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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Max Supply Current | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Density | Pbfree Code | Thickness | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Element Configuration | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Number of Circuits | Qualification Status | JESD-30 Code | Screening Level | Memory Size | Data Bus Width | Frequency (Max) | Direction | Output Characteristics | Access Time | Clock Frequency | Organization | Memory Width | Memory Density | Parallel/Serial | Standby Current-Max | Word Size | Sync/Async | Memory IC Type | Output Enable | Bus Directional | Retransmit Capability | FWFT Support | Programmable Flags Support | Cycle Time |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 72V05L25JI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 | 85°C | -40°C | CMOS | 3.556mm | RoHS Compliant | 2005 | /files/integrateddevicetechnology-72v05l25ji-datasheets-3158.pdf | PLCC | 13.97mm | 11.43mm | 3.3V | Contains Lead | 75mA | 32 | 7 Weeks | 3.6V | 3V | 32 | 72 kb | no | 2.79mm | EAR99 | Lead, Tin | 1 | 75mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 32 | INDUSTRIAL | Dual | FIFOs | 2 | 9kB | 9b | 28.5MHz | Bidirectional | 25 ns | 8KX9 | PARALLEL | 0.005A | 9b | Asynchronous | OTHER FIFO | NO | Unidirectional | Yes | No | 35 ns | |||||||||||||||||||||||
| 72215LB25J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 | 70°C | 0°C | CMOS | 40MHz | 4.572mm | RoHS Compliant | 2000 | /files/integrateddevicetechnology-72215lb25j8-datasheets-3112.pdf | PLCC | 24mm | 24mm | 5V | Contains Lead | 60mA | 68 | 7 Weeks | 5.5V | 4.5V | 68 | 9 kb | no | 3.63mm | EAR99 | Lead, Tin | 8542.32.00.71 | 1 | 60mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 1.27mm | 68 | COMMERCIAL | Dual | FIFOs | 5V | 40MHz | 15 ns | 512X18 | PARALLEL | 0.005A | 18b | Synchronous | OTHER FIFO | YES | Unidirectional | No | Yes | 25 ns | |||||||||||||||||||||||
| IDT7201LA35SO8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Tape & Reel (TR) | 3 | 70°C | 0°C | CMOS | 3.048mm | Non-RoHS Compliant | 2009 | /files/integrateddevicetechnology-idt7201la35so8-datasheets-3097.pdf | SOIC | 18.3642mm | 8.763mm | 80mA | 28 | no | EAR99 | RETRANSMIT | 8542.32.00.71 | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | GULL WING | 225 | 5V | 1.27mm | 28 | COMMERCIAL | 5.5V | 4.5V | 30 | FIFOs | 5V | R-PDSO-G28 | 3-STATE | 35 ns | 22.2MHz | 512X9 | 9 | 4608 bit | PARALLEL | 0.0005A | OTHER FIFO | NO | Unidirectional | Yes | No | 45 ns | |||||||||||||||||||||||||||||
| 72261LA20PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | 50MHz | RoHS Compliant | 2002 | /files/integrateddevicetechnology-72261la20pf8-datasheets-3088.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 75mA | 7 Weeks | 5.5V | 4.5V | 64 | 144 kb | 1.4mm | Lead, Tin | 75mA | Dual | 50MHz | Unidirectional | 12 ns | 9b | Synchronous | Unidirectional | Yes | Yes | Yes | ||||||||||||||||||||||||||||||||||||||||||||||
| 72V3690L7-5BB8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 | 70°C | 0°C | CMOS | 133.3MHz | RoHS Compliant | 2008 | /files/integrateddevicetechnology-72v3690l75bb8-datasheets-3063.pdf | BGA | 13mm | 1.76mm | 13mm | 3.3V | Contains Lead | 40mA | 144 | 7 Weeks | 3.45V | 3.15V | 144 | 1.1 Mb | no | 1.76mm | EAR99 | Lead, Tin | 8542.32.00.71 | 1 | 40mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 1mm | 144 | COMMERCIAL | Dual | 20 | FIFOs | Not Qualified | 133.3MHz | 5 ns | 32KX36 | PARALLEL | 0.015A | 36b | Synchronous | OTHER FIFO | YES | Unidirectional | Yes | ||||||||||||||||||||||||
