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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Supply Current | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Weight | Max Supply Voltage | Min Supply Voltage | Number of Pins | Lifecycle Status | Pbfree Code | ECCN Code | Radiation Hardening | Max Frequency | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Supplier Device Package | Memory Size | Number of I/O | RAM Size | Speed Grade | Number of Outputs | Number of Registers | Number of Inputs | Clock Frequency | Number of Gates | Number of Logic Elements/Cells | Number of Logic Blocks (LABs) | Programmable Logic Type | Number of Logic Cells | Total RAM Bits | Number of LABs/CLBs | Combinatorial Delay of a CLB-Max |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| M2GL025TS-FCS325 | Microsemi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | IGLOO2 | Surface Mount | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | Non-RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 325-TFBGA | 325 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 8542.39.00.01 | YES | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 20 | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B325 | 180 | 180 | 180 | 27696 | FIELD PROGRAMMABLE GATE ARRAY | 1130496 | |||||||||||||||||||||||||||||||||||||||
| XC7A35T-L1CPG236I | Xilinx Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Artix-7 | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | 1.38mm | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/xilinxinc-xc7s251csga324c-datasheets-5458.pdf | 238-LFBGA, CSPBGA | 10mm | 10mm | 236 | 10 Weeks | EAR99 | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 0.95V~1.05V | BOTTOM | BALL | NOT SPECIFIED | 0.95V | 0.5mm | NOT SPECIFIED | S-PBGA-B236 | 106 | 225kB | 33208 | FIELD PROGRAMMABLE GATE ARRAY | 1843200 | 2600 | 1.27 ns | ||||||||||||||||||||||||||||||||||||
| M2GL025T-1FCSG325 | Microsemi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | IGLOO2 | Surface Mount | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 324-LFBGA, CSPBGA | 325 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 8542.39.00.01 | YES | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 30 | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B325 | 180 | 180 | 180 | 27696 | FIELD PROGRAMMABLE GATE ARRAY | 1130496 | |||||||||||||||||||||||||||||||||||||||
| M2GL025-VF400 | Microsemi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | IGLOO2 | Surface Mount | 0°C~85°C TJ | Tray | 3 (168 Hours) | 1.51mm | Non-RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/microsemicorporation-m2gl005s1vf400i-datasheets-6764.pdf | 400-LFBGA | 17mm | 17mm | 1.2V | 400 | 13 Weeks | 400 | IN PRODUCTION (Last Updated: 3 weeks ago) | no | 8542.39.00.01 | YES | 1.14V~2.625V | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | M2GL025 | 400 | NOT SPECIFIED | Field Programmable Gate Arrays | Not Qualified | 207 | 138kB | 207 | 27696 | FIELD PROGRAMMABLE GATE ARRAY | 1130496 | |||||||||||||||||||||||||||||||||
| LFE2-20E-6FN484I | Lattice Semiconductor |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ECP2 | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | 2.6mm | ROHS3 Compliant | 2008 | /files/latticesemiconductorcorporation-lfe250e5fn484i-datasheets-4229.pdf | 484-BBGA | 23mm | 23mm | 1.2V | Lead Free | 484 | 8 Weeks | 484 | yes | EAR99 | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.14V~1.26V | BOTTOM | BALL | 250 | 1.2V | 1mm | LFE2-20 | 484 | 30 | Field Programmable Gate Arrays | 39.8kB | 331 | 34.5kB | 331 | 357MHz | 21000 | FIELD PROGRAMMABLE GATE ARRAY | 20000 | 282624 | 2625 | ||||||||||||||||||||||||||
