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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Clock Frequency | Address Bus Width | Organization | Memory Width | Memory Density | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | I/O Type | Standby Voltage-Min | Output Enable |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 7142LA35PDG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | 70°C | 0°C | CMOS | ASYNCHRONOUS | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7142la35pdg-datasheets-6488.pdf | DIP | 61.7mm | 15.24mm | Lead Free | 48 | 7 Weeks | 48 | Parallel | yes | 3.8mm | EAR99 | 8542.32.00.41 | 1 | e3 | Matte Tin (Sn) | NO | DUAL | THROUGH-HOLE | 260 | 5V | 48 | COMMERCIAL | 5.5V | 4.5V | NOT SPECIFIED | RAM, SRAM | 2KX8 | 16384 bit | 35 ns | |||||||||||||||||||||||||||||||||||
| 70V7339S166BFG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v7339s166bfg8-datasheets-6489.pdf | 15mm | 15mm | 3.3V | Lead Free | 208 | 7 Weeks | 3.45V | 3.15V | 208 | Parallel | 9 Mb | yes | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 790mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 0.8mm | 208 | COMMERCIAL | 30 | SRAMs | RAM, SRAM | 3-STATE | 12 ns | 19b | 0.03A | 18b | Synchronous | COMMON | |||||||||||||||||||||||||
| 7024L20PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.6mm | RoHS Compliant | 2000 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7024l20pfi-datasheets-6472.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 64 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 320mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | INDUSTRIAL | 20 | SRAMs | 5V | 8kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 24b | 4KX16 | 0.004A | 16b | Asynchronous | COMMON | 2V | ||||||||||||||||||||
| IDT71V67602S150PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 150MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v67602s150pf8-datasheets-6430.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | COMMERCIAL | 3.465V | 3.135V | 20 | SRAMs | 2.53.3V | 0.325mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 256KX36 | 36 | 9437184 bit | 0.05A | 3.8 ns | COMMON | 3.14V | |||||||||||||||||||||||||
| 71321LA25PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71321la25pfi-datasheets-6400.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 16 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 220mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.8mm | 64 | INDUSTRIAL | 20 | SRAMs | 5V | 2kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 22b | 0.004A | 8b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||
| 70V657S10BC8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v657s10bc8-datasheets-6381.pdf | 17mm | 17mm | 3.3V | Contains Lead | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 1.1 Mb | no | 1.4mm | 2 | No | 1 | 500mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 1mm | 256 | COMMERCIAL | SRAMs | RAM, SRAM | 3-STATE | 10 ns | 30b | 0.015A | 36b | Asynchronous | COMMON | |||||||||||||||||||||||||||
| 71V416S10YG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.683mm | RoHS Compliant | 2014 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v416s10yg8-datasheets-6365.pdf | 28.6mm | 10.2mm | 3.3V | Lead Free | 44 | 12 Weeks | 3.6V | 3V | 44 | Parallel | 4 Mb | yes | 2.9mm | 1 | No | 1 | 200mA | e3 | MATTE TIN | DUAL | J BEND | 260 | 3.3V | 44 | COMMERCIAL | SRAMs | 512kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 10 ns | 18b | 0.02A | 16b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||||
| 7133SA25PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7133sa25pf8-datasheets-6355.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 32 kb | no | 1.4mm | 2 | EAR99 | 1 | 300mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 5V | Not Qualified | 4kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 22b | 0.015A | 16b | Asynchronous | COMMON | |||||||||||||||||||||||
| 70V9389L9PRFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 40MHz | 1.6mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9389l9prfi8-datasheets-6362.pdf | TQFP | 20mm | 14mm | 3.3V | Contains Lead | 128 | 7 Weeks | 3.6V | 3V | 128 | Parallel | 1.1 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 240mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 128 | INDUSTRIAL | SRAMs | RAM, SRAM | 3-STATE | 20 ns | 16b | 64KX18 | 18b | Synchronous | COMMON | 3V | |||||||||||||||||||||||
