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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Max Supply Current | Number of Terminations | Factory Lead Time | REACH SVHC | Number of Pins | Interface | Density | Pbfree Code | Number of Ports | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Voltage - Supply | Terminal Position | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Supplier Device Package | Screening Level | Memory Size | Memory Type | Data Bus Width | Output Characteristics | Access Time | Programming Voltage | Clock Frequency | Address Bus Width | Memory Format | Memory Interface | Organization | Memory Width | Write Cycle Time - Word, Page | Memory Density | Parallel/Serial | Alternate Memory Width | Standby Current-Max | Word Size | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Access Time (Max) | Sync/Async | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Ready/Busy | Boot Block | Common Flash Interface | Page Size | I/O Type | Standby Voltage-Min |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| SST39VF402C-70-4I-MAQE-T | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SST39 MPF™ | Surface Mount | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2014 | https://pdf.utmel.com/r/datasheets/microchiptechnology-sst39vf401c704ceke-datasheets-2268.pdf | 48-WFBGA | 3.3V | 48 | 7 Weeks | 48 | 4 Mb | No | 18mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 2.7V~3.6V | BOTTOM | 0.5mm | SST39VF402C | 4Mb 256K x 16 | Non-Volatile | 70ns | 1b | FLASH | Parallel | 256KX16 | 16 | 10μs | 0.00002A | 16b | Asynchronous | YES | YES | YES | 128 | 2K | YES | TOP | YES | |||||||||||||||||||||||||||||||||||||||||||||||||||
| MX25L6406EXCI-12G | Macronix |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MX25xxx05/06 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 1.2mm | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/macronix-mx25l6406em2i12g-datasheets-1335.pdf | 24-TBGA, CSPBGA | 8mm | 6mm | 24 | 16 Weeks | SPI, Serial | 1 | YES | 2.7V~3.6V | BOTTOM | NOT SPECIFIED | 3.3V | 1mm | 24 | 3.6V | 2.7V | NOT SPECIFIED | 3/3.3V | 0.025mA | Not Qualified | R-PBGA-B24 | 64Mb 8M x 8 | Non-Volatile | 3V | 86MHz | FLASH | SPI | 32MX2 | 2 | 300μs, 5ms | 67108864 bit | 1 | 0.00002A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | |||||||||||||||||||||||||||||||||||||||||||||||
| 25AA256T-E/SM | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 1 (Unlimited) | CMOS | SYNCHRONOUS | 2.03mm | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/microchiptechnology-25lc256tisn-datasheets-0746.pdf | 8-SOIC (0.209, 5.30mm Width) | 5.21mm | Lead Free | 8 | 5 Weeks | 8 | SPI, Serial | 256 kb | yes | EAR99 | 1 | 6mA | e3 | Matte Tin (Sn) - annealed | 1.8V~5.5V | DUAL | 260 | 2.5V | 1.27mm | 25AA256 | 8 | 5.5V | 40 | 2/5V | Not Qualified | 256Kb 32K x 8 | Non-Volatile | 50 ns | 10MHz | EEPROM | SPI | 8 | 5ms | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | |||||||||||||||||||||||||||||||||||||||||||||
