||||||||||||||||||||||||||
| IS62WV5128DALL-55BLI-TR | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | SRAM - Asynchronous | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/issiintegratedsiliconsolutioninc-is62wv5128dall55tli-datasheets-5717.pdf | 36-TFBGA | 36 | 1.65V~2.2V | 4Mb 512K x 8 | Volatile | SRAM | Parallel | 55ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S25FL164K0XMFV013 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | FL1-K | Surface Mount | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 2.159mm | ROHS3 Compliant | 2015 | https://pdf.utmel.com/r/datasheets/cypresssemiconductorcorp-s25fl164k0xnfiq11-datasheets-1131.pdf | 8-SOIC (0.209, 5.30mm Width) | 3V | 8 | 11 Weeks | 8 | SPI, Serial | 64 Mb | ALSO CONFIGURABLE AS 64M X 1 | Tin | 1 | e3 | 2.7V~3.6V | DUAL | NOT SPECIFIED | 3V | 1.27mm | 3.6V | 2.7V | NOT SPECIFIED | 0.025mA | Not Qualified | 64Mb 8M x 8 | Non-Volatile | 7 ns | 3V | 108MHz | 24b | FLASH | SPI - Quad I/O | 16MX4 | 4 | 3ms | 2 | 0.000005A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 256B | ||||||||||||||||||||||||||||||||||||
| IS66WVE2M16ALL-7010BLI-TR | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | PSRAM (Pseudo SRAM) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/issiintegratedsiliconsolutioninc-is66wve2m16all7010bli-datasheets-5772.pdf | 48-TFBGA | 1.7V~1.95V | 48-TFBGA (6x8) | 32Mb 2M x 16 | Volatile | 70ns | PSRAM | Parallel | 70ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q256FVFIP | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 2.64mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q256fvcif-datasheets-3435.pdf | 16-SOIC (0.295, 7.50mm Width) | 10.31mm | 7.49mm | 16 | 1 | YES | 2.7V~3.6V | DUAL | 3V | 1.27mm | 3.6V | 2.7V | 3/3.3V | 0.025mA | Not Qualified | R-PDSO-G16 | 256Mb 32M x 8 | Non-Volatile | 3V | 104MHz | FLASH | SPI - Quad I/O, QPI | 256MX1 | 1 | 50μs, 3ms | 268435456 bit | SERIAL | 0.00002A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | |||||||||||||||||||||||||||||||||||||||||||||
| AT28HC256-90LM/883-696 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -55°C~125°C TC | Tube | 3 (168 Hours) | EEPROM | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-at28hc25612su-datasheets-3953.pdf | 32-CLCC | 4.5V~5.5V | 32-LCC (11.43x13.97) | 256Kb 32K x 8 | Non-Volatile | 90ns | EEPROM | Parallel | 10ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IS66WVE4M16ALL-7010BLI | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | PSRAM (Pseudo SRAM) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/issiintegratedsiliconsolutioninc-is66wve4m16all70bli-datasheets-1391.pdf | 48-TFBGA | 1.7V~1.95V | 64Mb 4M x 16 | Volatile | PSRAM | Parallel | 70ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT29F8G08ABBCAH4-IT:C | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 2013 | 63-VFBGA | 1.8V | 63 | 5 Weeks | 63 | 8 Gb | Copper, Silver, Tin | No | 20mA | 1.7V~1.95V | BOTTOM | 1.8V | 0.8mm | 8Gb 1G x 8 | Non-Volatile | 31b | FLASH | Parallel | 1GX8 | 8 | 0.00005A | 8b | 30 ns | Asynchronous | NO | NO | YES | 4K | 256K | YES | 4kB | ||||||||||||||||||||||||||||||||||||||||||||||||
| AT28C010-12FM/883-341 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -55°C~125°C TC | Tube | 3 (168 Hours) | EEPROM | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-at28c010e12em883-datasheets-6434.pdf | 32-CFlatpack | 4.5V~5.5V | 32-Flatpack, Ceramic Bottom-Brazed | 1Mb 128K x 8 | Non-Volatile | 120ns | EEPROM | Parallel | 10ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IS62WV25616DBLL-45BI | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | SRAM - Asynchronous | 1.2mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/issiintegratedsiliconsolutioninc-is62wv25616dall55bitr-datasheets-5647.pdf | 48-TFBGA | 8mm | 6mm | 48 | 48 | no | 3A991.B.2.A | 8542.32.00.41 | 1 | YES | 2.3V~3.6V | BOTTOM | NOT SPECIFIED | 0.75mm | 48 | 3.6V | 2.3V | NOT SPECIFIED | 2.5/3.3V | 0.018mA | Not Qualified | 4Mb 256K x 16 | Volatile | 3-STATE | SRAM | Parallel | 256KX16 | 16 | 45ns | 4194304 bit | 0.000007A | 45 ns | COMMON | 1.2V |