| LFE2-20SE-6QN208I | Lattice Semiconductor Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ECP2 | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | 4.1mm | ROHS3 Compliant | 2000 | https://pdf.utmel.com/r/datasheets/latticesemiconductorcorporation-lfe250e5fn484i-datasheets-4229.pdf | 208-BFQFP | 28mm | 28mm | 1.2V | Lead Free | 208 | 8 Weeks | 208 | yes | EAR99 | 357MHz | 8542.39.00.01 | e3 | Matte Tin (Sn) | 1.14V~1.26V | QUAD | GULL WING | 245 | 1.2V | 0.5mm | LFE2-20 | 208 | 30 | Field Programmable Gate Arrays | Not Qualified | 39.8kB | 131 | 34.5kB | 131 | 21000 | FIELD PROGRAMMABLE GATE ARRAY | 20000 | 282624 | 2625 | 0.331 ns | |||||||||||||||||||||||||
| LFE2-20SE-7QN208C | Lattice Semiconductor |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ECP2 | Surface Mount | Surface Mount | 0°C~85°C TJ | Tray | 3 (168 Hours) | 4.1mm | ROHS3 Compliant | 2000 | /files/latticesemiconductorcorporation-lfe250e5fn484i-datasheets-4229.pdf | 208-BFQFP | 28mm | 28mm | 1.2V | Lead Free | 208 | 8 Weeks | 208 | yes | EAR99 | 420MHz | 8542.39.00.01 | e3 | Matte Tin (Sn) | 1.14V~1.26V | QUAD | GULL WING | 245 | 1.2V | 0.5mm | LFE2-20 | 208 | 30 | Field Programmable Gate Arrays | Not Qualified | 39.8kB | 131 | 34.5kB | 131 | 21000 | FIELD PROGRAMMABLE GATE ARRAY | 20000 | 282624 | 2625 | 0.304 ns | |||||||||||||||||||||||||
| M1A3P600-1FGG256I | Microsemi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ProASIC3 | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | RoHS Compliant | 2003 | https://pdf.utmel.com/r/datasheets/microsemicorporation-m1a3p600fgg256i-datasheets-8926.pdf | 256-LBGA | 17mm | 1.2mm | 17mm | 1.5V | 256 | 12 Weeks | 400.011771mg | 256 | IN PRODUCTION (Last Updated: 1 month ago) | No | 272MHz | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | M1A3P600 | 40 | 177 | 13.5kB | 1 | 13824 | 600000 | FIELD PROGRAMMABLE GATE ARRAY | 110592 | ||||||||||||||||||||||||||||||||
| XC2S200-6FGG256C | Xilinx Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Spartan®-II | Surface Mount | Surface Mount | 0°C~85°C TJ | Tray | 3 (168 Hours) | 2mm | ROHS3 Compliant | 2008 | https://pdf.utmel.com/r/datasheets/xilinxinc-xc2s155tq144c-datasheets-8899.pdf | 256-BGA | 17mm | 17mm | 2.5V | 256 | 10 Weeks | 256 | yes | EAR99 | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 2.375V~2.625V | BOTTOM | BALL | 260 | 2.5V | 1mm | XC2S200 | 256 | 30 | Field Programmable Gate Arrays | Not Qualified | 176 | 7kB | 6 | 284 | 200000 | 5292 | FIELD PROGRAMMABLE GATE ARRAY | 57344 | 1176 | ||||||||||||||||||||||||||||
| M2GL025T-FCSG325I | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | IGLOO2 | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 324-LFBGA, CSPBGA | 325 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 8542.39.00.01 | YES | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 30 | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B325 | 180 | 180 | 180 | 27696 | FIELD PROGRAMMABLE GATE ARRAY | 1130496 | |||||||||||||||||||||||||||||||||||||||
| XC7A35T-1FT256I | Xilinx Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Artix-7 | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | 100°C | -40°C | Non-RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/xilinxinc-xc7s251csga324c-datasheets-5458.pdf | 256-LBGA | 10 Weeks | 256 | 0.95V~1.05V | 256-FTBGA (17x17) | 170 | 225kB | 33208 | 2600 | 1843200 | 2600 | ||||||||||||||||||||||||||||||||||||||||||||||||