| S29AL008J70BFI013 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | AL-J | Surface Mount | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | 1mm | ROHS3 Compliant | 2015 | https://pdf.utmel.com/r/datasheets/cypresssemiconductorcorp-s29al008j70bfi020-datasheets-8036.pdf | 48-VFBGA | 8.15mm | 48 | 8 Weeks | 48 | 8 Mb | EAR99 | TOP BOOT BLOCK | No | 8542.32.00.51 | 1 | 12mA | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 2.7V~3.6V | BOTTOM | 260 | 3V | 0.8mm | 3.6V | 2.7V | 40 | 3.3V | 8Mb 1M x 8 512K x 16 | Non-Volatile | 8b | 3V | FLASH | Parallel | 512KX16 | 16 | 70ns | 8 | 0.000005A | 70 ns | Asynchronous | YES | YES | YES | 12115 | 16K8K32K64K | YES | TOP | YES | ||||||||||||||||||||||||||||||||||||||||
| S29AS008J70BFA040 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | AS-J | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | 85°C | -40°C | FLASH - NOR | ROHS3 Compliant | 2015 | 48-VFBGA | 18 Weeks | 48 | Parallel | 1.65V~1.95V | 48-FBGA (8.15x6.15) | 8Mb 1M x 8 512K x 16 | Non-Volatile | 70ns | FLASH | Parallel | 70ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IS61C64AL-10JLI-TR | ISSI, Integrated Silicon Solution Inc | $1.11 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 2 (1 Year) | SRAM - Asynchronous | 3.56mm | ROHS3 Compliant | 28-BSOJ (0.300, 7.62mm Width) | 5V | 28 | 8 Weeks | 28 | 64 kb | yes | 1 | EAR99 | No | 1 | 50mA | e3 | MATTE TIN | YES | 4.75V~5.25V | DUAL | 260 | 5V | 28 | 40 | 64Kb 8K x 8 | Volatile | 13b | SRAM | Parallel | 8KX8 | 8 | 10ns | 8b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W9464G6KH-5I TR | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | SDRAM - DDR | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/winbondelectronics-w9464g6kh5-datasheets-5803.pdf | 66-TSSOP (0.400, 10.16mm Width) | 10 Weeks | 2.3V~2.7V | 64Mb 4M x 16 | Volatile | 55ns | 200MHz | DRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SST39SF020A-55-4C-WHE-T | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SST39 MPF™ | Surface Mount | Surface Mount | 0°C~70°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/microchiptechnology-sst39sf040704cphe-datasheets-1742.pdf | 32-TFSOP (0.488, 12.40mm Width) | 5V | 32 | 7 Weeks | 32 | 2 Mb | No | 25mA | 4.5V~5.5V | DUAL | 5V | 0.5mm | SST39SF020A | 5V | 2Mb 256K x 8 | Non-Volatile | 8b | 55ns | 18b | FLASH | Parallel | 256KX8 | 8 | 20μs | 0.0001A | 8b | Asynchronous | YES | YES | YES | 64 | 4K | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| SST26WF016BT-104I/SN | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SST26 SQI® | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 1 (Unlimited) | CMOS | SYNCHRONOUS | 1.75mm | ROHS3 Compliant | 2014 | https://pdf.utmel.com/r/datasheets/microchiptechnology-sst26wf016b104isn-datasheets-5992.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | 1.8V | 8 | 7 Weeks | SPI, Serial | 16 Mb | 1 | e3 | Matte Tin (Sn) - annealed | YES | 1.65V~1.95V | DUAL | 260 | 1.8V | 1.27mm | SST26WF016 | 1.95V | 1.65V | 40 | R-PDSO-G8 | TS 16949 | 16Mb 2M x 8 | Non-Volatile | 104MHz | FLASH | SPI - Quad I/O | 16MX1 | 1 | 1.5ms | 256B | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| SST26WF016BA-104I/SN | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SST26 SQI® | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 1 (Unlimited) | CMOS | SYNCHRONOUS | ROHS3 Compliant | 2014 | https://pdf.utmel.com/r/datasheets/microchiptechnology-sst26wf016b104isn-datasheets-5992.