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ContactApplication Specific Microcontrollers(1956)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Number of Terminations | Factory Lead Time | Number of Pins | Interface | Pbfree Code | Additional Feature | Max Frequency | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Applications | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Supplier Device Package | Screening Level | Number of I/O | Memory Type | Core Architecture | RAM Size | uPs/uCs/Peripheral ICs Type | Bit Size | Number of UART Channels | Boundary Scan | Low Power Mode | Format | Integrated Cache | Core Processor | Program Memory Type | Controller Series |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| WIN247NHEI-300A1 | Microsemi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | RoHS Compliant | 8 Weeks | Ethernet, PCI, SPI, USB | Network Processor | MIPS32® 24Kc™ | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| WDS3-UFE4-12-DC | Microsemi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | RoHS Compliant | /files/microchiptechnology-ufe412t1-datasheets-7694.pdf | 676-BGA, FCBGA | Asynchronous Host Interface | Network Processor | UFE4 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| MEC1705Q-C1-I/SZ | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | CMOS | 0.8mm | ROHS3 Compliant | 2017 | /files/microchiptechnology-mec1705qc1isz-datasheets-2860.pdf | 144-WFBGA | 9mm | 9mm | 144 | ACPI, EBI/EMI, eSPI, I2C, LPC, PECI, PS/2, QSPI, SPI | IT ALSO OPERATES AT 3.3 NOMINAL SUPPLY VOLTAGE | unknown | Keyboard and Embedded Controller | YES | 1.71V~3.465V | BOTTOM | BALL | 1.8V | 0.65mm | MEC170 | S-PBGA-B144 | 123 | 480KB | MICROPROCESSOR CIRCUIT | ARM® Cortex®-M4 | MEC170x | ||||||||||||||||||||||||||||
| SLE66R32PMCC8IXHSA1 | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | my-d™ NFC | Surface Mount | -25°C~70°C | Tape & Reel (TR) | 1 (Unlimited) | ROHS3 Compliant | Die | 9 Weeks | ISO14443-3 Type A, NFC Forum Type 2 | Security | Wafer | |||||||||||||||||||||||||||||||||||||||||||||||
| AT97SC3205T-U3A1610B | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tube | 1 (Unlimited) | CMOS | 1.1mm | ROHS3 Compliant | /files/microchiptechnology-at97sc3205tu3a1420-datasheets-1760.pdf | 28-TSSOP (0.173, 4.40mm Width) | 9.7mm | 28 | I2C | Trusted Platform Module (TPM) | YES | 3.3V | DUAL | GULL WING | NOT SPECIFIED | 3.3V | 0.65mm | AT97SC3205T | NOT SPECIFIED | R-PDSO-G28 | 4 | MICROPROCESSOR, RISC | 8 | NO | YES | FIXED POINT | YES | AVR | EEPROM | ||||||||||||||||||||||||||
| AT97SC3204-U2MA-00 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | CryptoController™ | Surface Mount | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | ROHS3 Compliant | 1997 | /files/microchiptechnology-at97sc3204tu2mb00-datasheets-2249.pdf | 40-VFQFN Exposed Pad | 3.3V | LPC | 33MHz | Trusted Platform Module (TPM) | 3.3V | AT97SC3204 | 40-VQFN (6x6) | EEPROM | AVR | AVR | EEPROM | |||||||||||||||||||||||||||||||||||
| AT97SC3205T-U3A1620B | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tube | 1 (Unlimited) | CMOS | 1.1mm | ROHS3 Compliant | /files/microchiptechnology-at97sc3205tu3a1420-datasheets-1760.pdf | 28-TSSOP (0.173, 4.40mm Width) | 9.7mm | 28 | I2C | Trusted Platform Module (TPM) | YES | 3.3V | DUAL | GULL WING | NOT SPECIFIED | 3.3V | 0.65mm | AT97SC3205T | NOT SPECIFIED | R-PDSO-G28 | 4 | MICROPROCESSOR, RISC | 8 | NO | YES | FIXED POINT | YES | AVR | EEPROM | ||||||||||||||||||||||||||
| AT97SC3205T-X3A1620B | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tube | 1 (Unlimited) | CMOS | 1.1mm | ROHS3 Compliant | /files/microchiptechnology-at97sc3205tu3a1420-datasheets-1760.pdf | 28-TSSOP (0.173, 4.40mm Width) | 9.7mm | 28 | I2C | Trusted Platform Module (TPM) | YES | 3.3V | DUAL | GULL WING | NOT SPECIFIED | 3.3V | 0.65mm | AT97SC3205T | NOT SPECIFIED | R-PDSO-G28 | 4 | MICROPROCESSOR, RISC | 8 | NO | YES | FIXED POINT | YES | AVR | EEPROM | ||||||||||||||||||||||||||