| XC2S200-5FGG256I | Xilinx Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Spartan®-II | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | 2mm | ROHS3 Compliant | 2004 | https://pdf.utmel.com/r/datasheets/xilinxinc-xc2s155tq144c-datasheets-8899.pdf | 256-BGA | 17mm | 17mm | 2.5V | Lead Free | 256 | 10 Weeks | 256 | yes | EAR99 | e1 | 2.375V~2.625V | BOTTOM | BALL | 260 | 2.5V | 1mm | XC2S200 | 256 | 30 | Field Programmable Gate Arrays | Not Qualified | 176 | 7kB | 5 | 284 | 263MHz | 200000 | 5292 | FIELD PROGRAMMABLE GATE ARRAY | 57344 | 1176 | 0.7 ns | |||||||||||||||||||||||||||
| A3P400-2PQG208I | Microsemi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ProASIC3 | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 310MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/microsemicorporation-a3p600pqg208i-datasheets-5753.pdf | 208-BFQFP | 28mm | 3.4mm | 28mm | 1.5V | 208 | 20 Weeks | 208 | IN PRODUCTION (Last Updated: 1 month ago) | No | e3 | Matte Tin (Sn) | 1.425V~1.575V | QUAD | GULL WING | 245 | 1.5V | 0.5mm | A3P400 | 40 | 151 | 6.8kB | 2 | 9216 | 400000 | FIELD PROGRAMMABLE GATE ARRAY | 55296 | ||||||||||||||||||||||||||||||||
| AGL400V2-FG256 | Microsemi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | IGLOO | Surface Mount | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | 70°C | 0°C | 27μA | Non-RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/microsemicorporation-agl600v5fgg256i-datasheets-6582.pdf | 256-LBGA | 17mm | 1.2mm | 17mm | 1.5V | 22 Weeks | 400.011771mg | 1.575V | 1.14V | 256 | IN PRODUCTION (Last Updated: 1 month ago) | 250MHz | 1.14V~1.575V | AGL400 | 256-FPBGA (17x17) | 178 | 6.8kB | 400000 | 9216 | 55296 | ||||||||||||||||||||||||||||||||||||||
| M1A3P600-1FG256I | Microsemi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ProASIC3 | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | Non-RoHS Compliant | 2003 | https://pdf.utmel.com/r/datasheets/microsemicorporation-m1a3p600fgg256i-datasheets-8926.pdf | 256-LBGA | 17mm | 1.2mm | 17mm | 1.5V | 256 | 12 Weeks | 400.011771mg | 256 | IN PRODUCTION (Last Updated: 1 month ago) | No | 272MHz | e0 | TIN LEAD/TIN LEAD SILVER | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | M1A3P600 | 30 | 177 | 13.5kB | 1 | 13824 | 600000 | FIELD PROGRAMMABLE GATE ARRAY | 110592 | ||||||||||||||||||||||||||||||||
| XA3S400A-4FTG256I | Xilinx Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100, Spartan®-3A XA | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | 100°C | -40°C | ROHS3 Compliant | 1999 | https://pdf.utmel.com/r/datasheets/xilinxinc-xa3s200a4ftg256i-datasheets-2815.pdf | 256-LBGA | 1.2V | 15 Weeks | 256 | 1.14V~1.26V | XA3S400A | 256-FTBGA (17x17) | 195 | 45kB | 4 | 400000 | 8064 | 896 | 368640 | 896 | ||||||||||||||||||||||||||||||||||||||||||||
| XC2S200-5PQ208I | Xilinx Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Spartan®-II | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 4.1mm | Non-RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/xilinxinc-xc2s155tq144c-datasheets-8899.pdf | 208-BFQFP | 28mm | 28mm | 2.5V | Contains Lead | 208 | 10 Weeks | 208 | no | EAR99 | e0 | 2.375V~2.625V | QUAD | GULL WING | 225 | 2.5V | XC2S200 | 208 | 30 | Field Programmable Gate Arrays | Not Qualified | 140 | 7kB | 5 | 140 | 263MHz | 200000 | 5292 | FIELD PROGRAMMABLE GATE ARRAY | 57344 | 1176 | 0.7 ns | |||||||||||||||||||||||||||
| M2GL010TS-1VF400I | Microsemi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | IGLOO2 | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | 1.51mm | Non-RoHS Compliant | https://pdf.utmel.com/r/datasheets/microsemicorporation-m2gl005s1vf400i-datasheets-6764.pdf | 400-LFBGA | 17mm | 17mm | 400 | 12 Weeks | 400 | IN PRODUCTION (Last Updated: 3 weeks ago) | 8542.39.00.01 | YES | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 0.8mm | M2GL010TS | 20 | Field Programmable Gate Arrays | 1.2V | Not Qualified | 195 | 114kB | 195 | 12084 | FIELD PROGRAMMABLE GATE ARRAY | 933888 | ||||||||||||||||||||||||||||||||||||