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 1.25mm | 3.9mm | 1.8V | 8 | 7 Weeks | 8 | SPI, Serial | 16 Mb | 1 | e3 | Matte Tin (Sn) - annealed | 1.65V~1.95V | DUAL | 260 | 1.8V | 1.27mm | SST26WF016 | 1.95V | 1.65V | 40 | TS 16949 | 16Mb 2M x 8 | Non-Volatile | 3 ns | 104MHz | FLASH | SPI - Quad I/O | 16MX1 | 1.5ms | 256B | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| 25AA256T-E/ST | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 1 (Unlimited) | CMOS | SYNCHRONOUS | 1.1mm | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/microchiptechnology-25lc256tisn-datasheets-0746.pdf | 8-TSSOP (0.173, 4.40mm Width) | 4.4mm | 3mm | 8 | 6 Weeks | 8 | SPI, Serial | 256 kb | yes | EAR99 | 1 | 6mA | e3 | Matte Tin (Sn) | 1.8V~5.5V | DUAL | 260 | 2.5V | 0.65mm | 25AA256 | 8 | 5.5V | 40 | 2/5V | Not Qualified | 256Kb 32K x 8 | Non-Volatile | 50 ns | 10MHz | EEPROM | SPI | 8 | 5ms | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | |||||||||||||||||||||||||||||||||||||||||||||
| SST39VF801C-70-4C-EKE | Microchip Technology | $2.23 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SST39 MPF™ | Surface Mount | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | CMOS | 5MHz | ROHS3 Compliant | 2011 | https://pdf.utmel.com/r/datasheets/microchiptechnology-sst39vf802c704ieke-datasheets-9587.pdf | 48-TFSOP (0.724, 18.40mm Width) | 18.5mm | 1.05mm | 12.2mm | 3.3V | Lead Free | 48 | 7 Weeks | No SVHC | 48 | 8 Mb | EAR99 | BOTTOM BOOT BLOCK | No | 8542.32.00.51 | 1 | 18mA | e3 | Matte Tin (Sn) - annealed | 2.7V~3.6V | DUAL | 260 | 0.5mm | SST39VF801C | 48 | 3.6V | 2.7V | 40 | 8Mb 512K x 16 | Non-Volatile | 16b | 70ns | 2.7V | 19b | FLASH | Parallel | 512KX16 | 10μs | 0.00002A | 16b | Asynchronous | YES | YES | YES | 256 | 2K | YES | BOTTOM | YES | ||||||||||||||||||||||||||||||||||
| 25LC256T-E/ST | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 1 (Unlimited) | CMOS | 1.1mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-25lc256tisn-datasheets-0746.pdf | 8-TSSOP (0.173, 4.40mm Width) | 4.4mm | 3mm | Lead Free | 8 | 6 Weeks | 8 | SPI, Serial | 256 kb | yes | EAR99 | No | 1 | 6mA | e3 | Matte Tin (Sn) | 2.5V~5.5V | DUAL | 260 | 4.5V | 0.65mm | 25LC256 | 8 | 5.5V | 2.5V | 40 | 3/5V | 256Kb 32K x 8 | Non-Volatile | 50 ns | 10MHz | EEPROM | SPI | 8 | 5ms | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | |||||||||||||||||||||||||||||||||||||||||||||
| SST39VF801C-70-4I-EKE | Microchip Technology | $2.17 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SST39 MPF™ | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 5MHz | ROHS3 Compliant | 2011 | https://pdf.utmel.com/r/datasheets/microchiptechnology-sst39vf802c704ieke-datasheets-9587.pdf | 48-TFSOP (0.724, 18.40mm Width) | 18.5mm | 1.05mm | 12.2mm | 3.3V | Lead Free | 48 | 7 Weeks | No SVHC | 48 | 8 Mb | 3A991.B.1.A | BOTTOM BOOT BLOCK | No | 8542.32.00.51 | 1 | 18mA | e3 | Matte Tin (Sn) - annealed | YES | 2.7V~3.6V | DUAL | 260 | 0.5mm | SST39VF801C | 48 | 3.6V | 2.7V | 40 | 8Mb 512K x 16 | Non-Volatile | 16b | 70ns | 2.7V | 19b | FLASH | Parallel | 512KX16 | 10μs | 0.00002A | 16b | Asynchronous | YES | YES | YES | 256 | 2K | YES | BOTTOM | YES | ||||||||||||||||||||||||||||||||||
