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Transistor Sockets(21155)

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Part Status Type Series Mount Mounting Type Operating Temperature Packaging Moisture Sensitivity Level (MSL) Termination Max Operating Temperature Min Operating Temperature RoHS Status Published Datasheet Current Rating Package / Case Factory Lead Time Number of Pins Pbfree Code Number of Positions Gender Number of Contacts Contact Finish - Mating Orientation Flammability Rating ECCN Code Additional Feature Contact Material Contact Plating Housing Material Lead Length HTS Code Insulation Resistance Contact Resistance JESD-609 Code Feature Terminal Pitch Operating Temperature (Max) Operating Temperature (Min) Pitch Body Length or Diameter Body Breadth Termination Type Device Socket Type Current Rating (Amps) Mounting Style Contact Finish Termination PCB Contact Pattern Body Depth Contact Style Mating Contact Pitch PCB Contact Row Spacing Dielectric Withstanding Voltage Device Type Used On Contact Configuration Number of Positions or Pins (Grid) Material Flammability Rating Contact Finish Thickness - Mating Contact Material - Mating Contact Material - Post Pitch - Mating Termination Post Length Pitch - Post Contact Finish - Post Contact Finish Thickness - Post
28-3574-18 28-3574-18 Aries Electronics
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 0 0x0x0 download DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 57 Through Hole Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2005 https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf 1A 6 Weeks yes 28 28 Gold UL94 V-0 EAR99 UL 94V-0 Polyphenylene Sulfide (PPS), Glass Filled 2.794mm Closed Frame 28 (2 x 14) UL94 V-0 10.0μin 0.25μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm 10.0μin 0.25μm
523-93-361-19-000001 523-93-361-19-000001 Mill-Max Manufacturing Corp.
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 0 0x0x0 download Non-RoHS Compliant 3 Weeks
180-PRS18007-12 180-PRS18007-12 Aries Electronics
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Min: 1

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 0 0x0x0 download PGA, ZIF (ZIP) PRS Through Hole Through Hole -65°C~125°C Bulk 1 (Unlimited) Solder 125°C -65°C ROHS3 Compliant 2006 https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf 1A 5 Weeks 180 Gold UL94 V-0 Gold Polyphenylene Sulfide (PPS) 3.175mm Closed Frame 1A UL94 V-0 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.125 3.18mm 0.100 2.54mm Tin 200.0μin 5.08μm
32-6553-18 32-6553-18 Aries Electronics
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 0 0x0x0 download DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 55 Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 6 Weeks yes 32 Tin EAR99 STANDARD: UL 94V-0 Polyphenylene Sulfide (PPS), Glass Filled 1000000000Ohm Closed Frame 2.54mm 250°C 2.19 inch 0.9 inch 1A RECTANGULAR 0.47 inch SQ PIN-SKT 0.1 inch 1000VAC V 36 (2 x 18) UL94 V-0 200.0μin 5.08μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm 200.0μin 5.08μm
32-3554-18 32-3554-18 Aries Electronics
RFQ

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 0 0x0x0 download DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 55 Through Hole Through Hole -55°C~250°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 2006 1A 6 Weeks 32 32 Nickel Boron UL94 V-0 EAR99 STANDARD: UL 94V-0 Nickel Polyetheretherketone (PEEK), Glass Filled 2.794mm 1000000000Ohm Closed Frame 2.54mm 2.19 inch 0.9 inch RECTANGULAR 0.47 inch SQ PIN-SKT 0.1 inch 1000VAC V 32 (2 x 16) UL94 V-0 50.0μin 1.27μm Beryllium Nickel Beryllium Nickel 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm Nickel Boron 50.0μin 1.27μm
252-4205-00 252-4205-00 3M
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Min: 1