| AT97SC3205T-H3M4B-10 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 0.9mm | ROHS3 Compliant | /files/microchiptechnology-at97sc3205tx3m4300-datasheets-2055.pdf | 32-VFQFN Exposed Pad | 32 | I2C | Trusted Platform Module (TPM) | YES | 3.3V | QUAD | NO LEAD | 3.3V | AT97SC3205T | S-XQCC-N32 | 4 | MICROPROCESSOR, RISC | 8 | NO | YES | FIXED POINT | YES | AVR | EEPROM | ||||||||||||||||||||||||||||||
| WIN867NHEI-300A1 | Microsemi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | RoHS Compliant | Ethernet, PCI, SPI, USB | Network Processor | MIPS32® 24Kc™ | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MEC1701H-C1-SZ | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | CMOS | 0.8mm | ROHS3 Compliant | /files/microchiptechnology-mec1705qc1isz-datasheets-2860.pdf | 144-WFBGA | 9mm | 9mm | 144 | 12 Weeks | ACPI, EBI/EMI, eSPI, I2C, LPC, PECI, PS/2, QSPI, SPI | ALSO OPERATES AT 3.3V NOMINAL | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | Keyboard and Embedded Controller | YES | 1.71V~3.465V | BOTTOM | BALL | 260 | 1.8V | 0.65mm | MEC170 | 30 | S-PBGA-B144 | TS 16949 | 123 | 256KB | MICROPROCESSOR CIRCUIT | ARM® Cortex®-M4 | MEC170x | |||||||||||||||||||||||
| TMG201A-32LQXIT | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TrueTouch™ | Surface Mount | -40°C~85°C | 1 (Unlimited) | ROHS3 Compliant | 32-VFQFN Exposed Pad | I2C, SPI, UART/USART, USB | Touchscreen Controller | 1.8V | 32-QFN | 28 | 2K x 8 | M8C | FLASH (16kB) | CY8CT | |||||||||||||||||||||||||||||||||||||||||||
| MEC1701H-C1-SZ-TR | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Cut Tape (CT) | 3 (168 Hours) | CMOS | 0.8mm | ROHS3 Compliant | 2017 | /files/microchiptechnology-mec1705qc1isz-datasheets-2860.pdf | 144-WFBGA | 9mm | 9mm | 144 | ACPI, EBI/EMI, eSPI, I2C, LPC, PECI, PS/2, QSPI, SPI | ALSO OPERATES AT 3.3V NOMINAL | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | Keyboard and Embedded Controller | YES | 1.71V~3.465V | BOTTOM | BALL | 1.8V | 0.65mm | MEC170 | S-PBGA-B144 | TS 16949 | 123 | 256KB | MICROPROCESSOR CIRCUIT | ARM® Cortex®-M4 | MEC170x | |||||||||||||||||||||||||
| WP3260W2EFEI-400B2 | Microsemi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 1997 | /files/microsemicorporation-wp3260w2efei400b2-datasheets-3005.pdf | 896-BGA, FCBGA | I2C, RMII, UART | Network Processor | 896-FCBGA (31x31) | MIPS32® 34Kc™ | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||
| SLE66R35RMCC8XHSA1 | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -25°C~70°C | Tape & Reel (TR) | 1 (Unlimited) | 70°C | -25°C | ROHS3 Compliant | Die | 26 Weeks | 8 | ISO14443-3 Type A | Security | Wafer | ||||||||||||||||||||||||||||||||||||||||||||
| AT97SC3205T-G3M4B-20 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 0.9mm | ROHS3 Compliant | /files/microchiptechnology-at97sc3205tx3m4300-datasheets-2055.pdf | 32-VFQFN Exposed Pad | 32 | I2C | Trusted Platform Module (TPM) | YES | 3.3V | QUAD | NO LEAD | 3.3V | AT97SC3205T | S-XQCC-N32 | 4 | MICROPROCESSOR, RISC | 8 | NO | YES | FIXED POINT | YES | AVR | EEPROM | ||||||||||||||||||||||||||||||
| SLE66R35MCC8IXHSA1 | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~70°C | Tape & Reel (TR) | 1 (Unlimited) | ROHS3 Compliant | Die | 26 Weeks | ISO14443-3 Type A | Security | Wafer | ||||||||||||||||||||||||||||||||||||||||||||||||
| SLE66R35RMCC2XHSA1 | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~70°C | Tape & Reel (TR) | 1 (Unlimited) | 70°C | -25°C | ROHS3 Compliant | Die | 26 Weeks | ISO14443-3 Type A | Security | Wafer | ||||||||||||||||||||||||||||||||||||||||||||||