| IDT71V3579YS85PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3579ys85pf-datasheets-6340.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | COMMERCIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.18mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 87MHz | 256KX18 | 18 | 4718592 bit | 0.03A | 8.5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||
| IDT6116LA35TPG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 70°C | 0°C | CMOS | 4.191mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt6116la35tpg-datasheets-6342.pdf | DIP | 31.75mm | 7.62mm | 24 | Parallel | 1 | EAR99 | 8542.32.00.41 | 1 | e3 | MATTE TIN | NO | DUAL | THROUGH-HOLE | 260 | 5V | 2.54mm | 24 | COMMERCIAL | 5.5V | 4.5V | 30 | SRAMs | 5V | 0.095mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 2KX8 | 8 | 16384 bit | 0.00002A | 35 ns | COMMON | 2V | YES | ||||||||||||||||||||||||||||||
| IDT71V67603S150PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 150MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v67603s150pfi-datasheets-6338.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.325mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 256KX36 | 36 | 9437184 bit | 0.07A | 3.8 ns | COMMON | 3.14V | ||||||||||||||||||||||||||
| IDT71P72804S167BQI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 85°C | -40°C | 167MHz | Non-RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71p72804s167bqi-datasheets-6328.pdf | 165 | Parallel | QDR, RAM, SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 70V06L15PFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v06l15pfg-datasheets-6300.pdf | TQFP | 14mm | 14mm | 3.3V | Lead Free | 64 | 7 Weeks | 3.6V | 3V | 64 | Parallel | 128 kb | yes | 1.4mm | 2 | EAR99 | No | 1 | 185mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.8mm | 64 | COMMERCIAL | 30 | SRAMs | 16kB | RAM, SDR, SRAM | 3-STATE | 15 ns | 28b | 16KX8 | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||
| 7132SA20J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7132sa20j-datasheets-6288.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 16 kb | 3.63mm | 2 | No | 250mA | 2kB | RAM, SDR, SRAM | 20 ns | 22b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||
| 7008S55PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 85°C | -40°C | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7008s55pfi-datasheets-6285.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 512 kb | 1.4mm | 2 | No | 310mA | 64kB | RAM, SDR, SRAM | 55 ns | 32b | 8b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||
| IDT6116LA35SOGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 1 (Unlimited) | 85°C | -40°C | CMOS | 2.65mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt6116la35sogi8-datasheets-6272.pdf | SOIC | 15.4mm | 7.5mm | 24 | Parallel | EAR99 | 8542.32.00.41 | 1 | e3 | Matte Tin (Sn) - annealed | YES | DUAL | GULL WING | 260 | 5V | 1.27mm | 24 | INDUSTRIAL | 5.5V | 4.5V | 30 | SRAMs | 5V | 0.095mA | Not Qualified | R-PDSO-G24 | RAM, SRAM - Asynchronous | 3-STATE | 2KX8 | 8 | 16384 bit | 0.00002A | 35 ns | COMMON | 2V | |||||||||||||||||||||||||||||
| IDT71P72804S167BQGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 85°C | -40°C | 167MHz | RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71p72804s167bqgi8-datasheets-6238.pdf | 165 | Parallel | QDR, RAM, SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71V3579YS65PFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 1.6mm | RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3579ys65pfg-datasheets-6234.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | unknown | 8542.32.00.41 | 1 | e3 | Matte Tin (Sn) - annealed | YES | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | COMMERCIAL | 3.465V | 3.135V | 30 | SRAMs | 3.3V | 0.3mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 133MHz | 256KX18 | 18 | 4718592 bit | 0.03A | 6.5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||
| 71V321L25TFGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v321l25tfgi-datasheets-6196.pdf | TQFP | 10mm | 10mm | 3.3V | Lead Free | 64 | 7 Weeks | 3.6V | 3V | 64 | Parallel | 16 kb | yes | 1.4mm | 2 | EAR99 | No | 1 | 130mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 64 | INDUSTRIAL | 30 | SRAMs | 2kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 22b | 0.004A | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||