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 0 0x0x0 download Through Hole Not Applicable Solder Non-RoHS Compliant https://pdf.utmel.com/r/datasheets/3m-248420501-datasheets-2397.pdf QFN 11 Weeks 52 Female Straight 400μm
551-10-431-24-125005 551-10-431-24-125005 Mill-Max Manufacturing Corp.
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 0 0x0x0 download ROHS3 Compliant 3 Weeks yes 431 GOLD (10) OVER NICKEL (150) EAR99 PGA SOCKET NOT SPECIFIED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER 8536.90.40.00 e4 IC SOCKET Gold (Au) - with Nickel (Ni) barrier PGA431
514-87-478M26-131148 514-87-478M26-131148 Preci-Dip
RFQ

Min: 1

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 0 0x0x0 download BGA 514 Surface Mount Surface Mount -55°C~125°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 2012 /files/precidip-51487192m16001148-datasheets-7359.pdf 1A 10 Weeks 478 Gold UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 1.397mm 10mOhm Open Frame 478 (26 x 26) UL94 V-0 Flash Beryllium Copper Brass 0.100 2.54mm 0.055 1.40mm 0.100 2.54mm Tin
550-10-478M26-131166 550-10-478M26-131166 Preci-Dip
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 0 0x0x0 download BGA 550 Through Hole -55°C~125°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 2012 https://pdf.utmel.com/r/datasheets/precidip-55010192m16001166-datasheets-7079.pdf 10 Weeks Gold FR4 Epoxy Glass 10mOhm Open Frame 1A 478 (26 x 26) UL94 V-0 10.0μin 0.25μm Beryllium Copper Brass 0.050 1.27mm 0.098 2.50mm 0.050 1.27mm 10.0μin 0.25μm
240-4205-01 240-4205-01 3M
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Min: 1

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 0 0x0x0 download Through Hole Not Applicable Solder Non-RoHS Compliant 2015 https://pdf.utmel.com/r/datasheets/3m-248420501-datasheets-2397.pdf QFN 11 Weeks 40 Female Straight 400μm
514-87-456M26-001148 514-87-456M26-001148 Preci-Dip
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Min: 1

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 0 0x0x0 download BGA 514 Surface Mount Surface Mount -55°C~125°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 2012 https://pdf.utmel.com/r/datasheets/precidip-51487192m16001148-datasheets-7359.pdf 1A 10 Weeks 456 Gold UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 1.397mm 10mOhm Open Frame 456 (26 x 26) UL94 V-0 Flash Beryllium Copper Brass 0.100 2.54mm 0.055 1.40mm 0.100 2.54mm Tin
523-13-289-17-000001 523-13-289-17-000001 Mill-Max Manufacturing Corp.
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Min: 1

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 0 0x0x0 download ROHS3 Compliant 3 Weeks
522-13-324-18-000001 522-13-324-18-000001 Mill-Max Manufacturing Corp.
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 0 0x0x0 download ROHS3 Compliant 3 Weeks
522-13-324-18-000003 522-13-324-18-000003 Mill-Max Manufacturing Corp.
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Min: 1

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 0 0x0x0 download ROHS3 Compliant 1A 3 Weeks yes 324 GOLD (30) OVER NICKEL (100) EAR99 PGA SOCKET NOT SPECIFIED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER 8536.90.40.00 10000000000Ohm e4 2.54mm 125°C -55°C 1.8 inch 1.8 inch WIRE WRAP IC SOCKET STRAIGHT Gold (Au) - with Nickel (Ni) barrier RECTANGULAR 0.193 inch RND PIN-SKT 0.1 inch 0.1 mm 1000VAC V PGA324 18X18
32-6552-18 32-6552-18 Aries Electronics
RFQ