| 72245LB15JI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 | 85°C | -40°C | CMOS | 66.7MHz | 4.572mm | RoHS Compliant | 2000 | /files/integrateddevicetechnology-72245lb15ji-datasheets-3023.pdf | PLCC | 24mm | 24mm | 5V | Contains Lead | 60mA | 68 | 7 Weeks | 5.5V | 4.5V | 68 | 72 kb | no | 3.63mm | EAR99 | Lead, Tin | 8542.32.00.71 | 1 | 60mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 1.27mm | 68 | INDUSTRIAL | Dual | FIFOs | 5V | 66.7MHz | 10 ns | 4KX18 | PARALLEL | 0.005A | 18b | Synchronous | OTHER FIFO | YES | Unidirectional | No | Yes | 15 ns | |||||||||||||||||||||||
| 72V845L10PFG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | /files/integrateddevicetechnology-72v845l10pfg8-datasheets-2966.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 60mA | 128 | 7 Weeks | 3.6V | 3V | 128 | yes | 1.4mm | EAR99 | Tin | 8542.32.00.71 | 1 | e3 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 128 | COMMERCIAL | 100MHz | 6.5 ns | 4KX18 | 73728 bit | PARALLEL | YES | Bidirectional | No | Yes | 10 ns | |||||||||||||||||||||||||||||||||
| 72V05L15J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 | 70°C | 0°C | CMOS | 3.556mm | RoHS Compliant | 2007 | /files/integrateddevicetechnology-72v05l15j8-datasheets-2936.pdf | PLCC | 13.97mm | 11.43mm | 3.3V | Contains Lead | 75mA | 32 | 7 Weeks | 3.6V | 3V | 32 | 72 kb | no | 2.79mm | EAR99 | Lead, Tin | 1 | 75mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 1.27mm | 32 | COMMERCIAL | Dual | FIFOs | 15 ns | 40MHz | 8KX9 | PARALLEL | 0.005A | 9b | Asynchronous | OTHER FIFO | NO | Unidirectional | Yes | No | 25 ns | ||||||||||||||||||||||||||
| 72V845L10PFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | /files/integrateddevicetechnology-72v845l10pfg-datasheets-2878.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 60mA | 128 | 7 Weeks | 3.6V | 3V | 128 | yes | 1.4mm | EAR99 | Tin | 8542.32.00.71 | 1 | e3 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 128 | COMMERCIAL | 30 | FIFOs | 100MHz | 6.5 ns | 4KX18 | 73728 bit | PARALLEL | 0.01A | OTHER FIFO | YES | Bidirectional | No | Yes | 10 ns | ||||||||||||||||||||||||||||
| 72V82L15PAG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Tape & Reel (TR) | 70°C | 0°C | CMOS | 1.2mm | RoHS Compliant | 2009 | /files/integrateddevicetechnology-72v82l15pag8-datasheets-2863.pdf | TFSOP | 14mm | 6.1mm | 3.3V | 100mA | 56 | 7 Weeks | 3.6V | 3V | yes | EAR99 | RETRANSMIT | Tin | 8542.32.00.71 | 1 | e3 | DUAL | GULL WING | 260 | 3.3V | 0.5mm | 56 | COMMERCIAL | 40 | R-PDSO-G56 | 15 ns | 1KX9 | 9 | 9216 bit | PARALLEL | NO | Bidirectional | Yes | No | |||||||||||||||||||||||||||||||||||
| 7200L25JI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 | 85°C | -40°C | CMOS | 3.55mm | RoHS Compliant | 2005 | /files/integrateddevicetechnology-7200l25ji8-datasheets-2835.pdf | PLCC | 13.97mm | 11.43mm | 5V | Contains Lead | 80mA | 32 | 7 Weeks | 5.5V | 4.5V | 32 | 2.3 kb | no | 2.79mm | EAR99 | RETRANSMIT | Lead, Tin | 1 | 80mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 1.27mm | 32 | INDUSTRIAL | Dual | 20 | FIFOs | 5V | 25 ns | 28.5MHz | 256X9 | PARALLEL | 0.0005A | 9b | Asynchronous | OTHER FIFO | NO | Unidirectional | Yes | No | 35 ns | |||||||||||||||||||||||