| MX25L6435EMI-10G | Macronix |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MX25xxx35/36 - MXSMIO™ | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2014 | https://pdf.utmel.com/r/datasheets/macronix-mx25l6435em2i10g-datasheets-8452.pdf | 16-SOIC (0.295, 7.50mm Width) | Lead Free | 16 Weeks | SPI, Serial | e3 | Matte Tin (Sn) | 2.7V~3.6V | 260 | 40 | 3/3.3V | Not Qualified | 64Mb 8M x 8 | Non-Volatile | 104MHz | FLASH | SPI | 300μs, 5ms | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AS62V256A-70SIN | Alliance Memory, Inc. | $1.83 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | SRAM - Asynchronous | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/alliancememoryinc-as62v256a70sin-datasheets-9499.pdf | 28-SOIC (0.330, 8.38mm Width) | 28 | 6 Weeks | yes | ALSO OPERATES AT MIN 2.7 V | 1 | e3/e6 | PURE MATTE TIN/TIN BISMUTH | YES | 2.5V~3.6V | DUAL | 260 | 3.3V | 1.27mm | 28 | 3.6V | 2.5V | 40 | 3/3.3V | 0.09mA | Not Qualified | R-PDSO-G28 | 256Kb 32K x 8 | Volatile | 3-STATE | SRAM | Parallel | 32KX8 | 8 | 70ns | 262144 bit | 0.000005A | 70 ns | COMMON | 2V | |||||||||||||||||||||||||||||||||||||||||||||||||||
| S29AS008J70BFA022 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | AS-J | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | FLASH - NOR | ROHS3 Compliant | 2015 | 48-VFBGA | 18 Weeks | 48 | Parallel | 1.65V~1.95V | 48-FBGA (8.15x6.15) | 8Mb 1M x 8 512K x 16 | Non-Volatile | 70ns | FLASH | Parallel | 70ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SST39SF010A-55-4C-NHE-T | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SST39 MPF™ | Surface Mount | Surface Mount | 0°C~70°C TA | Tape & Reel (TR) | 2 (1 Year) | CMOS | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/microchiptechnology-sst39sf040704cphe-datasheets-1742.pdf | 32-LCC (J-Lead) | 5V | 32 | 7 Weeks | 32 | 1 Mb | No | 25mA | 4.5V~5.5V | QUAD | 5V | 1.27mm | SST39SF010A | 5V | 1Mb 128K x 8 | Non-Volatile | 8b | 55ns | 17b | FLASH | Parallel | 128KX8 | 8 | 20μs | 0.0001A | 8b | Asynchronous | YES | YES | YES | 32 | 4K | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| BU9829GUL-WE2 | ROHM Semiconductor | $5.55 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -30°C~85°C TA | Tape & Reel (TR) | 1 (Unlimited) | CMOS | SYNCHRONOUS | 0.55mm | ROHS3 Compliant | 2010 | 9-UFBGA, WLCSP | 1.74mm | 1.65mm | 9 | 12 Weeks | 9 | SPI, Serial | 16 kb | yes | 8542.32.00.51 | 1 | 1.6V~3.6V | BOTTOM | NOT SPECIFIED | 1.8V | 0.5mm | BU9829 | 9 | 3.6V | 1.6V | NOT SPECIFIED | 1.8/3.3V | 0.002mA | Not Qualified | 16Kb 2K x 8 | Non-Volatile | 5MHz | EEPROM | SPI | 2KX8 | 8 | 5ms | 0.000001A | SPI | 100000 Write/Erase Cycles | 5ms | 10 | SOFTWARE | ||||||||||||||||||||||||||||||||||||||||||||||
| SST39LF200A-55-4C-B3KE | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SST39 MPF™ | Surface Mount | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | CMOS | 1.2mm | ROHS3 Compliant | 2000 | https://pdf.utmel.com/r/datasheets/microchiptechnology-sst39lf400a554cb3ke-datasheets-1593.pdf | 48-TFBGA | 8mm | 3.3V | Lead Free | 48 | 7 Weeks | 48 | 2 Mb | yes | EAR99 | No | 8542.32.00.51 | 1 | 30mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 3V~3.6V | BOTTOM | 260 | 3.3V | 0.8mm | SST39LF200A | 48 | 3.6V | 3V | 40 | 2Mb 128K x 16 | Non-Volatile | 16b | 55ns | 3V | 17b | FLASH | Parallel | 128KX16 | 16 | 20μs | 0.00002A | 16b | Asynchronous | YES | YES | YES | 64 | 2K | YES | ||||||||||||||||||||||||||||||||||||||