| 7132SA55C | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 1 (Unlimited) | 70°C | 0°C | CMOS | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7132sa55c-datasheets-6190.pdf | DIP | 61.72mm | 15.24mm | 5V | Contains Lead | 48 | 7 Weeks | 5.5V | 4.5V | 48 | Parallel | 16 kb | no | 3.3mm | 2 | EAR99 | AUTOMATIC POWER-DOWN | No | 1 | 155mA | e0 | Tin/Lead (Sn/Pb) | DUAL | 240 | 5V | 48 | COMMERCIAL | SRAMs | 5V | RAM, SRAM | 3-STATE | 55 ns | 22b | 0.015A | 8b | Asynchronous | COMMON | ||||||||||||||||||||||||||
| 71T75602S150PFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 150MHz | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71t75602s150pfg-datasheets-6188.pdf | TQFP | 20mm | 14mm | 2.5V | Lead Free | 100 | 8 Weeks | 2.625V | 2.375V | 100 | Parallel | 18 Mb | yes | 1.4mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 215mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 100 | COMMERCIAL | 30 | SRAMs | 2.3MB | RAM, SDR, SRAM | 150MHz | 3-STATE | 3.8 ns | 19b | 0.04A | 36b | Synchronous | COMMON | 2.38V | ||||||||||||||||||||||
| 70V3379S5BFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 100MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3379s5bfi8-datasheets-6179.pdf | 15mm | 15mm | 3.3V | Contains Lead | 208 | 7 Weeks | 3.45V | 3.15V | 208 | Parallel | 576 kb | no | 1.4mm | 2 | PIPELINED OUTPUT MODE; SELF TIMED WRITE CYCLE | No | 1 | 415mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 0.8mm | 208 | INDUSTRIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 5 ns | 30b | 0.03A | 18b | Synchronous | COMMON | |||||||||||||||||||||||||
| IDT71P72604S167BQGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 85°C | -40°C | 167MHz | RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71p72604s167bqgi-datasheets-6148.pdf | 1.8V | 1.9V | 1.7V | 165 | Parallel | 18 Mb | 2 | 900mA | 165 | QDR, RAM, SRAM | 500 ps | 18b | 36b | Synchronous | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| 7132SA100P | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 70°C | 0°C | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7132sa100p-datasheets-6136.pdf | PDIP | 61.7mm | 15.24mm | 5V | Contains Lead | 5.5V | 4.5V | 48 | Parallel | 16 kb | 3.8mm | 2 | No | 155mA | 2kB | SDR | 100 ns | 22b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||
| IDT6116LA35SOGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Rail/Tube | 1 (Unlimited) | 85°C | -40°C | CMOS | 2.65mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt6116la35sogi-datasheets-6131.pdf | SOIC | 5V | 24 | 5.5V | 4.5V | 24 | Parallel | 16 kb | 1 | EAR99 | unknown | 1 | 95mA | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 5V | 24 | INDUSTRIAL | 30 | SRAMs | 5V | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 35 ns | 11b | 2KX8 | 8 | 8b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||||||||
| IDT71V3579S85PFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3579s85pfi8-datasheets-6134.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.19mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 87MHz | 256KX18 | 18 | 4718592 bit | 0.035A | 8.5 ns | COMMON | 3.14V | |||||||||||||||||||||||||
| 71V321S35J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v321s35j8-datasheets-6135.pdf | PLCC | 19mm | 19mm | 3.3V | Contains Lead | 52 | 7 Weeks | 3.6V | 3V | 52 | Parallel | 16 kb | no | 3.63mm | 2 | EAR99 | BATTERY BACKUP;AUTOMATIC POWER DOWN | No | 1 | 125mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 52 | COMMERCIAL | SRAMs | 2kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 22b | 0.005A | 8b | Asynchronous | COMMON | 3V | ||||||||||||||||||||||||
| 7009L15PFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7009l15pfg-datasheets-6101.pdf | TQFP | 14mm | 14mm | 5V | Lead Free | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 1 Mb | 1.4mm | 2 | No | 340mA | 128kB | RAM, SDR, SRAM | 15 ns | 34b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||
| 7132LA55PDGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 1 (Unlimited) | 85°C | -40°C | CMOS | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7132la55pdgi-datasheets-6091.pdf | DIP | 61.7mm | 15.24mm | 5V | Lead Free | 48 | 7 Weeks | 5.5V | 4.5V | 48 | Parallel | 16 kb | yes | 3.8mm | 2 | EAR99 | No | 1 | 140mA | e3 | MATTE TIN | DUAL | 260 | 5V | 48 | INDUSTRIAL | 2kB | RAM, SDR, SRAM | 55 ns | 22b | 8b | Asynchronous |