| 72V223L6PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 | 70°C | 0°C | CMOS | 166MHz | 1.6mm | RoHS Compliant | 2009 | /files/integrateddevicetechnology-72v223l6pf-datasheets-2832.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 35mA | 80 | 7 Weeks | 3.45V | 3.15V | 80 | 9 kb | no | 1.4mm | EAR99 | Lead, Tin | 8542.32.00.71 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 80 | COMMERCIAL | Dual | 20 | FIFOs | Not Qualified | 166MHz | 4 ns | 512X18 | PARALLEL | 0.015A | Synchronous | OTHER FIFO | YES | Unidirectional | Yes | 6 ns | ||||||||||||||||||||||||
| 72V04L35J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 | 70°C | 0°C | CMOS | 3.556mm | RoHS Compliant | 2005 | /files/integrateddevicetechnology-72v04l35j8-datasheets-2831.pdf | PLCC | 13.97mm | 11.43mm | 3.3V | Contains Lead | 60mA | 32 | 7 Weeks | 3.6V | 3V | 32 | 36 kb | no | 2.79mm | EAR99 | RETRANSMIT | Lead, Tin | 1 | 60mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 1.27mm | 32 | COMMERCIAL | Dual | FIFOs | 35 ns | 22.2MHz | 4KX9 | PARALLEL | 0.0003A | 9b | Asynchronous | OTHER FIFO | NO | Unidirectional | Yes | No | 45 ns | |||||||||||||||||||||||||
| 72V82L20PAI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 85°C | -40°C | RoHS Compliant | 2012 | /files/integrateddevicetechnology-72v82l20pai8-datasheets-2761.pdf | TFSOP | 14mm | 6.1mm | 3.3V | Contains Lead | 120mA | 7 Weeks | 3.6V | 3V | 56 | 1mm | Dual | 20 ns | Unidirectional | Yes | No | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| 72V3640L6PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 | 70°C | 0°C | CMOS | 166MHz | 1.6mm | RoHS Compliant | 2008 | /files/integrateddevicetechnology-72v3640l6pf8-datasheets-2747.pdf | TQFP | 20mm | 14mm | 3.3V | Contains Lead | 40mA | 128 | 7 Weeks | 3.45V | 3.15V | 128 | 36 kb | no | 1.4mm | EAR99 | Lead, Tin | 8542.32.00.71 | 1 | 40mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 128 | COMMERCIAL | Dual | NOT SPECIFIED | FIFOs | Not Qualified | 166MHz | 4 ns | 1KX36 | PARALLEL | 0.015A | 36b | Synchronous | OTHER FIFO | YES | Unidirectional | Yes | 6 ns | |||||||||||||||||||||||
| 72V04L25JI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 1 | 85°C | -40°C | CMOS | 3.556mm | RoHS Compliant | 2009 | /files/integrateddevicetechnology-72v04l25ji8-datasheets-2729.pdf | PLCC | 13.97mm | 11.43mm | 3.3V | Contains Lead | 60mA | 32 | 7 Weeks | 3.6V | 3V | 32 | 36 kb | no | 2.79mm | EAR99 | Lead, Tin | 1 | 60mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 1.27mm | 32 | INDUSTRIAL | Dual | FIFOs | 25 ns | 28.5MHz | 4KX9 | PARALLEL | 0.0003A | 9b | Asynchronous | OTHER FIFO | NO | Unidirectional | Yes | No | 35 ns | |||||||||||||||||||||||||
| 72V3662L15PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 4 | 70°C | 0°C | CMOS | 66.7MHz | 1.6mm | Non-RoHS Compliant | 2009 | /files/integrateddevicetechnology-72v3662l15pf8-datasheets-2708.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 120 | 3.6V | 3V | 120 | 288 kb | no | 1.4mm | EAR99 | MAIL BOX BYPASS REGISTER | No | 8542.32.00.71 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.4mm | 120 | COMMERCIAL | Dual | 20 | FIFOs | 36b | 66.7MHz | 10 ns | 4KX36 | PARALLEL | 0.001A | 36b | Synchronous | BI-DIRECTIONAL FIFO | YES | Bidirectional | Yes | 15 ns | ||||||||||||||||||||||||