| MAXQ1050B-2012+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | ROHS3 Compliant | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SLE66R35E7MCC2ZZZA1 | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~70°C | Tape & Reel (TR) | 1 (Unlimited) | ROHS3 Compliant | Die | 26 Weeks | ISO14443-3 Type A | Security | Wafer | ||||||||||||||||||||||||||||||||||||||||||||||||
| AT97SC3205T-G3M4B10B | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tray | 1 (Unlimited) | CMOS | 0.9mm | ROHS3 Compliant | /files/microchiptechnology-at97sc3205tx3m4300-datasheets-2055.pdf | 32-VFQFN Exposed Pad | 32 | I2C | yes | Trusted Platform Module (TPM) | YES | 3.3V | QUAD | NO LEAD | 3.3V | AT97SC3205T | S-XQCC-N32 | 4 | MICROPROCESSOR, RISC | 8 | NO | YES | FIXED POINT | YES | AVR | EEPROM | |||||||||||||||||||||||||||||
| AT97SC3205T-H3M4B-00 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 0.9mm | ROHS3 Compliant | /files/microchiptechnology-at97sc3205tx3m4300-datasheets-2055.pdf | 32-VFQFN Exposed Pad | 32 | I2C | Trusted Platform Module (TPM) | YES | 3.3V | QUAD | NO LEAD | NOT SPECIFIED | 3.3V | AT97SC3205T | NOT SPECIFIED | S-XQCC-N32 | 4 | MICROPROCESSOR, RISC | 8 | NO | YES | FIXED POINT | YES | AVR | EEPROM | ||||||||||||||||||||||||||||
| SLE66R04PNBZZZA1 | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | my-d™ NFC | Surface Mount | -25°C~70°C | 3 (168 Hours) | Non-RoHS Compliant | Die | 9 Weeks | ISO14443-3 Type A, NFC Forum Type 2 | Security | Wafer | ||||||||||||||||||||||||||||||||||||||||||||||||
| AT97SC3205T-H3M4B10B | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 1 (Unlimited) | CMOS | 0.9mm | ROHS3 Compliant | /files/microchiptechnology-at97sc3205tx3m4300-datasheets-2055.pdf | 32-VFQFN Exposed Pad | 32 | I2C | yes | Trusted Platform Module (TPM) | YES | 3.3V | QUAD | NO LEAD | NOT SPECIFIED | 3.3V | AT97SC3205T | NOT SPECIFIED | S-XQCC-N32 | 4 | MICROPROCESSOR, RISC | 8 | NO | YES | FIXED POINT | YES | AVR | EEPROM | |||||||||||||||||||||||||||
| SLE66R32SMCC8ZZZA1 | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | my-d™ | Tape & Reel (TR) | 1 (Unlimited) | Non-RoHS Compliant | 9 Weeks | ARM® Cortex®-M4 | EEPROM (4kB) | |||||||||||||||||||||||||||||||||||||||||||||||||||
| SLE66R32SMCC2ZZZA1 | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | my-d™ | Tape & Reel (TR) | 1 (Unlimited) | Non-RoHS Compliant | MCC2 Chip Card Module | 9 Weeks | P-MCC2-2-1 | ARM® Cortex®-M4 | EEPROM (4kB) | |||||||||||||||||||||||||||||||||||||||||||||||||
| 15321R-1000 | Echelon Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PL3150® | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | 64-LQFP | SPI, UART | Smart Transceiver | 4.75V~5.25V | 12 | 2K x 8 | Neuron | EEPROM (512B) | |||||||||||||||||||||||||||||||||||||||||||||
| AT97SC3205T-U3A1410B | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tube | 1 (Unlimited) | CMOS | 1.1mm | ROHS3 Compliant | /files/microchiptechnology-at97sc3205tu3a1420-datasheets-1760.pdf | 28-TSSOP (0.173, 4.40mm Width) | 9.7mm | 28 | I2C | Trusted Platform Module (TPM) | YES | 3.3V | DUAL | GULL WING | NOT SPECIFIED | 3.3V | 0.65mm | AT97SC3205T | NOT SPECIFIED | R-PDSO-G28 | 4 | MICROPROCESSOR, RISC | 8 | NO | YES | FIXED POINT | YES | AVR | EEPROM | ||||||||||||||||||||||||||
| AT97SC3205T-G3M4B-10 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 0.9mm | ROHS3 Compliant | /files/microchiptechnology-at97sc3205tx3m4300-datasheets-2055.pdf | 32-VFQFN Exposed Pad | 32 | I2C | Trusted Platform Module (TPM) | YES | 3.3V | QUAD | NO LEAD | NOT SPECIFIED | 3.3V | AT97SC3205T | NOT SPECIFIED | S-XQCC-N32 | 4 | MICROPROCESSOR, RISC | 8 | NO | YES | FIXED POINT | YES | AVR | EEPROM | ||||||||||||||||||||||||||||
| SLE66R32SNBZZZA1 | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | my-d™ | Surface Mount | 3 (168 Hours) | Non-RoHS Compliant | Die | 9 Weeks | Die | ARM® Cortex®-M4 | EEPROM (4kB) |