| M1A3P600-2FG256 | Microsemi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ProASIC3 | Surface Mount | Surface Mount | 0°C~85°C TJ | Tray | 3 (168 Hours) | 70°C | 0°C | Non-RoHS Compliant | 2003 | https://pdf.utmel.com/r/datasheets/microsemicorporation-m1a3p600fgg256i-datasheets-8926.pdf | 256-LBGA | 17mm | 1.2mm | 17mm | 1.5V | 12 Weeks | 400.011771mg | 1.575V | 1.425V | 256 | IN PRODUCTION (Last Updated: 1 month ago) | No | 310MHz | 1.425V~1.575V | M1A3P600 | 256-FPBGA (17x17) | 177 | 13.5kB | 2 | 13824 | 600000 | 110592 | |||||||||||||||||||||||||||||||||||||
| LFXP2-17E-6FN484C | Lattice Semiconductor |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | XP2 | Surface Mount | Surface Mount | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 2.6mm | ROHS3 Compliant | 2009 | /files/latticesemiconductorcorporation-lfxp25e6tn144c-datasheets-5567.pdf | 484-BBGA | 23mm | 23mm | 1.2V | Lead Free | 484 | 8 Weeks | 484 | yes | EAR99 | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.14V~1.26V | BOTTOM | BALL | 250 | 1.2V | 1mm | LFXP2-17 | 484 | 30 | Field Programmable Gate Arrays | 1.21.2/3.33.3V | Not Qualified | 38.9kB | 358 | 34.5kB | 358 | 435MHz | 17000 | FIELD PROGRAMMABLE GATE ARRAY | 282624 | 2125 | 0.399 ns | ||||||||||||||||||||||||
| A3P600-1FGG256I | Microsemi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ProASIC3 | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/microsemicorporation-a3p600pqg208i-datasheets-5753.pdf | 256-LBGA | 17mm | 1.2mm | 17mm | 1.5V | 256 | 12 Weeks | 400.011771mg | 256 | IN PRODUCTION (Last Updated: 1 month ago) | No | 272MHz | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | A3P600 | 40 | 177 | 13.5kB | 1 | 13824 | 600000 | FIELD PROGRAMMABLE GATE ARRAY | 110592 | ||||||||||||||||||||||||||||||||
| M2GL010TS-1VFG400I | Microsemi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | IGLOO2 | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | 1.51mm | RoHS Compliant | https://pdf.utmel.com/r/datasheets/microsemicorporation-m2gl005s1vf400i-datasheets-6764.pdf | 400-LFBGA | 17mm | 17mm | 400 | 12 Weeks | 400 | IN PRODUCTION (Last Updated: 3 weeks ago) | 8542.39.00.01 | YES | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | M2GL010TS | 30 | Field Programmable Gate Arrays | 1.2V | Not Qualified | 195 | 114kB | 195 | 12084 | FIELD PROGRAMMABLE GATE ARRAY | 933888 | ||||||||||||||||||||||||||||||||||||
| XC2S200-6PQ208C | Xilinx Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Spartan®-II | Surface Mount | Surface Mount | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 4.1mm | Non-RoHS Compliant | 1999 | https://pdf.utmel.com/r/datasheets/xilinxinc-xc2s155tq144c-datasheets-8899.pdf | 208-BFQFP | 28mm | 28mm | 2.5V | Contains Lead | 208 | 10 Weeks | 208 | no | EAR99 | 8542.39.00.01 | e0 | Tin/Lead (Sn85Pb15) | 2.375V~2.625V | QUAD | GULL WING | 225 | 2.5V | 0.5mm | XC2S200 | 208 | 30 | Field Programmable Gate Arrays | Not Qualified | 140 | 7kB | 6 | 140 | 200000 | 5292 | FIELD PROGRAMMABLE GATE ARRAY | 57344 | 1176 | ||||||||||||||||||||||||||
| AGLP060V2-CS289I | Microsemi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | IGLOO PLUS | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | 85°C | -40°C | Non-RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/microsemicorporation-aglp060v2vqg176-datasheets-6770.pdf | 289-TFBGA, CSBGA | 14mm | 810μm | 14mm | 1.5V | 12 Weeks | 1.575V | 1.14V | 289 | IN PRODUCTION (Last Updated: 1 month ago) | No | 892.86MHz | 1.14V~1.575V | AGLP060 | 289-CSP (14x14) | 157 | 2.3kB | 1584 | 60000 | 1584 | 512 | 18432 | |||||||||||||||||||||||||||||||||||||