| 72V82L20PAI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 1 | 85°C | -40°C | CMOS | RoHS Compliant | 2012 | /files/integrateddevicetechnology-72v82l20pai-datasheets-2669.pdf | TFSOP | 14mm | 6.1mm | 3.3V | Contains Lead | 120mA | 56 | 7 Weeks | 3.6V | 3V | 56 | no | 1mm | EAR99 | 8542.32.00.71 | e0 | Tin/Lead (Sn85Pb15) | GULL WING | 240 | 3.3V | 0.5mm | 56 | INDUSTRIAL | Dual | 30 | FIFOs | 20 ns | 33.3MHz | 2KX9 | 18432 bit | 0.005A | OTHER FIFO | Unidirectional | Yes | No | |||||||||||||||||||||||||||||||||
| 72V3643L15PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 | 70°C | 0°C | CMOS | 66.7MHz | 1.6mm | RoHS Compliant | 2009 | /files/integrateddevicetechnology-72v3643l15pf-datasheets-2652.pdf | TQFP | 20mm | 14mm | 3.3V | Contains Lead | 400mA | 128 | 7 Weeks | 3.6V | 3V | 128 | 36 kb | no | 1.4mm | EAR99 | EASILY EXPANDABLE IN DEPTH AND WIDTH | Lead, Tin | 8542.32.00.71 | 1 | 400mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 128 | COMMERCIAL | Dual | FIFOs | 66.7MHz | 10 ns | 1KX36 | PARALLEL | 0.0004A | 36b | Synchronous | OTHER FIFO | YES | Bidirectional | No | Yes | 15 ns | |||||||||||||||||||||||
| 72V04L25J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 | 70°C | 0°C | CMOS | 3.556mm | RoHS Compliant | 2005 | /files/integrateddevicetechnology-72v04l25j8-datasheets-2645.pdf | PLCC | 13.97mm | 11.43mm | 3.3V | Contains Lead | 60mA | 32 | 7 Weeks | 3.6V | 3V | 32 | 36 kb | no | 2.79mm | EAR99 | RETRANSMIT | Lead, Tin | 1 | 60mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 1.27mm | 32 | COMMERCIAL | Dual | FIFOs | 25 ns | 28.5MHz | 4KX9 | PARALLEL | 0.0003A | 9b | Asynchronous | OTHER FIFO | NO | Unidirectional | Yes | No | 35 ns | |||||||||||||||||||||||||
| 72V81L20PAI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 85°C | -40°C | RoHS Compliant | 2012 | /files/integrateddevicetechnology-72v81l20pai8-datasheets-2574.pdf | TFSOP | 14mm | 6.1mm | 3.3V | Contains Lead | 120mA | 7 Weeks | 3.6V | 3V | 56 | 1mm | Dual | 20 ns | Unidirectional | Yes | No | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 72V04L15J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 | 70°C | 0°C | CMOS | 3.556mm | RoHS Compliant | 2009 | /files/integrateddevicetechnology-72v04l15j8-datasheets-2547.pdf | PLCC | 13.97mm | 11.43mm | 3.3V | Contains Lead | 60mA | 32 | 7 Weeks | 3.6V | 3V | 32 | 36 kb | no | 2.79mm | EAR99 | Lead, Tin | 1 | 60mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 1.27mm | 32 | COMMERCIAL | Dual | FIFOs | 15 ns | 50MHz | 4KX9 | PARALLEL | 9b | Asynchronous | OTHER FIFO | NO | Unidirectional | Yes | No | 25 ns | |||||||||||||||||||||||||||
| 72V3650L10PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 | 70°C | 0°C | CMOS | SYNCHRONOUS | 1.6mm | RoHS Compliant | 2003 | /files/integrateddevicetechnology-72v3650l10pf8-datasheets-2541.pdf | TQFP | 20mm | 14mm | 3.3V | Contains Lead | 40mA | 128 | 7 Weeks | 3.45V | 3.15V | 128 | no | 1.4mm | EAR99 | RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE | Lead, Tin | 8542.32.00.71 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 128 | COMMERCIAL | Dual | NOT SPECIFIED | FIFOs | Not Qualified | 100MHz | 6.5 ns | 2KX36 | 73728 bit | PARALLEL | 0.015A | OTHER FIFO | YES | Unidirectional | Yes | 10 ns | |||||||||||||||||||||||||
| IDT7201LA25SO | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 | 70°C | 0°C | CMOS | 3.048mm | Non-RoHS Compliant | 2009 | /files/integrateddevicetechnology-idt7201la25so-datasheets-2513.pdf | SOIC | 18.3642mm | 8.763mm | 80mA | 28 | no | EAR99 | RETRANSMIT | 8542.32.00.71 | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | GULL WING | 225 | 5V | 1.27mm | 28 | COMMERCIAL | 5.5V | 4.5V | 30 | FIFOs | 5V | R-PDSO-G28 | 3-STATE | 25 ns | 28.5MHz | 512X9 | 9 | 4608 bit | PARALLEL | 0.0005A | OTHER FIFO | NO | Unidirectional | Yes | No | 35 ns | ||||||||||||||||||||||||||||||