Min: 1

Mult: 1

 0 0x0x0 download DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 55 Through Hole -55°C~250°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 6 Weeks yes 32 Nickel Boron EAR99 STANDARD: UL 94V-0 Polyetheretherketone (PEEK), Glass Filled 1000000000Ohm Closed Frame 2.54mm 2.19 inch 0.9 inch 1A RECTANGULAR 0.47 inch SQ PIN-SKT 0.1 inch 1000VAC V 32 (2 x 16) UL94 V-0 50.0μin 1.27μm Beryllium Nickel Beryllium Nickel 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm Nickel Boron 50.0μin 1.27μm
181-PRS18040-12 181-PRS18040-12 Aries Electronics
RFQ

Min: 1

Mult: 1

 0 0x0x0 download PGA, ZIF (ZIP) PRS Through Hole Through Hole -65°C~125°C Bulk 1 (Unlimited) Solder 125°C -65°C ROHS3 Compliant 2006 https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf 1A 5 Weeks 181 Gold UL94 V-0 Gold Polyphenylene Sulfide (PPS) 3.175mm Closed Frame 1A UL94 V-0 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.125 3.18mm 0.100 2.54mm Tin 200.0μin 5.08μm
523-13-256-19-081002 523-13-256-19-081002 Mill-Max Manufacturing Corp.
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Min: 1

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 0 0x0x0 download ROHS3 Compliant 3 Weeks
523-13-273-21-125001 523-13-273-21-125001 Mill-Max Manufacturing Corp.
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Min: 1

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 0 0x0x0 download ROHS3 Compliant 3 Weeks
522-13-281-19-081003 522-13-281-19-081003 Mill-Max Manufacturing Corp.
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Min: 1

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 0 0x0x0 download ROHS3 Compliant 1A 3 Weeks yes 281 GOLD (30) OVER NICKEL (100) EAR99 PGA SOCKET NOT SPECIFIED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER 8536.90.40.00 10000000000Ohm e4 2.54mm 125°C -55°C 1.9 inch 1.9 inch WIRE WRAP IC SOCKET STRAIGHT Gold (Au) - with Nickel (Ni) barrier RECTANGULAR 0.193 inch RND PIN-SKT 0.1 inch 0.1 mm 1000VAC V PGA281 19X19
518-77-272M20-001106 518-77-272M20-001106 Preci-Dip
RFQ

Min: 1

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 0 0x0x0 download PGA 518 Surface Mount Surface Mount -55°C~125°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 2012 https://pdf.utmel.com/r/datasheets/precidip-51877256m20001106-datasheets-4965.pdf 1A 10 Weeks 272 Gold UL94 V-0 FR4 Epoxy Glass 1.5748mm 10mOhm Open Frame 272 (20 x 20) UL94 V-0 Flash Beryllium Copper Brass 0.050 1.27mm 0.062 1.57mm 0.050 1.27mm
32-3553-18 32-3553-18 Aries Electronics
RFQ

Min: 1

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 0 0x0x0 download DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 55 Through Hole -55°C~250°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 6 Weeks 32 Nickel Boron EAR99 STANDARD: UL 94V-0 Polyetheretherketone (PEEK), Glass Filled 1000000000Ohm Closed Frame 2.54mm 2.19 inch 0.9 inch 1A RECTANGULAR 0.47 inch SQ PIN-SKT 0.1 inch 1000VAC V 32 (2 x 16) UL94 V-0 50.0μin 1.27μm Beryllium Nickel Beryllium Nickel 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm Nickel Boron 50.0μin 1.27μm
229-PRS16014-12 229-PRS16014-12 Aries Electronics
RFQ

Min: 1

Mult: 1

 0 0x0x0 download PGA, ZIF (ZIP) PRS Through Hole Through Hole -65°C~125°C Bulk 1 (Unlimited) Solder 125°C -65°C ROHS3 Compliant 2016 https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf 1A 5 Weeks Gold UL94 V-0 Gold Polyphenylene Sulfide (PPS) 3.175mm Closed Frame 1A UL94 V-0 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.125 3.18mm 0.100 2.54mm Tin 200.0μin 5.08μm
181-PLS18040-12 181-PLS18040-12 Aries Electronics
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Min: 1