| AT25DL161-MHN-T | Adesto Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C TC | Tape & Reel (TR) | 1 (Unlimited) | CMOS | 0.6mm | ROHS3 Compliant | 1997 | https://pdf.utmel.com/r/datasheets/adestotechnologies-at25dl161sshnt-datasheets-3089.pdf | 8-UDFN Exposed Pad | 6mm | 1.8V | 8 | 16 Weeks | 8 | SPI, Serial | 16 Mb | EAR99 | Gold | 1 | 20mA | e4 | 1.65V~1.95V | DUAL | 260 | 1.8V | 1.27mm | 8 | 1.95V | 1.65V | NOT SPECIFIED | Not Qualified | 16Mb 256Bytes x 8192 pages | Non-Volatile | 8b | 5 ns | 100MHz | 1b | FLASH | SPI | 16MX1 | 1 | 8μs, 3ms | 0.00001A | SPI | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | Synchronous | 256B | |||||||||||||||||||||||||||||||||||||||||||||
| 25AA256-E/P | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Through Hole | -40°C~125°C TA | Tube | 1 (Unlimited) | CMOS | SYNCHRONOUS | 4.32mm | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/microchiptechnology-25lc256tisn-datasheets-0746.pdf | 8-DIP (0.300, 7.62mm) | 9.46mm | 7.62mm | 8 | 7 Weeks | SPI, Serial | yes | EAR99 | Tin | 8542.32.00.51 | 1 | e3 | 1.8V~5.5V | DUAL | NOT APPLICABLE | 2.5V | 2.54mm | 25AA256 | 8 | 5.5V | 1.8V | NOT APPLICABLE | 2/5V | 0.006mA | Not Qualified | R-PDIP-T8 | 256Kb 32K x 8 | Non-Volatile | 50 ns | 10MHz | EEPROM | SPI | 32KX8 | 8 | 5ms | 262144 bit | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | ||||||||||||||||||||||||||||||||||||||||||
| S29GL032N11FFIS12 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | GL-N | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2015 | 64-LBGA | 8 Weeks | 64 | 1.65V~3.6V | 32Mb 4M x 8 2M x 16 | Non-Volatile | 3V | FLASH | Parallel | 110ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S25FL064P0XBHI030 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | FL-P | Surface Mount | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | FLASH - NOR | 1mm | ROHS3 Compliant | 2015 | https://pdf.utmel.com/r/datasheets/cypresssemiconductorcorp-s25fl064p0xbhi020-datasheets-8418.pdf | 24-TBGA | 8mm | 24 | 10 Weeks | 24 | SPI, Serial | 64 Mb | 3A991.B.1.A | No | 8542.32.00.51 | 1 | 26mA | 2.7V~3.6V | BOTTOM | 3V | 1.2mm | 3.6V | 2.7V | 3/3.3V | 64Mb 8M x 8 | Non-Volatile | 8b | 8 ns | 3V | 104MHz | 1b | FLASH | SPI - Quad I/O | 64MX1 | 1 | 5μs, 3ms | 0.00001A | 1b | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | Synchronous | 256B | |||||||||||||||||||||||||||||||||||||||||||||
| S29GL032N11FFIV22 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | GL-N | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | ASYNCHRONOUS | 1.4mm | ROHS3 Compliant | 1997 | 64-LBGA | 13mm | 11mm | 64 | 18 Weeks | 64 | 3A991.B.1.A | 8542.32.00.51 | 1 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | YES | 1.65V~3.6V | BOTTOM | 260 | 3V | 1mm | 3.6V | 2.7V | 40 | 1.8/3.33/3.3V | 0.05mA | Not Qualified | 32Mb 4M x 8 2M x 16 | Non-Volatile | 3V | FLASH | Parallel | 2MX16 | 16 | 110ns | 33554432 bit | 8 | 0.000005A | 110 ns | YES | YES | YES | 64 | 64K | YES | BOTTOM/TOP | YES | 8/16words | |||||||||||||||||||||||||||||||||||||||||