| 72V3690L6BBG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 | 70°C | 0°C | CMOS | 166MHz | 1.97mm | RoHS Compliant | 2008 | /files/integrateddevicetechnology-72v3690l6bbg8-datasheets-2494.pdf | BGA | 13mm | 13mm | 3.3V | Lead Free | 40mA | 144 | 7 Weeks | 3.45V | 3.15V | 144 | 1.1 Mb | yes | 1.76mm | EAR99 | Copper, Silver, Tin | 8542.32.00.71 | 1 | 40mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 1mm | 144 | COMMERCIAL | Dual | NOT SPECIFIED | 166MHz | 4 ns | 32KX36 | PARALLEL | 36b | Synchronous | YES | Unidirectional | Yes | 6 ns | |||||||||||||||||||||||||||
| 72V03L35J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 | 70°C | 0°C | CMOS | 3.556mm | RoHS Compliant | 2009 | /files/integrateddevicetechnology-72v03l35j8-datasheets-2459.pdf | PLCC | 13.97mm | 11.43mm | 3.3V | Contains Lead | 60mA | 32 | 7 Weeks | 3.6V | 3V | 32 | 18 kb | no | 2.79mm | EAR99 | RETRANSMIT | Lead, Tin | 1 | 60mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 1.27mm | 32 | COMMERCIAL | Dual | FIFOs | 35 ns | 22.2MHz | 2KX9 | PARALLEL | 0.0003A | 9b | Asynchronous | OTHER FIFO | NO | Unidirectional | Yes | No | 45 ns | |||||||||||||||||||||||||
| 7201LA80DB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 1 | 125°C | -55°C | CMOS | 5.08mm | RoHS Compliant | 2005 | /files/integrateddevicetechnology-7201la80db-datasheets-2390.pdf | CDIP | 37.2mm | 15.24mm | 5V | Contains Lead | 100mA | 28 | 10 Weeks | 5.5V | 4.5V | 28 | 4.5 kb | no | 1.65mm | EAR99 | RETRANSMIT | Lead, Tin | 1 | 100mA | e0 | Tin/Lead (Sn63Pb37) | 240 | 5V | 2.54mm | 28 | MILITARY | Dual | FIFOs | 5V | 1 | MIL-STD-883 Class B | 512B | 9b | 10MHz | Bidirectional | 80 ns | PARALLEL | 0.0009A | 9b | Asynchronous | OTHER FIFO | NO | Unidirectional | Yes | No | ||||||||||||||||||||||
| 72V3690L6BBG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 | 70°C | 0°C | CMOS | 166MHz | RoHS Compliant | 2008 | /files/integrateddevicetechnology-72v3690l6bbg-datasheets-2375.pdf | BGA | 13mm | 13mm | 3.3V | Lead Free | 40mA | 144 | 7 Weeks | 3.45V | 3.15V | 144 | 1.1 Mb | yes | 1.76mm | EAR99 | Copper, Silver, Tin | 1 | 40mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 144 | COMMERCIAL | Dual | 30 | FIFOs | 1 | Not Qualified | 128kB | 36b | 166MHz | 4 ns | 32KX36 | PARALLEL | 36b | Synchronous | OTHER FIFO | YES | Unidirectional | Yes | 6 ns | |||||||||||||||||||||||
| 72V2113L7-5BC | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 | 70°C | 0°C | CMOS | 133.3MHz | 1.5mm | RoHS Compliant | 2009 | /files/integrateddevicetechnology-72v2113l75bc-datasheets-2358.pdf | 11mm | 11mm | 3.3V | Contains Lead | 35mA | 100 | 7 Weeks | 3.45V | 3.15V | 100 | 4.5 Mb | no | 1.4mm | EAR99 | Lead, Tin | No | 8542.32.00.71 | 1 | 35mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 100 | COMMERCIAL | Dual | 20 | FIFOs | 512kB | 18b | 133.3MHz | 5 ns | 256KX18 | PARALLEL | 0.015A | Synchronous | OTHER FIFO | YES | Unidirectional | Yes | ||||||||||||||||||||||||
| 72V2113L6PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | 166MHz | RoHS Compliant | 2009 | /files/integrateddevicetechnology-72v2113l6pf-datasheets-2354.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 35mA | 7 Weeks | 3.45V | 3.15V | 80 | 4.5 Mb | 1.4mm | Lead, Tin | 35mA | Dual | 166MHz | Unidirectional | 4 ns | Synchronous | Unidirectional | Yes | Yes | Yes |