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 0 0x0x0 download PGA, ZIF (ZIP) PLS Through Hole 1 (Unlimited) Solder Non-RoHS Compliant 5 Weeks 181 Gold Polyphenylene Sulfide (PPS) Closed Frame 1A UL94 V-0 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.125 3.18mm 0.100 2.54mm Tin 200.0μin 5.08μm
2100-6310-9UA-1902 2100-6310-9UA-1902 Artery
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 0 0x0x0 download Through Hole Through Hole -55°C~150°C Bulk 1 (Unlimited) Solder RoHS Compliant 1A 8 Weeks Female 100 Gold Straight Copper Gold Polyethersulfone (PES) Closed Frame 2.54mm 1A 100 (10 x 10) UL94 V-0 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.100 2.54mm Gold 30.0μin 0.76μm
523-13-281-19-081003 523-13-281-19-081003 Mill-Max Manufacturing Corp.
RFQ

Min: 1

Mult: 1

 0 0x0x0 download ROHS3 Compliant 1A 3 Weeks yes 281 GOLD (30) OVER NICKEL (100) EAR99 PGA SOCKET NOT SPECIFIED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER 8536.90.40.00 10000000000Ohm e4 2.54mm 125°C -55°C 1.9 inch 1.9 inch WIRE WRAP IC SOCKET STRAIGHT Gold (Au) - with Nickel (Ni) barrier RECTANGULAR 0.193 inch RND PIN-SKT 0.1 inch 0.1 mm 1000VAC V PGA281 19X19
558-10-292M20-001104 558-10-292M20-001104 Preci-Dip
RFQ

Min: 1

Mult: 1

 0 0x0x0 download BGA 558 Surface Mount Surface Mount -55°C~125°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 2012 /files/precidip-55810256m20001104-datasheets-4888.pdf 10 Weeks Gold FR4 Epoxy Glass 10mOhm Closed Frame 1A 292 (20 x 20) UL94 V-0 10.0μin 0.25μm Brass 0.050 1.27mm 0.086 2.20mm 0.050 1.27mm 10.0μin 0.25μm
523-13-281-19-081001 523-13-281-19-081001 Mill-Max Manufacturing Corp.
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Min: 1

Mult: 1

 0 0x0x0 download ROHS3 Compliant 3 Weeks
169-PLS17012-12 169-PLS17012-12 Aries Electronics
RFQ

Min: 1

Mult: 1

 0 0x0x0 download PGA, ZIF (ZIP) PLS Through Hole Through Hole -65°C~125°C Bulk 1 (Unlimited) Solder 125°C -65°C ROHS3 Compliant 2016 /files/arieselectronics-225prs1500112-datasheets-2299.pdf 1A 5 Weeks Gold UL94 V-0 Gold Polyphenylene Sulfide (PPS) 3.175mm Closed Frame 1A UL94 V-0 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.125 3.18mm 0.100 2.54mm Tin 200.0μin 5.08μm
32-3551-18 32-3551-18 Aries Electronics
RFQ

Min: 1

Mult: 1

 0 0x0x0 download DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 55 Through Hole -55°C~250°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 6 Weeks yes 32 Nickel Boron EAR99 STANDARD: UL 94V-0 Polyetheretherketone (PEEK), Glass Filled 1000000000Ohm Closed Frame 2.54mm 2.19 inch 0.9 inch 1A RECTANGULAR 0.47 inch SQ PIN-SKT 0.1 inch 1000VAC V 32 (2 x 16) UL94 V-0 50.0μin 1.27μm Beryllium Nickel Beryllium Nickel 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm Nickel Boron 50.0μin 1.27μm
522-13-324-18-000002 522-13-324-18-000002 Mill-Max Manufacturing Corp.
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Min: 1

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 0 0x0x0 download ROHS3 Compliant 3 Weeks
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