Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mounting Type | Packaging | Size / Dimension | Moisture Sensitivity Level (MSL) | Package / Case | Bandwidth | Applications | Insertion Loss | Height (Max) | Frequency - Cutoff or Center |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
B39941B9840P810 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 0.067Lx0.051W 1.70mmx1.30mm | 2 (1 Year) | 10-SMD, No Lead | 25MHz 35MHz | Cellular, WCDMA | 2.7dB | 0.018 0.45mm | 881.5MHz 942.5MHz | |||
B39941B8658P812S5 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 2 (1 Year) | |||||||||||
B39941B8667P810 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 2 (1 Year) | |||||||||||
B39941B8667P810S5 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 2 (1 Year) | |||||||||||
B39941B8606P810S5 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 2 (1 Year) |
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