| AT45DB081E-SHNHC-T | Adesto Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C TC | Tape & Reel (TR) | 1 (Unlimited) | CMOS | SYNCHRONOUS | 2.16mm | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/adestotechnologies-at45db081esshnt-datasheets-0668.pdf | 8-SOIC (0.209, 5.30mm Width) | 5.29mm | 8 | 8 Weeks | 8 | SPI, Serial | 8 Mb | Gold | 1 | e4 | 1.7V~3.6V | DUAL | 260 | 3V | 1.27mm | 3.6V | 1.7V | NOT SPECIFIED | 0.016mA | Not Qualified | 8Mb 264Bytes x 4096 pages | Non-Volatile | 7 ns | 2.7V | 85MHz | 20b | FLASH | SPI | 1 | 8μs, 4ms | 0.000001A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 256B | ||||||||||||||||||||||||||||||||||||||||||||||||
| MX25L6406EZNI-12GF | Macronix |
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0 | 0x0x0 | download | MX25xxx05/06 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/macronix-mx25l6406em2i12g-datasheets-1335.pdf | 8-WDFN Exposed Pad | 16 Weeks | SPI, Serial | 2.7V~3.6V | 64Mb 8M x 8 | Non-Volatile | 86MHz | FLASH | SPI | 300μs, 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS28E10P+T | Maxim Integrated |
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0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 1 (Unlimited) | EPROM - OTP | 1.5mm | ROHS3 Compliant | 2011 | https://pdf.utmel.com/r/datasheets/maximintegrated-ds28e10rt-datasheets-2182.pdf | 6-LSOJ (0.148, 3.76mm Width) | 3.94mm | 6 | 6 Weeks | 6 | yes | EAR99 | No | 8542.32.00.71 | 1 | e3 | Matte Tin (Sn) | YES | 2.8V~3.6V | DUAL | 1.27mm | DS28E10 | 6 | 2.8V | 224b 28 x 8 | Non-Volatile | EPROM | 1-Wire® | 1 | SERIAL | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SST39VF802C-70-4I-EKE | Microchip Technology | $2.07 |
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0 | 0x0x0 | download | SST39 MPF™ | Surface Mount | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 5MHz | ROHS3 Compliant | 2011 | https://pdf.utmel.com/r/datasheets/microchiptechnology-sst39vf802c704ieke-datasheets-9587.pdf | 48-TFSOP (0.724, 18.40mm Width) | 18.5mm | 1.05mm | 12.2mm | 3.3V | Lead Free | 18mA | 48 | 7 Weeks | No SVHC | 48 | 8 Mb | EAR99 | TOP BOOT BLOCK | No | 8542.32.00.51 | 1 | 18mA | e3 | Matte Tin (Sn) - annealed | 2.7V~3.6V | DUAL | 260 | 0.5mm | SST39VF802C | 48 | 3.6V | 2.7V | 40 | 8Mb 512K x 16 | Non-Volatile | 16b | 70ns | 2.7V | 19b | FLASH | Parallel | 512KX16 | 10μs | 0.00002A | 16b | Asynchronous | YES | YES | YES | 256 | 2K | YES | TOP | YES | |||||||||||||||||||||||||||||||||
| 25LC256-E/P | Microchip Technology |
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0 | 0x0x0 | download | Through Hole | Through Hole | -40°C~125°C TA | Tube | 1 (Unlimited) | CMOS | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/microchiptechnology-25lc256tisn-datasheets-0746.pdf | 8-DIP (0.300, 7.62mm) | 10.16mm | 4.953mm | 7.112mm | Lead Free | 8 | 7 Weeks | 8 | SPI, Serial | 256 kb | yes | EAR99 | No | 1 | 6mA | e3 | Matte Tin (Sn) | 2.5V~5.5V | DUAL | 5V | 2.54mm | 25LC256 | 8 | 5.5V | 2.5V | 3/5V | 256Kb 32K x 8 | Non-Volatile | 50 ns | 10MHz | EEPROM | SPI | 5ms | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE |
