Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Part Status Mounting Type Operating Temperature Packaging Moisture Sensitivity Level (MSL) Technology Operating Mode Height Seated (Max) RoHS Status Published Datasheet Package / Case Length Width Operating Supply Voltage Lead Free Number of Terminations Number of Pins Pbfree Code ECCN Code Additional Feature Radiation Hardening Reach Compliance Code Number of Functions JESD-609 Code Terminal Finish Surface Mount Voltage - Supply Terminal Position Terminal Form Peak Reflow Temperature (Cel) Supply Voltage Terminal Pitch Base Part Number Pin Count Supply Voltage-Max (Vsup) Supply Voltage-Min (Vsup) Time@Peak Reflow Temperature-Max (s) Power Supplies Supply Current-Max Qualification Status Supplier Device Package Memory Size Output Characteristics Clock Frequency Organization Memory Width Memory Density Parallel/Serial Standby Current-Max I/O Type Memory IC Type Programmable Type
XC1736ESOG8C XC1736ESOG8C Xilinx
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0 0x0x0 download Surface Mount 0°C~70°C Tube 1 (Unlimited) CMOS SYNCHRONOUS 1.7272mm RoHS Compliant 2004 /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf 8-SOIC (0.154, 3.90mm Width) 4.9276mm 3.937mm Lead Free 8 8 yes EAR99 USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS unknown 1 e3 Matte Tin (Sn) YES 4.75V~5.25V DUAL GULL WING 260 5V 1.27mm XC1736E 8 5.25V 4.75V 40 5V 0.01mA Not Qualified 36kb 3-STATE 10MHz 1 SERIAL 0.00005A COMMON CONFIGURATION MEMORY OTP
XC17S200APDG8I XC17S200APDG8I Xilinx
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0 0x0x0 download Through Hole -40°C~85°C Tube 1 (Unlimited) CMOS 4.5974mm RoHS Compliant 1999 /files/xilinxinc-xc17s200apdg8i-datasheets-4355.pdf 8-DIP (0.300, 7.62mm) 9.3599mm 7.62mm 3.3V 8 8 yes EAR99 No 1 e3 Matte Tin (Sn) NO 3V~3.6V DUAL 250 3.3V 2.54mm XC17S200A 8 3.6V 3V 30 0.015mA 2Mb 3-STATE 1 SERIAL 0.001A COMMON CONFIGURATION MEMORY OTP
XC1701LPDG8C XC1701LPDG8C Xilinx
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0 0x0x0 download Through Hole 0°C~70°C Tube 1 (Unlimited) CMOS SYNCHRONOUS 4.5974mm RoHS Compliant 2004 /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf 8-DIP (0.300, 7.62mm) 9.3599mm 7.62mm 8 8 yes USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS 1 e3 Matte Tin (Sn) NO 3V~3.6V DUAL 250 3.3V 2.54mm XC1701L 8 3.6V 3V 30 3.3V 0.01mA Not Qualified 1Mb 3-STATE 15MHz 1MX1 1 SERIAL 0.00005A COMMON CONFIGURATION MEMORY OTP
AT17LV002A-10CU AT17LV002A-10CU Microchip Technology
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0 0x0x0 download Surface Mount -40°C~85°C Tube 3 (168 Hours) ROHS3 Compliant 1997 /files/microchiptechnology-at17lv002a10cu-datasheets-4359.pdf 8-TDFN 3V~3.6V 4.5V~5.5V AT17LV002A 8-LAP (6x6) 2Mb Serial EEPROM
XC17S10XLPDG8C XC17S10XLPDG8C Xilinx
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0 0x0x0 download Through Hole 0°C~70°C Tube 1 (Unlimited) CMOS SYNCHRONOUS 4.5974mm RoHS Compliant 1999 /files/xilinxinc-xc17s10xlpdg8c-datasheets-4365.pdf 8-DIP (0.300, 7.62mm) 9.3599mm 7.62mm 8 8 EAR99 unknown 1 e3 Matte Tin (Sn) NO 3V~3.6V DUAL 250 3.3V 2.54mm XC17S10XL 8 3.6V 3V 30 3.3V 0.005mA Not Qualified 100kb 3-STATE 10MHz 95752X1 1 95752 bit 0.00005A COMMON MEMORY CIRCUIT OTP
XC1701LPDG8I XC1701LPDG8I Xilinx
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0 0x0x0 download Through Hole -40°C~85°C Tube 1 (Unlimited) CMOS SYNCHRONOUS 4.5974mm RoHS Compliant 2004 /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf 8-DIP (0.300, 7.62mm) 9.3599mm 7.62mm 8 8 yes EAR99 USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS unknown 1 e3 Matte Tin (Sn) NO 3V~3.6V DUAL 250 3.3V 2.54mm XC1701L 8 3.6V 3V 30 3.3V 0.01mA Not Qualified 1Mb 3-STATE 15MHz 1MX1 1 SERIAL 0.00005A COMMON CONFIGURATION MEMORY OTP
AT17N512-10PC AT17N512-10PC Microchip Technology
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0 0x0x0 download Through Hole 0°C~70°C Tube 1 (Unlimited) Non-RoHS Compliant 1997 /files/microchiptechnology-at17n51210pc-datasheets-4369.pdf 8-DIP (0.300, 7.62mm) 3V~3.6V AT17N512 8-PDIP 512kb Serial EEPROM

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