| M1A3P600-2FG144I | Microsemi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ProASIC3 | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | Non-RoHS Compliant | 2003 | https://pdf.utmel.com/r/datasheets/microsemicorporation-m1a3p600fgg256i-datasheets-8926.pdf | 144-LBGA | 13mm | 1.05mm | 13mm | 1.5V | 144 | 12 Weeks | 400.011771mg | 144 | IN PRODUCTION (Last Updated: 1 month ago) | No | 310MHz | e0 | TIN LEAD SILVER | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | M1A3P600 | 30 | 97 | 13.5kB | 2 | 13824 | 600000 | FIELD PROGRAMMABLE GATE ARRAY | 110592 | |||||||||||||||||||||||||||||||
| M2GL025-VF256 | Microsemi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | IGLOO2 | Surface Mount | 0°C~85°C TJ | Tray | 3 (168 Hours) | 1.56mm | Non-RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 256-LFBGA | 14mm | 14mm | 256 | 13 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 8542.39.00.01 | YES | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 0.8mm | 20 | S-PBGA-B256 | 138 | 27696 | FIELD PROGRAMMABLE GATE ARRAY | 1130496 | |||||||||||||||||||||||||||||||||||||||||
| M1A3P600-FGG484 | Microsemi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ProASIC3 | Surface Mount | Surface Mount | 0°C~85°C TJ | Tray | 3 (168 Hours) | 70°C | 0°C | RoHS Compliant | https://pdf.utmel.com/r/datasheets/microsemicorporation-m1a3p600fgg256i-datasheets-8926.pdf | 484-BGA | 23mm | 1.73mm | 23mm | 1.5V | 12 Weeks | 400.011771mg | 1.575V | 1.425V | 484 | IN PRODUCTION (Last Updated: 1 month ago) | No | 231MHz | 1.425V~1.575V | M1A3P600 | 484-FPBGA (23x23) | 235 | 13.5kB | 13824 | 600000 | 110592 | |||||||||||||||||||||||||||||||||||||||
| LFE3-35EA-8FN672I | Lattice Semiconductor |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ECP3 | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | 18mA | 2.6mm | ROHS3 Compliant | 2012 | /files/latticesemiconductorcorporation-lfe395ea9fn672c-datasheets-4220.pdf | 672-BBGA | 27mm | 27mm | 1.2V | Lead Free | 672 | 8 Weeks | 672 | EAR99 | 500MHz | not_compliant | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 1.14V~1.26V | BOTTOM | BALL | 250 | 1.2V | 1mm | LFE3-35 | 672 | 30 | Field Programmable Gate Arrays | Not Qualified | 174.4kB | 310 | 165.9kB | 310 | 33000 | FIELD PROGRAMMABLE GATE ARRAY | 1358848 | 4125 | 0.281 ns | |||||||||||||||||||||||||
| M1A3P600-FG484 | Microsemi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ProASIC3 | Surface Mount | Surface Mount | 0°C~85°C TJ | Tray | 3 (168 Hours) | 70°C | 0°C | Non-RoHS Compliant | https://pdf.utmel.com/r/datasheets/microsemicorporation-m1a3p600fgg256i-datasheets-8926.pdf | 484-BGA | 23mm | 1.73mm | 23mm | 1.5V | 12 Weeks | 400.011771mg | 1.575V | 1.425V | 484 | IN PRODUCTION (Last Updated: 1 month ago) | No | 231MHz | 1.425V~1.575V | M1A3P600 | 484-FPBGA (23x23) | 235 | 13.5kB | 13824 | 600000 | 110592 | |||||||||||||||||||||||||||||||||||||||
| M1A3P600-PQG208I | Microsemi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ProASIC3 | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | RoHS Compliant | 2003 | https://pdf.utmel.com/r/datasheets/microsemicorporation-m1a3p600fgg256i-datasheets-8926.pdf | 208-BFQFP | 28mm | 3.4mm | 28mm | 1.5V | 12 Weeks | 208 | IN PRODUCTION (Last Updated: 1 month ago) | No | 231MHz | 1.425V~1.575V | M1A3P600 | 154 | 13.5kB | 13824 | 600000 | FIELD PROGRAMMABLE GATE ARRAY | 110592 |
